LP3972SQX-E514 [NSC]
IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, QCC40, 5 X 5 MM, LLP-40, Power Management Circuit;
| 型号： | LP3972SQX-E514 |
| 厂家： | 
National Semiconductor |
| 描述： | IC 1-CHANNEL POWER SUPPLY SUPPORT CKT, QCC40, 5 X 5 MM, LLP-40, Power Management Circuit |
| 文件： | 总60页 (文件大小：787K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
June 8, 2009
LP3972
Power Management Unit for Advanced Application
Processors
General Description
Features
■
The LP3972 is a multi-function, programmable Power Man-
agement Unit, designed especially for advanced application
processors. The LP3972 is optimized for low power handheld
applications and provides 6 low-dropout, low-noise linear reg-
ulators, three DC/DC magnetic buck regulators, a back-up
battery charger and two GPIO’s. A high speed serial interface
is included to program individual regulator output voltages as
well as on/off control.
Compatible with advanced applications processors
requiring DVM (Dynamic Voltage Management)
Three buck regulators for powering high current processor
functions or I/O's
■
6 LDO's for powering RTC, peripherals, and I/O's
■
■
Backup battery charger with automatic switch for lithium-
manganese coin cell batteries and Super capacitors
I2C compatible high speed serial interface
Software control of regulator functions and settings
Precision internal reference
■
■
■
■
■
■
Key Specifications
Buck Regulators
Thermal overload protection
Programmable VOUT from 0.725 to 3.3V
■
■
■
■
Current overload protection
Up to 95% efficiency
Tiny 40-pin 5x5 mm LLP package
Up to 1.6A output current
±3% output voltage accuracy
Applications
PDA phones
■
■
■
■
LDO’s
Smart phones
Programmable VOUT of 1.0V–3.3V
■
■
■
Personal Media Players
±3% output voltage accuracy
Digital cameras
150/300/400 mA output currents
Application processors
■
LDO_RTC 30 mA
LDO1 300 mA
LDO2 150 mA
LDO3 150 mA
LDO4 150 mA
LDO5 400 mA
—
—
—
—
—
—
Marvell PXA
Freescale
Samsung
—
—
—
100 mV (typ) dropout
■
© 2009 National Semiconductor Corporation
202076
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Simplified Application Circuit
20207601
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2
20207628
The I2C lines are pulled up via a I/O source
—
—
VINLDOs 4, 5 can either be powered from main battery source, or by a buck regulator or VIN
.
3
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Connection Diagrams and Package Mark Information
40-Pin Leadless Leadframe Package
NS Package Number SQF40A
20207602
Note: Circle marks pin 1 position.
Package Mark
20207604
Top View
Note: The actual physical placement of the package marking will vary from part to part.
(*) UZTTYY format: 'U' — wafer fab code; 'Z' — assembly code; 'XY' 2 digit date code; 'TT' — die run code.
See http://www.national.com/quality/marking_convertion.html for more information on marking information.
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Ordering Information
Voltage Option
Order Number
Package Type
NSC Package Package Marking
Drawing
Supplied As
Voltage A514
Voltage A514
LP3972SQ-A514
40 lead LLP
40 lead LLP
40 lead LLP
40 lead LLP
40 lead LLP
40 lead LLP
SQF040A
SQF040A
SQF040A
SQF040A
SQF040A
SQF040A
72-A514
72-A514
72-A413
72-A413
72-E514
72-E514
1000 tape & reel
4500 tape & reel
1000 tape & reel
4500 tape & reel
1000 tape & reel
4500 tape & reel
LP3972SQX-
A514
Voltage A413
Voltage A413
LP3972SQ-A413
LP3972SQX-
A413
Voltage E514
Voltage E514
LP3972SQ-E514
LP3972SQX-
E514
Voltage I414
Voltage I414
Voltage I514
Voltage I514
Voltage 0514*
Voltage 0514*
LP3972SQ-I414
LP3972SQX-I414
LP3972SQ-I514
LP3972SQX-I514
LP3972SQ-0514
LP3972SQX-0514
40 lead LLP
40 lead LLP
40 lead LLP
40 lead LLP
40 lead LLP
40 lead LLP
SQF040A
SQF040A
SQF040A
SQF040A
SQF040A
SQF040A
72–I414
72–I414
72-I514
72-I514
72-0514
72-0514
1000 tape & reel
4500 tape & reel
1000 tape & reel
4500 tape & reel
1000 tape & reel
4500 tape & reel
* Option 0514 has default tracking enabled.
20207605
Default VOUT Coding
Z
0
1
2
3
4
5
6
7
8
9
Default VOUT
1.3
1.8
2.5
2.8
3.0
3.3
1.0
1.4
1.2
1.25
5
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Pin Descriptions
Pin #
Name
I/O
Type
Description
1
PWR_ON
I
D
This is an active HI push button input which can be used to signal PWR_ON
and PWR_OFF events to the CPU by controlling the ext_wakeup [pin4] and
select contents of register 8H'88
2
3
4
nTEST_JIG
SPARE
I
I
D
D
D
This is an active LOW input signal used for detecting an external HW event.
The response is seen in the ext_wakeup [pin4] and select contents of register
8H'88
This is an input signal used for detecting a external HW event. The response
is seen in the ext_wakeup [pin4] and select contents of register 8H'88. The
polarity on this pin is assignable
EXT_WAKEUP
O
This pin generates a single 10 mS pulse output to CPU in response to input
from pin[s] 1, 2, and 3. Flags CPU to interrogate register 8H'88
5
6
7
8
9
FB1
VIN
I
I
A
Buck1 input feedback terminal
Battery Input (Internal circuitry and LDO1-3 power input)
LDO1 output
PWR
PWR
PWR
D
VOUT LDO1
VOUT LDO2
nRSTI
O
O
I
LDO2 output
Active low Reset pin. Signal used to reset the IC (by default is pulled high
internally). Typically a push button reset.
10
11
12
13
14
GND1
VREF
G
O
O
O
I
G
Ground
A
Bypass Cap. for the high internal impedance reference.
VOUT LDO3
VOUT LDO4
VIN LDO4
PWR
PWR
PWR
LDO3 output
LDO4 output
Power input to LDO4, this can be connected to either from a 1.8V supply to
main Battery supply.
15
16
17
VIN BUBATT
VOUT LDO_RTC
nBATT_FLT
I
PWR
PWR
D
Back Up Battery input supply.
O
O
LDO_RTC output supply to the RTC of the application processor.
Main Battery fault output, indicates the main battery is low
(discharged) or the dc source has been removed from the system. This gives
the processor an indicator that the power will shut down. During this time the
processor will operate from the back up coin cell.
18
19
20
21
22
23
24
25
26
PGND2
SW2
G
O
I
G
PWR
PWR
D
Buck2 NMOS Power Ground
Buck2 switcher output
VIN Buck2
SDA
Battery input power to Buck2
I2C Data (Bidirectional)
I2C Clock
I/O
I
SCL
D
FB2
I
A
Buck2 input feedback terminal
Reset output from the PMIC to the processor
LDO5 output
nRSTO
VOUT LDO5
VIN LDO5
O
O
I
D
PWR
PWR
Power input to LDO5, this can be connected to VIN or to a separate 1.8V
supply.
27
28
29
VDDA
FB3
I
I
PWR
A
Analog Power for VREF, BIAS
Buck3 Feedback
GPIO1 /
nCHG_EN
I/O
D
General Purpose I/O / Ext. backup battery charger enable pin. This pin
enables the main battery / DC source power to charge the backup battery.
This pin toggled via the application processor. By grounding this pin the DC
source continuously charges the backup battery
30
31
32
33
GPIO2
VIN Buck3
SW3
I/O
I
D
General Purpose I/O
PWR
PWR
G
Battery input power to Buck3
Buck3 switcher output
O
G
PGND3
Buck3 NMOS Power Ground
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Pin #
34
Name
BGND1,2,3
SYNC
I/O
G
I
Type
G
Description
Bucks 1, 2 and 3 analog Ground
35
D
Frequency Synchronization: Connection to an external clock signal PLL to
synchronize the PMIC internal oscillator.
Input Digital enable pin for the high voltage power domain supplies. Output
from the Monahans processor.
36
SYS_EN
I
D
Digital enable pin for the Low Voltage domain supplies. Output signal from
the Monahans processor
37
38
39
40
PWR_EN
PGND1
SW1
I
D
G
O
I
G
Buck1 NMOS Power Ground
Buck1 Switcher output
PWR
PWR
VIN Buck1
Battery input power to Buck1
A: Analog Pin D: Digital Pin G: Ground Pin P: Power Pin I: Input Pin I/O: Input/Output Pin O: Output Pin
Note: In this document active low logic items are prefixed with a lowercase “n”
7
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Maximum Lead Temp (Soldering)
ESD Rating (Note 5)
Human Body Model
260°C
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
2 kV
200V
Machine Model
All Inputs
−0.3V to +6.5V
±0.3V
Operating Ratings
GND to GND SLUG
Junction Temperature (TJ-MAX
Storage Temperature
VIN LDO 4,5
2.7V to 5.5V
1.74 to (VIN
)
150°C
−65°C to +150°C
VEN
Junction Temperature (TJ)
Operating Temperature (TA)
−40°C to +125°C
−40°C to +85°C
Power Dissipation
(TA = 70°C) (Note 3)
3.2W
Junction-to-Ambient Thermal
Maximum Power Dissipation
(TA = 70°C) (Notes 3, 4)
Resistance θJA (Note 3)
2.2W
25°C/W
General Electrical Characteristics Typical values and limits appearing in normal type apply for
TJ = 25°C. Limits appearing in boldface type apply over the entire junction temperature range for operation, −40°C to +125°C.
(Notes 2, 6)
Symbol
VIN, VDDA, VIN Buck1, 2 and 3
VINLDO4, VINLDO5
TSD
Parameter
Battery Voltage
Conditions
Min
2.7
Typ
3.6
3.6
160
20
Max
5.5
Units
V
V
Power Supply for LDO 4 and 5
Thermal Shutdown (Note 14)
1.74
5.5
Temperature
Hysteresis
°C
**No input supply should be higher then VDDA
Supply Specifications (Notes 2, 5)
VOUT (Volts)
IMAX
Maximum Current
Supply
Range
Resolution
(mV)
Current (mA)
(V)
30 mA dc source 10 mA backup
source
LDO_RTC
LDO1 (VCC_MVT)
LDO2
2.8V
N/A
25
1.7 to 2.0
1.8 to 3.3
1.8 to 3.3
1.0 to 3.3
300
150
100
LDO3
100
150
LDO4
50-600
25
150
LDO5 (VCC_SRAM)
BUCK1 (VCC_APPS)
BUCK2
0.850 to 1.5
0.725 to 1.5
0.8 to 3.3
400
25
1600
1600
1600
50-600
50-600
BUCK3
0.8 to 3.3
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Default Voltage Option (Notes 2, 5)
Version
Enable
LDO_RTC
LDO1
LP3972SQ-A514
Version A
LP3972SQ-A413
Version A
—
2.8
1.8
1.8D
3D
—
2.8
1.8
1.8D
3D
SYS_EN
SYS_EN
SYS_EN
SYS_EN
PWR_EN
PWR_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
LDO2
LDO3
LDO4
3D
2.8D
1.4
1.4
3
LDO5
1.4
1.4
3.3
1.8
PWR_EN
PWR_EN
SYS_EN
SYS_EN
BUCK1
BUCK2
BUCK3
1.8
Version
Enable
LDO_RTC
LDO1
LP3972SQ-E514
LP3972SQ-I514
Version E
Version I
—
2.8
1.8
1.8E
3D
—
2.8
1.8
1.8E
3E
SYS_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
PWR_EN
PWR_EN
SYS_EN
SYS_EN
LDO2
LDO3
LDO4
3D
3E
LDO5
PWR_EN
PWR_EN
SYS_EN
SYS_EN
1.4
1.4
3.3
1.8
1.4
1.4
3.3
1.8
BUCK1
BUCK2
BUCK3
Version
Enable
LDO_RTC
LDO1
LP3972SQ-I414
LP3972SQ-0514
Version I
Version 0
—
2.8
1.8
1.8E
3E
Tracking enabled
SYS_EN
3.3 w/ tracking
SYS_EN
SYS_EN
SYS_EN
SYS_EN
PWR_EN
PWR_EN
SYS_EN
SYS_EN
1.8
1.8E
3.3E
3E
LDO2
SYS_EN
LDO3
SYS_EN
LDO4
3E
SYS_EN
LDO5
1.4
1.4
3.0
1.8
PWR_EN
PWR_EN
SYS_EN
1.4
BUCK1
BUCK2
BUCK3
1.4
3.3
SYS_EN
1.8
Note : E = Regulator is ENABLED during startup
D = Regulator is DISABLED during startup
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LDO RTC
Unless otherwise noted, VIN = 3.6V, CIN = 1.0 μF, COUT = 0.47 µF, COUT (VRTC) = 1.0 μF ceramic. Typical values and limits appearing
in normal type apply for TJ = 25°C. Limits appearing in boldface type apply over the entire junction temperature range for operation,
−40°C to +125°C. (Notes 2, 6, 7) and (Note 10)
Symbol
VOUT
Parameter
Conditions
VIN Connected, Load Current =
1 mA
Min
Typ
Max
Units
Output Voltage Accuracy
2.632
2.8
2.968
V
Accuracy
Line Regulation
Load Regulation
VIN = (VOUT nom + 1.0V) to 5.5V
(Note 11) Load Current = 1 mA
0.15
0.05
0.5
%/V
ΔVOUT
From Main Battery
Load Current = 1 mA to 30 mA
%/mA
From Backup Battery
VIN = 3.0V
Load Current = 1 mA to 10 mA
ISC
Short Circuit Current Limit
From Main Battery
VIN = VOUT +0.3V to 5.5V
100
30
mA
mV
From Backup Battery
Load Current = 10 mA
IOUT = 0 mA
VIN - VOUT Dropout Voltage
375
IQ_Max
TP1
Maximum Quiescent Current
30
μA
V
RTC LDO Input Switched from Main VIN Falling
2.9
Battery to Backup Battery
TP2
CO
RTC LDO Input Switched from
Backup Battery to Main Battery
VIN Rising
3.0
1.0
V
Output Capacitor
Capacitance for Stability
ESR
0.7
5
μF
500
mΩ
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10
LDOs 1 to 5
Unless otherwise noted, VIN = 3.6V, CIN = 1.0 μF, COUT = 0.47 µF, COUT (VRTC) = 1.0 μF ceramic. Typical values and limits appearing
in normal type apply for TJ = 25°C. Limits appearing in boldface type apply over the entire junction temperature range for operation,
−40°C to +125°C. (Notes 2, 6, 7, 10, 11, 15) and (Note 16).
Symbol
VOUT
Parameter
Conditions
Load Current = 1 mA
Min
−3
Typ
Max
3
Units
Output Voltage Accuracy (Default
%
VOUT
)
Accuracy
Line Regulation
VIN =3.1V to 5.0V, (Note 11) Load
Current = 1 mA
0.15
%/V
ΔVOUT
Load Regulation
VIN = 3.6V,
0.011
%/mA
Load Current = 1 mA to IMAX
ISC
Short Circuit Current Limit
LDO1–4, VOUT = 0V
LDO5, VOUT = 0V
400
500
mA
VIN - VOUT Dropout Voltage
Load Current = 50 mA (Note 7)
f = 10 kHz, Load Current = IMAX
IOUT = 0 mA
150
mV
dB
PSRR
IQ
Power Supply Ripple Rejection
45
40
Quiescent Current “On”
Quiescent Current “On”
Quiescent Current “Off”
Turn On Time
IOUT = IMAX
60
µA
μsec
µF
EN is de-asserted
0.03
300
0.47
TON
Start up from Shut-down
Capacitance for Stability
0°C ≤ TJ ≤ 125°C
COUT
Output Capacitor
0.33
0.68
5
1.0
−40°C ≤ TJ ≤ 125°C
ESR
500
mΩ
11
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LDO Dropout Voltage vs. Load Current Collect Data For All LDO’s
Dropout Voltage vs. Load Current
Change in Output Voltage vs. Load Current
20207629
20207630
LDO1 Line Regulation
VOUT = 1.8 volts VIN 3 to 4 volts Load = 100 mA
LDO1 Load Transient
VIN = 4.1 volts VOUT = 1.8 volts no-load-100 mA
20207631
20207632
Enable Start-up time (LDO1)
LDO1 Channel 2 LDO4 Channel 1 Sys_enable from 0 volts
Load = 100 mA
20207633
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Buck Converters SW1, SW2, SW3
Unless otherwise noted, VIN = 3.6V, CIN = 10 μF, COUT = 10 μF, LOUT = 2.2 μH ceramic. Typical values and limits appearing in
normal type apply for TJ = 25°C. Limits appearing in boldface type apply over the entire junction temperature range for operation,
−40°C to +125°C. (Notes 2, 6, 12) and (Note 13).
Symbol
VOUT
Parameter
Output Voltage Accuracy
Efficiency
Conditions
Default VOUT
Min
Typ
Max
Units
%
−3
+3
Eff
Load Current = 500 mA
EN is de-asserted
95
0.1
13
%
ISHDN
Shutdown Supply Current
Sync Mode Clock Frequency
μA
MHz
Synchronized from 13 MHz System
Clock
10.4
15.6
2.4
fOSC
IPEAK
IQ
Internal Oscillator Frequency
Peak Switching Current Limit
Quiescent Current “On”
2.0
2.1
MHz
A
No Load PFM Mode
No Load PWM Mode
21
μA
200
240
200
500
RDSON (P)
RDSON (N)
TON
Pin-Pin Resistance PFET
Pin-Pin Resistance NFET
Turn On Time
mΩ
mΩ
μsec
µF
Start up from Shut-down
Capacitance for Stability
Capacitance for Stability
CIN
Input Capacitor
8
8
CO
Output Capacitor
µF
Buck1 Output Efficiency vs. Load Current Varied from 1mA to 1.5 Amps
VIN = 3, 3.5 volts VOUT = 1.4 volts Forced PWM
VIN = 4.0-4.5 volts VOUT = 1.4 volts Forced PWM
20207634
20207635
13
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VIN = 3, 3.5 volts VOUT = 1.4 volts Forced PWM
Line Transient Response
VIN = 3 – 3.6 V, VOUT = 1.2 V, 250 mA load
20207637
20207636
Load Transient
3.6 VIN, 3.3 VOUT, 0 – 100 mA load
Mode Change
Load transients 20 mA to 560 mA
VOUT = 1.4 volts [PFM to PWM] VIN = 4.1 volts
20207638
20207639
Startup
Startup into PWM Mode 980 mA [channel 2]
VOUT = 1.4 volts VIN = 4.1 volts
20207638
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Back-Up Charger Electrical Characteristics
Unless otherwise noted, VIN = VBATT = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25°C. Limits appearing
in boldface type apply over the entire junction temperature range for operation, −40°C to +125°C. (Notes 2, 6) and (Note 8).
Symbol
VIN
Parameter
Conditions
Voltage at VIN
Min
3.3
Typ
Max
5.5
Units
Operational Voltage Range
Backup Battery Charging Current
V
IOUT
VIN = 3.6V, Backup_Bat = 2.5V,
Backup Battery Charger Enabled
(Note 8)
190
μA
VOUT
Charger Termination Voltage
VIN = 5.0V Backup Battery Charger
Enabled. Programmable
2.91
3.1
9
V
Backup Battery Charger Short Circuit Backup_Bat = 0V, Backup Battery
Current
mA
dB
Charger Enabled
PSRR
Power Supply Ripple Rejection Ratio
15
IOUT ≤ 50 μA, VOUT = 3.15V
VOUT + 0.4 ≤ VBATT = VIN ≤ 5.0V
f < 10 kHz
IQ
Quiescent Current
25
IOUT < 50 μA
μA
μF
COUT
Output Capacitance
Output Capacitor ESR
0.1
0 μA ≤ IOUT ≤ 100 μA
5
500
mΩ
continued the battery switch will disconnect the input of the
LDO_RTC from the main battery and connect to the backup
battery.
LP3972 Battery Switch Operation
The LP3972 has provisions for two battery connections, the
main battery VBAT and Backup Battery
•
The main battery voltage at which the LDO_RTC is
switched over from main to backup battery is 2.8V typically.
There is a hysteric voltage in this switch operation, thus
The function of the battery switch is to connect power to the
LDO_RTC from the appropriate battery, depending on con-
ditions described below:
•
the LDO_RTC will not be reconnected to main battery until
main battery voltage is greater than 3.1V typically.
•
If only the backup battery is applied, the switch will auto-
matically connect the LDO_RTC power to this battery.
If only the main battery is applied, the switch will auto-
matically connect the LDO_RTC power to this battery
If both batteries are applied, and the main battery is suf-
•
The system designer may wish to disable the battery
•
switch when only a main battery is used. This is accomplished
by setting the “no back up battery bit” in the control register
8h’0B bit 7 NBUB. With this bit set to “1”, the above described
switching will not occur, that is the LDO_RTC will remain con-
nected to the main battery even as it is discharged below the
2.9V threshold. The Backup battery input should also be con-
nected to main battery.
•
ficiently charged (VBAT > 3.1V), the switch will automatically
connect the LDO_RTC power to the main battery.
•
As the main battery is discharged a separate circuit called
nBATT_FLT will warn the system. Then if no action is taken
to restore the charge on the main battery, and discharging is
15
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Logic Inputs and Outputs DC Operating Conditions (Note 2)
Logic Inputs (SYS_EN, PWR_EN, SYNC, nRSTI, PWR_ON, nTEST_JIG, SPARE and GPI's)
Symbol
VIL
Parameter
Low Level Input Voltage
High Level Input Voltage
Conditions
Min
Max
0.5
Units
V
V
VIH
VRTC
−0.5V
−1
ILEAK
Input Leakage Current
+1
µA
Logic Outputs (nRSTO, EXT_WAKEUP and GPO's)
Symbol Parameter
VOL Output Low Level
Conditions
Load = +0.2 mA = IOL Max
Load = −0.1 mA = IOL Max
Min
Max
0.5
Units
V
V
VOH
Output High Level
VRTC
−0.5V
ILEAK
Output Leakage Current
VON = VIN
+5
µA
Logic Output (nBATT_FLT)
Symbol Parameter
Conditions
Min
2.4
Typ
Max
3.4
Units
nBATT_FLT Threshold Voltage
Programmable via Serial Interface
Default = 2.8V
2.8
V
VOL
Output Low Level
Output High Level
Load = +0.4 mA = IOL Max
Load = −0.2 mA = IOH Max
0.5
+5
V
V
VOH
VRTC
−0.5V
ILEAK
Input Leakage Current
μA
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16
I2C Compatible Serial Interface Electrical Specifications (SDA and SCL)
Unless otherwise noted, VIN = 3.6V. Typical values and limits appearing in normal type apply for TJ = 25°C. Limits appearing in
boldface type apply over the entire junction temperature range for operation, −40°C to +125°C. (Notes 2, 6) and (Note 9)
Symbol
VIL
Parameter
Low Level Input Voltage
High Level Input Voltage
Low Level Output Voltage
Low Level Output Current
Clock Frequency
Conditions
Min
−0.5
0.7 VRTC
0
Typ
Max
0.3 VRTC
VRTC
Units
(Note 14)
(Note 14)
(Note 14)
V
VIH
VOL
0.2 VTRC
IOL
VOL = 0.4V (Note 14)
(Note 14)
3.0
mA
FCLK
tBF
400
kHz
Bus-Free Time Between Start and Stop
Hold Time Repeated Start Condition
CLK Low Period
(Note 14)
1.3
0.6
1.3
0.6
0.6
0
μs
μs
μs
μs
μs
μs
ns
tHOLD
tCLKLP
tCLKHP
tSU
(Note 14)
(Note 14)
CLK High Period
(Note 14)
Set Up Time Repeated Start Condition
Data Hold Time
(Note 14)
tDATAHLD
tCLKSU
TSU
(Note 14)
Data Set Up Time
(Note 14)
100
0.6
Set Up Time for Start Condition
(Note 14)
μs
TTRANS
Maximum Pulse Width of Spikes that Must (Note 14)
be Suppressed by the Input Filter of Both
DATA & CLK Signals
50
ns
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power
dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the
following equation: TA-MAX = TJ-MAX-OP – (θJA x PD-MAX).
Note 4: Junction-to-ambient thermal resistance (θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the
JEDEC standard JESD51–7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array of thermal vias. The ground plane
on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/1.8 µm/18 µm/36 µm (1.5 oz/1 oz/1 oz/1.5 oz). Ambient temperature in simulation is 22°
C, still air. Power dissipation is 1W. Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum
power dissipation exists, special care must be paid to thermal dissipation issues in board design. The value of θJA of this product can vary significantly, depending
on PCB material, layout, and environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be
paid to thermal dissipation issues. For more information on these topics, please refer to Application Note 1187: Leadless Leadframe Package (LLP) and the Power
Efficiency and Power Dissipation section of this datasheet.
Note 5: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7) The machine model is a 200
pF capacitor discharged directly into each pin. (EAIJ)
Note 6: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are production
tested, guaranteed through statistical analysis or guaranteed by design. All limits at temperature extremes are guaranteed via correlation using standard Statistical
Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
Note 7: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value.
Note 8: Back-up battery charge current is programmable via the I2C compatible interface. Refer to the Application Section for more information.
Note 9: The I2C signals behave like open-drain outputs and require an external pull-up resistor on the system module in the 2 kΩ to 20 kΩ range.
Note 10: LDO_RTC voltage can track LDO3 voltage. LP3972 has a tracking function (nIO_TRACK). When enabled, LDO_RTC voltage will track LDO3 voltage
within 200mV down to 2.8V when LDO3 is enabled
Note 11: VIN minimum for line regulation values is 2.7V for LDOs 1–3 and 1.8V for LDOs 4 and 5. Condition does not apply to input voltages below the minimum
input operating voltage.
Note 12: The input voltage range recommended for ideal applications performance for the specified output voltages is given below:
VIN = 2.7V to 5.5V for 0.80V < VOUT < 1.8V
VIN = (VOUT+ 1V) to 5.5V for 1.8V ≤ VOUT ≤ 3.3V
Note 13: Test condition: for VOUT less than 2.7V, VIN = 3.6V; for VOUT greater than or equal to 2.7V, VIN = VOUT+ 1V.
Note 14: This electrical specification is guaranteed by design.
Note 15: An increase in the load current results in a slight decrease in the output voltage and vice versa.
Note 16: Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This specification does not apply
for input voltages below 2.7V for LDOs 1–3 and 1.8V for LDOs 4 and 5.
17
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next cycle is initiated by the clock turning off the NFET and
turning on the PFET.
Buck Converter Operation
DEVICE INFORMATION
The LP3972 includes three high efficiency step down DC-DC
switching buck converters. Using a voltage mode architecture
with synchronous rectification, the buck converters have the
ability to deliver up to 1600 mA depending on the input volt-
age, output voltage, ambient temperature and the inductor
chosen.
There are three modes of operation depending on the current
required - PWM, PFM, and shutdown. The device operates in
PWM mode at load currents of approximately 100 mA or high-
er, having voltage tolerance of ±3% with 95% efficiency or
better. Lighter load currents cause the device to automatically
switch into PFM for reduced current consumption. Shutdown
mode turns off the device, offering the lowest current con-
sumption (IQ, SHUTDOWN = 0.01 µA typ).
Additional features include soft-start, under voltage protec-
tion, current overload protection, and thermal shutdown
protection.
20207611
FIGURE 1. Typical PWM Operation
The part uses an internal reference voltage of 0.5V. It is rec-
ommended to keep the part in shutdown until the input voltage
is 2.7V or higher.
Internal Synchronous Rectification
While in PWM mode, the converters uses an internal NFET
as a synchronous rectifier to reduce rectifier forward voltage
drop and associated power loss. Synchronous rectification
provides a significant improvement in efficiency whenever the
output voltage is relatively low compared to the voltage drop
across an ordinary rectifier diode.
CIRCUIT OPERATION
The buck converter operates as follows. During the first por-
tion of each switching cycle, the control block turns on the
internal PFET switch. This allows current to flow from the input
through the inductor to the output filter capacitor and load. The
inductor limits the current to a ramp with a slope of (VIN–
VOUT)/L, by storing energy in a magnetic field.
Current Limiting
A current limit feature allows the converters to protect itself
and external components during overload conditions. PWM
mode implements current limiting using an internal compara-
tor that trips at 2.0 A (typ). If the output is shorted to ground
the device enters a timed current limit mode where the NFET
is turned on for a longer duration until the inductor current falls
below a low threshold, ensuring inductor current has more
time to decay, thereby preventing runaway.
During the second portion of each cycle, the controller turns
the PFET switch off, blocking current flow from the input, and
then turns the NFET synchronous rectifier on. The inductor
draws current from ground through the NFET to the output
filter capacitor and load, which ramps the inductor current
down with a slope of –VOUT/L.
The output filter stores charge when the inductor current is
high, and releases it when inductor current is low, smoothing
the voltage across the load.
PFM OPERATION
At very light loads, the converter enters PFM mode and op-
erates with reduced switching frequency and supply current
to maintain high efficiency.
The output voltage is regulated by modulating the PFET
switch on time to control the average current sent to the load.
The effect is identical to sending a duty-cycle modulated rect-
angular wave formed by the switch and synchronous rectifier
at the SW pin to a low-pass filter formed by the inductor and
output filter capacitor. The output voltage is equal to the av-
erage voltage at the SW pin.
The part will automatically transition into PFM mode when ei-
ther of two conditions occurs for a duration of 32 or more clock
cycles:
A: The inductor current becomes discontinuous.
B: The peak PMOS switch current drops below the IMODE
PWM OPERATION
level, (Typically IMODE < 30 mA + VIN/42Ω).
During PWM operation the converter operates as a voltage
mode controller with input voltage feed forward. This allows
the converter to achieve good load and line regulation. The
DC gain of the power stage is proportional to the input voltage.
To eliminate this dependence, feed forward inversely propor-
tional to the input voltage is introduced.
While in PWM (Pulse Width Modulation) mode, the output
voltage is regulated by switching at a constant frequency and
then modulating the energy per cycle to control power to the
load. At the beginning of each clock cycle the PFET switch is
turned on and the inductor current ramps up until the com-
parator trips and the control logic turns off the switch. The
current limit comparator can also turn off the switch in case
the current limit of the PFET is exceeded. Then the NFET
switch is turned on and the inductor current ramps down. The
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18
the “high” PFM comparator threshold, the PMOS power
switch is turned on. It remains on until the output voltage
reaches the ‘high’ PFM threshold or the peak current exceeds
the IPFM level set for PFM mode. The typical peak current in
PFM mode is: IPFM = 112 mA + VIN/27Ω. Once the PMOS
power switch is turned off, the NMOS power switch is turned
on until the inductor current ramps to zero. When the NMOS
zero-current condition is detected, the NMOS power switch is
turned off. If the output voltage is below the ‘high’ PFM com-
parator threshold (see Figure 3), the PMOS switch is again
turned on and the cycle is repeated until the output reaches
the desired level. Once the output reaches the ‘high’ PFM
threshold, the NMOS switch is turned on briefly to ramp the
inductor current to zero and then both output switches are
turned off and the part enters an extremely low power mode.
Quiescent supply current during this ‘sleep’ mode is 21 μA
(typ), which allows the part to achieve high efficiencies under
extremely light load conditions. When the output drops below
the ‘low’ PFM threshold, the cycle repeats to restore the out-
put voltage (average voltage in PFM mode) to <1.15% above
the nominal PWM output voltage. If the load current should
increase during PFM mode (see Figure 3) causing the output
voltage to fall below the ‘low2’ PFM threshold, the part will
automatically transition into fixed-frequency PWM mode. Typ-
ically when VIN = 3.6V the part transitions from PWM to PFM
mode at 100 mA output current .
20207612
FIGURE 2. Typical PFM Operation
During PFM operation, the converter positions the output volt-
age slightly higher than the nominal output voltage during
PWM operation, allowing additional headroom for voltage
drop during a load transient from light to heavy load. The PFM
comparators sense the output voltage via the feedback pin
and control the switching of the output FETs such that the
output voltage ramps between <0.6% and <1.7% above the
nominal PWM output voltage. If the output voltage is below
20207613
FIGURE 3. Operation in PFM Mode and Transfer to PWM Mode
SHUTDOWN MODE
SOFT START
During shutdown the PFET switch, reference, control and
bias circuitry of the converters are turned off. The NFET
switch will be open in shutdown to discharge the output. When
the converter is enabled, EN, soft start is activated. It is rec-
ommended to disable the converter during the system power
up and undervoltage conditions when the supply is less than
2.7V.
The buck converter has a soft-start circuit that limits in-rush
current during start-up. During start-up the switch current limit
is increased in steps. Soft start is activated only if EN goes
from logic low to logic high after VIN reaches 2.7V. Soft start
is implemented by increasing switch current limit in steps of
213 mA, 425 mA, 850 mA and 1700 mA (typ. Switch current
limit). The start-up time thereby depends on the output ca-
pacitor and load current demanded at start-up. Typical start-
19
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up times with 10 μF output capacitor and 1000 mA load
current is 390 μs and with 1 mA load current it is 295 μs.
switching frequency, FC, is one parameter that system de-
signers want to be as low as practical to reduce interference
to the environment and subsystems within their products. The
LP3972 has a user selectable function on chip, wherein a
noise reduction technique known as “spread spectrum” can
be employed to ease customer’s design and production is-
sues.
LDO - LOW DROP OUT OPERATION
The LP3972 can operate at 100% duty cycle (no switching;
PMOS switch completely on) for low drop out support of the
output voltage. In this way the output voltage will be controlled
down to the lowest possible input voltage. When the device
operates near 100% duty cycle, output voltage ripple is ap-
proximately 25 mV. The minimum input voltage needed to
support the output voltage is
The principle behind spread spectrum is to modulate the
switching frequency slightly and slowly, and spread the signal
frequency over a broader bandwidth. Thus, its power spectral
density becomes attenuated, and the associated interference
electro-magnetic energy is reduced. The clock used to mod-
ulate the LP3972 buck regulator can be used as a spread
spectrum clock via 2 I2C control register (System Control
Register 1 (SCR1) 8h’80) bits bk_ssen, and slomod. With this
feature enabled, the intense energy of the clock frequency
can be spread across a small band of frequencies in the
neighborhood of the center frequency. The results in a re-
duction of the peak energy!
VIN, MIN = ILOAD * (RDSON, PFET + RINDUCTOR) + VOUT
Load Current
• ꢀILOAD
Drain to source resistance of PFET
switch in the triode region
• ꢀRDSON, PFET
Inductor resistance
• ꢀRINDUCTOR
SPREAD SPECTRUM FEATURE
The LP3972 spread spectrum clock uses a triangular modu-
lation profile with equal rise and fall slopes. The modulation
has the following characteristics:
Periodic switching in the buck regulator is inherently a noisier
function block compared to an LDO. It can be challenging in
some critical applications to comply with stringent regulatory
standards or simply to minimize interference to sensitive cir-
cuits in space limited portable systems. The regulator’s
switching frequency and harmonics can cause “noise” in the
signal spectrum. The magnitude of this noise is measured by
its power spectral density. The power spectral density of the
•
•
•
•
The center frequency:
The modulating frequency,
Peak frequency deviation:
Modulation index
FC = 2 MHz, and
fM = 6.8 kHz or 12 kHz.
Δ_f = ±100 kHz (or ±5%)
β = Δ_f/fM = 14.7 or 8.3
Switching Energy RBW = 300 Hz
20207641
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20
I2C Compatible Interface
I2C DATA VALIDITY
The data on SDA line must be stable during the HIGH period
of the clock signal (SCL). In other words, state of the data line
can only be changed when CLK is LOW.
20207614
I2C START and STOP CONDITIONS
START and STOP bits. The I2C bus is considered to be busy
after START condition and free after STOP condition. During
data transmission, I2C master can generate repeated START
conditions. First START and repeated START conditions are
equivalent, function-wise.
START and STOP bits classify the beginning and the end of
the I2C session. START condition is defined as SDA signal
transitioning from HIGH to LOW while SCL line is HIGH.
STOP condition is defined as the SDA transitioning from LOW
to HIGH while SCL is HIGH. The I2C master always generates
20207615
TRANSFERRING DATA
acknowledge. A receiver which has been addressed must
generate an acknowledge after each byte has been received.
Every byte put on the SDA line must be eight bits long, with
the most significant bit (MSB) being transferred first. The
number of bytes that can be transmitted per transfer is unre-
stricted. Each byte of data has to be followed by an acknowl-
edge bit. The acknowledge related clock pulse is generated
by the master. The transmitter releases the SDA line (HIGH)
during the acknowledge clock pulse. The receiver must pull
down the SDA line during the 9th clock pulse, signifying an
After the START condition, a chip address is sent by the I2C
master. This address is seven bits long followed by an eighth
bit which is a data direction bit (R/W). The LP3972 address is
34h. For the eighth bit, a “0” indicates a WRITE and a “1”
indicates a READ. The second byte selects the register to
which the data will be written. The third byte contains data to
write to the selected register.
I2C CHIP ADDRESS - 7h'34
MSB
ADR6
Bit7
ADR5
Bit6
ADR4
Bit5
ADR3
Bit4
ADR2
Bit3
ADR1
Bit2
ADR0
Bit1
R/W
Bit0
0
1
1
0
1
0
0
R/W
21
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Write Cycle
Write cycle
20207616
Read Cycle
When a READ function is to be accomplished, a WRITE function must precede the READ function as follows.
Read Cycle
20207617
w = write (SDA = “0”)
r = read (SDA = “1”)
ack = acknowledge (SDA pulled down by either master or slave)
rs = repeated start
id = 34h (Chip Address)
I2C DVM Timing for VCC_APPS (Buck1)
20207618
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22
MULTI-BYTE I2C COMMAND SEQUENCE
Register A Address, Ach,
Register A Data, Ach
Device Address,
To correctly function with the Monahan’s Power Management
I2C the LP3972’s I2C serial interface shall support Random
register Multi-byte command sequencing: During a multi-byte
write the Master sends the Start command followed by the
Device address, which is sent only once, followed by the 8 Bit
register address, then 8 bits of data. The I2C slave must then
accept the next random register address followed by 8 bits of
data and continue this process until the master sends a valid
stop condition.
Register M Address, Ach,
Register M Data, Ach
Register X Address, Ach,
Register X Data, Ach
Register Z Address, Ach,
Register Z Data, Ach, Stop
Note: the PMIC is not required to see the I2C device address
for each transaction. A, M, X, and Z are Random numbers.
A Typical Multi-byte random register transfer is outlined
below:
20207642
INCREMENTAL REGISTER I2C COMMAND SEQUENCE
been sent. Address incrimination may be required for non
XScale applications. User can define whether multi-byte (de-
fault) to random address or address incrimination will be used.
The LP3972 supports address increment (burst mode). When
you have defined register address n data bytes can be sent
and register address is incremented after each data byte has
20207643
23
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LP3972 CONTROL REGISTER
Register Name
Register Address
8h’07
8h’10
8h’11
8h’12
8h’13
8h’20
8h’23
8h’24
8h’25
8h’26
8h’27
8h’29
8h’2A
8h’32
8h’33
8h’39
8h’3A
8h’80
8h’81
8h’82
8h’83
8h’84
8h’85
8h’86
8h’87
8h’88
8h’89
8h’8E
8h’8F
Read/Write
R/W
R/W
R
Register Description
System Control Register
SCR
OVER1
OVSR1
OVER2
OVSR2
Output Voltage Enable Register 1
Output Voltage Status Register 1
Output Voltage Enable Register 2
Output Voltage Status Register 2
Voltage Change Control Register 1
Buck1 Target Voltage 1 Register
Buck1 DVM Target Voltage 2 Register
VCC_APPS Voltage Ramp Control
Dummy Register
R/W
R
VCC
1
R/W
R/W
R/W
R/W
W
ADTV1
ADTV2
AVRC
CDTC1
CDTC2
SDTV1
SDTV2
MDTV1
MDTV2
L2VCR
L34VCR
SCR1
W
Dummy Register
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
LDO5 Target Voltage 1
LDO5 Target Voltage 2
LDO1 Target Voltage 1 Register
LDO1 Voltage 2 Register
LDO2 Voltage Control Registers
LDO3 & LDO4 Voltage Control Registers
System Control Register 1
SCR2
System Control Register 2
OEN3
Output Voltage Enable Register 3
Output Voltage Status Register 3
Output Voltage Enable Register 3
VCC_Buck2 Target Voltage
OSR3
LOER4
B2TV
B3TV
VCC_Buck3 Target Voltage
B32RC
ISRA
Buck 3:2 Voltage Ramp Control
Interrupt Status Register A
BCCR
II1RR
R/W
R
Backup Battery Charger Control Register
Internal 1 Revision Register
Internal 2 Revision Register
II2RR
R
SERIAL INTERFACE REGISTER SELECTION CODES (Bold face voltages are default values)
System Control Status Register
Register is an 8-bit register which specifies the control bits for the PMIC clocks. This register works in conjunction with the SYNC
pin where an external clock PLL buffer operating at 13 MHz is synchronized with the oscillators of the buck converters.
System Control Register (SCR) 8h’07
Bit
7
6
5
4
Reserved
0
3
2
1
0
CLK_SCL
0
Designation
Reset Value
0
0
0
0
0
0
System Control Register (SCR) 8h’07 Definitions
Bit
7-1
0
Access
—
Name
—
Description
Reserved
R/W
CLK_SCL
External Clock Select
0 = Internal Oscillator clock for Buck Converters
1 = External 13 MHz Oscillator clock for Buck Converters
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24
OUTPUT VOLTAGE ENABLE REGISTER 1
This register enables or disables the low voltage supplies LDO1 and Buck1. See details below.
Output Voltage Enable Register 1 (OVER1) 8h’10
Bit
7
6
5
Reserved
0
4
3
2
S_EN
1
1
Reserved
0
0
A_EN
1
Designation
Reset Value
0
0
0
0
Output Voltage Enable Register 1 (OVER1) 8h’10 Definitions
Bit
Access
Name
Description
7-3
2
Reserved
—
R/W
—
S_EN
VCC_SRAM (LDO5) Supply Output Enabled
0 = VCC_SRAM (LDO5) Supply Output Disabled
1 = VCC_SRAM (LDO5) Supply Output Enabled
1
0
Reserved
—
R/W
—
A_EN
VCC_APPS (Buck1) Supply Output Enabled
0 = VCC_APPS (Buck1) Supply Output Disabled
1 = VCC_APPS (Buck1) Supply Output Enabled
OUTPUT VOLTAGE STATUS REGISTER
This 8 bit register is used to indicate the status of the low voltage supplies. By polling each of the specify supplies is within its
specified operating range.
Output Voltage Status Register 1 (OVSR1) 8h’11
Bit
7
LP_OK
0
6
5
4
3
2
S_OK
0
1
Reserved
0
0
A_OK
0
Designation
Reset Value
Reserved
0
0
0
0
Output Voltage Status Register 1 (OVSR1) 8h’11 Definitions
Bit
Access
Name
Description
Low Voltage Supply Output Voltage Status
7
R
LP_OK
0 - VCC_APPS (Buck1) & VCC_SRAM (LDO5) output voltage < 90% of
selected value
1 - VCC_APPS (Buck1) & VCC_SRAM (LDO5) output voltage > 90% of
selected value
6:3
2
Reserved
—
R
—
S_OK
VCC_SRAM Supply Output Voltage Status
0 - VCC_SRAM (LDO5) output voltage < 90% of selected value
1 - VCC_SRAM (LDO5) output voltage > 90% of selected value
1
0
Reserved
—
R
—
A_OK
VCC_APPS Supply output Voltage Status
0 - VCC_APPS (Buck1) output voltage < 90% of selected value
1 - VCC_APPS (Buck1) output voltage > 90% of selected value
25
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OUTPUT VOLTAGE ENABLE REGISTER 2
This 8 bit output register enables and disables the output voltages on the LDOs 2,3,4 supplies.
Output Voltage Enable Register 2 (OVER2) 8h’12
Bit
Designation
Reset Value
7
6
Reserved
0
5
4**
LDO4_EN
0
3**
LDO3_EN
0
2**
LDO2_EN
0
1
0
Reserved
0
0
0
0
Note: ** denotes one time factory programmable EPROM registers for default values
Output Voltage Enable Register 2 (OVER2) 8h’12 Definitions
Bit
7
Access
—
Name
Description
Reserved
Reserved
Reserved
—
—
6
—
5
—
—
4
R/W
LDO4_EN
LDO4 Output Voltage Enable
0 = LDO4 Supply Output Disabled, Default
1 = LDO4 Supply Output Enabled
3
2
R/W
R/W
LDO3_EN
LDO2_EN
LDO3 Output Voltage Enable
0 = LDO3 Supply Output Disabled, Default
1 = LDO3 Supply Output Enabled
LDO2 Output Voltage Enable
0 = LDO2 Supply Output Disabled, Default
1 = LDO2 Supply Output Enabled
1
0
Reserved
Reserved
—
—
—
—
OUTPUT VOLTAGE ENABLE REGISTER 2
Output Voltage Status Register 2 (OVSR2) 8h’13
Bit
Designation
Reset Value
7
LDO_OK
0
6
N/A
0
5
N/A
0
4
LDO4_OK
0
3
LDO3_OK
0
2
LDO2_OK
0
1
N/A
0
0
N/A
0
Output Voltage Status Register 2 (OVSR2) 8h’13 Definitions
Bit
Access
Name
Description
LDOs 2-4 Supply Output Voltage Status
7
R
LDO_OK
0 - (LDOs 2-4) output voltage < 90% of selected value
1 - (LDOs 2-4) output voltage > 90% of selected value
6
5
4
Reserved
Reserved
—
—
R
—
—
LDO4_OK
LDO4 Output Voltage Status
0 - (VCC_LDO4) output voltage < 90% of selected value
1 - (VCC_LDO4) output voltage > 90% of selected value
3
2
R
R
LDO3_OK
LDO2_OK
LDO3 Output Voltage Status
0 - (VCC_LDO3) output voltage < 90% of selected value
1 - (VCC_LDO3) output voltage > 90% of selected value
LDO2 Output Voltage Status
0 - (VCC_LDO2) output voltage < 90% of selected value
1 - (VCC_LDO2) output voltage > 90% of selected value
1
0
Reserved
Reserved
—
—
—
—
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26
DVM VOLTAGE CHANGE CONTROL REGISTER 1
DVM Voltage Change Control Register 1 (VCC1) 8h’20
Bit
7
MVS
0
6
MGO
0
5
SVS
0
4
SGO
0
3
2
1
AVS
0
0
AGO
0
Designation
Reset Value
Reserved
0
0
DVM Voltage Change Control Register 1 (VCC1) 8h’20 Definitions
Bit
Access
Name
Description
VCC_MVT (LDO1) Voltage Select
7
R/W
MVS
0 - Change VCC_MVT Output Voltage to MDVT1
1 - Change VCC_MVT Output Voltage to MDVT2
6
5
4
R/W
R/W
R/W
MGO
SVS
Start VCC_MVT (LDO1) Voltage Change
0 - Hold VCC_MVT Output Voltage at current Level
1 - Ramp VCC_MVT Output Voltage as selected by MVS
VCC_SRAM (LDO5) Voltage Select
0 - Change VCC_SRAM Output Voltage to SDTV1
1 - Change VCC_SRAM Output Voltage to SDTV2
SGO
Start VCC_SRAM (LDO5) Voltage Change
0 - Hold VCC_SRAM Output Voltage at current Level
1 - Change VCC_SRAM Output Voltage as selected by SVS
3:2
1
Reserved
—
R/W
—
AVS
VCC_APPS (Buck1) Voltage Select
0 - Ramp VCC_APPS Output Voltage to ADVT1
1 - Ramp VCC_APPS Output Voltage to ADVT2
0
R/W
AGO
Start VCC_APPS(Buck1) Voltage Change
0 - Hold VCC_APPS Output Voltage at current Level
1 - Ramp VCC_APPS Output Voltage as selected by AVS
27
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BUCK1 (VCC_APPS) VOLTAGE 1
Buck1 (VCC_APPS) Target Voltage 1 Register (ADTV1) 8h’23
Bit
7
6
Reserved
0
5
4**
3**
2**
1**
0**
Designation
Reset Value
Buck1 Output Voltage (B1OV1)
0
0
0
1
0
1
1
Note: ** denotes one time factory programmable
Buck1 (VCC_APPS) Target Voltage 1 Register (ADTV1) 8h’23 Definitions
Bit
7:5
4:0
Access
—
Name
—
Description
Reserved
R/W
B1OV1
Data Code
5h’0
Output Voltage
0.725
Data Code
5h’10
5h’11
5h’12
5h’13
5h’14
5h’15
5h’16
5h’17
5h’18
5h’19
5h’1A
5h’1B
5h’1C
5h’1D
5h’1E
5h’1F
Output Voltage
1.125
5h’1
5h’2
5h’3
5h’4
5h’5
5h’6
5h’7
5h’8
0.750
0.775
0.800
0.825
0.850
0.875
0.900
0.925
0.950
0.975
1.000
1.025
1.050
1.075
1.100
1.150
1.175
1.200
1.225
1.250
1.275
1.300
1.325
1.350
1.375
1.400
1.425
1.450
1.475
1.500
5h’9
5h’A
5h’B
5h’C
5h’D
5h’E
5h’F
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28
BUCK1 (VCC_APPS) TARGET VOLTAGE 2 REGISTER
Buck1 (VCC_APPS) Target Voltage 2 Register (ADTV2) 8h’24
Bit
7
6
Reserved
0
5
4
3
2
1
0
Designation
Reset Value
Buck1 Output Voltage (B1OV2)
0
0
0
1
0
1
1
Buck1 (VCC_APPS) Target Voltage 2 Register (ADTV2) 8h’24 Definitions
Bit
7:5
4:0
Access
—
Name
—
Description
Reserved
Data Code
R/W
B1OV2
Output Voltage
0.725
Data Code
5h’10
5h’11
5h’12
5h’13
5h’14
5h’15
5h’16
5h’17
5h’18
5h’19
5h’1A
5h’1B
5h’1C
5h’1D
5h’1E
5h’1F
Output Voltage
1.125
5h’0
5h’1
5h’2
5h’3
5h’4
5h’5
5h’6
5h’7
5h’8
5h’9
5h’A
5h’B
5h’C
5h’D
5h’E
5h’F
0.750
0.775
0.800
0.825
0.850
0.875
0.900
0.925
0.950
0.975
1.000
1.025
1.050
1.075
1.100
1.150
1.175
1.200
1.225
1.250
1.275
1.300
1.325
1.350
1.375
1.400
1.425
1.450
1.475
1.500
29
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BUCK1 (VCC_APPS) VOLTAGE RAMP CONTROL REGISTER
Buck1 (VCC_APPS) Voltage Ramp Control Register (AVRC) 8h’25
Bit
7
6
Reserved
0
5
4
3
2
1
0
Designation
Reset Value
Ramp Rate (B1RR)
0
0
0
0
1
1
0
Buck1 (VCC_APPS) Voltage Ramp Control Register (AVRC) 8h’25 Definitions
Bit
Access
Name
Description
7:5
Reserved
—
—
DVM Ramp Speed
Data Code
Ramp Rate (mV/uS)
5h’0
5h’1
Instant
1
5h’2
2
5h’3
3
5h’4
5h’5
4
5
4:0
R/W
B1RR
5h’6
6
5h’7
7
5h’8
8
5h’9
5h’A
4h’B-4h’1F
9
10
Reserved
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30
VCC_COMM TARGET VOLTAGE 1 DUMMY REGISTER (CDTV1)
VCC_COMM Target Voltage 1 Dummy Register (CDTV1) 8h’26 Write Only
Bit
7
6
Reserved
0
5
4
3
2
1
0
Designation
Reset Value
Output Voltage
0
0
0
0
0
0
0
Note: CDTV1 must be writable by an I2C controller. This is a dummy register
VCC_COMM TARGET VOLTAGE 2 DUMMY REGISTER (CDTV2)
VCC_COMM Target Voltage 2 Dummy Register (CDTV2) 8h’27 Write Only
Bit
7
6
Reserved
0
5
4
3
2
1
0
Designation
Reset Value
Output Voltage
0
0
0
0
0
0
0
Note: CDTV2 must be writable by an I2C controller. This is a dummy register and can not be read.
This is a variable voltage supply to the internal SRAM of the Application processor.
LDO5 (VCC_SRAM) TARGET VOLTAGE 1 REGISTER
LDO5 (VCC_SRAM) Target Voltage 1 Register (SDTV1) 8H'29
Bit
7
6
Reserved
0
5
4**
3**
2**
1**
0**
Designation
Reset Value
LDO 5 Output Voltage (L5OV)
0
0
0
1
0
1
1
Note: ** denotes one time factory programmable EPROM registers for default values
LDO5 (VCC_SRAM) Target Voltage 1 Register (SDTV1) 8h’29 Definitions
Bit
7:5
4:0
Access
—
Name
—
Description
Reserved
Data Code
R/W
B1OV
Output Voltage
—
Data Code
Output Voltage
1.125
5h’0
5h’1
5h’2
5h’3
5h’4
5h’5
5h’6
5h’7
5h’8
5h’9
5h’A
5h’B
5h’C
5h’D
5h’E
5h’F
5h’10
5h’11
5h’12
5h’13
5h’14
5h’15
5h’16
5h’17
5h’18
5h’19
5h’1A
5h’1B
5h’1C
5h’1D
5h’1E
5h’1F
1.150
1.175
1.200
1.225
1.250
1.275
1.300
1.325
1.350
1.375
1.400
1.425
1.450
1.475
1.500
—
—
—
—
0.850
0.875
0.900
0.925
0.950
0.975
1.000
1.025
1.050
1.075
1.100
31
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LDO5 (VCC_SRAM) TARGET VOLTAGE 2 REGISTER
LDO5 (VCC_SRAM) Target Voltage 2 Register (SDTV2) 8h’2A
Bit
7
6
Reserved
0
5
4
3
2
1
0
Designation
Reset Value
LDO 5 Output Voltage (L5OV)
0
0
0
1
0
1
1
LDO5 (VCC_SRAM) Target Voltage 2 Register (SDTV2) 8h’2A Definitions
Bit
7:5
4:0
Access
—
Name
—
Description
Reserved
Data Code
R/W
B1OV
Output Voltage
—
Data Code
Output Voltage
1.125
5h’0
5h’1
5h’2
5h’3
5h’4
5h’5
5h’6
5h’7
5h’8
5h’9
5h’A
5h’B
5h’C
5h’D
5h’E
5h’F
5h’10
5h’11
5h’12
5h’13
5h’14
5h’15
5h’16
5h’17
5h’18
5h’19
5h’1A
5h’1B
5h’1C
5h’1D
5h’1E
5h’1F
1.150
1.175
1.200
1.225
1.250
1.275
1.300
1.325
1.350
1.375
1.400
1.425
1.450
1.475
1.500
—
—
—
—
0.850
0.875
0.900
0.925
0.950
0.975
1.000
1.025
1.050
1.075
1.100
VCC_MVT is low tolerance regulated power supply for the application processor ring oscillator and logic for communicating to the
LP3972. VCC_MVT is enabled when SYS_EN is asserted and disabled when SYS_EN is deasserted.
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32
LDO1 (VCC_MVT) TARGET VOLTAGE 1 REGISTER (MDTV1)
LDO1 (VCC_MVT) Target Voltage 1 Register (MDTV1) 8h’32
Bit
7
6
Reserved
0
5
4**
3**
2**
1**
0**
Designation
Reset Value
Output Voltage (OV)
1
0
0
0
0
0
0
Note: ** denotes one time factory programmable EPROM registers for default values
LDO1 (VCC_MVT) Target Voltage 1 Register (MDTV1) 8h’32 Definitions
Bit
7:5
4:0
Access
—
Name
—
Description
Reserved
Data Code
R/W
L1OV
Output Voltage
1.700
Notes:
5h’0
5h’1
1.725
5h’2
1.750
5h’3
1.775
5h’4
5h’5
1.800
1.825
5h’6
1.850
5h’7
1.875
5h’8
1.900
5h’9
1.925
5h’A
5h’B
5h’C
5h’D-5h’F
1.950
1.975
2.000
Reserved
33
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LDO1 (VCC_MVT) TARGET VOLTAGE 2 REGISTER
LDO1 (VCC_MVT) Target Voltage 2 Register (MDTV2) 8h’33
Bit
7
6
Reserved
0
5
4
3
2
1
0
Designation
Reset Value
Output Voltage (OV)
0
0
0
0
1
1
1
LDO1 (VCC_MVT) Target Voltage 2 Register (MDTV2) 8h’33 Definitions
Bit
7:5
4:0
Access
—
Name
—
Description
Reserved
Data Code
R/W
L1OV
Output Voltage
1.700
Notes:
5h’0
5h’1
1.725
5h’2
1.750
5h’3
1.775
5h’4
5h’5
1.800
1.825
5h’6
1.850
5h’7
1.875
5h’8
1.900
5h’9
1.925
5h’A
5h’B
5h’C
5h’D-5h’F
1.950
1.975
2.000
Reserved
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34
LDO2 VOLTAGE CONTROL REGISTER (L12VCR)
LDO2 Voltage Control Register (L12VCR) 8h’39
Bit
7**
6**
5**
4**
3
2
1
0
Designation
Reset Value
LDO2 Output Voltage (L2OV)
Reserved
0
0
0
0
0
0
0
0
Note: ** denotes one time factory programmable EPROM registers for default values
LDO2 Voltage Control Register (L12VCR) 8h’39 Definitions
Bit
Access
Name
Description
7:4
R/W
L2OV
Data Code
4h’0
4h’1
Output Voltage
Notes:
Default
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
4h’2
4h’3
4h’4
4h’5
4h’6
4h’7
4h’8
4h’9
4h’A
4h’B
4h’C
4h’D
4h’E
4h’F
3:0
Reserved
—
—
35
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LDO4 – LDO3 VOLTAGE CONTROL REGISTER (L34VCR)
LDO4 – LDO3 Voltage Control Register (L34VCR) 8h’3A
Bit
Designation
Reset Value
7**
6**
5**
4**
3**
2**
1**
0**
LDO4 Output Voltage (L4OV)
LDO3 Output Voltage (L3OV)
0
0
0
0
0
0
0
0
Note: ** denotes one time factory programmable EPROM registers for default values
LDO4 – LDO3 Voltage Control Register (L34VCR) 8h’3A Definitions
Bit
Access
Name
Description
7:4
R/W
L4OV
Data Code
4h’0
4h’1
Output Voltage
1.00
Notes:
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
1.50
1.80
1.90
2.50
2.80
3.00
3.30
4h’2
4h’3
4h’4
4h’5
4h’6
4h’7
4h’8
4h’9
4h’A
4h’B
4h’C
4h’D
4h’E
4h’F
ꢀ
Default
3:0
R/W
L3OV
Data Code
4h’0
Output Voltage
Notes:
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
4h’1
4h’2
4h’3
4h’4
4h’5
4h’6
4h’7
4h’8
4h’9
4h’A
4h’B
4h’C
4h’D
4h’E
4h’F
ꢀ
Default
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36
NSC DEFINED CONTROL AND STATUS REGISTERS
SYSTEM CONTROL REGISTER 1 (SCR1)
System Control Register 1 (SCR1) 8h’80
Bit
Designation
Reset Value
7**
BPSEN
0
6**
5**
4
FPWM3
0
3
FPWM2
0
2
FPWM1
0
1
0
BK_SSEN
0
SENDL
BK_SLOMOD
0
1
0
Note: ** denotes one time factory programmable EPROM registers for default values
System Control Register 1 (SCR1) 8h’80 Definitions
Bit
Access
Name
Description
7
R/W
BPSEN
Bypass System enable safety Lock. Prevents activation of PWR_EN
when SYS_EN is low.
0 = PWR_EN “AND” with SYS_EN signal, Default
1 = PWR_EN independent of SYS_EN
Delay time for High Voltage Power Domains LDO2, LDO3, LDO4,
Buck2, and Buck3 after activation of SYS_EN. VCC_LDO1 has no
delay.
Data Code
2h’0
Delay mS
0.0
Notes:
6:5
R/W
SENDL
ꢀ
ꢀ
2h’1
2h’2
2h’3
0.5
1.0
1.4
Default
4
3
2
1
0
R/W
R/W
R/W
R
FPWM3
FPWM2
Buck3 PWM/PFM Mode select
0 - Auto Switch between PFM and PWM operation
1 - PWM Mode Only will not switch to PFM
Buck2 PWM/PFM Mode select
0 - Auto Switch between PFM and PWM operation
1 - PWM Mode Only will not switch to PFM
FPWM1
Buck1 PWM/PFM Mode select
0 - Auto Switch between PFM and PWM operation
1 - PWM Mode Only will not switch to PFM
BK_SLOMOD
BK_SSEN
Buck Spread Spectrum Modulation Bucks 1-3
0 = 10 kHz triangular wave spread spectrum modulation
1 = 2 kHz triangular wave spread spectrum modulation
R
Spread spectrum function Bucks 1-3
0 = SS Output Disabled
1 = SS Output Enabled
37
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SYSTEM CONTROL REGISTER 2 (SCR2)
System Control Register 2 (SCR2) 8h’81
Bit
7
BBCS
1
6
SHBU
0
5**
BPTR
1
4
WUP3
1
3
2
1
0
Designation
GPIO2
GPIO1
0
0
1
0
Note: ** denotes one time factory programmable EPROM registers for default values
System Control Register 2 (SCR2) 8h’81 Definitions
Bit
Access
Name
Description
7
R/W
BBCS
Sets GPIO1 as control input for Back Up battery charger
0 - Back Up battery Charger GPIO Disabled
1 - Back Up battery Charger GPIO Pin Enabled
Shut down Back up battery to prevent battery drain during shipping
0 = Back up Battery Enabled
1 = Back up battery Disabled
6
5
R/W
R/W
SHBU
BPTR
Bypass LDO_RTC Output Voltage to LDO3 Output Voltage Tracking
0 - LDO_RTC3 Tracking enabled
1 - LDO_RTC3 Tracking disabled, Default
4
R/W
R/W
WUP3
GPIO2
Spare Wakeup control input
0 - Active High
1 - Active Low
3:2
Configure direction and output sense of GPIO2 Pin
Data Code
2h’00
GPIO2
Hi-Z
2h’01
2h’02
Output Low
Input
2h’03
Output high
1:0
R/W
GPIO1
Configure direction and output sense of GPIO1 Pin
Data Code
2h’00
GPIO1
Hi-Z
2h’01
2h’02
Output Low
Input
2h’03
Output high
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38
OUTPUT ENABLE 3 REGISTER (OEN3) 8H’82
Bit
Designation
Reset Value
7
6
Reserved
0
5
4**
B3EN
1
3
ENFLAG
0
2**
B2EN
1
1
Reserved
0
0**
L1EN
1
0
0
Note: ** denotes one time factory programmable EPROM registers for default values
OUTPUT ENABLE 3 REGISTER (OEN3) 8H’82 DEFINITIONS
Bit
7:5
4
Access
—
Name
—
Description
Reserved
R/W
B3EN
VCC_Buck3 Supply Output Enabled
0 = VCC_Buck3 Supply Output Disabled
1 = VCC_Buck3 Supply Output Enabled, Default
3
2
R/W
R/W
ENFLAG
B2EN
Enable for Temperature Flags (BCT)
0 = Temperature Flag Disabled
1 = Temperature Flag Enabled
VCC_Buck2 Supply Output Enabled
0 = VCC_Buck2 Supply Output Disabled
1 = VCC_Buck2 Supply Output Enabled, Default
1
0
Reserved
—
R/W
—
L1EN
LDO1 (MVT)Output Voltage Enable
0 = LDO1 Supply Output Disabled
1 = LDO1 Supply Output Enabled, Default
STATUS REGISTER 3 (OSR3) 8H’83
Bit
Designation
Reset Value
7
BT_OK
0
6
5
B2_OK
0
4
LDO1_OK
0
3
Reserved
0
2
1
BCT1
0
0
BCT0
0
B3_OK
BCT2
0
0
STATUS REGISTER 3 (OSR3) DEFINITIONS 8H’83
Bit
Access
Name
Description
7
R
BT_OK
Bucks 2-3 Supply Output Voltage Status
0 - (Bucks 1-3) output voltage < 90% Default value
1 - (Bucsk 1-3) output voltage > 90% Default value
6
5
4
R
R
R
B3_OK
B2_OK
Buck3 Supply Output Voltage Status
0 - (Buck3) output voltage < 90% Default value
1 - (Buck3) output voltage > 90% Default value
Buck2 Supply Output Voltage Status
0 - (Buck2) output voltage < 90% Default value
1 - (Buck2) output voltage > 90% Default value
LDO1_OK
LDO1 Output Voltage Status
0 - (VCC_LDO1) output voltage < 90% of selected value
1 - (VCC_LDO1) output voltage > 90% of selected value
3
Reserved
—
—
39
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Bit
Access
Name
Description
2:0
R
BCT
Binary coded thermal management flag status register
Temperature
Ascending °C
ꢀ
Data Code
000
40
60
001
80
010
100
011
120
100
140
101
160
110
Reserved
111
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40
LOGIC OUTPUT ENABLE REGISTER (LOER) 8H’84
Bit
Designation
Reset Value
7
Reserved
0
6*
B3ENC
1
5*
B2ENC
1
4*
B1ENC
0
3*
L5EC
0
2*
L4EC
1
1*
L3EC
1
0*
L2EC
1
Note: ** denotes one time factory programmable EPROM registers for default values
LOGIC OUTPUT ENABLE REGISTER (LOER) DEFINITIONS 8H’84
Bit
7
Access
—
Name
—
Description
Reserved
6
R/W
B3ENC
Connects Buck3 enable to SYS_EN or PWR_EN Logic Control pin
0 - Buck3 enable connected to PWR_EN
1 - Buck3 enable connected to SYS_EN, Default
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
B2ENC
B1ENC
L5EC
Connects Buck2 enable to SYS_EN or PWR_EN Logic Control pin
0 - Buck2 enable connected to PWR_EN
1 - Buck2 enable connected to SYS_EN, Default
Connects Buck1 enable to SYS_EN or PWR_EN Logic Control pin
0 - Buck1 enable connected to PWR_EN, Default
1 - Buck1 enable connected to SYS_EN
Connects LDO5 enable to SYS_EN or PWR_EN Logic Control pin
0 - LDO5 enable connected to PWR_EN, Default
1 - LDO5 enable connected to SYS_EN
L4EC
Connects LDO4 enable to SYS_EN or PWR_EN Logic Control pin
0 - LDO4 enable connected to PWR_EN
1 - LDO4 enable connected to SYS_EN, Default
L3EC
Connects LDO3 enable to SYS_EN or PWR_EN Logic Control pin
0 - LDO3 enable connected to PWR_EN
1 - LDO3 enable connected to SYS_EN, Default
L2EC
Connects LDO2 enable to SYS_EN or PWR_EN Logic Control pin
0 - LDO2 enable connected to PWR_EN
1 - LDO2 enable connected to SYS_EN, Default
41
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VCC_BUCK2 TARGET VOLTAGE REGISTER (B2TV) 8H’85
Bit
7
6
Reserved
0
5
4**
3**
2**
1**
0**
Designation
Reset Value
Buck2 Output Voltage (B2OV)
0
0
1
1
0
0
1
Note: ** denotes one time factory programmable EPROM registers for default values
VCC_BUCK2 TARGET VOLTAGE REGISTER (B2TV) 8H’85 DEFINITIONS
Bit
7:5
4:0
Access
—
Name
Description
Reserved
R/W
B2OV
Output Voltage
Data Code
5h’01
5h’02
5h’03
5h’04
5h’05
5h’06
5h’07
5h’08
5h’09
5h’0A
5h’0B
5h’0C
(V)
Data Code
(V)
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
5h’0D
5h’0E
5h’0F
5h’10
5h’11
5h’12
5h’13
5h’14
5h’15
5h’16
5h’17
5h’18
5h’19
1.40
1.45
1.50
1.55
1.60
1.65
1.70
1.80
1.90
2.50
2.80
3.00
3.30
BUCK3 TARGET VOLTAGE REGISTER (B3TV) 8H’86
Bit
7
6
Reserved
0
5
4**
3**
2**
1**
0**
Designation
Reset Value
Buck3 Output Voltage (B3OV)
0
0
1
0
1
0
0
Note: ** denotes one time factory programmable EPROM registers for default values
BUCK3 TARGET VOLTAGE REGISTER (B3TV) 8H’86 DEFINITIONS
Bit
7:5
4:0
Access
—
Name
Description
Reserved
R/W
B3OV
Output Voltage
Data Code
5h’01
(V)
Data Code
5h’0D
5h’0E
5h’0F
5h’11
5h’12
5h’13
5h’14
5h’15
5h’16
5h’17
5h’18
5h’19
(V)
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
1.45
1.50
1.60
1.65
1.70
1.80
1.90
2.50
2.80
3.00
3.30
5h’02
5h’03
5h’04
5h’05
5h’06
5h’07
5h’08
5h’09
ꢀ
Default
5h’0A
5h’0B
5h’0C
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42
VCC_BUCK3:2 VOLTAGE RAMP CONTROL REGISTER (B32RC)
VCC_Buck3:2 Voltage Ramp Control Register (B32RC) 8h’87
Bit
7
6
5
4
3
2
1
0
Designation
Reset Value
Ramp Rate (B3RR)
Ramp Rate (B2RR)
1
0
1
0
1
0
1
0
Buck3:2 Voltage Ramp Control Register (B3RC) 8h’87 Definitions
Bit
Access
Name
Description
7:4
R/W
B3RR
Data Code
4h’0
Ramp Rate mV/µS
Instant
4h’1
4h’2
1
2
4h’3
3
4h’4
4
4h’5
5
4h’6
6
4h’7
7
4h’8
8
4h’9
9
4h’A
10
3:0
R/W
B2RR
Data Code
4h’0
Ramp Rate mV/µS
Instant
4h’1
4h’2
1
2
4h’3
3
4h’4
4
4h’5
5
4h’6
6
4h’7
7
4h’8
8
4h’9
9
4h’A
10
43
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INTERRUPT STATUS REGISTER ISRA
This register specifies the status bits for the interrupts generated by the PMIC. Thermal warning of the IC, GPIO1, GPIO2, PWR_ON
pin, TEST_JIG factory programmable on signal, and the SPARE pin.
Interrupt Status Register ISRA 8h’88
Bit
Designation
Reset Value
7
Reserved
0
6
T125
0
5
GPI2
0
4
GPI1
0
3
WUP3
0
2
WUP2
0
1
WUPT
0
0
WUPS
0
Interrupt Status Register ISRA 8h’88 Definitions
Bit
7
Access
Name
—
Description
Reserved
—
6
R
T125
Status bit for thermal warning PMIC T>125C
0 = PMIC Temp. < 125°C
1 = PMIC Temp. > 125°C
5
4
3
2
1
0
R
R
R
R
R
R
GPI2
GPI1
Status bit for the input read in from GPIO 2 when set as Input
0 = GPI2 Logic Low
1 = GPI2 Logic High
Status bit for the input read in from GPIO 1 when set as Input
0 = GPI1 Logic Low
1 = GPI1 Logic High
WUP3
WUP2
WUPT
WUPS
PWR_ON Pin long pulse Wake Up Status
0 = No wake up event
1 = Long pulse wake up event
PWR_ON Pin Short pulse Wake Up Status
0 = No wake up event
1 = Short pulse wake up event
TEST_JIG Pin Wake Up Status
0 = No wake up event
1 = Wake up event
SPARE Pin Wake Up Status
0 = No wake up event
1 = Wake up event
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BACKUP BATTERY CHARGER CONTROL REGISTER (BCCR)
This register specifies the status of the main battery supply. NBUB bit
Backup Battery Charger Control Register (BCCR) 8h’89
Bit
7**
NBUB
0
6
CNBFL
0
5**
4**
nBFLT
1
3**
2
BUCEN
0
1
0
Designation
Reset Value
IBUC
0
0
0
1
Note: ** denotes one time factory programmable EPROM registers for default values
Backup Battery Charger Control Register (BCCR) 8h’89 Definitions
Bit
Access
Name
Description
7
R/W
NBUB
No back-up battery default setting. Logic will not allow switch over to back-up
battery.
0 = Back up Battery Enabled, Default
1 = Back up Battery Disabled
6
R/W
CNBFL
Control for nBATT_FLT output signal
0 = nBATT_FLT Enabled
1 = nBATT_FLT Disabled
nBATT_FLT monitors the battery voltage and can be set to the Assert voltages
listed below.
Data Code
3h’01
Asserted
2.6
De-Asserted
Note:
2.8
3.0
3.2
3.4
3.6
ꢀ
5:3
2
R/W
R/W
BFLT
3h’02
3h’03
3h’04
3h’05
2.8
3.0
3.2
3.4
Default
BUCEN
Enables backup battery charger
0 = Back up Battery Charger Disabled
1 = Back up Battery Charger Enabled
Charger current setting for back-up battery
Data Code
2h’00
BU Charger I (µA)
Note:
260
190
325
390
ꢀ
1:0
R/W
IBUC
2h’01
2h’02
2h’03
Default
45
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MARVELL PXA INTERNAL 1 REVISION REGISTER (II1RR) 8H’8E
Bit
7
6
5
4
3
2
1
0
Designation
Reset Value
II1RR
0
0
0
0
0
0
0
0
MARVELL PXA INTERNAL 1 REVISION REGISTER (II1RR) 8H’8E DEFINITIONS
Bit
Access
Name
Description
7:0
R
II1RR
Intel internal usage register for revision information.
MARVELL PXA INTERNAL 2 REVISION REGISTER (II2RR) 8H’8F
Bit
7
6
5
4
3
2
1
0
Designation
Reset Value
II2RR
0
0
0
0
0
0
0
0
MARVELL PXA INTERNAL 2 REVISION REGISTER (II2RR) 8H’8F DEFINITIONS
Bit
Access
Name
Description
7:0
R
II2RR
Intel internal usage register for revision information.
REGISTER PROGRAMMING EXAMPLES
Example 1) Start of Day Sequence
PMIC Register PMIC Register
Register Data
Description
Address
Name
ADTVI
SDTV1
OVER1
8h’23
00011011
00011011
00000111
Sets the SOD VCC_APPS voltage
Sets the SOD VCC_SRAM voltage
8h’29
8h’10
Enables VCC_SRAM and VCC_APPS to their programmed values.
SODl Multi-byte random register transfer is outlined below:
20207644
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46
Register A Address, Ach,
Register A Data, Ach
Device Address,
Register M Address, Ach,
Register M Data, Ach
Register X Address, Ach,
Register X Data, Ach
Register Z Address, Ach,
Register Z Data, Ach, Stop
Example 2) Voltage change Sequence
PMIC Register PMIC Register
Register Data
Description
Address
8h’24
Name
ADTV2
SDTV2
00010111
00001111
00110011
Sets the VCC_APPS target voltage 2 to 1.3 V
Sets the VCC_SRAM target voltage 2 to 1.1 V
8h’2A
8h’20
VCC
1
Enable VCC_SRAM and VCC_APPS to change to their programmed
target values.
I2C DATA EXCHANGE BETWEEN MASTER AND SLAVE DEVICE
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LP3972 Controls
DIGITAL INTERFACE CONTROL SIGNALS
Signal
Definition
Active State Signal Direction
SYS_EN
PWR_EN
SCL
High Voltage Power Enable
Low Voltage Power Enable
Serial Bus Clock Line
High
High
Input
Input
Clock
Input
SDA
Serial Bus Data Line
Bidirectional
Input
nRSTI
Forces an unconditional hardware reset
Forces an unconditional hardware reset
Main Battery removed or discharged indicator
Wakeup Input to CPU
Low
Low
nRSTO
Output
nBATT_FLT
PWR_ON
nTEST_JIG
SPARE
Low
Output
High
Low
Input
Wakeup Input to CPU
Input
Wakeup Input to CPU
High/Low
High
—
Input
EXT_WAKEUP
Wake-Up Output for application processor
Output
GPIO1 / nCHG_EN General Purpose I/O /External Back-up Battery Charger enable
GPIO2 General Purpose I/O
Bidirectional /Input
Bidirectional
—
POWER DOMAIN ENABLES
PMU Output
HW Enable
SW Enable
PMU Output
LDO5 (VCC_SRAM)
Buck1 (VCC_APPS)
BUCK2
HW Enable
SW Enable
S_EN
LDO_RTC
LDO1 (VCC_MVT)
LDO2
PWR_EN
PWR_EN
SYS_EN
SYS_EN
—
—
A_EN
SYS_EN
SYS_EN
SYS_EN
SYS_EN
LDO1_EN
LDO2_EN
LDO3_EN
LDO4_EN
B2_EN
B3_EN
BUCK3
LDO3
LDO4
POWER DOMAINS SEQUENCING (DELAY)
LDO_RTC TRACKING (nIO_TRACK)
By default SYS_EN must be on to have PWR_EN enable but
this feature can be switched off by register bit BP_SYS.
LP3972 has a tracking function (nIO_TRACK). When en-
abled, LDO_RTC voltage will track LDO3 voltage within 200
mV down to 2.8V when LDO3 is enabled. This function can
be switched on/off by nIO_TRACK register bit BPTR.
By default SYS_EN enables LDO1 always first and after a
typical of 1 ms delay others. Also when SYS_EN is set off the
LDO1 will go off last. This function can be switched off or delay
can be changed by DELAY bits via serial interface as seen
on table below.
POWER SUPPLY ENABLE
SYS_EN and PWR_EN can be changed by programmable
register bits.
8h’80 Bit 5:4
DELAY bits
Delay, ms
‘00’
0
‘01’
0.5
‘10’
1.0
‘11’
1.5
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WAKE-UP FUNCTIONALITY (PWR_ON, nTEST_JIG,
SPARE AND EXT_WAKEUP)
WAKEUP register bits
WUP0
Reason for WAKEUP
SPARE
Three input pins can be used to assert wakeup output for 10
ms for application processor notification to wakeup. SPARE
Input can be programmed through I2C compatible interface to
be active low or high (SPARE bit, Default is active low ‘1’). A
reason for wakeup event can be read through I2C compatible
interface also. Additionally wakeup inputs have 30 ms de-
bounce filtering. Furthermore PWR_ON have distinguishing
between short and long (∼1s) pulses (push button input).
LP3972 also has an internal Thermal Shutdown early warning
that generates a wakeup to the system also. This is generated
usually at 125°C.
WUP1
TEST_JIG
WUP2
PWR_ON short pulse
PWR_ON long pulse
TSD Early Warning
WUP3
TSD_EW
INTERNAL THERMAL SHUTDOWN PROCEDURE
Thermal shutdown is build to generate early warning (typ.
125°C) which triggers the EXT_WAKEUP for the processor
acknowledge. When a thermal shutdown triggers (typ. 160°
C) the PMU will reset the system until the device cools down.
BATTERY SWITCH AND BACK UP BATTERY CHARGER
When Back-Up battery is connected but the main battery has
been removed or its supply voltage too low, LP3972 uses
Back-Up Battery for generating LDO_RTC voltage. When
Main Battery is available the battery FET switches over to the
main battery for LDO_RTC voltage. When Main battery volt-
age is too low or removed nBATT_FLT is asserted. If no back
up battery exists, the battery switch to back up can be
switched off by nBU_BAT_EN bit. User can set the battery
fault determination voltage and battery charger current via
I2C compatible interface. Enabling of back up battery charger
can be done via serial interface (nBAT_CHG_EN) or external
charger enable pin (nCHG_EN). Pin 29 is set as external
charger enable input by default.
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GENERAL PURPOSE I/O FUNCTIONALITY (GPIO1 AND
GPIO2)
LP3972 has 2 general purpose I/Os for system control. I2C
compatible interface will be used for setting any of the pins to
input, output or hi-Z mode. Inputs value can be read via serial
interface (GPIO1,2 bits). The pin 29 functionality needs to be
set to GPIO by serial interface register bit nEXTCHGEN.
(GPIO/CHG)
Controls
Port Function
GPIO1
Reg
batmonchg
Function
GPIO<1>
GPIO<1>
Nextchgen_sel
bucen
Gpin 1
X
X
1
X
0
1
0
1
X
X
0
X
0
0
1
1
1
1
1
X
0
0
0
0
0
0
Input = 0
Input = 1
X
0
0
0
Enabled
Not Enabled
X
1
X
Enabled
X
X
X
X
HiZ
Input (dig)->
Output = 0
Output = 1
Input
0
0
ꢀ
GPIO<1>
GPIO<1>
Factory fm disabled
GPIO_tstiob
GPIO2
HiZ
gpin2
0
0
1
0
1
0
0
1
1
1
1
1
1
Input (dig)->
Output = 0
Output = 1
input
0
0
The LP3972 has provision for two battery connections, the
main battery VBAT and Backup Battery (See Applications
Schematic Diagrams 1 & 2 of the LP3972 Data Sheet).
There is a hysteresis voltage in this switch operation
so, the LDO_RTC will not be reconnected to main
battery until main battery voltage is greater than 3.1V
typically.
—
The function of the battery switch is to connect power to the
LDO_RTC from the appropriate battery, depending on con-
ditions described below:
•
Additionally, the user may wish to disable the battery
switch, such as, in the case when only a main battery is
used. This is accomplished by setting the “no back up
battery bit” in the control register 8h’89 bit 7 NBUB. With
this bit set to “1”, the above described switching will not
occur, that is the LDO_RTC will remain connected to the
main battery even as it is discharged below the 2.9 Volt
threshold.
•
•
•
If only the backup battery is applied, the switch will
automatically connect the LDO_RTC power to this battery.
If only the main battery is applied, the switch will
automatically connect the LDO_RTC power to this battery.
If both batteries are applied, and the main battery is
sufficiently charged (VBAT > 3.1V), the switch will
automatically connect the RTC LDO power to the main
battery.
REGULATED VOLTAGES OK
All the power domains have own register bit (X_OK) that pro-
cessor can read via serial interface to be sure that enabled
powers are OK (regulating). Note that these read only bits are
only valid when regulators are settled (avoid reading these
bits during voltage change or power up).
•
As the main battery is discharged by use, the user will be
warned by a separate circuit called nBATT_FLT. Then if
no action is taken to restore the charge on the main
battery, and discharging is continued the battery switch will
protect the LDO_RTC by disconnecting from the main
battery and connecting to the backup battery.
The main battery voltage at which the LDO_RTC is
switched from main to backup battery is 2.9V typically.
—
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50
THERMAL MANAGEMENT
temperature range and resolution of these flags, might also
be refined/redefined.
Application: There is a mode wherein all 6 comparators (flags)
can be turned on via the “enallflags” control register bit. This
mode allows the user to interrogate the device or system
temperature under the set operating conditions. Thus, the
rate of temperature change can also be estimated. The sys-
tem may then negotiate for speed and power trade off, or
deploy cooling maneuvers to optimize system performance.
The “enallflags” bit needs enabled only when the “bct<2:0>
bits are read to conserve power.
THERMAL WARNING
2 of 6 low power comparators, each consumes less than 1
µA, are always enabled to operate the “T=125°C warning flag
with hysteresis. This allows continuous monitoring of a ther-
mal-warning flag feature with very low power consumption.
LP3972 THERMAL FLAGS FUNCTIONAL DIAGRAM,
DATA FROM INITIAL SILICON
Note: The thermal management flags have been verified
functional. Presently these registers are accessible by factory
only. If there is a demand for this function, the relevant register
controls may be shifted into the user programmable bank; the
The following functions are extra features from the thermal
shutdown circuit:
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Application Note - LP3972 Reset Sequence
INITIAL COLD START POWER ON SEQUENCE
6. The LP3972 enables the high-voltage power supplies.
LDO1 power for VCC_MVT (Power for internal logic
and I/O Blocks), BG (Bandgap reference voltage),
OSC13M (13 MHz oscillator voltage) and PLL
enabled first, followed by others if delay is on.
1. The Back up battery is connected to the PMU, power is
applied to the back-up battery pin, the LDO_RTC turns
on and supplies a stable output voltage to the
VCC_BATT pin of the Applications processor (initiating
the power-on reset event) with nRSTO asserted from the
LP3972 to the processor.
—
7. Countdown timer expires; the Applications processor
asserts PWR_EN to enable the low-voltage power
supplies. The processor starts the countdown timer set
to 125 mS period.
2. nRSTO de-asserts after a minimum of 50 mS.
3. The Applications processor waits for the de-assertion of
nBATT_FLT to indicate system power (VIN) is available.
8. The Applications processor asserts PWR_EN (ext. pin or
I2C), the LP3972 enables the low-voltage regulators.
4. After system power (VIN) is applied, the LP3972 de-
asserts nBATT_FLT. Note that BOTH nRSTO and
nBATT_FLT need to be de-asserted before SYS_EN is
enabled. The sequence of the two signals is independent
of each other.
9. Countdown timer expires; If enabled power domains are
OK (I2C read) the power up sequence continues by
enabling the processors 13 MHz oscillator and PLL’s.
10. The Applications processor begins the execution of
code.
5. The Applications processor asserts SYS_EN, the
LP3972 enables the system high-voltage power
supplies. The Applications processor starts its
countdown timer set to 125 mS.
20207622
* Note that BOTH nRSTO and nBATT_FLT need to be de-asserted before SYS_EN is enabled. The sequence of the two signals is independent of each other
and can occur is either order.
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52
POWER-ON TIMING
Symbol
Description
Min
Typ
Max
Units
mS
µS
t1
t2
t3
t4
t5
Delay from VCC_RTC assertion to nRSTO de-assertion
Delay from nBATT_FLT de-assertion to nRSTI assertion
Delay from nRST de-assertion to SYS_EN assertion
Delay from SYS_EN assertion to PWR_EN assertion
Delay from PWR_EN assertion to nRSTO de-assertion
50
100
10
mS
mS
mS
125
125
HARDWARE RESET SEQUENCE
Hardware reset initiates when the nRSTI signal is asserted
(low). Upon assertion of nRST the processor enters hardware
RESET SEQUENCE
reset state. The LP3972 holds the nRST low long enough (50
ms typ.) to allow the processor time to initiate the reset state.
6. The LP3972 enables the high-voltage power supplies.
1. nRSTI is asserted.
7. Countdown timer expires; the Applications processor
asserts PWR_EN to enable the low-voltage power
supplies. The processor starts the countdown timer.
2. nRSTO is asserted and will de-asserts after a minimum
of 50 mS
8. The Applications processor asserts PWR_EN, the
LP3972 enables the low-voltage regulators.
3. The Applications processor waits for the de-assertion of
nBATT_FLT to indicate system power (VIN) is available.
9. Countdown timer expires; If enabled power domains are
OK (I2C read) the power up sequence continues by
enabling the processors 13 MHz oscillator and PLL’s.
4. After system power (VIN) is turned on, the LP3972 de-
asserts nBATT_FLT.
5. The Applications processor asserts SYS_EN, the
LP3972 enables the system high-voltage power
supplies. The Applications processor starts its
countdown timer.
10. The Applications processor begins the execution of
code.
53
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the capacitor parameters, to ensure that the specification is
met within the application. The capacitance can vary with DC
bias conditions as well as temperature and frequency of op-
eration. Capacitor values will also show some decrease over
time due to aging. The capacitor parameters are also depen-
dant on the particular case size, with smaller sizes giving
poorer performance figures in general. As an example, Figure
4 shows a typical graph comparing different capacitor case
sizes in a Capacitance vs. DC Bias plot. As shown in the
graph, increasing the DC Bias condition can result in the ca-
pacitance value falling below the minimum value given in the
recommended capacitor specifications table. Note that the
graph shows the capacitance out of spec for the 0402 case
size capacitor at higher bias voltages. It is therefore recom-
mended that the capacitor manufacturers’ specifications for
the nominal value capacitor are consulted for all conditions,
as some capacitor sizes (e.g. 0402) may not be suitable in the
actual application.
Application Hints
LDO CONSIDERATIONS
External Capacitors
The LP3972’s regulators require external capacitors for reg-
ulator stability. These are specifically designed for portable
applications requiring minimum board space and smallest
components. These capacitors must be correctly selected for
good performance.
Input Capacitor
An input capacitor is required for stability. It is recommended
that a 1.0 µF capacitor be connected between the LDO input
pin and ground (this capacitance value may be increased
without limit).
This capacitor must be located a distance of not more than 1
cm from the input pin and returned to a clean analogue
ground. Any good quality ceramic, tantalum, or film capacitor
may be used at the input.
Important: Tantalum capacitors can suffer catastrophic fail-
ures due to surge current when connected to a low impedance
source of power (like a battery or a very large capacitor). If a
tantalum capacitor is used at the input, it must be guaranteed
by the manufacturer to have a surge current rating sufficient
for the application.
There are no requirements for the ESR (Equivalent Series
Resistance) on the input capacitor, but tolerance and tem-
perature coefficient must be considered when selecting the
capacitor to ensure the capacitance will remain approximately
1.0 µF over the entire operating temperature range.
Output Capacitor
The LDO’s are designed specifically to work with very small
ceramic output capacitors. A 1.0 μF ceramic capacitor (tem-
perature types Z5U, Y5V or X7R) with ESR between 5 mΩ to
500 mΩ, are suitable in the application circuit.
For this device the output capacitor should be connected be-
tween the VOUT pin and ground.
20207623
FIGURE 4. Graph Showing a Typical Variation in
Capacitance vs. DC Bias
It is also possible to use tantalum or film capacitors at the
device output, COUT (or VOUT), but these are not as attractive
for reasons of size and cost (see the section Capacitor Char-
acteristics).
The ceramic capacitor’s capacitance can vary with tempera-
ture. The capacitor type X7R, which operates over a temper-
ature range of −55°C to +125°C, will only vary the capacitance
to within ±15%. The capacitor type X5R has a similar toler-
ance over a reduced temperature range of −55°C to +85°C.
Many large value ceramic capacitors, larger than 1 µF are
manufactured with Z5U or Y5V temperature characteristics.
Their capacitance can drop by more than 50% as the tem-
perature varies from 25°C to 85°C. Therefore X7R is recom-
mended over Z5U and Y5V in applications where the ambient
temperature will change significantly above or below 25°C.
The output capacitor must meet the requirement for the min-
imum value of capacitance and also have an ESR value that
is within the range 5 mΩ to 500 mΩ for stability.
No-Load Stability
The LDO’s will remain stable and in regulation with no exter-
nal load. This is an important consideration in some circuits,
for example CMOS RAM keep-alive applications.
Tantalum capacitors are less desirable than ceramic for use
as output capacitors because they are more expensive when
comparing equivalent capacitance and voltage ratings in the
0.47 µF to 4.7 µF range.
Capacitor Characteristics
The LDO’s are designed to work with ceramic capacitors on
the output to take advantage of the benefits they offer. For
capacitance values in the range of 0.47 µF to 4.7 µF, ceramic
capacitors are the smallest, least expensive and have the
lowest ESR values, thus making them best for eliminating
high frequency noise. The ESR of a typical 1.0 µF ceramic
capacitor is in the range of 20 mΩ to 40 mΩ, which easily
meets the ESR requirement for stability for the LDO’s.
Another important consideration is that tantalum capacitors
have higher ESR values than equivalent size ceramics. This
means that while it may be possible to find a tantalum capac-
itor with an ESR value within the stable range, it would have
to be larger in capacitance (which means bigger and more
costly) than a ceramic capacitor with the same ESR value. It
should also be noted that the ESR of a typical tantalum will
increase about 2:1 as the temperature goes from 25°C down
to –40°C, so some guard band must be allowed.
For both input and output capacitors, careful interpretation of
the capacitor specification is required to ensure correct device
operation. The capacitor value can change greatly, depend-
ing on the operating conditions and capacitor type. In partic-
ular, the output capacitor selection should take account of all
www.national.com
54
BUCK CONSIDERATIONS
Inductor Selection
A 2.2 μH inductor with a saturation current rating of at least
3A is recommended for most applications. The inductor’s re-
sistance should be less than 0.3Ω for a good efficiency. Table
1 lists suggested inductors and suppliers. For low-cost appli-
cations, an unshielded bobbin inductor could be considered.
For noise critical applications, a toroidal or shielded bobbin
inductor should be used. A good practice is to lay out the
board with overlapping footprints of both types for design flex-
ibility. This allows substitution of a low-noise shielded induc-
tor, in the event that noise from low-cost bobbin models is
unacceptable.
There are two main considerations when choosing an induc-
tor; the inductor should not saturate, and the inductor current
ripple is small enough to achieve the desired output voltage
ripple. Different saturation current rating specs are followed
by different manufacturers so attention must be given to de-
tails. Saturation current ratings are typically specified at 25°C
so ratings at max ambient temperature of application should
be requested from manufacturer.
There are two methods to choose the inductor saturation cur-
rent rating.
Input Capacitor Selection
A ceramic input capacitor of 10 μF, 6.3V is sufficient for most
applications. Place the input capacitor as close as possible to
the VIN pin of the device. A larger value may be used for im-
proved input voltage filtering. Use X7R or X5R types, do not
use Y5V. DC bias characteristics of ceramic capacitors must
be considered when selecting case sizes like 0805 and 0603.
The input filter capacitor supplies current to the PFET switch
of the converter in the first half of each cycle and reduces
voltage ripple imposed on the input power source. A ceramic
capacitor’s low ESR provides the best noise filtering of the
input voltage spikes due to this rapidly changing current. Se-
lect a capacitor with sufficient ripple current rating. The input
current ripple can be calculated as:
Method 1
The saturation current is greater than the sum of the maxi-
mum load current and the worst case average to peak induc-
tor current. This can be written as
• IRIPPLE: Average to peak inductor current
• IOUTMAX: Maximum load current (1500 mA)
• VIN: Maximum input voltage in application
• L: Min inductor value including worst case tolerances (30%
drop can be considered for method 1)
• f: Minimum switching frequency (1.6 MHz)
• VOUT: Output voltage
Method 2
The worst case is when VIN = 2 * VOUT
A more conservative and recommended approach is to
choose an inductor that has saturation current rating greater
than the max current limit of 3A.
TABLE 1. Suggested Inductors and Their Suppliers
Model
Vendor
Toko
Dimensions LxWxH (mm)
D.C.R. (Typ)
160 mΩ
80 mΩ
FDSE0312-2R2M
DO1608C-222
3.0 x 3.0 x 1.2
6.6 x 4.5 x 1.8
Coilcraft
Output Capacitor Selection
Voltage peak-to-peak ripple due to ESR can be expressed as
follows
Use a 10 μF, 6.3V ceramic capacitor. Use X7R or X5R types,
do not use Y5V. DC bias characteristics of ceramic capacitors
must be considered when selecting case sizes like 0805 and
0603. DC bias characteristics vary from manufacturer to man-
ufacturer and dc bias curves should be requested from them
as part of the capacitor selection process. The output filter
capacitor smooths out current flow from the inductor to the
load, helps maintain a steady output voltage during transient
load changes and reduces output voltage ripple. These ca-
pacitors must be selected with sufficient capacitance and
sufficiently low ESR to perform these functions.
VPP-ESR = (2 * IRIPPLE) * RESR
Because these two components are out of phase the rms val-
ue can be used to get an approximate value of peak-to-peak
ripple.
Voltage peak-to-peak ripple, root mean squared can be ex-
pressed as follows
The output voltage ripple is caused by the charging and dis-
charging of the output capacitor and also due to its ESR and
can be calculated as:
Note that the output voltage ripple is dependent on the induc-
tor current ripple and the equivalent series resistance of the
output capacitor (RESR).
The RESR is frequency dependent (as well as temperature
dependent); make sure the value used for calculations is at
the switching frequency of the part.
55
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TABLE 2. Suggested Capacitor and Their Suppliers
Case Size
Inch (mm)
Model
GRM21BR60J106K
Type
Ceramic, X5R
Vendor
Voltage
Murata
Taiyo-Yuden
TDK
6.3V
6.3V
6.3V
0805 (2012)
0805 (2012)
0805 (2012)
JMK212BJ106K
Ceramic, X5R
Ceramic, X5R
C2012X5R0J106K
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56
Buck Output Ripple Management
If VIN and ILOAD increase, the output ripple associated with the
Buck Regulators also increases. The figure below shows the
safe operating area. To ensure operation in the area of con-
cern it is recommended that the system designer circumvents
the output ripple issues to install Schottky diodes on the Buck
(s) that are expected to perform under these extreme corner
conditions.
(Schottky diodes are recommended to reduce the output rip-
ple, if system requirements include this shaded area of oper-
ation. VIN > 1.5V and ILOAD > 1.24)
20207647
57
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Board Layout Considerations
PC board layout is an important part of DC-DC converter de-
sign. Poor board layout can disrupt the performance of a DC-
DC converter and surrounding circuitry by contributing to EMI,
ground bounce, and resistive voltage loss in the traces. These
can send erroneous signals to the DC-DC converter IC, re-
sulting in poor regulation or instability.
copper fill as a pseudo-ground plane. Then, connect this
to the ground-plane (if one is used) with several vias. This
reduces ground-plane noise by preventing the switching
currents from circulating through the ground plane. It also
reduces ground bounce at the converter by giving it a
low-impedance ground connection.
4. Use wide traces between the power components and for
power connections to the DC-DC converter circuit. This
reduces voltage errors caused by resistive losses across
the traces.
Good layout for the converters can be implemented by fol-
lowing a few simple design rules.
1. Place the converters, inductor and filter capacitors close
together and make the traces short. The traces between
these components carry relatively high switching
5. Route noise sensitive traces, such as the voltage
feedback path, away from noisy traces between the
power components. The voltage feedback trace must
remain close to the converter circuit and should be direct
but should be routed opposite to noisy components. This
reduces EMI radiated onto the DC-DC converter’s own
voltage feedback trace. A good approach is to route the
feedback trace on another layer and to have a ground
plane between the top layer and layer on which the
feedback trace is routed. In the same manner for the
adjustable part it is desired to have the feedback dividers
on the bottom layer.
currents and act as antennas. Following this rule reduces
radiated noise. Special care must be given to place the
input filter capacitor very close to the VIN and GND pin.
2. Arrange the components so that the switching current
loops curl in the same direction. During the first half of
each cycle, current flows from the input filter capacitor
through the converter and inductor to the output filter
capacitor and back through ground, forming a current
loop. In the second half of each cycle, current is pulled
up from ground through the converter by the inductor to
the output filter capacitor and then back through ground
forming a second current loop. Routing these loops so
the current curls in the same direction prevents magnetic
field reversal between the two half-cycles and reduces
radiated noise.
6. Place noise sensitive circuitry, such as radio RF blocks,
away from the DC-DC converter, CMOS digital blocks
and other noisy circuitry. Interference with noise-
sensitive circuitry in the system can be reduced through
distance.
3. Connect the ground pins of the converter and filter
capacitors together using generous component-side
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58
Physical Dimensions inches (millimeters) unless otherwise noted
40-Pin Leadless Leadframe Package
NS Package Number SQF40A
59
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