LP3995ILDX-3.0 [NSC]
Micropower 150mA CMOS Voltage Regulator with Active Shutdown; 微150毫安CMOS电压稳压器与Active关闭
| 型号： | LP3995ILDX-3.0 |
| 厂家： | 
National Semiconductor |
| 描述： | Micropower 150mA CMOS Voltage Regulator with Active Shutdown |
| 文件： | 总14页 (文件大小：353K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
August 2004
LP3995
Micropower 150mA CMOS Voltage Regulator with Active
Shutdown
General Description
Key Specifications
n 2.5V to 6.0V Input Range
The LP3995 linear regulator is designed to meet the require-
ments of portable battery-powered applications and will pro-
vide an accurate output voltage with low noise and low
quiescent current. Ideally suited for powering RF/Analog
devices, this device will also be used to meet more general
circuit needs in which a fast turn-off is essential.
n Accurate Output Voltage; 75mV / 2%
n 60 mV Typical Dropout with 150 mA Load
n Virtually Zero Quiescent Current when Disabled
n Low Output Voltage Noise
n Stable with a 1 µF Output Capacitor
n Guaranteed 150 mA Output Current
n Fast Turn-on; 30 µs (Typ.)
For battery powered applications the low dropout and low
ground current provided by the device allows the lifetime of
the battery to be maximized. The Enable(/Disable) control
allows the system to further extend the battery lifetime by
reducing the power consumption to virtually zero.
n Fast Turn-off; 175 µs (Typ.)
Features
The Enable(/Disable) function on the device incorporates an
active discharge circuit on the output for faster device shut-
down. Where the fast turn-off is not required the LP3999
linear regulator is recommended.
n 5 pin micro SMD Package
n 6 pin LLP Package
n Stable with Ceramic Capacitor
n Logic Controlled Enable
n Fast Turn-on
The LP3995 also features internal protection against short-
circuit currents and over-temperature conditions.
The LP3995 is designed to be stable with small 1.0 µF
ceramic capacitors. The small outline of the LP3995 micro
SMD package with the required ceramic capacitors can
realize a system application within minimal board area.
n Active Disable for Fast Turn-off.
n Thermal-overload and Short-circuit Protection
n
−40 to +125˚C Junction Temperature Range for
Operation
Performance is specified for a −40˚C to +125˚C temperature
range.
Applications
The device is available in micro SMD package and LLP
package. For other package options contact your local NSC
sales office.
n GSM Portable Phones
n CDMA Cellular Handsets
n Wideband CDMA Cellular Handsets
n Bluetooth Devices
The device is available in fixed output voltages in the ranges
1.5V to 3.3V. For availability, please contact your local NSC
sales office.
n Portable Information Appliances
Typical Application Circuit
20034901
© 2004 National Semiconductor Corporation
DS200349
www.national.com
Block Diagram
20034902
Pin Description
5 pin micro SMD and LLP - 6
Pin No.
Symbol
Name and Function
micro
LLP
SMD
A1
3
VEN
Enable Input; Disables the Regulator when ≤ 0.4V.
Enables the regulator when ≥ 0.9V
Common Ground
B2
C1
C3
A3
2
6
1
4
GND
VOUT
Voltage output. Connect this output to the load circuit.
Voltage Supply Input
VIN
CBYPASS
Bypass Capacitor connection.
Connect a 0.01 µF capacitor for noise reduction.
5
N/C
No internal connection. There should not be any board connection to this pin.
Ground connection.
Pad
GND
Connect to ground plane for best thermal conduction.
Connection Diagrams
micro SMD, 5 Bump Package
20034903
Top View
See NS Package Number TLA05
www.national.com
2
Connection Diagrams (Continued)
LLP- 6 Package (SOT23 Footprint)
20034904
Top View
See NS Package Number LDE06A
3
www.national.com
Ordering Information
For micro SMD Package
LP3995 Supplied as 250
Output Voltage
(V)
Grade
LP3995 Supplied as
3000 Units, Tape and
Reel
Package
Marking
Units, Tape and Reel
1.5
1.6
1.8
1.9
2.1
2.5
2.8
2.85
3.0
STD
STD
STD
STD
STD
STD
STD
STD
STD
LP3995ITL-1.5
LP3995ITL-1.6
LP3995ITL-1.8
LP3995ITL-1.9
LP3995ITL-2.1
LP3995ITL-2.5
LP3995ITL-2.8
LP3995ITL-2.85
LP3995ITL-3.0
LP3995ITLX-1.5
LP3995ITLX-1.6
LP3995ITLX-1.8
LP3995ITLX-1.9
LP3995ITLX-2.1
LP3995ITLX-2.5
LP3995ITLX-2.8
LP3995ITLX-2.85
LP3995ITLX-3.0
For micro SMD Package unleaded
Output Voltage
(V)
Grade
LP3995 Supplied as 250
Units, Tape and Reel
LP3995 Supplied as
3000 Units, Tape and
Reel
Package
Marking
1.5 (Note 2)
1.6 (Note 2)
1.8 (Note 2)
1.9 (Note 2)
2.1 (Note 2)
2.5 (Note 2)
2.8 (Note 2)
3.0 (Note 2)
STD
STD
STD
STD
STD
STD
STD
STD
LP3995ITL-1.5
LP3995ITL-1.6
LP3995ITL-1.8
LP3995ITL-1.9
LP3995ITL-2.1
LP3995ITL-2.5
LP3995ITL-2.8
LP3995ITL-3.0
LP3995ITLX-1.5
LP3995ITLX-1.6
LP3995ITLX-1.8
LP3995ITLX-1.9
LP3995ITLX-2.1
LP3995ITLX-2.5
LP3995ITLX-2.8
LP3995ITLX-3.0
For LLP- 6 Package
Output Voltage
(V)
Grade
LP3995 Supplied as 1000
Units, Tape and Reel
LP3995 Supplied as
4500 Units, Tape and
Reel
Package
Marking
1.5
1.6
STD
STD
STD
STD
STD
STD
STD
STD
STD
LP3995ILD-1.5
LP3995ILD-1.6
LP3995ILD-1.8
LP3995ILD-1.9
LP3995ILD-2.1
LP3995ILD-2.5
LP3995ILD-2.8
LP3995ILD-3.0
LP3995ILD-3.3
LP3995ILDX-1.5
LP3995ILDX-1.6
LP3995ILDX-1.8
LP3995ILDX-1.9
LP3995ILDX-2.1
LP3995ILDX-2.5
LP3995ILDX-2.8
LP3995ILDX-3.0
LP3995ILDX-3.3
LO20B
LO21B
LO22B
LO23B
LO24B
LO25B
LO26B
LO30B
LO31B
1.8
1.9 (Note 2)
2.1 (Note 2)
2.5 (Note 2)
2.8
3.0
3.3 (Note 2)
Note 1: Available in sample quantities only
Note 2: For availability contact your local sales office
www.national.com
4
Absolute Maximum Ratings
(Notes 3, 4)
Operating Ratings (Note 3)
Input Voltage (VIN
)
2.5 to 6.0V
0 to 6.0V
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Enable Input Voltage
Junction Temperature
Ambient Temperature
Range(Note 7)
−40 to +125˚C
-40 to 85˚C
Input Voltage (VIN
Output Voltage
)
−0.3 to 6.5V
−0.3 to (VIN + 0.3V)
to 6.5V (max)
−0.3 to 6.5V
Thermal Properties(Note 8)
Junction to Ambient Thermal
Resistance
Enable Input Voltage
Junction Temperature
Lead/Pad Temperature
(Note 5)
150˚C
θJA (LLP pkg.)
88˚C/W
θJA (micro SMD pkg.)
255˚C/W
micro SMD
260˚C
235˚C
LLP
Storage Temperature
Continuous Power
Dissipation(Note 7)
ESD (Note 9)
−65 to +150˚C
Internally Limited
Human Body Model
Machine Model
2 kV
200V
Electrical Characteristics
Unless otherwise noted, VEN = 1.5, VIN = VOUT + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, cBP = 0.01 µF. Typical values
and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the full temperature
range for operation, −40 to +125˚C. (Notes 14, 15)
Limit
Symbol
Parameter
Conditions
Typical
Units
Min
Max
VIN
Input Voltage
2.5
6.0
V
<
DEVICE OUTPUT: 1.5 ≤ VOUT 1.8V
∆VOUT
Output Voltage Tolerance
IOUT = 1 mA
-50
50
mV
-75
75
Line Regulation Error
VIN = (VOUT(NOM)+1.0V) to 6.0V,
IOUT = 1 mA
-3.5
3.5
75
mV/V
micro SMD
Load Regulation Error
LLP
Load Regulation Error
Power Supply Rejection Ratio
(Note 11)
IOUT = 1 mA to 150 mA
µV/mA
10
70
IOUT = 1 mA to 150 mA
µV/mA
dB
125
PSRR
f = 1 kHz, IOUT = 1 mA
f = 10 kHz, IOUT = 1 mA
55
53
<
DEVICE OUTPUT: 1.8 ≤ VOUT 2.5V
∆VOUT
Output Voltage Tolerance
IOUT = 1 mA
-50
50
mV
−75
75
microSMDLine Regulation Error VIN = (VOUT(NOM)+1.0V) to 6.0V,
−2.5
−3.5
2.5
3.5
75
mV/V
IOUT = 1 mA
LLP
VIN = (VOUT(NOM)+1.0V) to 6.0V,
IOUT = 1 mA
mV/V
Line Regulation Error
micro SMD
IOUT = 1 mA to 150 mA
µV/mA
10
80
Load Regulation Error
LLP
IOUT = 1 mA to 150 mA
µV/mA
dB
125
Load Regulation Error
Power Supply Rejection Ratio
(Note 11)
PSRR
f = 1 kHz, IOUT = 1 mA
f = 10 kHz, IOUT = 1 mA
55
50
5
www.national.com
Electrical Characteristics (Continued)
Unless otherwise noted, VEN = 1.5, VIN = VOUT + 1.0V, CIN = 1 µF, IOUT = 1 mA, COUT = 1 µF, cBP = 0.01 µF. Typical values
and limits appearing in normal type apply for TJ = 25˚C. Limits appearing in boldface type apply over the full temperature
range for operation, −40 to +125˚C. (Notes 14, 15)
Limit
Symbol
Parameter
Conditions
Typical
Units
Min
Max
DEVICE OUTPUT: 2.5 ≤ VOUT ≤ 3.3V
∆VOUT
Output Voltage Tolerance
Line Regulation Error
IOUT = 1 mA
-2
2
% of
VOUT(NOM)
−3
3
VIN = (VOUT(NOM)+1.0V) to 6.0V,
IOUT = 1 mA
−0.1
0.1
%/V
%/mA
%/mA
mV
micro SMD
Load Regulation Error
LLP
Load Regulation Error
Dropout Voltage
IOUT = 1 mA to 150 mA
0.0004
0.002
0.002
0.005
IOUT = 1 mA to 150 mA
IOUT = 1 mA
0.4
60
60
50
2
IOUT = 150 mA
100
PSRR
Power Supply Rejection Ratio
(Note 11)
f = 1 kHz, IOUT = 1 mA
f = 10 kHz, IOUT = 1 mA
dB
FULL VOUT RANGE
ILOAD Load Current
IQ
(Notes 10, 11)
0
µA
µA
Quiescent Current
VEN = 1.5V, IOUT = 0 mA
VEN = 1.5V, IOUT = 150 mA
VEN = 0.4V
85
140
150
200
1.5
0.003
450
ISC
EN
Short Circuit Current Limit
mA
µVrms
˚C
Output Noise Voltage ((Note 11)) BW = 10 Hz to 100 kHz,
VIN = 4.2V, IOUT = 1mA
25
TSHUTDOWN
Thermal Shutdown
Temperature
Hysteresis
160
20
ENABLE CONTROL CHARACTERISTICS
IEN
Maximum Input Current at
VEN Input
VEN = 0.0V and VIN = 6.0V
0.001
µA
VIL
VIH
Low Input Threshold
High Input Threshold
0.4
V
V
0.9
TIMING CHARACTERISTICS
TON
Turn On Time (Note 11)
Turn Off Time (Note 11)
To 95% Level (Note 12)
To 5% Level (Note 13)
30
µs
µs
TOFF
175
Note 3: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 4: All voltages are with respect to the potential at the GND pin.
Note 5: For information regarding micro SMD and LLP packages please refer to the following application notes;
AN-1112 Micro SMD Package Wafer Level Chip Scale Package,
AN-1187. Leadless Leadframe Package.
Note 6: Internal Thermal shutdown circuitry protects the device from permanent damage.
Note 7: In applications where high power dissipation and/or poor thermal resistance is present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (T
) is dependant on the maximum operating junction temperature (T
), the maximum power dissipation (P
), and
A(max)
J(max-op)
D(max)
the junction to ambient thermal resistance in the application (θ ). This relationship is given by :-
JA
TA(max) = TJ(max-op) − (PD(max) x θJA
)
Note 8: Junction to ambient thermal resistance is highly dependant on the application and board layout. In applications where high thermal dissipation is possible,
special care must be paid to thermal issues in the board design.
Note 9: The human body model is an 100 pF discharge through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into
each pin.
Note 10: The device maintains a stable, regulated output voltage without load.
Note 11: This electrical specification is guaranteed by design.
Note 12: Time from V = 0.9V to V
= 95% (V
)
OUT(NOM)
EN
OUT
OUT
Note 13: Time from V = 0.4V to V
= 5% (V
)
EN
OUT(NOM)
www.national.com
6
Electrical Characteristics (Continued)
Note 14: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production at T = 25˚C or correlated using
J
Statistical Quality Control methods. Operation over the temperature specification is guaranteed by correlating the electrical characteristics to process and
temperature variations and applying statistical process control.
Note 15: V
is the stated output voltage option for the device.
OUT(NOM)
Recommended Output Capacitor
Limit
Symbol
COUT
Parameter
Output Capacitor
Conditions
VALUE
Units
Min
0.70
5
Max
Capacitance (Note 16)
ESR
1.0
µF
500
mΩ
Note 16: The capacitor tolerance should be 30% or better over the temperature range. The recommended capacitor type is X7R however, dependant on the
application X5R, Y5V, and Z5U can also be used.
Input Test Signals
20034906
FIGURE 1. Line Transient Response Input Test Signal
20034907
FIGURE 2. PSRR Input Test Signal
7
www.national.com
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN
= VOUT + 1.0V, TA = 25˚C, Enable pin is tied to VIN
.
Output Voltage Change vs Temperature
Ground Current vs Load Current (1.8V VOUT)
20034910
20034911
@
Ground Current vs VIN 25˚C
Ground Current vs Load Current (2.8V VOUT
)
20034912
20034913
@
Ground Current vs VIN 125˚C
Dropout vs Load Current
20034915
20034914
www.national.com
8
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN
= VOUT + 1.0V, TA = 25˚C, Enable pin is tied to VIN. (Continued)
Short Circuit Current
Line Transient Response (VOUT = 2.8V)
20034916
20034917
Ripple Rejection (VOUT = 1.8V)
Ripple Rejection (VOUT = 2.8V)
20034918
20034919
Enable Start-Up Time (VOUT = 2.8V)
Enable Start-Up Time (VOUT = 2.8V)
20034920
20034921
9
www.national.com
Typical Performance Characteristics Unless otherwise specified, CIN = COUT = 1.0 µF Ceramic, VIN
= VOUT + 1.0V, TA = 25˚C, Enable pin is tied to VIN. (Continued)
Enable Start-Up Time (VOUT = 1.8V)
Enable Start-Up Time (VOUT = 1.8V)
20034922
20034923
Turn-Off Time (VOUT = 2.8V)
Turn-Off Time (VOUT = 1.8V)
20034924
20034925
Load Transient Response (VOUT = 2.8V)
Load Transient Response (VOUT = 1.8V)
20034926
20034927
www.national.com
10
OUTPUT CAPACITOR
Application Hints
The LP3995 is designed specifically to work with very small
ceramic output capacitors. A ceramic capacitor (dielectric
types Z5U, Y5V or X7R) in the 1.0 [to 10 µF] range, and with
ESR between 5 mΩ to 500 mΩ, is suitable in the LP3995
application circuit.
POWER DISSIPATION AND DEVICE OPERATION
The permissible power dissipation for any package is a
measure of the capability of the device to pass heat from the
power source, the junctions of the IC, to the ultimate heat
sink, the ambient environment. Thus the power dissipation is
dependent on the ambient temperature and the thermal
resistance across the various interfaces between the die and
ambient air.
For this device the output capacitor should be connected
between the VOUT pin and ground.
It may also be possible to use tantalum or film capacitors at
the device output, VOUT, but these are not as attractive for
reasons of size and cost (see the section Capacitor Charac-
teristics).
The Thermal Resistance figure
Re-stating the equation in (Note 7) in the electrical specifi-
cation section, the allowable power dissipation for the device
in a given package can be calculated:
The output capacitor must meet the requirement for the
minimum value of capacitance and also have an ESR value
that is within the range 5 mΩ to 500 mΩ for stability.
NO-LOAD STABILITY
The LP3995 will remain stable and in regulation with no
external load. This is an important consideration in some
circuits, for example CMOS RAM keep-alive applications.
With a θJA = 255˚C/W, the device in the micro SMD package
returns a value of 392 mW with a maximum junction tem-
perature of 125˚C.
CAPACITOR CHARACTERISTICS
With a θJA = 88˚C/W, the device in the LLP package returns
a value of 1.136 mW with a maximum junction temperature
of 125˚C.
The LP3995 is designed to work with ceramic capacitors on
the output to take advantage of the benefits they offer. For
capacitance values in the range of 1 µF to 4.7 µF, ceramic
capacitors are the smallest, least expensive and have the
lowest ESR values, thus making them best for eliminating
high frequency noise. The ESR of a typical 1 µF ceramic
capacitor is in the range of 20 mΩ to 40 mΩ, which easily
meets the ESR requirement for stability for the LP3995.
The actual power dissipation across the device can be rep-
resented by the following equation:
PD = (VIN − VOUT) x IOUT
.
This establishes the relationship between the power dissipa-
tion allowed due to thermal consideration, the voltage drop
across the device, and the continuous current capability of
the device. These two equations should be used to deter-
mine the optimum operating conditions for the device in the
application.
The temperature performance of ceramic capacitors varies
by type. Most large value ceramic capacitors ( ≥ 2.2 µF) are
manufactured with Z5U or Y5V temperature characteristics,
which results in the capacitance dropping by more than 50%
as the temperature goes from 25˚C to 85˚C.
A better choice for temperature coefficient in a ceramic
capacitor is X7R. This type of capacitor is the most stable
and holds the capacitance within 15% over the tempera-
ture range. Tantalum capacitors are less desirable than ce-
ramic for use as output capacitors because they are more
expensive when comparing equivalent capacitance and volt-
age ratings in the 1 µF to 4.7 µF range.
EXTERNAL CAPACITORS
In common with most regulators, the LP3995 requires exter-
nal capacitors to ensure stable operation. The LP3995 is
specifically designed for portable applications requiring mini-
mum board space and smallest components. These capaci-
tors must be correctly selected for good performance.
Another important consideration is that tantalum capacitors
have higher ESR values than equivalent size ceramics. This
means that while it may be possible to find a tantalum
capacitor with an ESR value within the stable range, it would
have to be larger in capacitance (which means bigger and
more costly) than a ceramic capacitor with the same ESR
value. It should also be noted that the ESR of a typical
tantalum will increase about 2:1 as the temperature goes
from 25˚C down to −40˚C, so some guard band must be
allowed.
INPUT CAPACITOR
An input capacitor is required for stability. It is recommended
that a 1.0 µF capacitor be connected between the LP3995
input pin and ground (this capacitance value may be in-
creased without limit).
This capacitor must be located a distance of not more than
1 cm from the input pin and returned to a clean analogue
ground. Any good quality ceramic, tantalum, or film capacitor
may be used at the input.
Important: Tantalum capacitors can suffer catastrophic fail-
ures due to surge current when connected to a low-
impedance source of power (like a battery or a very large
capacitor). If a tantalum capacitor is used at the input, it must
be guaranteed by the manufacturer to have a surge current
rating sufficient for the application.
NOISE BYPASS CAPACITOR
A bypass capacitor should be connected between the CBP
pin and ground to significantly reduce the noise at the regu-
lator output. This device pin connects directly to a high
impedance node within the bandgap reference circuitry. Any
significant loading on this node will cause a change on the
regulated output voltage. For this reason, DC leakage cur-
rent through this pin must be kept as low as possible for best
output voltage accuracy.
There are no requirements for the ESR (Equivalent Series
Resistance) on the input capacitor, but tolerance and tem-
perature coefficient must be considered when selecting the
capacitor to ensure the capacitance will remain ≅ 1.0 µF over
the entire operating temperature range.
The use of a 0.01uF bypass capacitor is strongly recom-
mended to prevent overshoot on the output during start-up.
11
www.national.com
within the reference block allowing a very fast ramp of the
output voltage to reach the target voltage.
Application Hints (Continued)
The types of capacitors best suited for the noise bypass
capacitor are ceramic and film. High quality ceramic capaci-
tors with NPO or COG dielectric typically have very low
leakage. Polypropolene and polycarbonate film capacitors
are available in small surface-mount packages and typically
have extremely low leakage current.
micro SMD MOUNTING
The micro SMD package requires specific mounting tech-
niques which are detailed in National Semiconductor Appli-
cation Note AN-1112.
Referring to the section Surface Mount Technology (SMT)
Assembly Considerations, it should be noted that the pad
style which must be used with the 5 pin package is NSMD
(non-solder mask defined) type.
Unlike many other LDO’s, the addition of a noise reduction
capacitor does not effect the transient response of the de-
vice.
For best results during assembly, alignment ordinals on the
PC board may be used to facilitate placement of the micro
SMD device.
ENABLE OPERATION
The LP3995 may be switched ON or OFF by a logic input at
the ENABLE pin, VEN. A high voltage at this pin will turn the
device on. When the enable pin is low, the regulator output is
off and the device typically consumes 3 nA. If the application
does not require the shutdown feature, the VEN pin should
be tied to VIN to keep the regulator output permanently on.
To ensure proper operation, the signal source used to drive
the VEN input must be able to swing above and below the
specified turn-on/off voltage thresholds listed in the Electrical
micro SMD LIGHT SENSITIVITY
Exposing the micro SMD device to direct sunlight will cause
incorrect operation of the device. Light sources such as
halogen lamps can affect electrical performance if they are
situated in proximity to the device.
Light with wavelengths in the red and infra-red part of the
spectrum have the most detrimental effect thus the fluores-
cent lighting used inside most buildings has very little effect
on performance. Tests carried out on a micro SMD test
board showed a negligible effect on the regulated output
voltage when brought within 1 cm of a fluorescent lamp. A
deviation of less than 0.1% from nominal output voltage was
observed.
Characteristics section under VIL and VIH
.
FAST TURN OFF AND ON
The controlled switch-off feature of the device provides a fast
turn off by discharging the output capacitor via an internal
FET device. This discharge is current limited by the RDSon
of this switch. Fast turn-on is guaranteed by control circuitry
www.national.com
12
Physical Dimensions inches (millimeters) unless otherwise noted
micro SMD, 5 Bump, Package (TLA05)
NS Package Number TLA05ADA
The dimensions for X1, X2 and X3 are given as:
X1 = 1.006 +/− 0.03mm
X2 = 1.438 +/− 0.03mm
X3 = 0.600 +/− 0.075mm
13
www.national.com
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LLP, 6 Lead, Package (SOT23 Land)
NS Package Number LDE06A
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
National Semiconductor
Americas Customer
Support Center
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
National Semiconductor
Asia Pacific Customer
Support Center
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
Email: ap.support@nsc.com
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
相关型号：
©2020 ICPDF网 联系我们和版权申明