LP5951MFX-2.0 [NSC]

Micropower, 150mA Low-Dropout CMOS Voltage Regulator; 微器,150mA低压降CMOS电压稳压器
LP5951MFX-2.0
型号: LP5951MFX-2.0
厂家: National Semiconductor    National Semiconductor
描述:

Micropower, 150mA Low-Dropout CMOS Voltage Regulator
微器,150mA低压降CMOS电压稳压器

稳压器
文件: 总10页 (文件大小:606K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
June 2006  
LP5951  
Micropower, 150mA Low-Dropout CMOS Voltage  
Regulator  
General Description  
Features  
n Excellent line transient response: 2mV typ.  
n Excellent PSRR: -60dB at 1kHz typ.  
n Low quiescent current of 29µA typ.  
n 1.8 to 5.5V input voltage range  
n Small SOT23-5 package  
The LP5951 regulator is designed to meet the requirements  
of portable, battery-powered systems providing a regulated  
output voltage and low quiescent current. When switched to  
shutdown mode via a logic signal at the Enable pin, the  
power consumption is reduced to virtually zero.  
The LP5951 is designed to be stable with small 1µF/1.5µF  
ceramic capacitors.  
n Fast turn-on time of 30µs typ.  
<
n Typ. 1nA quiescent current in shutdown  
The LP5951 also features internal protection against short-  
circuit currents and over-temperature conditions.  
n Guaranteed 150mA output current  
n Output voltage range: 1.3V to 3.3V  
Performance is specified for a -40˚C to 125˚C temperature  
range.  
n Logic controlled enable 0.4V/0.9V  
n Good load transient response of 50mVpp typ.  
n Thermal-overload and short-circuit protection  
n -40˚C to +125˚C junction temperature range  
The device is currently available in SOT23-5 package and  
will be available in SC70-5 package soon.  
The device is available in fixed output voltages in the range  
of 1.3V to 3.3V. For availability, please contact your local  
NSC sales office.  
Applications  
n General purpose  
Typical Application Circuit  
20136201  
© 2006 National Semiconductor Corporation  
DS201362  
www.national.com  
Connection Diagram  
5-Lead Small Outline Package  
SOT23-5 (MF)  
20136202  
Top View  
See NS Package Number MF05A  
Pin Descriptions  
Pin  
Number  
Pin Name  
VIN  
Description  
1
2
3
Input Voltage. Input range: 1.8V to 5.5V  
GND  
EN  
Ground  
Enable pin logic input: Low = shutdown, High = normal operation. This pin should not be left  
floating.  
4
5
NC  
No internal connection  
Regulated output voltage  
VOUT  
Order Information  
For 5-Lead Small Outline Package SOT23-5 (MF)  
Output  
Voltage (V)  
LP5951 Supplied as 1000 Units,  
Tape and Reel  
LP5951MF-1.3  
LP5951MF-1.3  
LP5951MF-1.5  
LP5951MF-1.5  
LP5951MF-1.8  
LP5951MF-1.8  
LP5951MF-2.0  
LP5951MF-2.0  
LP5951MF-2.5  
LP5951MF-2.5  
LP5951MF-2.8  
LP5951MF-2.8  
LP5951MF-3.0  
LP5951MF-3.0  
LP5951MF-3.3  
LP5951MF-3.3  
LP5951 Supplied as 3000 Units,  
Tape and Reel  
Package  
Flow Marking  
LKRB  
LP5951MFX-1.3  
LP5951MFX-1.3  
LP5951MFX-1.5  
LP5951MFX-1.5  
LP5951MFX-1.8  
LP5951MFX-1.8  
LP5951MFX-2.0  
LP5951MFX-2.0  
LP5951MFX-2.5  
LP5951MFX-2.5  
LP5951MFX-2.8  
LP5951MFX-2.8  
LP5951MFX-3.0  
LP5951MFX-3.0  
LP5951MFX-3.3  
LP5951MFX-3.3  
1.3  
1.5  
1.8  
2.0  
2.5  
2.8  
3.0  
3.3  
NOPB LKRB  
LKAB  
NOPB LKAB  
LKBB  
NOPB LKBB  
LKCB  
NOPB LKCB  
LKEB  
NOPB LKEB  
LKFB  
NOPB LKFB  
LKGB  
NOPB LKGB  
LKHB  
NOPB LKHB  
Note: The package marking on the backside of the component designates the date code and a NSC internal code for die traceability. It will vary considerably.  
SOT23-5: ZWTT  
with: Z: 1 Digit Assembly Plant Code, W: 1 Digit Date Code, TT: 2 Digit Dierun Code  
www.national.com  
2
Absolute Maximum Ratings (Notes 2,  
1)  
Operating Ratings (Notes 1, 2)  
Input Voltage Range (VIN  
)
1.8V to 5.5V  
0 to (VIN + 0.3V)  
-40˚C to + 125˚C  
(Note 5)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
VEN Input Voltage  
Junction Temperature (TJ) Range  
Ambient Temperature (TA) Range  
VIN pin: Voltage to GND  
EN pin: Voltage to GND  
-0.3V to 6.5V  
-0.3V to (VIN+0.3V)  
with 5.5V max  
Thermal Properties  
Junction-to-Ambient Thermal  
Resistance (θJA), (Note 6)  
SOT23-5 Package:  
Continuous Power  
Dissipation(Note 3)  
Internally Limited  
150˚C  
220˚C/W  
Junction Temperature (TJ-MAX  
Storage Temperature Range  
Package Peak Reflow  
Temperature (10-20 sec.)  
Package Peak Reflow  
)
-65˚C to + 150˚C  
240˚C  
260˚C  
Temperature (Pb-free, 10-20 sec.)  
ESD Rating(Note 4)  
Human Body Model:  
Machine Model  
2.0kV  
200V  
ESD Caution Notice  
National Semiconductor recommends that all integrated circuits be handled with appropriate precautions. Failure to observe  
proper ESD handling techniques can result in damage.  
Electrical Characteristics(Notes 2, 7)  
Typical values and limits appearing in standard typeface are for TA = 25˚C. Limits appearing in boldface type apply over  
the full operating temperature range: -40˚C TJ +125˚C. Unless otherwise noted, VIN = VOUT(NOM) + 1V, CIN = 1µF, COUT  
= 1µF, VEN = 0.9V.  
Limit  
Symbol  
VIN  
Parameter  
Input Voltage  
Condition  
VIN VOUT(NOM) + VDO  
IOUT = 1mA  
Typ  
Min  
1.8  
Max  
5.5  
2.0  
3.5  
Units  
V
Output Voltage  
Tolerance  
-2.0  
-3.5  
%
-30˚C TJ +125˚C  
VIN = VOUT(NOM) + 1V to 5.5V  
IOUT = 1mA  
%
VOUT  
VDO  
IQ  
Line Regulation Error  
0.1  
-0.01  
200  
%/V  
Load Regulation Error IOUT = 1mA to 150mA  
Output Voltage Dropout IOUT = 150mA  
%/mA  
(Note 10)  
VOUT 2.5V  
250  
350  
55  
70  
1
mV  
mV  
µA  
<
VOUT 2.5V  
Quiescent Current  
VEN = 0.9V, ILOAD = 0  
VEN = 0.9V, ILOAD = 150mA  
VEN = 0V  
29  
33  
µA  
0.005  
400  
µA  
ISC  
Output Current  
(short circuit)  
Power Supply  
Rejection Ratio  
VIN = VOUT(NOM) + 1V  
150  
mA  
PSRR  
Sine modulated VIN  
f = 100Hz  
60  
60  
dB  
dB  
f = 1kHz  
f = 10kHz  
50  
dB  
EN  
Output Noise  
BW = 10Hz - 100kHz  
125  
160  
20  
µVRMS  
˚C  
TSD  
Thermal Shutdown  
Temperature Hysteresis  
˚C  
3
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Electrical Characteristics(Notes 2, 7) (Continued)  
Enable Control Characteristics  
Limit  
Symbol  
IEN  
Parameter  
Conditions  
Typical  
Min  
-1  
Max  
1
Units  
Maximum Input Current 0V VEN VIN, VIN = 5.5V  
µA  
at VEN Input  
VIL  
VIH  
Low Input Threshold  
(shutdown)  
VIN = 1.8..5.5V  
VIN = 1.8..5.5V  
0.4  
V
V
High Input Threshold  
(enable)  
0.9  
Transient Characteristics  
Limit  
Symbol  
Parameter  
Dynamic Line Transient VIN = VOUT(NOM) + 1V to  
VOUT(NOM) + 1V + 0.6V in 30µs, no  
Conditions  
Typical  
Min  
Max  
Units  
VOUT  
2
mV  
load  
VOUT  
Dynamic Load  
Transient  
IOUT = 0mA to 150mA in 10µs  
IOUT = 150mA to 0mA in 10µs  
IOUT = 1mA to 150mA in 1µs  
IOUT = 150mA to 1mA in 1µs  
Nominal conditions  
-30  
20  
-50  
40  
10  
30  
mV  
mV  
mV  
mV  
mV  
µs  
VOUT  
Overshoot on Startup  
Turn on time  
TON  
IOUT = 1mA  
Output Capacitor, Recommended Specification  
Limit(Note 8)  
Symbol  
Parameter  
Conditions  
Value  
Min  
Max  
Units  
Capacitance (Note 9)  
IOUT = 150mA, VIN = 5.0V  
<
VOUT 2.8V  
1.0  
1.5  
0.7  
1.1  
0.003  
47  
47  
µF  
µF  
COUT  
Output Capacitance  
VOUT 2.8V  
ESR  
0.300  
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of  
the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the  
Electrical Characteristics tables.  
Note 2: All voltages are with respect to the potential at the GND pin.  
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T = 160˚C (typ.) and disengages at T  
=
J
J
140˚C (typ.).  
Note 4: The Human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin. The machine model is a 200pF capacitor discharged  
directly into each pin. (MIL-STD-883 3015.7)  
Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be  
derated. Maximum ambient temperature (T  
) is dependent on the maximum operating junction temperature (T  
= 125˚C), the maximum power  
A-MAX  
J-MAX-OP  
dissipation of the device in the application (P  
), and the junction-to ambient thermal resistance of the part/package in the application (θ ), as given by the  
D-MAX  
– (θ x  
JA PD-MAX  
JA  
following equation: T  
= T  
).  
A-MAX  
J-MAX-OP  
Note 6: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,  
special attention must be paid to thermal dissipation issues in board design.  
Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.  
Note 8: Min and Max limits are guaranteed by design  
Note 9: The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered when selecting  
a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is X7R. However, dependent on application, X5R,  
Y5V, and Z5U can also be used. The shown minimum limit represents real minimum capacitance, including all tolerances and must be maintained over temperature  
and dc bias voltage (See capacitor section in Applications Hints)  
Note 10: Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100mV below the nominal output voltage. This  
specification does not apply for input voltages below 1.8V.  
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4
Output Current Derating  
Maximum Load Current vs VIN - VOUT, TA = 85˚C, VOUT = 1.5V, SOT23-5 Package  
20136208  
Block Diagram  
20136205  
5
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Typical Performance Characteristics Unless otherwise specified, CIN = 1µF ceramic, COUT = 1µF  
ceramic, VIN = VOUT(NOM) + 1V, TA = 25˚C, Enable pin is tied to VIN  
.
Load Transient Response  
Load Transient Response  
Line Transient Response  
Enable Start-up Time  
20136209  
20136210  
Line Transient Response  
20136211  
20136212  
Enable Start-up Time  
20136213  
20136214  
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6
Typical Performance Characteristics Unless otherwise specified, CIN = 1µF ceramic, COUT = 1µF  
ceramic, VIN = VOUT(NOM) + 1V, TA = 25˚C, Enable pin is tied to VIN  
. (Continued)  
Output Voltage Change vs Temperature  
Ground Current vs VIN  
20136217  
20136216  
Power Supply Rejection Ratio  
20136215  
7
www.national.com  
OUTPUT CAPACITOR  
Application Hints  
The LP5951 is designed specifically to work with very small  
ceramic output capacitors. The following ceramic capacitors  
(dielectric types X7R, Z5U, or Y5V) are suitable as COUT in  
the LP5951 application circuit:  
POWER DISSIPATION AND DEVICE OPERATION  
The permissible power dissipation for any package is a  
measure of the capability of the device to pass heat from the  
power source, the junctions of the IC, to the ultimate heat  
sink, the ambient environment. Thus the power dissipation is  
dependent on the ambient temperature and the thermal  
resistance across the various interfaces between the die and  
ambient air.  
<
-VOUT 2.8V: 1.0µF  
-VOUT 2.8V: 1.5µF  
COUT can be increased up to 47µF, the ESR should be  
between 3 mto 500 m.  
This capacitor must be located a distance of not more than  
1cm from the VOUT pin and returned to a clean analogue  
ground.  
As stated in (Note 5) in the electrical specification section,  
the allowable power dissipation for the device in a given  
package can be calculated using the equation:  
It is also possible to use tantalum or film capacitors at the  
device output, VOUT, but these are not as attractive for  
reasons of size and cost (see the section Capacitor Charac-  
teristics).  
PD = (TJ(MAX) - TA) / θJA  
With a θJA = 220˚C/W, the device in the SOT23-5 package  
returns a value of 454 mW with a maximum junction tem-  
perature of 125˚C at TA of 25˚C.  
CAPACITOR CHARACTERISTICS  
The LP5951 is designed to work with ceramic capacitors on  
the output to take advantage of the benefits they offer. For  
capacitance values in the range of 1µF to 4.7µF, ceramic  
capacitors are the smallest, least expensive and have the  
lowest ESR values, thus making them best for eliminating  
high frequency noise. The ESR of a typical 1µF ceramic  
capacitor is in the range of 3mto 40m, which easily  
meets the ESR requirement for stability for the LP5951.  
The actual power dissipation across the device can be esti-  
mated by the following equation:  
PD (VIN - VOUT) * IOUT  
This establishes the relationship between the power dissipa-  
tion allowed due to thermal consideration, the voltage drop  
across the device, and the continuous current capability of  
the device. These two equations should be used to deter-  
mine the optimum operating conditions for the device in the  
application.  
For both input and output capacitors, careful interpretation of  
the capacitor specification is required to ensure correct de-  
vice operation. The capacitor value can change greatly, de-  
pending on the operating conditions and capacitor type.  
In particular, the output capacitor selection should take ac-  
count of all the capacitor parameters, to ensure that the  
specification is met within the application. The capacitance  
can vary with DC bias conditions as well as temperature and  
frequency of operation. Capacitor values will also show  
some decrease over time due to aging. The capacitor pa-  
rameters are also dependant on the particular case size,  
with smaller sizes giving poorer performance figures in gen-  
eral. As an example, Figure 1 shows a typical graph com-  
paring different capacitor case sizes in a Capacitance vs. DC  
Bias plot. As shown in the graph, increasing the DC Bias  
condition can result in the capacitance value falling below  
the minimum value given in the recommended capacitor  
specifications table (0.7/1.1µF in this case). Note that the  
graph shows the capacitance out of spec for the 0402 case  
size capacitor at higher bias voltages. It is therefore recom-  
mended that the capacitor manufacturers’ specifications for  
the nominal value capacitor are consulted for all conditions,  
as some capacitor sizes (e.g. 0402) may not be suitable in  
the actual application.  
EXTERNAL CAPACITORS  
As is common with most regulators, the LP5951 requires  
external capacitors to ensure stable operation. The LP5951  
is specifically designed for portable applications requiring  
minimum board space and the smallest size components.  
These capacitors must be correctly selected for good perfor-  
mance.  
INPUT CAPACITOR  
An input capacitor is required for stability. It is recommended  
that a 1.0µF capacitor be connected between the LP5951  
input pin and ground (this capacitance value may be in-  
creased without limit).  
This capacitor must be located a distance of not more than 1  
cm from the input pin and returned to a clean analogue  
ground. Any good quality ceramic, tantalum, or film capacitor  
may be used at the input.  
Important: Tantalum capacitors can suffer catastrophic fail-  
ures due to surge current when connected to a low-  
impedance source of power (like a battery or a very large  
capacitor). If a tantalum capacitor is used at the input, it must  
be guaranteed by the manufacturer to have a surge current  
rating sufficient for the application.  
There are no requirements for the ESR (Equivalent Series  
Resistance) on the input capacitor, but tolerance and tem-  
perature coefficient must be considered when selecting the  
capacitor to ensure the capacitance will remain 0.7µF over  
the entire operating temperature range.  
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8
If the application does not require the Enable switching  
feature, the VEN pin should be tied to VIN to keep the  
regulator output permanently on.  
Application Hints (Continued)  
To ensure proper operation, the signal source used to drive  
the VEN input must be able to swing above and below the  
specified turn-on/off voltage thresholds listed in the Electrical  
Characteristics section under Enable Control Characteris-  
tics, VIL and VIH  
.
FAST TURN OFF AND ON  
The controlled switch-off feature of the device provides a fast  
turn off by discharging the output capacitor via an internal  
FET device. This discharge is current limited by the RDSon  
of this switch.  
Fast turn-on is guaranteed by an optimized architecture  
allowing a very fast ramp of the output voltage to reach the  
target voltage.  
SHORT-CIRCUIT PROTECTION  
The LP5951 is short circuit protected and in the event of a  
peak over-current condition, the output current through the  
PMOS will be limited.  
20136206  
FIGURE 1. Graph Showing A Typical Variation In  
Capacitance vs DC Bias  
If the over-current condition exists for a longer time, the  
average power dissipation will increase depending on the  
input to output voltage difference until the thermal shutdown  
circuitry will turn off the PMOS.  
The ceramic capacitor’s capacitance can vary with tempera-  
ture. The capacitor type X7R, which operates over a tem-  
perature range of -55˚C to +125˚C, will only vary the capaci-  
tance to within 15%. The capacitor type X5R has a similar  
tolerance over a reduced temperature range of -55˚C to  
+85˚C. Many large value ceramic capacitors, larger than 1µF  
are manufactured with Z5U or Y5V temperature characteris-  
tics. Their capacitance can drop by more than 50% as the  
temperature varies from 25˚C to 85˚C. Therefore X7R is  
recommended over Z5U and Y5V in applications where the  
ambient temperature will change significantly above or be-  
low 25˚C.  
Please refer to the section on thermal information for power  
dissipation calculations.  
THERMAL-OVERLOAD PROTECTION  
Thermal-Overload Protection limits the total power dissipa-  
tion in the LP5951. When the junction temperature exceeds  
TJ = 160˚C typ., the shutdown logic is triggered and the  
PMOS is turned off, allowing the device to cool down. After  
the junction temperature dropped by 20˚C (temperature hys-  
teresis), the PMOS is activated again. This results in a  
pulsed output voltage during continuous thermal-overload  
conditions.  
Tantalum capacitors are less desirable than ceramic for use  
as output capacitors because they are more expensive when  
comparing equivalent capacitance and voltage ratings in the  
1µF to 4.7µF range.  
The Thermal-Overload Protection is designed to protect the  
LP5951 in the event of a fault condition. For normal, continu-  
ous operation, do not exceed the absolute maximum junc-  
tion temperature rating of TJ = +150˚C (see Absolute Maxi-  
mum Ratings).  
Another important consideration is that tantalum capacitors  
have higher ESR values than equivalent size ceramics. This  
means that while it may be possible to find a tantalum  
capacitor with an ESR value within the stable range, it would  
have to be larger in capacitance (which means bigger and  
more costly) than a ceramic capacitor with the same ESR  
value. It should also be noted that the ESR of a typical  
tantalum will increase about 2:1 as the temperature goes  
from 25˚C down to -40˚C, so some guard band must be  
allowed.  
REVERSE CURRENT PATH  
The internal MOSFET in LP5951 has an inherent parasitic  
body diode. During normal operation, the input voltage is  
higher than the output voltage and the parasitic diode is  
reverse biased. However, if the output is pulled above the  
input in an application, then current flows from the output to  
the input as the parasitic diode gets forward biased. The  
output can be pulled above the input as long as the current  
in the parasitic diode is limited to 50mA.  
NO-LOAD STABILITY  
The LP5951 will remain stable and in regulation with no  
external load. This is an important consideration in some  
circuits, for example CMOS RAM keep-alive applications.  
For currents above this limit an external Schottky diode must  
be connected from VOUT to VIN (cathode on VIN, anode on  
VOUT).  
ENABLE OPERATION  
The LP5951 may be switched ON or OFF by a logic input at  
the Enable pin, VEN. A logic high at this pin will turn the  
device on. When the enable pin is low, the regulator output is  
off and the device typically consumes 5nA.  
9
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Physical Dimensions inches (millimeters) unless otherwise noted  
20136207  
5-Lead Small Outline Package SOT23-5 (MF),  
NS Package Number MF05A  
For most accurate revision please refer to www.national.com/packaging/parts/  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support device  
or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
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LP5951MFX-3.3

Micropower, 150mA Low-Dropout CMOS Voltage Regulator
NSC

LP5951MFX-3.3

LP5951 Micropower, 150mA Low-Dropout CMOS Voltage Regulator
TI