MM74HC245AWM/A+ [NSC]

IC,BUS TRANSCEIVER,SINGLE,8-BIT,HC-CMOS,SOP,20PIN,PLASTIC;
MM74HC245AWM/A+
型号: MM74HC245AWM/A+
厂家: National Semiconductor    National Semiconductor
描述:

IC,BUS TRANSCEIVER,SINGLE,8-BIT,HC-CMOS,SOP,20PIN,PLASTIC

文件: 总6页 (文件大小:130K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
January 1988  
MM54HC245A/MM74HC245A  
Octal TRI-STATE Transceiver  
É
General Description  
This TRI-STATE bidirectional buffer utilizes advanced sili-  
con-gate CMOS technology, and is intended for two-way  
asynchronous communication between data buses. It has  
high drive current outputs which enable high speed opera-  
tion even when driving large bus capacitances. This circuit  
possesses the low power consumption and high noise im-  
This device can drive up to 15 LS-TTL Loads, and does not  
have Schmitt trigger inputs. All inputs are protected from  
damage due to static discharge by diodes to V  
ground.  
and  
CC  
Features  
munity usually associated with CMOS circuitry, yet has  
speeds comparable to low power Schottky TTL circuits.  
Y
Typical propagation delay: 13 ns  
Wide power supply range: 26V  
Low quiescent current: 80 mA maximum (74 HC)  
Y
This device has an active low enable input G and a direction  
control input, DIR. When DIR is high, data flows from the A  
Y
Y
TRI-STATE outputs for connection to bus oriented  
systems  
inputs to the B outputs. When DIR is low, data flows from  
B inputs to the A outputs. The MM54HC245A/  
the  
MM74HC245A transfers true data from one bus to the oth-  
er.  
Y
Y
High output drive: 6 mA (minimum)  
Same as the ’645  
Connection Diagram  
Dual-In-Line Package  
TL/F/5165–1  
Top View  
Order Number MM54HC245A or MM74HC245A  
Truth Table  
Control  
Inputs  
Operation  
G
DIR  
L
L
L
H
X
B data to A bus  
A data to B bus  
Isolation  
H
e
e
e
low level, X irrelevant  
H
high level, L  
TRI-STATEÉ is a registered trademark of National Semiconductor Corp.  
C
1995 National Semiconductor Corporation  
TL/F/5165  
RRD-B30M105/Printed in U. S. A.  
Absolute Maximum Ratings (Notes 1 & 2)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales  
Office/Distributors for availability and specifications.  
Operating Conditions  
Min  
Max  
Units  
Supply Voltage (V  
)
CC  
2
6
V
DC Input or Output Voltage  
(V , V  
b
a
0.5 to 7.0V  
Supply Voltage (V  
)
CC  
)
0
V
V
IN OUT  
CC  
b
b
a
a
DC Input Voltage DIR and G pins (V  
)
1.5 to V  
1.5V  
0.5V  
IN  
CC  
CC  
Operating Temp. Range (T )  
A
DC Input/Output Voltage (V , V  
)
0.5 to V  
IN OUT  
b
b
a
85  
a
125  
MM74HC  
MM54HC  
40  
55  
C
§
§
g
g
g
Clamp Diode Current (I  
)
20 mA  
35 mA  
70 mA  
CD  
C
DC Output Current, per pin (I  
)
OUT  
Input Rise/Fall Times  
DC V or GND Current, per pin (I  
CC  
)
CC  
e
V
CC  
(t , t )  
r f  
2.0V  
4.5V  
6.0V  
1000  
500  
ns  
ns  
ns  
b
a
65 C to 150 C  
Storage Temperature Range (T  
)
§
§
e
e
STG  
V
CC  
V
CC  
Power Dissipation (P )  
D
(Note 3)  
400  
600 mW  
500 mW  
S.O. Package only  
Lead Temp. (T ) (Soldering 10 seconds)  
L
260 C  
§
DC Electrical Characteristics (Note 4)  
74HC  
eb  
54HC  
e
T
25 C  
§
A
eb  
T
40 to 85 C  
§
T
A
55 to 125 C  
§
Symbol  
Parameter  
Conditions  
V
CC  
Units  
A
Typ  
Guaranteed Limits  
V
V
V
Minimum High Level Input  
Voltage  
2.0V  
4.5V  
6.0V  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
1.5  
3.15  
4.2  
V
V
V
IH  
Maximum Low Level Input  
2.0V  
4.5V  
6.0V  
0.5  
1.35  
1.8  
0.5  
1.35  
1.8  
0.5  
1.35  
1.8  
V
V
V
IL  
Voltage**  
e
V or V  
IH IL  
Minimum High Level Output  
Voltage  
V
I
OH  
IN  
s
20 mA  
2.0V 2.0  
4.5V 4.5  
6.0V 6.0  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
1.9  
4.4  
5.9  
V
V
V
l
OUT  
l
e
V
I
V
or V  
IH IL  
IN  
s
s
6.0 mA  
7.8 mA  
4.5V 4.2 3.98  
6.0V 5.7 5.48  
3.84  
5.34  
3.7  
5.2  
V
V
l
l
OUT  
OUT  
l
l
I
e
V or V  
IH IL  
V
OL  
Maximum Low Level Output  
Voltage  
V
IN  
s
I
20 mA  
2.0V  
4.5V  
6.0V  
0
0
0
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
V
V
l
OUT  
l
e
V
I
V
or V  
IH IL  
IN  
s
s
6.0 mA  
7.8 mA  
4.5V 0.2 0.26  
6.0V 0.2 0.26  
0.33  
0.33  
0.4  
0.4  
V
V
l
l
OUT  
OUT  
l
l
I
e
V to GND  
CC  
g
g
g
1.0  
I
I
I
Input Leakage  
V
6.0V  
0.1  
1.0  
mA  
mA  
mA  
IN  
IN  
Current (G and DIR)  
e
V or GND 6.0V  
CC  
g
g
g
10  
Maximum TRI-STATE Output  
Leakage Current  
V
0.5  
5.0  
OZ  
CC  
OUT  
e
Enable G  
V
IH  
or GND  
CC  
e
Maximum Quiescent Supply  
Current  
V
IN  
V
6.0V  
8.0  
80  
160  
e
I
0 mA  
OUT  
Note 1: Maximum Ratings are those values beyond which damage to the device may occur.  
Note 2: Unless otherwise specified all voltages are referenced to ground.  
b
b
Note 3: Power Dissipation temperature derating Ð plastic ‘‘N’’ package: 12 mW/ C from 65 C to 85 C; ceramic ‘‘J’’ package: 12 mW/ C from 100 C to 125 C.  
§
§
§
§
Note 4: For a power supply of 5V 10% the worst case output voltages (V , and V ) occur for HC at 4.5V. Thus the 4.5V values should be used when designing  
§
§
g
OH OL  
5.5V and 4.5V respectively. (The V value at 5.5V is 3.85V.) The worst case leakage current (I , I , and  
IH IN CC  
e
with this supply. Worst case V and V occur at V  
IH IL  
CC  
) occur for CMOS at the higher voltage and so the 6.0V values should be used.  
I
OZ  
e
**V limits are currently tested at 20% of V . The above V specification (30%) of V ) will be implemented no later than Q1, CY’89. O  
IL CC IL CC  
V .  
IL  
2
e
e
e e  
25 C, t t 6 ns  
§
r f  
AC Electrical Characteristics V  
5V, T  
CC  
A
Guaranteed  
Limit  
Symbol  
, t  
Parameter  
Conditions Typ  
Units  
e
t
t
Maximum Propagation Delay  
Maximum Output Enable Time  
C
45 pF  
12  
24  
17  
35  
ns  
ns  
PHL PLH  
L
e
e
, t  
PZH PZL  
R
1 kX  
L
C
45 pF  
L
e
e
t , t  
PHZ PLZ  
Maximum Output Disable Time  
R
1 kX  
18  
25  
ns  
L
C
L
5 pF  
e
e
e
t
f
e
AC Electrical Characteristics V  
2.0V to 6.0V, C  
50 pF, t  
6 ns (unless otherwise specified)  
54HC  
CC  
L
r
74HC  
eb  
e
T
25 C  
§
A
eb  
T
40 to 85 C  
§
T
A
55 to 125 C  
§
Symbol  
Parameter  
Conditions  
V
CC  
Units  
A
Typ  
Guaranteed Limits  
e
e
t
t
,
Maximum Propagation Delay  
C
C
50 pF  
2.0V  
31  
41  
90  
96  
113  
116  
135  
128  
ns  
ns  
PHL  
L
150 pF 2.0V  
PLH  
L
e
e
C
C
50 pF  
4.5V  
13  
17  
18  
22  
23  
28  
27  
33  
ns  
ns  
L
150 pF 4.5V  
L
e
e
C
C
50 pF  
6.0V  
11  
14  
15  
19  
19  
23  
23  
28  
ns  
ns  
L
150 pF 6.0V  
L
e
t
t
,
Maximum Output Enable  
Time  
R
1 kX  
PZH  
L
PZL  
e
e
C
C
50 pF  
2.0V  
71  
81  
190  
240  
240  
300  
285  
360  
ns  
ns  
L
150 pF 2.0V  
L
e
e
C
C
50 pF  
4.5V  
26  
31  
38  
48  
48  
60  
57  
72  
ns  
ns  
L
150 pF 4.5V  
L
e
e
C
C
50 pF  
6.0V  
21  
25  
32  
41  
41  
51  
48  
61  
ns  
ns  
L
150 pF 6.0V  
L
e
e
t
t
,
Maximum Output Disable  
Time  
R
1 kX  
2.0V  
4.5V  
6.0V  
39  
20  
18  
135  
27  
169  
34  
203  
41  
ns  
ns  
ns  
PHZ  
L
C
L
50 pF  
PLZ  
23  
29  
34  
e
t , t  
TLH THL  
Output Rise and Fall Time  
C
L
50 pF  
2.0V  
4.5V  
6.0V  
20  
6
60  
12  
10  
75  
15  
13  
90  
18  
15  
ns  
ns  
ns  
5
e
e
C
PD  
Power Dissipation  
G
G
V
V
50  
5
pF  
pF  
IL  
Capacitance (Note 5)  
IH  
C
C
Maximum Input Capacitance  
5
10  
20  
10  
20  
10  
20  
pF  
pF  
IN  
Maximum Input/Output  
Capacitance, A or B  
15  
IN/OUT  
2
e
a
e
a
V f I  
PD CC CC  
Note 5: C determines the no load dynamic power consumption, P  
PD  
C
V
PD CC  
f
I V  
CC CC  
, and the no load dynamic current consumption, I  
C
.
D
S
3
Logic Diagram  
TL/F/5165–2  
4
Physical Dimensions inches (millimeters)  
Order Number MM54HC245A or MM74HC245A  
NS Package J20A  
5
Physical Dimensions inches (millimeters) (Continued)  
Order Number MM74HC245A  
NS Package N20A  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT  
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL  
SEMICONDUCTOR CORPORATION. As used herein:  
1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and whose  
failure to perform, when properly used in accordance  
with instructions for use provided in the labeling, can  
be reasonably expected to result in a significant injury  
to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform can  
be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or  
effectiveness.  
National Semiconductor  
Corporation  
National Semiconductor  
Europe  
National Semiconductor  
Hong Kong Ltd.  
National Semiconductor  
Japan Ltd.  
a
1111 West Bardin Road  
Arlington, TX 76017  
Tel: 1(800) 272-9959  
Fax: 1(800) 737-7018  
Fax:  
(
49) 0-180-530 85 86  
@
13th Floor, Straight Block,  
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Tsimshatsui, Kowloon  
Hong Kong  
Tel: (852) 2737-1600  
Fax: (852) 2736-9960  
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(
49) 0-180-530 85 85  
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National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.  

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