NTE3034A [NTE]
Phototransistor Detector; 光电晶体管探测器
| 型号： | NTE3034A |
| 厂家： | 
NTE ELECTRONICS |
| 描述： | Phototransistor Detector |
| 文件： | 总2页 (文件大小：23K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NTE3034A
Phototransistor Detector
Description:
The NTE3034A is designed for industrial processing and control applications such as light modula-
tors, shaft or position encoders, and end tape detectors. The NTE3034A is designed to be used with
the NTE3029A infrared emitter in optical slotted coupler/interrupter applications.
Features:
D Economical, Miniature Plastic Package
D Package Designed for Accurate Positioning
D Lens Molded into Package
Absolute Maximum Ratings:
Collector–Emitter Voltage, VCEO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V
Total Device Dissipation (TA = +25°C), PD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150mW
Derate Above 25°C (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2mW/°C
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40° to +100°C
Lead Temperature (During Soldering, 1/16” from case, 5sec max., Note 2), TL . . . . . . . . . . +260°C
Electrical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min Typ Max Unit
Collector Dark Current
ID
VCE = 10V, H [ 0
–
–
–
100 nA
Collector–Emitter Breakdown Voltage V(BR)CEO IC = 10mA, H [ 0
30
–
V
Optical Characteristics: (TA = +25°C unless otherwise specified)
Parameter
Collector Light Current
Turn–On Time
Symbol
Test Conditions
VCE = 5V, H = 500µW/cm2
Min Typ Max Unit
IL
100 500
–
–
µA
µs
µs
V
H = 5mW/cm2, VCC = 5V,
RL = 2400Ω
ton
toff
–
–
–
–
60
Turn–Off Time
0.25 0.4
0.25 0.4
Saturation Voltage
VCE(sat) H = 5mW/cm2, IC = 2mA, VCC = 5V
Wavelength of Maximum Sensitivity
λs
0.8
–
µm
Note 1. Measured with device soldered into a typical PC board.
Note 2. Heat sink should be applied to leads during soldering to prevent case temperature from ex-
ceeding +100°C.
.160 (4.06)
.045 (1.14) Dia
.120
(3.04)
.125
(3.17)
.168
(4.27)
.750
(19.05)
Max
.020 (.508)
.100 (2.54)
E
C
.060 (1.52)
.103
(2.62)
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