M29W800AB90N6 [NUMONYX]
Flash, 512KX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48;型号: | M29W800AB90N6 |
厂家: | NUMONYX B.V |
描述: | Flash, 512KX16, 90ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 光电二极管 |
文件: | 总40页 (文件大小:720K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
M29W800AT
M29W800AB
8 Mbit (1Mb x8 or 512Kb x16, Boot Block)
Low Voltage Single Supply Flash Memory
FEATURES SUMMARY
■
2.7V to 3.6V SUPPLY VOLTAGE for
Figure 1. Packages
PROGRAM, ERASE and READ
OPERATIONS
■
■
■
ACCESS TIME: 80ns
PROGRAMMING TIME: 10µs typical
PROGRAM/ERASE CONTROLLER (P/E.C.)
FBGA
–
–
Program Byte-by-Byte or Word-by-Word
Status Register bits and Ready/Busy
Output
TFBGA48 (ZA)
8 x 6 solder balls
TSOP48 (N)
12 x 20mm
■
■
■
SECURITY PROTECTION MEMORY AREA
INSTRUCTION ADDRESS CODING: 3 digits
MEMORY BLOCKS
–
–
Boot Block (Top or Bottom location)
Parameter and Main blocks
■
■
BLOCK, MULTI-BLOCK and CHIP ERASE
MULTI BLOCK PROTECTION/TEMPORARY
UNPROTECTION MODES
■
■
ERASE SUSPEND and RESUME MODES
–
Read and Program another Block during
Erase Suspend
SO44 (M)
LOW POWER CONSUMPTION
Stand-by and Automatic Stand-by
–
■
■
100,000 PROGRAM/ERASE CYCLES per
BLOCK
20 YEARS DATA RETENTION
Figure 2. Logic Diagram
V
CC
–
Defectivity below 1ppm/year
■
ELECTRONIC SIGNATURE
19
15
–
–
–
Manufacturer Code: 20h
Top Device Code, M29W800AT: D7h
Bottom Device Code, M29W800AB: 5Bh
A0-A18
DQ0-DQ14
W
E
DQ15A–1
BYTE
RB
M29W800AT
M29W800AB
G
RP
V
SS
AI02599
March 2004
1/40
M29W800AT, M29W800AB
TABLE OF CONTENTS
FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 1. Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Organisation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Memory Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Command Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. SO Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 5. TFBGA Connections (Top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. Top Boot Block Addresses, M29W800AT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3. Bottom Boot Block Addresses, M29W800AB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SIGNAL DESCRIPTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Address Inputs (A0-A18). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data Input/Outputs (DQ0-DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Data Input/Outputs (DQ8-DQ14 and DQ15A–1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Chip Enable (E). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Output Enable (G). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write Enable (W). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Byte/Word Organization Select (BYTE). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ready/Busy Output (RB). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Reset/Block Temporary Unprotect Input (RP). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
V
V
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
CC
SS
DEVICE OPERATIONS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Read.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Write. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Output Disable. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Stan-by. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Automatic Stan-by. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Electronic Signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Temporary Unprotection.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Block Unprotection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
(1)
Table 4. User Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 5. Read Electronic Signature (following AS instruction or with A9 = V ) . . . . . . . . . . . . . . 11
ID
Table 6. Read Block Protection with AS Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/40
M29W800AT, M29W800AB
INSTRUCTIONS AND COMMANDS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Coded Cycles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 7. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Read/Reset (RD) Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Auto Select (AS) Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Program (PG) Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Block Erase (BE) Instruction.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chip Erase (CE) Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Erase Suspend (ES) Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Erase Resume (ER) Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
(1)
Table 8. Instructions
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
STATUS REGISTER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Data Polling Bit (DQ7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Toggle Bit (DQ6).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Error Bit (DQ5). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Erase Timer Bit (DQ3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Toggle Bit (DQ2).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 9. Polling and Toggle Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 10. Status Register Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
MAXIMUM RATING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 11. Absolute Maximum Ratings (1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
DC AND AC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 6. AC Testing Input Output Waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 12. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 7. AC Testing Load Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
(1)
Table 13. Capacitance
(TA = 25 °C, f = 1 MHz) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 14. DC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C; V = 2.7V to 3.6V) . . . . . . . . . . . . . . . . . . . . . . . . . 18
A
CC
Table 15. Read AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
A
Table 16. Read AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
A
Figure 8. Read Mode AC Waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 17. Write AC Characteristics, W Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
A
Table 18. Write AC Characteristics, W Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
A
Table 19. Write AC Characteristics, E Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
A
Table 20. Write AC Characteristics, E Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
A
Figure 9. Write AC Waveforms, W Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 10.Write AC Waveforms, E Controlled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3/40
M29W800AT, M29W800AB
Figure 11.Read and Write AC Characteristics, RP Related . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
(1)
Figure 12.Data Polling and Toggle Bit AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
A
(1)
Table 21. Data Polling and Toggle Bit AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
A
Figure 13.Data Polling DQ7 AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 14.Data Toggle DQ6, DQ2 AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 15.Data Polling Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 16.Data Toggle Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 22. Program, Erase Times and Program, Erase Endurance Cycles
(T = 0 to 70°C; V = 2.7V to 3.6V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
A
CC
POWER SUPPLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Supply Rails. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
SECURITY PROTECTION MEMORY AREA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Read Security Data (RDS) Instruction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 23. Security Block Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 17.Security Block Address Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
PACKAGE MECHANICAL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 18.TSOP48, 48 Lead Plastic Thin Small Outline, 12x20 mm - Package Outline . . . . . . . . . 34
Table 24. TSOP48, 48 Lead Plastic Thin Small Outline, 12x20 mm - Package Mechanical Data . 34
Figure 19.TFBGA48, 6 x 8 Ball Array, 0.8mm Pitch - Bottom View Package Outline . . . . . . . . . . . 35
Table 25. TFBGA48, 6 x 8 Ball Array, 0.8mm Pitch - Package Mechanical Data . . . . . . . . . . . . . . 35
Figure 20.TFBGA48 Daisy Chain Connections (Top view through package) . . . . . . . . . . . . . . . . . 36
Figure 21.TFBGA48 Daisy Chain - PCB Connections (Top view through package). . . . . . . . . . . . 36
Figure 22.SO44 , Small Outline, 525mm Body Width - Package Outline . . . . . . . . . . . . . . . . . . . . 37
Table 26. SO44 , Small Outline, 525mm Body Width Package Mechanical Data. . . . . . . . . . . . . . 37
PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 27. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 28. Daisy Chain Ordering Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
REVISION HISTORY. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 29. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4/40
M29W800AT, M29W800AB
DESCRIPTION
The M29W800A is a non-volatile memory that may
be erased electrically at the block or chip level and
programmed in-system on a Byte-by-Byte or
Word-by-Word basis using only a single 2.7V to
A0-A18. The Data Input/Output signal DQ15A–1
acts as address line A–1 which selects the lower
or upper Byte of the memory word for output on
DQ0-DQ7, DQ8-DQ14 remain at High impedance.
When BYTE is High the memory uses the address
inputs A0-A18 and the Data Input/Outputs DQ0-
DQ15. Memory control is provided by Chip Enable
E, Output Enable G and Write Enable W inputs.
3.6V V
supply. For Program and Erase opera-
CC
tions the necessary high voltages are generated
internally. The device can also be programmed in
standard programmers.
The array matrix organisation allows each block to
be erased and reprogrammed without affecting
other blocks. Blocks can be protected against pro-
graming and erase on programming equipment,
and temporarily unprotected to make changes in
the application. Each block can be programmed
and erased over 100,000 cycles.
Instructions for Read/Reset, Auto Select for read-
ing the Electronic Signature or Block Protection
status, Programming, Block and Chip Erase,
Erase Suspend and Resume are written to the de-
vice in cycles of commands to a Command Inter-
face using standard microprocessor write timings.
A Reset/Block Temporary Unprotection RP tri-lev-
el input provides a hardware reset when pulled
Low, and when held High (at V ) temporarily un-
ID
protects blocks previously protected allowing them
to be programed and erased. Erase and Program
operations are controlled by an internal Program/
Erase Controller (P/E.C.). Status Register data
output on DQ7 provides a Data Polling signal, and
DQ6 and DQ2 provide Toggle signals to indicate
the state of the P/E.C operations. A Ready/Busy
RB output indicates the completion of the internal
algorithms.
Memory Blocks
The device is offered in TSOP48 (12 x 20mm),
SO44 and TFBGA48 0.8 mm ball pitch packages.
The devices feature asymmetrically blocked archi-
tecture providing system memory integration. Both
M29W800AT and M29W800AB devices have an
array of 19 blocks, one Boot Block of 16 KBytes or
8 KWords, two Parameter Blocks of 8 KBytes or 4
KWords, one Main Block of 32 KBytes or 16
KWords and fifteen Main Blocks of 64 KBytes or
32 KWords. The M29W800AT has the Boot Block
at the top of the memory address space and the
M29W800AB locates the Boot Block starting at the
bottom. The memory maps are showed in Tables
2 and 3.
Each block can be erased separately, any combi-
nation of blocks can be specified for multi-block
erase or the entire chip may be erased. The Erase
operations are managed automatically by the P/
E.C. The block erase operation can be suspended
in order to read from or program to any block not
being erased, and then resumed.
Table 1. Signal Names
A0-A18
DQ0-DQ7
DQ8-DQ14
DQ15A–1
E
Address Inputs
Data Input/Outputs, Command Inputs
Data Input/Outputs
Data Input/Output or Address Input
Chip Enable
G
Output Enable
W
Write Enable
RP
Reset/Block Temporary Unprotect
Ready/Busy Output
RB
Block protection provides additional data security.
Each block can be separately protected or unpro-
tected against Program or Erase on programming
equipment. All previously protected blocks can be
temporarily unprotected in the application.
BYTE
Byte/Word Organization
Supply Voltage
V
CC
V
SS
Ground
Bus Operations
NC
DU
Not Connected Internally
Don’t Use as Internally Connected
The following operations can be performed using
the appropriate bus cycles: Read (Array, Electron-
ic Signature, Block Protection Status), Write com-
mand, Output Disable, Stan-by, Reset, Block
Protection, Unprotection, Protection Verify, Unpro-
tection Verify and Block Temporary Unprotection.
See Table 5., Read Electronic Signature (follow-
Organisation
The M29W800A is organised as 1M x8 or 512K
x16 bits selectable by the BYTE signal. When
BYTE is Low the Byte-wide x8 organisation is se-
lected and the address lines are DQ15A–1 and
ing AS instruction or with A9 = V ) and Table
ID
6., Read Block Protection with AS Instruction.
5/40
M29W800AT, M29W800AB
Command Interface
at any time, during programming or erase, to mon-
itor the progress of the operation.
Instructions, made up of commands written in cy-
cles, can be given to the Program/Erase Controller
through a Command Interface (C.I.). For added
data protection, program or erase execution starts
after 4 or 6 cycles. The first, second, fourth and
fifth cycles are used to input Coded cycles to the
C.I. This Coded sequence is the same for all Pro-
gram/Erase Controller instructions. The 'Com-
mand' itself and its confirmation, when applicable,
are given on the third, fourth or sixth cycles. Any
incorrect command or any improper command se-
quence will reset the device to Read Array mode.
Instructions are composed of up to six cycles. The
first two cycles input a Coded sequence to the
Command Interface which is common to all in-
structions (see Table 8).
The third cycle inputs the instruction set-up com-
mand. Subsequent cycles output the addressed
data, Electronic Signature or Block Protection Sta-
tus for Read operations. In order to give additional
data protection, the instructions for Program and
Block or Chip Erase require further command in-
puts. For a Program instruction, the fourth com-
mand cycle inputs the address and data to be
programmed. For an Erase instruction (Block or
Chip), the fourth and fifth cycles input a further
Coded sequence before the Erase confirm com-
mand on the sixth cycle. Erasure of a memory
block may be suspended, in order to read data
from another block or to program data in another
block, and then resumed. When power is first ap-
Instructions
Seven instructions are defined to perform Read
Array, Auto Select (to read the Electronic Signa-
ture or Block Protection Status), Program, Block
Erase, Chip Erase, Erase Suspend and Erase Re-
sume.
The internal P/E.C. automatically handles all tim-
ing and verification of the Program and Erase op-
erations. The Status Register Data Polling,
Toggle, Error bits and the RB output may be read
plied or if V
falls below V
, the command in-
CC
LKO
terface is reset to Read Array.
Figure 3. TSOP Connections
Figure 4. SO Connections
RB
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
E
1
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
RP
A15
A14
A13
A12
A11
A10
A9
1
48
A16
2
W
BYTE
3
A8
V
SS
4
A9
DQ15A–1
DQ7
5
A10
A11
A12
A13
A14
A15
A16
BYTE
6
DQ14
DQ6
7
8
A8
DQ13
DQ5
9
NC
NC
W
10
11
12
13
14
15
16
17
18
19
20
21
22
DQ12
DQ4
M29W800T
M29W800B
RP
NC
NC
RB
A18
A17
A7
12
13
37
36
V
M29W800T
M29W800B
CC
V
V
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
G
SS
G
SS
DQ15A–1
DQ7
DQ0
DQ8
DQ14
DQ6
DQ1
DQ9
DQ13
DQ5
DQ2
A6
DQ10
DQ3
DQ12
DQ4
A5
A4
DQ11
V
CC
A3
V
E
SS
AI02181
A2
A1
24
25
A0
AI02179
6/40
M29W800AT, M29W800AB
Figure 5. TFBGA Connections (Top view through package)
1
2
3
4
5
6
A9
A8
A
B
C
D
E
F
A3
A4
A7
RB
NC
W
A13
A12
RP
A17
A2
A1
A6
A5
A18
NC
NC
NC
A10
A11
A14
A15
A0
DQ0
DQ2
DQ5
DQ7
A16
DQ12
DQ14
DQ13
DQ6
E
DQ8
DQ9
DQ1
DQ10
DQ11
DQ3
BYTE
DQ15
A–1
G
H
G
V
CC
V
DQ4
V
SS
SS
AI00656
7/40
M29W800AT, M29W800AB
Table 2. Top Boot Block Addresses,
M29W800AT
Table 3. Bottom Boot Block Addresses,
M29W800AB
Size
(Kbytes)
Address Range Address Range
(x8) (x16)
Size
(Kbytes)
Address Range Address Range
(x8) (x16)
#
#
18
17
16
15
14
13
12
11
10
9
16
8
FC000h-FFFFFh 7E000h-7FFFFh
FA000h-FBFFFh 7D000h-7DFFFh
F8000h-F9FFFh 7C000h-7CFFFh
F0000h-F7FFFh 78000h-7BFFFh
E0000h-EFFFFh 70000h-77FFFh
D0000h-DFFFFh 68000h-6FFFFh
C0000h-CFFFFh 60000h-67FFFh
B0000h-BFFFFh 58000h-5FFFFh
A0000h-AFFFFh 50000h-57FFFh
90000h-9FFFFh 48000h-4FFFFh
80000h-8FFFFh 40000h-47FFFh
70000h-7FFFFh 38000h-3FFFFh
60000h-6FFFFh 30000h-37FFFh
50000h-5FFFFh 28000h-2FFFFh
40000h-4FFFFh 20000h-27FFFh
30000h-3FFFFh 18000h-1FFFFh
20000h-2FFFFh 10000h-17FFFh
10000h-1FFFFh 08000h-0FFFFh
00000h-0FFFFh 00000h-07FFFh
18
17
16
15
14
13
12
11
10
9
64
64
64
64
64
64
64
64
64
64
64
64
64
64
64
32
8
F0000h-FFFFFh 78000h-7FFFFh
E0000h-EFFFFh 70000h-77FFFh
D0000h-DFFFFh 68000h-6FFFFh
C0000h-CFFFFh 60000h-67FFFh
B0000h-BFFFFh 58000h-5FFFFh
A0000h-AFFFFh 50000h-57FFFh
90000h-9FFFFh 48000h-4FFFFh
80000h-8FFFFh 40000h-47FFFh
70000h-7FFFFh 38000h-3FFFFh
60000h-6FFFFh 30000h-37FFFh
50000h-5FFFFh 28000h-2FFFFh
40000h-4FFFFh 20000h-27FFFh
30000h-3FFFFh 18000h-1FFFFh
20000h-2FFFFh 10000h-17FFFh
10000h-1FFFFh 08000h-0FFFFh
08000h-0FFFFh 04000h-07FFFh
06000h-07FFFh 03000h-03FFFh
04000h-05FFFh 02000h-02FFFh
00000h-03FFFh 00000h-01FFFh
8
32
64
64
64
64
64
64
64
64
64
64
64
64
64
64
64
8
8
7
7
6
6
5
5
4
4
3
3
2
2
1
1
8
0
0
16
8/40
M29W800AT, M29W800AB
SIGNAL DESCRIPTIONS
See Figure 2., Logic Diagram and Table 1., Signal
Names.
Address Inputs (A0-A18). The address inputs
for the memory array are latched during a write op-
eration on the falling edge at Chip Enable E or
Write Enable W. In Word-wide organisation the
address lines are A0-A18, in Byte-wide organisa-
tion DQ15A–1 acts as an additional LSB address
Write Enable (W). This input controls writing to
the Command Register and Address and Data
latches.
Byte/Word Organization Select (BYTE). The BYTE
input selects the output configuration for the de-
vice: Byte-wide (x8) mode or Word-wide (x16)
mode. When BYTE is Low, the Byte-wide mode is
selected and the data is read and programmed on
DQ0-DQ7. In this mode, DQ8-DQ14 are at high
impedance and DQ15A–1 is the LSB address.
When BYTE is High, the Word-wide mode is se-
lected and the data is read and programmed on
DQ0-DQ15.
line. When A9 is raised to V , either a Read Elec-
ID
tronic Signature Manufacturer or Device Code,
Block Protection Status or a Write Block Protection
or Block Unprotection is enabled depending on the
combination of levels on A0, A1, A6, A12 and A15.
Data Input/Outputs (DQ0-DQ7). These Inputs/
Outputs are used in the Byte-wide and Word-wide
organisations. The input is data to be programmed
in the memory array or a command to be written to
the C.I. Both are latched on the rising edge of Chip
Enable E or Write Enable W. The output is data
from the Memory Array, the Electronic Signature
Manufacturer or Device codes, the Block Protec-
tion Status or the Status register Data Polling bit
DQ7, the Toggle Bits DQ6 and DQ2, the Error bit
DQ5 or the Erase Timer bit DQ3. Outputs are valid
when Chip Enable E and Output Enable G are ac-
tive. The output is high impedance when the chip
is deselected or the outputs are disabled and
when RP is at a Low level.
Ready/Busy Output (RB). Ready/Busy is an
open-drain output and gives the internal state of
the P/E.C. of the device. When RB is Low, the de-
vice is Busy with a Program or Erase operation
and it will not accept any additional program or
erase instructions except the Erase Suspend in-
struction. When RB is High, the device is ready for
any Read, Program or Erase operation. The RB
will also be High when the memory is put in Erase
Suspend or Stan-by modes.
Reset/Block Temporary Unprotect Input (RP).
The RP Input provides hardware reset and pro-
tected block(s) temporary unprotection functions.
Reset of the memory is achieved by pulling RP to
V
for at least t
. When the reset pulse is giv-
PLPX
IL
Data Input/Outputs (DQ8-DQ14 and DQ15A–
1). These Inputs/Outputs are additionally used in
the Word-wide organisation. When BYTE is High
DQ8-DQ14 and DQ15A–1 act as the MSB of the
Data Input or Output, functioning as described for
DQ0-DQ7 above, and DQ8-DQ15 are 'don't care'
for command inputs or status outputs. When
BYTE is Low, DQ0-DQ14 are high impedance,
DQ15A–1 is the Address A–1 input.
Chip Enable (E). The Chip Enable input acti-
vates the memory control logic, input buffers, de-
coders and sense amplifiers. E High deselects the
memory and reduces the power consumption to
the stan-by level. E can also be used to control
writing to the command register and to the memo-
ry array, while W remains at a low level. The Chip
en, if the memory is in Read or Stan-by modes, it
will be available for new operations in t after
PHEL
the rising edge of RP. If the memory is in Erase,
Erase Suspend or Program modes the reset will
take t
during which the RB signal will be held
PLYH
at V . The end of the memory reset will be indicat-
IL
ed by the rising edge of RB. A hardware reset dur-
ing an Erase or Program operation will corrupt the
data being programmed or the sector(s) being
erased. See Tables 15 and 16, Read AC Charac-
teristics and Figure 13., Data Polling DQ7 AC
Waveforms.
Temporary block unprotection is made by holding
RP at V . In this condition previously protected
ID
blocks can be programmed or erased. The transi-
tion of RP from V to V must slower than t
IH
ID
PH-
Enable must be forced to V during the Block Un-
ID
.
See Tables 17 and 18, Write AC
Characterisics and Figure 13., Data Polling DQ7
AC Waveforms. When RP is returned from V to
PHH
protection operation.
Output Enable (G). The Output Enable gates the
outputs through the data buffers during a read op-
eration. When G is High the outputs are High im-
ID
V
all blocks temporarily unprotected will be again
IH
protected.
pedance. G must be forced to V level during
Block Protection and Unprotection operations.
ID
V
Supply Voltage. The power supply for all
CC
operations (Read, Program and Erase).
V
Ground. V is the reference for all voltage
SS
SS
measurements.
9/40
M29W800AT, M29W800AB
DEVICE OPERATIONS
See Table 4., User Bus Operations
(1)
, Table
The Electronic Signature can also be read, without
5., Read Electronic Signature (following AS in-
raising A9 to V , by giving the memory the In-
ID
struction or with A9 = V ) and Table 6., Read
struction AS. If the Byte-wide configuration is se-
lected the codes are output on DQ0-DQ7 with
DQ8-DQ14 at High impedance; if the Word-wide
configuration is selected the codes are output on
DQ0-DQ7 with DQ8-DQ15 at 00h.
Block Protection. Each block can be separately
protected against Program or Erase on program-
ming equipment. Block protection provides addi-
tional data security, as it disables all program or
erase operations. This mode is activated when
ID
Block Protection with AS Instruction.
Read. Read operations are used to output the
contents of the Memory Array, the Electronic Sig-
nature, the Status Register or the Block Protection
Status. Both Chip Enable E and Output Enable G
must be low in order to read the output of the mem-
ory. A new operation is initiated either on the fol-
lowing edge of Chip Enable E or on any address
transition with E at V .
IL
both A9 and G are raised to V and an address in
the block is applied on A12-A18. Block protection
ID
Write. Write operations are used to give Instruc-
tion Commands to the memory or to latch input
data to be programmed. A write operation is initi-
ated when Chip Enable E is Low and Write Enable
W is Low with Output Enable G High. Addresses
are latched on the falling edge of W or E whichever
occurs last. Commands and Input Data are
latched on the rising edge of W or E whichever oc-
curs first.
Output Disable. The data outputs are high im-
pedance when the Output Enable G is High with
Write Enable W High.
Stan-by. The memory is in stan-by when Chip
Enable E is High and the P/E.C. is idle. The power
consumption is reduced to the stan-by level and
the outputs are high impedance, independent of
the Output Enable G or Write Enable W inputs.
is initiated on the edge of W falling to V . Then af-
IL
ter a delay of 100µs, the edge of W rising to V
IH
ends the protection operations. Block protection
verify is achieved by bringing G, E, A0 and A6 to
V and A1 to V , while W is at V and A9 at V .
IL
IH
IH
ID
Under these conditions, reading the data output
will yield 01h if the block defined by the inputs on
A12-A18 is protected. Any attempt to program or
erase a protected block will be ignored by the de-
vice.
Block Temporary Unprotection. Any previously
protected block can be temporarily unprotected in
order to change stored data. The temporary un-
protection mode is activated by bringing RP to V .
ID
During the temporary unprotection mode the pre-
viously protected blocks are unprotected. A block
can be selected and data can be modified by exe-
cuting the Erase or Program instruction with the
Automatic Stan-by. After 150ns of bus inactivity
(no address transition, CE = V ) and when CMOS
IL
levels are driving the addresses, the chip automat-
ically enters a pseudo-stan-by mode where con-
sumption is reduced to the CMOS stan-by value,
RP signal held at V . When RP is returned to V ,
ID
IH
all the previously protected blocks are again pro-
tected.
Block Unprotection. All protected blocks can be
unprotected on programming equipment to allow
updating of bit contents. All blocks must first be
protected before the unprotection operation. Block
unprotection is activated when A9, G and E are at
while outputs still drive the bus (if G = V ).
IL
Electronic Signature. Two codes identifying the
manufacturer and the device can be read from the
memory. The manufacturer's code for STMicro-
electronics is 20h, the device code is D7h for the
M29W800AT (Top Boot) and 5Bh for the
M29W800AB (Bottom Boot). These codes allow
programming equipment or applications to auto-
matically match their interface to the characteris-
tics of the M29W800A. The Electronic Signature is
output by a Read operation when the voltage ap-
V
and A12, A15 at V . Unprotection is initiated
ID
IH
by the edge of W falling to V . After a delay of
IL
10ms, the unprotection operation will end. Unpro-
tection verify is achieved by bringing G and E to
V while A0 is at V , A6 and A1 are at V and A9
IL
IL
IH
remains at V . In these conditions, reading the
ID
plied to A9 is at V and address inputs A1 is Low.
ID
output data will yield 00h if the block defined by the
inputs A12-A18 has been successfully unprotect-
ed. Each block must be separately verified by giv-
ing its address in order to ensure that it has been
unprotected.
The manufacturer code is output when the Ad-
dress input A0 is Low and the device code when
this input is High. Other Address inputs are ig-
nored. The codes are output on DQ0-DQ7.
10/40
M29W800AT, M29W800AB
(1)
Table 4. User Bus Operations
DQ0-
DQ7
DQ8-
DQ14
DQ15
A–1
Operation
Read Word
Read Byte
Write Word
Write Byte
E
G
W
RP BYTE A0 A1 A6 A9 A12 A15
Data
Output
Data
Output
Data
Output
V
V
V
IH
V
IH
V
IH
V
IH
V
IH
V
IH
A0 A1 A6 A9 A12 A15
A0 A1 A6 A9 A12 A15
A0 A1 A6 A9 A12 A15
A0 A1 A6 A9 A12 A15
IL
IL
IL
IL
IL
Data
Output
Address
Input
V
V
V
V
V
V
IH
V
V
Hi-Z
IL
Data
Input
Data
Input
Data
Input
V
IH
IL
IL
IH
Data
Input
Address
Input
V
V
V
V
V
IL
Hi-Z
IL
IL
IH
V
V
V
V
Output Disable
Stan-by
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
IH
IH
IH
X
X
X
X
IH
IH
V
V
Reset
X
X
X
IL
Block
V
IL
V
ID
V
V
Pulse
Pulse
V
ID
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
IL
IH
(2,4)
Protection
Blocks
V
V
ID
V
V
ID
V
IH
V
IH
ID
IL
IH
(4)
Unprotection
Block
Block
Protection
Protect
V
V
V
V
V
V
V
V
V
V
X
A12 A15
A12 A15
X
X
IL
IL
IL
IH
IH
IL
IL
IH
IL
ID
ID
(2,4)
(3)
Verify
Status
Block
Block
Protect
Unprotection
V
IH
V
V
V
V
IH
V
V
X
X
X
X
X
X
IL
IH
IH
(2,4)
(3)
Verify
Status
Block
Temporary
X
X
X
X
X
X
X
X
X
X
ID
Unprotection
Note: 1. X = V or V
.
IH
IL
2. Block Address must be given an A12-A18 bits.
3. See Table 6., Read Block Protection with AS Instruction.
4. Operation performed on programming equipment.
Table 5. Read Electronic Signature (following AS instruction or with A9 = V )
ID
Other
DQ0- DQ8- DQ15
Org.
Code
Device
E
G
W
BYTE A0
A1
Addresses DQ7 DQ14
A–1
Manufact.
Code
V
V
V
V
V
V
V
Don’t Care
20h
00h
0
IL
IL
IH
IH
IL
IL
Word-
wide
V
V
V
V
V
V
V
V
V
IL
M29W800AT
M29W800AB
Don’t Care
Don’t Care
D7h
5Bh
00h
00h
0
0
IL
IL
IL
IH
IH
IH
IH
Device
Code
V
V
IL
IL
IH
IH
Table 6. Read Block Protection with AS Instruction
Other
Addresses
Code
E
G
W
A0
A1
A12-A18
DQ0-DQ7
V
V
V
V
V
Protected Block
Block Address
Block Address
Don’t Care
Don’t Care
01h
00h
IL
IL
IH
IL
IH
V
IL
V
IL
V
IH
V
V
IH
Unprotected Block
IL
11/40
M29W800AT, M29W800AB
INSTRUCTIONS AND COMMANDS
The Command Interface latches commands writ-
ten to the memory. Instructions are made up from
one or more commands to perform Read Memory
Array, Read Electronic Signature, Read Block Pro-
tection, Program, Block Erase, Chip Erase, Erase
Suspend and Erase Resume. Commands are
made of address and data sequences. The in-
structions require from 1 to 6 cycles, the first or first
three of which are always write operations used to
initiate the instruction. They are followed by either
further write cycles to confirm the first command or
execute the command immediately. Command se-
quencing must be followed exactly. Any invalid
combination of commands will reset the device to
Read Array. The increased number of cycles has
been chosen to assure maximum data security. In-
structions are initialised by two initial Coded cycles
which unlock the Command Interface. In addition,
for Erase, instruction confirmation is again preced-
ed by the two Coded cycles.
Read/Reset (RD) Instruction. The Read/Reset
instruction consists of one write cycle giving the
command F0h. It can be optionally preceded by
the two Coded cycles. Subsequent read opera-
tions will read the memory array addressed and
output the data read. A wait state of 10µs is nec-
essary after Read/Reset prior to any valid read if
the memory was in an Erase mode when the RD
instruction is given. The Read/Reset command is
not accepted during Erase and erase Suspend.
Auto Select (AS) Instruction. This instruction
uses the two Coded cycles followed by one write
cycle giving the command 90h to address AAAh in
the Byte-wide configuration or address 555h in the
Word-wide configuration for command set-up. A
subsequent read will output the manufacturer
code and the device code or the block protection
status depending on the levels of A0 and A1. The
manufacturer code, 20h, is output when the ad-
dresses lines A0 and A1 are Low, the device code,
EEh for Top Boot, EFh for Bottom Boot is output
when A0 is High with A1 Low.
See Table 7., Commands for a summary of Com-
mands.
Coded Cycles
The AS instruction also allows access to the block
protection status. After giving the AS instruction,
The two Coded cycles unlock the Command Inter-
face. They are followed by an input command or a
confirmation command. The Coded cycles consist
of writing the data AAh at address AAAh in the
Byte-wide configuration and at address 555h in
the Word-wide configuration during the first cycle.
During the second cycle the Coded cycles consist
of writing the data 55h at address 555h in the Byte-
wide configuration and at address 2AAh in the
Word-wide configuration. In the Byte-wide config-
uration the address lines A–1 to A10 are valid, in
Word-wide A0 to A11 are valid, other address lines
are 'don't care'. The Coded cycles happen on first
and second cycles of the command write or on the
fourth and fifth cycles.
A0 is set to V with A1 at V , while A12-A18 de-
IL
IH
fine the address of the block to be verified. A read
in these conditions will output a 01h if the block is
protected and a 00h if the block is not protected.
Program (PG) Instruction. This instruction uses
four write cycles. Both for Byte-wide configuration
and for Word-wide configuration. The Program
command A0h is written to address AAAh in the
Byte-wide configuration or to address 555h in the
Word-wide configuration on the third cycle after
two Coded cycles. A fourth write operation latches
the Address on the falling edge of W or E and the
Data to be written on the rising edge and starts the
P/E.C. Read operations output the Status Register
bits after the programming has started. Memory
programming is made only by writing '0' in place of
'1'. Status bits DQ6 and DQ7 determine if pro-
gramming is on-going and DQ5 allows verification
of any possible error. Programming at an address
not in blocks being erased is also possible during
erase suspend. In this case, DQ2 will toggle at the
address being programmed.
Table 7. Commands
Hex Code
00h
Command
Invalid/Reserved
10h
Chip Erase Confirm
Reserved
20h
Block Erase (BE) Instruction. This instruction
uses a minimum of six write cycles. The Erase
Set-up command 80h is written to address AAAh
in the Byte-wide configuration or address 555h in
the Word-wide configuration on third cycle after
the two Coded cycles. The Block Erase Confirm
command 30h is similarly written on the sixth cycle
after another two Coded cycles. During the input of
the second command an address within the block
to be erased is given and latched into the memory.
Additional block Erase Confirm commands and
30h
Block Erase Resume/Confirm
Set-up Erase
80h
Read Electronic Signature/
Block Protection Status
90h
A0h
B0h
F0h
Program
Erase Suspend
Read Array/Reset
12/40
M29W800AT, M29W800AB
block addresses can be written subsequently to
erase other blocks in parallel, without further Cod-
ed cycles. The erase will start after the erase tim-
eout period (see Erase Timer Bit DQ3 description).
cles are wrong, the instruction aborts and the de-
vice is reset to Read Array. It is not necessary to
program the array with 00h first as the P/E.C. will
automatically do this before erasing it to FFh.
Read operations after the sixth rising edge of W or
E output the Status Register bits. During the exe-
cution of the erase by the P/E.C., Data Polling bit
DQ7 returns '0', then '1' on completion. The Toggle
bits DQ2 and DQ6 toggle during erase operation
and stop when erase is completed. After comple-
tion the Status Register bit DQ5 returns '1' if there
has been an Erase Failure.
Thus, additional Erase Confirm commands for oth-
er blocks must be given within this delay. The input
of a new Erase Confirm command will restart the
timeout period. The status of the internal timer can
be monitored through the level of DQ3, if DQ3 is '0'
the Block Erase Command has been given and
the timeout is running, if DQ3 is '1', the timeout has
expired and the P/E.C. is erasing the Block(s). If
the second command given is not an erase con-
firm or if the Coded cycles are wrong, the instruc-
tion aborts, and the device is reset to Read Array.
It is not necessary to program the block with 00h
as the P/E.C. will do this automatically before to
erasing to FFh. Read operations after the sixth ris-
ing edge of W or E output the status register status
bits.
During the execution of the erase by the P/E.C.,
the memory accepts only the Erase Suspend ES
instruction. Data Polling bit DQ7 returns '0' while
the erasure is in progress and '1' when it has com-
pleted. The Toggle bit DQ2 and DQ6 toggle during
the erase operation. They stop when erase is com-
pleted. After completion the Status Register bit
DQ5 returns '1' if there has been an erase failure.
In such a situation, the Toggle bit DQ2 can be
used to determine which block is not correctly
erased. In the case of erase failure, a Read/Reset
RD instruction is necessary in order to reset the P/
E.C.
Erase Suspend (ES) Instruction. The
Block
Erase operation may be suspended by this in-
struction which consists of writing the command
B0h without any specific address. No Coded cy-
cles are required. It permits reading of data from
another block and programming in another block
while an erase operation is in progress. Erase sus-
pend is accepted only during the Block Erase in-
struction execution. Writing this command during
Erase timeout will, in addition to suspending the
erase, terminate the timeout. The Toggle bit DQ6
stops toggling when the P/E.C. is suspended. The
Toggle bits will stop toggling between 0.1µs and
15µs after the Erase Suspend (ES) command has
been written. The device will then automatically be
set to Read Memory Array mode. When erase is
suspended, a Read from blocks being erased will
output DQ2 toggling and DQ6 at '1'. A Read from
a block not being erased returns valid data. During
suspension the memory will respond only to the
Erase Resume ER and the Program PG instruc-
tions. A Program operation can be initiated during
erase suspend in one of the blocks not being
erased. It will result in both DQ2 and DQ6 toggling
when the data is being programmed.
Chip Erase (CE) Instruction. This
instruction
uses six write cycles. The Erase Set-up command
80h is written to address AAAh in the Byte-wide
configuration or the address 555h in the Word-
wide configuration on the third cycle after the two
Coded cycles. The Chip Erase Confirm command
10h is similarly written on the sixth cycle after an-
other two Coded cycles. If the second command
given is not an erase confirm or if the Coded cy-
Erase Resume (ER) Instruction. If an Erase
Suspend instruction was previously executed, the
erase operation may be resumed by giving the
command 30h, at any address, and without any
Coded cycles.
13/40
M29W800AT, M29W800AB
(1)
Table 8. Instructions
Mne.
Instr.
Cyc.
1st Cyc. 2nd Cyc. 3rd Cyc. 4th Cyc. 5th Cyc. 6th Cyc. 7th Cyc.
(3,7)
X
Read Memory Array until a new write cycle is initiated.
Addr.
Data
1+
F0h
Read/Reset
Memory
Array
Read Memory Array until a new write cycle
(2,4)
RD
Byte AAAh
555h
AAAh
Addr.
is initiated.
(3,7)
3+
Word 555h
AAh
2AAh
55h
555h
F0h
Data
Byte AAAh
Word 555h
AAh
555h
2AAh
55h
AAAh
Addr.
Read Electronic Signature or Block
(3,7)
(4)
Auto Select 3+
555h Protection Status until a new write cycle is
AS
initiated. See Note 5 and 6.
Data
90h
Byte AAAh
Word 555h
555h
2AAh
AAAh
Program
Address
Addr.
(3,7)
555h
A0h
Read Data Polling or Toggle Bit
until Program completes.
PG
Program
4
Program
Data
Data
AAh
55h
Byte AAAh
555h
2AAh
55h
AAAh
555h
80h
AAAh
555h
AAh
555h
2AAh
55h
Additional
Block
Address
Addr.
(8)
(3,7)
Block
BE
CE
Block Erase
Chip Erase
6
6
Word 555h
Data
AAh
30h
AAAh
555h
10h
30h
Byte AAAh
555h
2AAh
55h
AAAh
555h
80h
AAAh
555h
AAh
555h
2AAh
55h
Addr.
(3,7)
Word 555h
Note 9
Data
AAh
X
(3,7)
(3,7)
Addr.
Data
Erase
Suspend
Read until Toggle stops, then read all the data needed from any
Block(s) not being erased then Resume Erase.
(10)
1
1
ES
B0h
X
Addr.
Data
Erase
Resume
Read Data Polling or Toggle Bits until Erase completes or Erase
is suspended another time.
ER
30h
Note: 1. Commands not interpreted in this table will default to read array mode.
2. A wait of t is necessary after a Read/Reset command if the memory was in an Erase or Program mode before starting any new
PLYH
operation (see Tables 15, 16 and Figure 13).
3. X = Don't Care.
4. The first cycles of the RD or AS instructions are followed by read operations. Any number of read cycles can occur after the com-
mand cycles.
5. Signature Address bits A0, A1, at V will output Manufacturer code (20h). Address bits A0 at V and A1, at V will output Device
IL
IH
IL
code.
6. Block Protection Address: A0, at V , A1 at V and A15-A18 within the Block will output the Block Protection status.
IL
IH
7. For Coded cycles address inputs A11-A18 are don't care.
8. Optional, additional Blocks addresses must be entered within the erase timeout delay after last write entry, timeout statuscan be
verified through DQ3 value (see Erase Timer Bit DQ3 description). When full command is entered, read Data Polling or Toggle bit
until Erase is completed or suspended.
9. Read Data Polling, Toggle bits or RB until Erase completes.
10. During Erase Suspend, Read and Data Program functions are allowed in blocks not being erased.
14/40
M29W800AT, M29W800AB
STATUS REGISTER
P/E.C. status is indicated during execution by Data
Polling on DQ7, detection of Toggle on DQ6 and
DQ2, or Error on DQ5 and Erase Timer DQ3 bits.
Any read attempt during Program or Erase com-
mand execution will automatically output these
five Status Register bits. The P/E.C. automatically
sets bits DQ2, DQ3, DQ5, DQ6 and DQ7. Other
bits (DQ0, DQ1 and DQ4) are reserved for future
use and should be masked. See Table 10., Status
Register Bits and Table 9., Polling and Toggle
Bits.
Data Polling Bit (DQ7). When Programming op-
erations are in progress, this bit outputs the com-
plement of the bit being programmed on DQ7.
During Erase operation, it outputs a '0'. After com-
pletion of the operation, DQ7 will output the bit last
programmed or a '1' after erasing. Data Polling is
valid and only effective during P/E.C. operation,
that is after the fourth W pulse for programming or
after the sixth W pulse for erase. It must be per-
formed at the address being programmed or at an
address within the block being erased. If all the
blocks selected for erasure are protected, DQ7 will
be set to '0' for about 100µs, and then return to the
previous addressed memory data value. See Fig-
ure 15., Data Polling Flowchart and Figure
13., Data Polling DQ7 AC Waveforms. DQ7 will
also flag the Erase Suspend mode by switching
from '0' to '1' at the start of the Erase Suspend. In
order to monitor DQ7 in the Erase Suspend mode
an address within a block being erased must be
provided. For a Read Operation in Erase Suspend
mode, DQ7 will output '1' if the read is attempted
on a block being erased and the data value on oth-
er blocks. During Program operation in Erase Sus-
pend Mode, DQ7 will have the same behavior as
in the normal program execution outside of the
suspend mode.
a block different to the block in Erase Suspend. Ei-
ther E or G toggling will cause DQ6 to toggle. See
Figure 16., Data Toggle Flowchart and Figure
14., Data Toggle DQ6, DQ2 AC Waveforms.
Error Bit (DQ5). This bit is set to '1' by the P/E.C.
when there is a failure of programming, block
erase, or chip erase that results in invalid data in
the memory block. In case of an error in block
erase or program, the block in which the error oc-
curred or to which the programmed data belongs,
must be discarded. The DQ5 failure condition will
also appear if a user tries to program a '1' to a lo-
cation that is previously programmed to '0'. Other
Blocks may still be used. The error bit resets after
a Read/Reset (RD) instruction. In case of success
of Program or Erase, the error bit will be set to '0'.
Erase Timer Bit (DQ3). This bit is set to '0' by the
P/E.C. when the last block Erase command has
been entered to the Command Interface and it is
awaiting the Erase start. When the erase timeout
period is finished, after 50µs to 90µs, DQ3 returns
to '1'.
Toggle Bit (DQ2). This toggle bit, together with
DQ6, can be used to determine the device status
during the Erase operations. It can also be used to
identify the block being erased. During Erase or
Erase Suspend a read from a block being erased
will cause DQ2 to toggle. A read from a block not
being erased will set DQ2 to '1' during erase and
to DQ2 during Erase Suspend. During Chip Erase
a read operation will cause DQ2 to toggle as all
blocks are being erased. DQ2 will be set to '1' dur-
ing program operation and when erase is com-
plete. After erase completion and if the error bit
DQ5 is set to '1', DQ2 will toggle if the faulty block
is addressed.
Table 9. Polling and Toggle Bits
Toggle Bit (DQ6). When Programming or Eras-
ing operations are in progress, successive at-
tempts to read DQ6 will output complementary
data. DQ6 will toggle following toggling of either G,
or E when G is low. The operation is completed
when two successive reads yield the same output
data. The next read will output the bit last pro-
grammed or a '1' after erasing. The toggle bit DQ6
is valid only during P/E.C. operations, that is after
the fourth W pulse for programming or after the
sixth W pulse for Erase. If the blocks selected for
erasure are protected, DQ6 will toggle for about
100µs and then return back to Read. DQ6 will be
set to '1' if a Read operation is attempted on an
Erase Suspend block. When erase is suspended
DQ6 will toggle during programming operations in
Mode
DQ7
DQ7
0
DQ6
DQ2
Program
Erase
Toggle
1
Toggle Note 1
Erase Suspend Read
(in Erase Suspend
block)
1
1
Toggle
Erase Suspend Read
(outside Erase Suspend
block)
DQ7
DQ7
DQ6
DQ2
N/A
Erase Suspend Program
Toggle
15/40
M29W800AT, M29W800AB
Table 10. Status Register Bits
DQ
Name
Logic Level
Definition
Note
Erase Complete or erase block
in Erase Suspend
’1’
’0’
Indicates the P/E.C. status, check during
Program or Erase, and on completion before
checking bits DQ5 for program or Erase
Success.
Erase On-going
Data
Polling
7
Program Complete or data of
non erase block during Erase
Suspend
DQ
DQ
Program On-going
’-1-0-1-0-1-0-1-’ Erase or Program On-going
Successive reads output complementary
data on DQ6 while Programming or Erase
operations are on-going. DQ6 remains at
constant level when P/E.C. operations are
completed or Erase Suspend is
DQ
Program Complete
6
Toggle Bit
Erase Complete or Erase
’-1-1-1-1-1-1-1-’ Suspend on currently
acknowledged.
addressed block
’1’
’0’
Program or Erase Error
This bit is set to ‘1’ in the case of
Programming or Erase failure.
5
4
Error Bit
Program or Erase On-going
Reserved
P/E.C. Erase operation has started. Only
possible command entry is Erase Suspend
(ES).
’1’
’0’
Erase Timeout Period Expired
Erase Timeout Period On-going
Erase
Time Bit
3
An additional block to be erased in parallel
can be entered to the P/E.C.
Chip Erase, Erase or Erase
Suspend on the currently
addressed block.
Erase Error due to the currently
addressed block
’-1-0-1-0-1-0-1-’
(when DQ5 = ‘1’).
Indicates the erase status and allows to
identify the erased block
2
Toggle Bit
Program on-going, Erase on-
going on another block or
Erase Complete
1
Erase Suspend read on non
Erase Suspend block
DQ
1
0
Reserved
Reserved
Note: 1. Logic level '1' is High, '0' is Low. -0-1-0-0-0-1-1-1-0- represent bit value in successive Read operations.
2. Toggle if the address is within a block being erased.
'1' if the address is within a block not being erased.
16/40
M29W800AT, M29W800AB
MAXIMUM RATING
(1)
Table 11. Absolute Maximum Ratings
Symbol
Parameter
Value
Unit
°C
°C
°C
V
(3)
T
A
–40 to 85
–50 to 125
–65 to 150
–0.6 to 5
Ambient Operating Temperature
T
Temperature Under Bias
Storage Temperature
Input or Output Voltage
BIAS
T
STG
(2)
V
IO
V
Supply Voltage
–0.6 to 5
V
V
CC
(A9, E, G, RP)
(2)
A9, E, G, RP Voltage
–0.6 to 13.5
V
Note: 1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute Maximum Ratings" may
cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-
tions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant qual-
ity documents.
2. Minimum Voltage may undershoot to –2V during transition and for less than 20ns during transitions.
3. Depends on range.
17/40
M29W800AT, M29W800AB
DC AND AC CHARACTERISTICS
Figure 6. AC Testing Input Output Waveform
Figure 7. AC Testing Load Circuit
0.8V
3V
1N914
1.5V
0V
3.3kΩ
AI01417
DEVICE
UNDER
TEST
OUT
= 30pF or 100pF
Table 12. AC Measurement Conditions
C
L
Input Rise and Fall Times
≤10ns
0 to 3V
1.5V
Input Pulse Voltages
C
includes JIG capacitance
L
Input and Output Timing Ref. Voltages
AI01968
(1)
Table 13. Capacitance (T = 25 °C, f = 1 MHz)
A
Symbol
Parameter
Input Capacitance
Output Capacitance
Test Condition
Min
Max
6
Unit
pF
C
V
IN
= 0V
= 0V
IN
C
V
OUT
12
pF
OUT
Note: 1. Sampled only, not 100% tested.
Table 14. DC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C; V = 2.7V to 3.6V)
A
CC
Symbol
Parameter
Test Condition
Min
Max
±1
Unit
Typ.
I
LI
0V ≤ V ≤ V
Input Leakage Current
µA
µA
IN
CC
I
LO
0V ≤ V ≤ V
OUT CC
Output Leakage Current
Supply Current (Read by Word)
Supply Current (Read by Word)
Supply Current (Stan-by)
±1
I
E = V , G = V , f = 6MHz
IL IH
3
10
mA
mA
µA
CC1
I
E = V , G = V , f = 6MHz
IL IL
4.5
30
10
CC2
I
E = V ±0.2V
100
CC3
CC
Supply Current
(Program or Erase)
Byte program, Block or
Chip Erase in progress
(1)
20
mA
I
CC4
V
Input Low Voltage
–0.5
0.8
V
V
IL
V
V
0.7 V
V
+ 0.3
Input High Voltage
IH
CC
CC
I
OL
= 1.8mA
Output Low Voltage
0.45
V
OL
V
I
= –100µA
V
–0.4V
CC
Output High Voltage CMOS
A9 Voltage (Electronic Signature)
A9 Current (Electronic Signature)
V
OH
OH
V
11.5
12.5
100
V
ID
ID
I
A9 = V
30
µA
ID
Supply Voltage (Erase and
Program lock-out)
(1)
2.0
2.3
V
V
LKO
Note: 1. Sampled only, not 100% tested.
18/40
M29W800AT, M29W800AB
Table 15. Read AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
80
90
Test
Condition
Symbol
Alt
Parameter
Unit
V
CC
= 3.0V to 3.6V
CL = 30pF
V
CC
= 2.7V to 3.6V
CL = 30pF
Min
80
Max
Min
90
Max
E = V
G = V
Address Valid to Next
Address Valid
IL,
t
t
ns
AVAV
RC
IL
E = V
G = V
Address Valid to Output
Valid
IL,
t
t
ACC
80
90
ns
ns
AVQV
IL
E = V
G = V
Address Transition to
Output Transition
IL,
t
t
OH
0
0
0
0
AXQX
IL
BYTE Switching High to
Output Valid
t
t
FHQV
50
50
50
50
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
BHQV
BYTE Switching Low to
Output High Z
t
t
FLQZ
BLQZ
Chip Enable High to Output
Transition
t
t
G = V
G = V
EHQX
OH
IL
IL
Chip Enable High to Output
Hi-Z
(1)
t
HZ
30
5
30
5
t
EHQZ
t
t
t
ELFH
t
ELFL
Chip Enable to BYTE
Switching Low or High
ELBH
ELBL
Chip Enable Low to Output
Valid
(2)
(1)
t
G = V
G = V
E = V
80
90
t
t
CE
IL
IL
ELQV
Chip Enable Low to Output
Transition
t
LZ
0
0
0
0
ELQX
Output Enable High to
Output Transition
t
t
GHQX
OH
IL
IL
IL
IL
Output Enable High to
Output Hi-Z
(1)
t
DF
E = V
E = V
E = V
30
35
30
35
t
GHQZ
Output Enable Low to
Output Valid
(2)
(1)
t
t
t
OE
GLQV
Output Enable Low to
Output Transition
t
0
0
OLZ
GLQX
RP High to Chip Enable
Low
t
t
RH
50
50
PHEL
t
RRB
(1, 3)
RP Low to Read Mode
RP Pulse Width
10
10
µs
ns
t
PLYH
t
READY
t
t
500
500
PLPX
RP
Note: 1. Sampled only, not 100% tested.
2. G may be delayed by up to t
- t
after the falling edge of E without increasing t
.
ELQV
ELQV GLQV
3. To be considered only if the Reset pulse is given while the memory is in Erase or Program mode.
19/40
M29W800AT, M29W800AB
Table 16. Read AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
100
120
Test
Condition
Symbol
Alt
Parameter
Unit
V
CC
= 2.7V to 3.6V
CL = 30pF
V
CC
= 2.7V to 3.6V
CL = 100pF
Min
100
Max
Min
120
Max
E = V
G = V
Address Valid to Next
Address Valid
IL,
t
t
ns
AVAV
RC
IL
E = V
G = V
Address Valid to Output
Valid
IL,
t
t
ACC
100
120
ns
ns
AVQV
IL
E = V
G = V
Address Transition to
Output Transition
IL,
t
t
OH
0
0
0
AXQX
IL
BYTE Switching High to
Output Valid
t
t
FHQV
50
50
60
60
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
BHQV
BYTE Switching Low to
Output High Z
t
t
FLQZ
BLQZ
Chip Enable High to Output
Transition
t
t
G = V
G = V
0
EHQX
OH
IL
IL
Chip Enable High to Output
Hi-Z
(1)
t
HZ
30
5
30
5
t
EHQZ
t
t
t
ELFH
t
ELFL
Chip Enable to BYTE
Switching Low or High
ELBH
ELBL
Chip Enable Low to Output
Valid
(2)
(1)
t
G = V
G = V
E = V
100
120
t
t
CE
IL
IL
ELQV
Chip Enable Low to Output
Transition
t
LZ
0
0
0
0
ELQX
Output Enable High to
Output Transition
t
t
GHQX
OH
IL
IL
IL
IL
Output Enable High to
Output Hi-Z
(1)
t
DF
E = V
E = V
E = V
30
40
30
50
t
GHQZ
Output Enable Low to
Output Valid
(2)
(1)
t
t
t
OE
GLQV
Output Enable Low to
Output Transition
t
0
0
OLZ
GLQX
RP High to Chip Enable
Low
t
t
RH
50
50
PHEL
t
RRB
(1, 3)
RP Low to Read Mode
RP Pulse Width
10
10
µs
ns
t
PLYH
t
READY
t
t
500
500
PLPX
RP
Note: 1. Sampled only, not 100% tested.
2. G may be delayed by up to t
- t
after the falling edge of E without increasing t
.
ELQV
ELQV GLQV
3. To be considered only if the Reset pulse is given while the memory is in Erase or Program mode.
20/40
M29W800AT, M29W800AB
Figure 8. Read Mode AC Waveforms
21/40
M29W800AT, M29W800AB
Table 17. Write AC Characteristics, W Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
80
90
Symbol
Alt
Parameter
Unit
V
= 3.0V to 3.6V
CL = 30pF
V
CC
= 2.7V to 3.6V
CL = 30pF
CC
Min
80
0
Max
Min
90
Max
t
t
WC
Address Valid to Next Address Valid
Address Valid to Write Enable Low
Input Valid to Write Enable High
ns
ns
ns
ns
ns
ns
AVAV
t
t
0
45
0
AVWL
AS
DS
CS
t
t
t
35
0
DVWH
t
Chip Enable Low to Write Enable Low
Output Enable High to Write Enable Low
ELWL
t
0
0
GHWL
(1, 2)
t
RP Rise Time to V
500
500
t
VIDR
ID
PHPHH
(1)
t
RP High to Write Enable Low
RP Pulse Width
4
500
50
0
4
500
50
0
µs
ns
µs
ns
ns
ns
ns
ns
ns
ns
t
RSP
PHWL
t
t
PLPX
RP
t
t
V
CC
High to Chip Enable Low
VCHEL
VCS
t
t
Write Enable High to Input Transition
Write Enable High to Chip Enable High
Write Enable High to Output Enable Low
Program Erase Valid to RB Delay
WHDX
DH
CH
t
t
0
0
WHEH
t
t
OEH
0
0
WHGL
(1)
t
90
90
t
BUSY
WHRL
t
t
WPH
Write Enable High to Write Enable Low
Write Enable Low to Address Transition
Write Enable Low to Write Enable High
30
45
35
30
45
35
WHWL
t
t
WLAX
WLWH
AH
t
t
WP
Note: 1. Sampled only, not 100% tested.
2. This timing is for Temporary Block Unprotection operation.
22/40
M29W800AT, M29W800AB
Table 18. Write AC Characteristics, W Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
100
120
Symbol
Alt
Parameter
Unit
V
= 2.7V to 3.6V
CL = 30pF
V
CC
= 2.7V to 3.6V
CL = 100pF
CC
Min
100
0
Max
Min
Max
t
t
WC
Address Valid to Next Address Valid
Address Valid to Write Enable Low
Input Valid to Write Enable High
120
0
ns
ns
ns
ns
ns
ns
AVAV
t
t
AVWL
AS
DS
CS
t
t
t
45
0
50
0
DVWH
t
Chip Enable Low to Write Enable Low
Output Enable High to Write Enable Low
ELWL
t
0
0
GHWL
(1, 2)
t
RP Rise Time to V
500
500
t
VIDR
ID
PHPHH
(1)
t
RP High to Write Enable Low
RP Pulse Width
4
500
50
0
4
500
50
0
µs
ns
µs
ns
ns
ns
ns
ns
ns
ns
t
RSP
PHWL
t
t
PLPX
RP
t
t
V
CC
High to Chip Enable Low
VCHEL
VCS
t
t
Write Enable High to Input Transition
Write Enable High to Chip Enable High
Write Enable High to Output Enable Low
Program Erase Valid to RB Delay
WHDX
DH
CH
t
t
0
0
WHEH
t
t
OEH
0
0
WHGL
(1)
t
90
90
t
BUSY
WHRL
t
t
WPH
Write Enable High to Write Enable Low
Write Enable Low to Address Transition
Write Enable Low to Write Enable High
30
45
35
30
50
50
WHWL
t
t
WLAX
WLWH
AH
t
t
WP
Note: 1. Sampled only, not 100% tested.
2. This timing is for Temporary Block Unprotection operation.
23/40
M29W800AT, M29W800AB
Table 19. Write AC Characteristics, E Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
80
90
Symbol
Alt
Parameter
Unit
V
= 3.0V to 3.6V
CL = 30pF
V
CC
= 2.7V to 3.6V
CL = 30pF
CC
Min
80
0
Max
Min
90
Max
t
t
WC
Address Valid to Next Address Valid
Address Valid to Chip Enable Low
Input Valid to Chip Enable High
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
AVAV
t
t
0
45
0
AVEL
AS
DS
t
t
t
35
0
DVEH
t
Chip Enable High to Input Transition
Chip Enable High to Chip Enable Low
Chip Enable High to Output Enable Low
Program Erase Valid to RB Delay
Chip Enable High to Write Enable High
Chip Enable Low to Address Transition
Chip Enable Low to Chip Enable High
Output Enable High Chip Enable Low
EHDX
DH
t
t
t
30
0
30
0
EHEL
CPH
t
EHGL
OEH
(1)
t
80
90
t
BUSY
EHRL
t
t
0
45
35
0
0
45
35
0
EHWH
WH
t
t
AH
ELAX
t
t
ELEH
CP
t
GHEL
(1, 2)
(1)
t
RP Rise TIme to V
500
500
ns
t
VIDR
ID
PHPHH
t
RP High to Write Enable Low
RP Pulse Width
4
500
50
0
4
500
50
0
µs
ns
µs
ns
t
RSP
PHWL
t
t
PLPX
RP
t
t
V
CC
High to Write Enable Low
VCHWL
VCS
t
t
WS
Write Enable Low to Chip Enable Low
WLEL
Note: 1. Sampled only, not 100% tested.
2. This timing is for Temporary Block Unprotection operation.
24/40
M29W800AT, M29W800AB
Table 20. Write AC Characteristics, E Controlled
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
100
120
Symbol
Alt
Parameter
Unit
V
= 2.7V to 3.6V
CL = 30pF
V
CC
= 2.7V to 3.6V
CL = 100pF
CC
Min
100
0
Max
Min
Max
t
t
WC
Address Valid to Next Address Valid
Address Valid to Chip Enable Low
Input Valid to Chip Enable High
120
0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
AVAV
t
t
AVEL
AS
DS
t
t
t
45
0
50
0
DVEH
t
Chip Enable High to Input Transition
Chip Enable High to Chip Enable Low
Chip Enable High to Output Enable Low
Program Erase Valid to RB Delay
Chip Enable High to Write Enable High
Chip Enable Low to Address Transition
Chip Enable Low to Chip Enable High
Output Enable High Chip Enable Low
EHDX
DH
t
t
t
30
0
30
0
EHEL
CPH
t
EHGL
OEH
(1)
t
90
90
t
BUSY
EHRL
t
t
0
45
35
0
0
50
50
0
EHWH
WH
t
t
AH
ELAX
t
t
ELEH
CP
t
GHEL
(1,2)
(1)
t
RP Rise TIme to V
500
500
ns
t
VIDR
ID
PHPHH
t
RP High to Write Enable Low
RP Pulse Width
4
500
50
0
4
500
50
0
µs
ns
µs
ns
t
RSP
PHWL
t
t
PLPX
RP
t
t
V
CC
High to Write Enable Low
VCHWL
VCS
t
t
WS
Write Enable Low to Chip Enable Low
WLEL
Note: 1. Sampled only, not 100% tested.
2. This timing is for Temporary Block Unprotection operation.
25/40
M29W800AT, M29W800AB
Figure 9. Write AC Waveforms, W Controlled
tAVAV
VALID
A0-A18/
A–1
tWLAX
tAVWL
tWHEH
E
tELWL
tWHGL
G
tGHWL
tWLWH
W
tWHWL
tWHDX
tDVWH
VALID
DQ0-DQ7/
DQ8-DQ15
V
CC
tVCHEL
RB
tWHRL
Note: Address are latched on the falling edge of W, Data is latched on the rising edge of W.
AI02183
26/40
M29W800AT, M29W800AB
Figure 10. Write AC Waveforms, E Controlled
tAVAV
VALID
A0-A18/
A–1
tELAX
tAVEL
tEHWH
tEHGL
W
tWLEL
G
tGHEL
tELEH
E
tEHEL
tEHDX
tDVEH
VALID
DQ0-DQ7/
DQ8-DQ15
V
CC
tVCHWL
RB
tEHRL
AI02184
Note: Address are latched on the falling edge of E, Data is latched on the rising edge of E.
Figure 11. Read and Write AC Characteristics, RP Related
E
tPHEL
W
tPHWL
RB
tPLPX
RP
tPHPHH
tPLYH
AI02091
27/40
M29W800AT, M29W800AB
(1)
Figure 12. Data Polling and Toggle Bit AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
80
90
Symbol
Parameter
Unit
V
CC
= 3.0V to 3.6V
CL = 30pF
V
= 2.7V to 3.6V
CL = 30pF
CC
Min
10
Max
Min
Max
Chip Enable High to DQ7 Valid
(Program, E Controlled)
2400
10
2400
µs
t
EHQ7V
Chip Enable High to DQ7 Valid
(Chip Erase, E Controlled)
1.0
60
1.0
60
sec
Chip Enable High to Output Valid (Program)
Chip Enable High to Output Valid (Chip Erase)
Q7 Valid to Output Valid (Data Polling)
10
2400
60
10
2400
60
µs
sec
ns
t
EHQV
1.0
1.0
t
35
35
Q7VQV
Write Enable High to DQ7 Valid
(Program, W Controlled)
10
2400
60
10
2400
60
ms
t
WHQ7V
Write Enable High to DQ7 Valid
(Chip Erase, W Controlled)
1.0
1.0
sec
Write Enable High to Output Valid (Program)
Write Enable High to Output Valid (Chip Erase)
10
2400
60
10
2400
60
µs
t
WHQV
1.0
1.0
sec
Note: 1. All other timings are defined in Read AC Characteristics table.
(1)
Table 21. Data Polling and Toggle Bit AC Characteristics
(T = 0 to 70°C, –20 to 85°C or –40 to 85°C)
A
M29W800AT / M29W800AB
100 120
= 2.7V to 3.6V
Symbol
Parameter
Unit
V
CC
= 2.7V to 3.6V
CL = 30pF
V
CC
CL = 100pF
Min
10
Max
Min
Max
Chip Enable High to DQ7 Valid
(Program, E Controlled)
2400
10
2400
µs
t
EHQ7V
Chip Enable High to DQ7 Valid
(Chip Erase, E Controlled)
1.0
60
1.0
60
sec
Chip Enable High to Output Valid (Program)
Chip Enable High to Output Valid (Chip Erase)
Q7 Valid to Output Valid (Data Polling)
10
2400
60
10
2400
60
µs
sec
ns
t
EHQV
1.0
1.0
t
40
50
Q7VQV
Write Enable High to DQ7 Valid
(Program, W Controlled)
10
2400
60
10
2400
60
ms
t
WHQ7V
Write Enable High to DQ7 Valid
(Chip Erase, W Controlled)
1.0
1.0
sec
Write Enable High to Output Valid (Program)
Write Enable High to Output Valid (Chip Erase)
10
2400
60
10
2400
60
µs
t
WHQV
1.0
1.0
sec
Note: 1. All other timings are defined in Read AC Characteristics table.
28/40
M29W800AT, M29W800AB
Figure 13. Data Polling DQ7 AC Waveforms
29/40
M29W800AT, M29W800AB
Figure 14. Data Toggle DQ6, DQ2 AC Waveforms
30/40
M29W800AT, M29W800AB
Figure 15. Data Polling Flowchart
Figure 16. Data Toggle Flowchart
START
START
READ
DQ2, DQ5 & DQ6
READ DQ5 & DQ7
at VALID ADDRESS
NO
DQ2, DQ6
=
DQ7
=
DATA
YES
TOGGLE
NO
YES
NO
NO
DQ5
= 1
DQ5
= 1
YES
YES
READ DQ7
READ DQ2, DQ6
DQ7
=
DATA
YES
NO
DQ2, DQ6
=
TOGGLE
NO
YES
FAIL
PASS
FAIL
PASS
AI01369
AI01873
Table 22. Program, Erase Times and Program, Erase Endurance Cycles
(T = 0 to 70°C; V = 2.7V to 3.6V)
A
CC
M29W800AT / M29W800AB
Parameter
Unit
(1)
Typical after
100k W/E Cycles
Min
Typ
Max
Chip Erase (Preprogrammed, V = 2.7V)
10
15
1.5
10
10
15
sec
sec
sec
sec
CC
Chip Erase (V = 2.7V)
CC
Main Block Erase (V = 2.7V)
15
CC
(1)
10
5
Chip Program (Byte)
(1)
5
sec
µs
Chip Program (Word)
Byte/Word Program
10
10
Program/Erase Cycles (per Block)
100,000
cycles
Note: 1. Excluded the time required to execute bus cycles sequence for program operation.
31/40
M29W800AT, M29W800AB
POWER SUPPLY
Power Up
Supply Rails
The memory Command Interface is reset on pow-
er up to Read Array. The device does not accept
commands on the first rising edge of W, if both W
Normal precautions must be taken for supply volt-
age decoupling; each device in a system should
have the V rail decoupled with a 0.1µF capacitor
CC
and E are at V with G at V during power-up.
close to the V
and V
pins. The PCB trace
IL
IH
CC
SS
Any write cycle initiation is blocked when V
is
widths should be sufficient to carry the V
gram and erase currents required.
pro-
CC
CC
below V
.
LKO
32/40
M29W800AT, M29W800AB
SECURITY PROTECTION MEMORY AREA
The M29W800A features a security protection
memory area. It consists of a memory block of 256
bytes or 128 words which is programmed in the ST
factory to store a unique code that uniquely identi-
fies the part.
Read Security Data (RDS) Instruction. This RDS
uses a single write cycle instruction: the command
B8h is written to the address AAh. This sets the
memory to the Read Security mode. Any succes-
sive read attempt will output the addressed Secu-
rity byte until a new write cycle is initiated.
This memory block can be read by using the Read
Security Data instruction (RDS) as shown in Table
23.
Table 23. Security Block Instruction
Unlock Cycle
Mne.
Instr.
Cyc.
2nd Cyc.
1st Cyc.
AAh
(1)
(2)
Read
Security
Data
Addr.
Data
RDS
1
Read OTP Data until a new write cycle is initiated.
B8h
Note: 1. Address bits A10-A19 are don't care for coded address inputs.
2. Data bits DQ8-DQ15 are don't care for coded address inputs.
Figure 17. Security Block Address Table
BYTE Organisation (x8)
TOP BOOT BLOCK
BOTTOM BOOT BLOCK
000FFh
0E0FFh
0E000h
Security
Memory Block
Security
Memory Block
00000h
WORD Organisation (x16)
TOP BOOT BLOCK
BOTTOM BOOT BLOCK
0007Fh
00000h
0E01Fh
0E000h
Security
Memory Block
Security
Memory Block
AI02746
33/40
M29W800AT, M29W800AB
PACKAGE MECHANICAL
Figure 18. TSOP48, 48 Lead Plastic Thin Small Outline, 12x20 mm - Package Outline
1
48
e
D1
B
L1
24
25
A2
A
E1
E
A1
α
L
DIE
C
CP
TSOP-G
Table 24. TSOP48, 48 Lead Plastic Thin Small Outline, 12x20 mm - Package Mechanical Data
millimeters
Min
inches
Min
Symbol
Typ
Max
1.200
0.150
1.050
0.270
0.210
0.080
12.100
20.200
18.500
–
Typ
Max
A
A1
A2
B
0.0472
0.0059
0.0413
0.0106
0.0083
0.0031
0.4764
0.7953
0.7283
–
0.100
1.000
0.220
0.050
0.950
0.170
0.100
0.0039
0.0394
0.0087
0.0020
0.0374
0.0067
0.0039
C
CP
D1
E
12.000
20.000
18.400
0.500
0.600
0.800
3
11.900
19.800
18.300
–
0.4724
0.7874
0.7244
0.0197
0.0236
0.0315
3
0.4685
0.7795
0.7205
–
E1
e
L
0.500
0.700
0.0197
0.0276
L1
a
0
5
0
5
34/40
M29W800AT, M29W800AB
Figure 19. TFBGA48, 6 x 8 Ball Array, 0.8mm Pitch - Bottom View Package Outline
D
D1
FD
FE
SD
SE
BALL "A1"
E
E1
ddd
e
e
b
A
A2
A1
BGA-Z00
Table 25. TFBGA48, 6 x 8 Ball Array, 0.8mm Pitch - Package Mechanical Data
millimeters
Min
inches
Symbol
Typ
Max
Typ
Min
Max
A
A1
A2
b
1.200
0.0472
0.200
0.0079
1.000
0.0394
0.400
6.000
4.000
0.350
5.900
–
0.450
0.0157
0.2362
0.1575
0.0138
0.2323
–
0.0177
D
6.100
0.2402
D1
ddd
E
–
–
0.100
0.0039
9.000
0.800
5.600
1.000
1.700
0.400
0.400
8.900
9.100
0.3543
0.0315
0.2205
0.0394
0.0669
0.0157
0.0157
0.3504
0.3583
e
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
E1
FD
FE
SD
SE
35/40
M29W800AT, M29W800AB
Figure 20. TFBGA48 Daisy Chain Connections (Top view through package)
1
2
3
4
5
6
A
B
C
D
E
F
G
H
AI04893
Figure 21. TFBGA48 Daisy Chain - PCB Connections (Top view through package)
START
POINT
END
POINT
1
2
3
4
5
6
A
B
C
D
E
F
G
H
AI04892
36/40
M29W800AT, M29W800AB
Figure 22. SO44 , Small Outline, 525mm Body Width - Package Outline
A2
A
C
b
e
CP
D
N
E
EH
1
A1
α
L
SO-d
Table 26. SO44 , Small Outline, 525mm Body Width Package Mechanical Data
millimeters
Min
inches
Symbol
Typ
Max
Typ
Min
Max
A
A1
A2
b
2.80
0.1102
0.10
2.20
0.35
0.10
0.0039
0.0866
0.0138
0.0039
2.30
0.40
0.15
2.40
0.50
0.20
0.08
28.40
13.50
16.25
–
0.0906
0.0157
0.0059
0.0945
0.0197
0.0079
0.0030
1.1181
0.5315
0.6398
–
C
CP
D
28.20
13.30
16.00
1.27
28.00
13.20
15.75
–
1.1102
0.5236
0.6299
0.0500
0.0315
1.1024
0.5197
0.6201
–
E
EH
e
L
0.80
a
8
8
N
44
44
37/40
M29W800AT, M29W800AB
PART NUMBERING
Table 27. Ordering Information Scheme
Example:
M29W800AT
80
N
1
T
Device Type
M29
Operating Voltage
W = 2.7 to 3.6V
Device Function
800A = 8 Mbit (1Mb x8 or 512Kb x16), Boot Block
Array Matrix
T = Top Boot
B = Bottom Boot
Speed
80 = 80 ns
90 = 90 ns
100 = 100 ns
120 = 120 ns
Package
N = TSOP48: 12 x 20 mm
M = SO44
ZA = TFBGA48: 0.8 mm pitch
Temperature Range
1 = 0 to 70 °C
5 = –20 to 85°C
6 = –40 to 85 °C
Option
T = Tape & Reel Packing
Table 28. Daisy Chain Ordering Scheme
Example:
M29
DCL1-8
T
Device Type
M29
Daisy Chain
DCL1-8 = Daisy Chain Level 1 for 8 Mbit parts
Option
T = Tape & Reel Packing
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the ST Sales Office nearest to you.
38/40
M29W800AT, M29W800AB
REVISION HISTORY
Table 29. Revision History
Date
Version
-01
Description
November 1998
February 1999
March 1999
First issue
Removed TSOP48 Package Reverse Pinout
-02
-03
Program, Erase Times and Erase Endurance Cycles change
New document template
Document type: from Preliminary Data to Data Sheet
Program, Erase Times and Endurance Cycles change (Table 22)
TFBGA Package Mechanical Data change
TFBGA Package Outline drawing change
02/09/00
-04
03/06/00
6/21/01
-05
-06
Program Erase Times change (Table 22)
TFBGA48 package mechanical ouline and data changed
Daisy Chain commercial code defined (Table 28)
TFBGA48 Daisy Chain diagrams, Package and PCB Connections added (Figure 20
and 21)
24-Jan-2002
09-Mar-2004
-07
8.0
-90 version changed to Vcc=2.7 to 3.6V; -120 version changed to CL=100pF
INSTRUCTIONS AND COMMANDS section: description of Block Erase (BE) and
Erase Suspend (ES) instructions updated.
39/40
M29W800AT, M29W800AB
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequ
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is g
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are s
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products a
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectron
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners.
© 2004 STMicroelectronics - All rights reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany -
Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore -
Spain - Sweden - Switzerland - United Kingdom - United States
www.st.com
40/40
相关型号:
M29W800AB90N6T
8 Mbit 1Mb x8 or 512Kb x16, Boot Block Low Voltage Single Supply Flash Memory
STMICROELECTR
M29W800AB90ZA1T
8 Mbit 1Mb x8 or 512Kb x16, Boot Block Low Voltage Single Supply Flash Memory
STMICROELECTR
M29W800AB90ZA5T
8 Mbit 1Mb x8 or 512Kb x16, Boot Block Low Voltage Single Supply Flash Memory
STMICROELECTR
M29W800AB90ZA6T
8 Mbit 1Mb x8 or 512Kb x16, Boot Block Low Voltage Single Supply Flash Memory
STMICROELECTR
M29W800AT
8 Mbit 1Mb x8 or 512Kb x16, Boot Block Low Voltage Single Supply Flash Memory
STMICROELECTR
©2020 ICPDF网 联系我们和版权申明