M58BW32FT4T3 [NUMONYX]
16 or 32 Mbit (x 32, boot block, burst) 3.3 V supply Flash memories; 16或32兆位( ×32 ,引导块,突发) 3.3 V电源闪存型号: | M58BW32FT4T3 |
厂家: | NUMONYX B.V |
描述: | 16 or 32 Mbit (x 32, boot block, burst) 3.3 V supply Flash memories |
文件: | 总87页 (文件大小:1607K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
M58BW16F
M58BW32F
16 or 32 Mbit (x 32, boot block, burst)
3.3 V supply Flash memories
Preliminary Data
Features
■ Supply voltage
– V = 2.7 V to 3.6 V (45 ns) or
DD
V
= 2.5 V to 3.3 V (55 ns)
DD
– V
= V
= 2.4 V to 3.6 V for I/O
DDQ
DDQIN
buffers
■ High performance
PQFP80 (T)
– Access times: 45 and 55 ns
– Synchronous burst reads
– 75 MHz effective zero wait-state burst read
– Asynchronous page reads
LBGA
■ M58BW32F memory organization:
– Eight 64 Kbit small parameter blocks
– Four 128 Kbit large parameter blocks
– Sixty-two 512 Kbit main blocks
LBGA80 (ZA)
10 x 8 ball array
■ M58BW16F memory organization:
– Eight 64 Kbit parameter blocks
– Thirty-one 512 Kbit main blocks
■ Hardware block protection
– 100 µA typical Standby current
– WP pin to protect any block combination
from Program and Erase operations
■ Electronic signature
– Manufacturer code: 0020h
– PEN signal for Program/Erase Enable
– Top device codes:
M58BW32FT: 8838h
M58BW16FT: 883Ah
■ Irreversible modify protection (OTP like) on
128 Kbits:
– Block 1 (bottom device) or block 72 (top
device) in the M58BW32F
– Blocks 2 and 3 (bottom device) or blocks 36
and 35 (top device) in the M58BW16F
– Bottom device codes:
M58BW32FB: 8837h
M58BW16FB: 8839h
■ Automotive device grade 3:
– Temperature: –40 to 125 °C
– Automotive grade certified
■ Security
– 64-bit unique device identifier (UID)
■ Fast programming
– Write to buffer and program capability
■ Optimized for FDI drivers
– Common Flash interface (CFI)
– Fast Program/Erase Suspend feature in
each block
■ Low power consumption
March 2008
Rev 5
1/87
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
www.numonyx.com
1
Contents
M58BW16F, M58BW32F
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1
Block protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2
Signal descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
Address inputs (A0-Amax) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Data inputs/outputs (DQ0-DQ31) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Chip Enable (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Output Enable (G) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Output Disable (GD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Write Enable (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Reset/Power-down (RP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Program/Erase Enable (PEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Latch Enable (L) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.10 Burst Clock (K) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.11 Burst Address Advance (B) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.12 Valid Data Ready (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.13 Write Protect (WP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
2.14 Supply voltage (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.15 Output supply voltage (VDDQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.16 Input supply voltage (VDDQIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.17 Ground (VSS and VSSQ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.18 Don’t use (DU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.19 Not connected (NC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3
Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1
Asynchronous Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.1.1
3.1.2
3.1.3
3.1.4
3.1.5
3.1.6
Asynchronous Bus Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Asynchronous Latch Controlled Bus Read . . . . . . . . . . . . . . . . . . . . . . 24
Asynchronous Page Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Asynchronous Bus Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Asynchronous Latch Controlled Bus Write . . . . . . . . . . . . . . . . . . . . . . 25
Output Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/87
M58BW16F, M58BW32F
Contents
3.1.7
3.1.8
Standby . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Reset/Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.2
3.3
Synchronous Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2.1
3.2.2
Synchronous Burst Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Synchronous Burst Read Suspend . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Burst Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
Read Select bit (M15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Standby Disable bit (M14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
X-Latency bits (M13-M11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Y-Latency bit (M9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Valid Data Ready bit (M8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Wrap Burst bit (M3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Burst Length bit (M2-M0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4
Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
Read Memory Array command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Read Electronic Signature command . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Read Query command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Read Status Register command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Clear Status Register command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Block Erase command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Erase All Main Blocks command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Program command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Write to Buffer and Program command . . . . . . . . . . . . . . . . . . . . . . . . . . 36
4.10 Program/Erase Suspend command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.11 Program/Erase Resume command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.12 Set Burst Configuration Register command . . . . . . . . . . . . . . . . . . . . . . . 38
4.13 Set Block Protection Configuration Register command . . . . . . . . . . . . . . 38
4.14 Clear Block Protection Configuration Register command . . . . . . . . . . . . 38
5
Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
5.1
5.2
5.3
5.4
Program/Erase Controller Status (bit 7) . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Erase Suspend Status (bit 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Erase Status (bit 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Program/Write to Buffer and Program Status (bit 4) . . . . . . . . . . . . . . . . . 42
3/87
Contents
M58BW16F, M58BW32F
5.5
5.6
5.7
5.8
PEN Status (bit 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Program Suspend Status (bit 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Block Protection Status (bit 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Bit 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6
7
8
9
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Appendix A Flowcharts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Appendix B Common Flash interface (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Appendix C Block protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
4/87
M58BW16F, M58BW32F
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
M58BW32F top boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
M58BW32F bottom boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
M58BW16F top boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
M58BW16F bottom boot block addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Asynchronous Bus operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Synchronous Burst Read Bus operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Burst Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Burst type definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Read electronic signature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Program, Erase times and endurance cycles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Status Register bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Operating and AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Device capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Asynchronous Bus Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Asynchronous Page Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Asynchronous Write and Latch controlled Write AC characteristics. . . . . . . . . . . . . . . . . . 54
Synchronous Burst Read AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Power supply AC and DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Reset, Power-down and Power-up AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
LBGA80 10 × 12 mm - 8 × 10 active ball array, 1 mm pitch, package
mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
PQFP80 - 80 lead plastic quad flat pack, package mechanical data . . . . . . . . . . . . . . . . . 66
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Query structure overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
CFI - Query address and data output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
CFI - device voltage and timing specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
M58BW16F device geometry definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
M58BW16F extended query information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
M58BW32F device geometry definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
M58BW32F extended query information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Protection register information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
5/87
List of figures
M58BW16F, M58BW32F
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
LBGA connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PQFP connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Example burst configuration X-1-1-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
AC measurement input/output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Asynchronous Bus Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Asynchronous Latch Controlled Bus Read AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . 48
Asynchronous Chip Enable Controlled Bus Read AC waveforms . . . . . . . . . . . . . . . . . . . 49
Figure 10. Asynchronous Address Controlled Bus Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . 49
Figure 11. Asynchronous Page Read AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 12. Asynchronous Write AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 13. Asynchronous Latch controlled Write AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Figure 14. Synchronous Burst Read, Latch Enable controlled (data valid from ’n’ clock rising edge). 55
Figure 15. Synchronous Burst Read, Chip Enable controlled (data valid from ’n’ clock rising edge) . 56
Figure 16. Synchronous Burst Read, Valid Address transition controlled (data valid
from ’n’ clock rising edge) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 17. Synchronous Burst Read (data valid from ’n’ clock rising edge). . . . . . . . . . . . . . . . . . . . . 58
Figure 18. Synchronous Burst Read - valid data ready output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 19. Synchronous Burst Read - Burst Address Advance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 20. Clock input AC waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Figure 21. Power supply slope specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Figure 22. Reset, Power-down and Power-up AC waveforms - Control pins Low. . . . . . . . . . . . . . . . 62
Figure 23. Reset, Power-down and Power-up AC waveforms - Control pins toggling. . . . . . . . . . . . . 62
Figure 24. LBGA80 10 × 12 mm - 8 × 10 ball array, 1 mm pitch, bottom view package outline . . . . . 64
Figure 25. PQFP80 - 80 lead plastic quad flat pack, package outline . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure 26. Program flowchart and pseudocode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Figure 27. Program Suspend & Resume flowchart and pseudocode . . . . . . . . . . . . . . . . . . . . . . . . . 69
Figure 28. Block Erase flowchart and pseudocode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Figure 29. Erase Suspend & Resume flowchart and pseudocode . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Figure 30. Power-up sequence followed by Synchronous Burst Read . . . . . . . . . . . . . . . . . . . . . . . . 72
Figure 31. Command interface and Program/Erase controller flowchart (a) . . . . . . . . . . . . . . . . . . . . 73
Figure 32. Command interface and Program/Erase controller flowchart (b) . . . . . . . . . . . . . . . . . . . . 74
Figure 33. Command interface and Program/Erase controller flowchart (c) . . . . . . . . . . . . . . . . . . . . 75
Figure 34. Command interface and Program/Erase controller flowchart (d) . . . . . . . . . . . . . . . . . . . . 76
Figure 35. Command interface and Program/Erase controller flowchart (e) . . . . . . . . . . . . . . . . . . . . 77
6/87
M58BW16F, M58BW32F
Description
1
Description
The M58BW16F and M58BW32F are 16 and 32 Mbit non-volatile Flash memories,
respectively. They can be erased electrically at block level and programmed in-system on a
double-word basis using a 2.7 V to 3.6 V or 2.5 V to 3.3 V V supply for the circuit and a
DD
2.4 V to 3.6 V V
supply voltage for the input and output buffers.
DDQ
In the rest of the document the M58BW16F and M58BW32F will be referred to as
M58BWxxF unless otherwise specified.
The devices support Asynchronous (Latch Controlled and Page Read) and Synchronous
Bus operations. The Synchronous Burst Read interface allows a high data transfer rate
controlled by the Burst Clock signal, K. It is capable of bursting fixed or unlimited lengths of
data. The burst type, latency and length are configurable and can be easily adapted to a
large variety of system clock frequencies and microprocessors. All write operations are
asynchronous. On power-up the memory defaults to Read mode with an Asynchronous Bus.
The device features an asymmetrical block architecture:
●
The M58BW32F has an array of 62 main blocks of 512 Kbits each, plus 4 large
parameter blocks of 128 Kbits each and 8 small parameter blocks of 64 Kbits each. The
large and small parameter blocks are located either at the top (M58BW32FT) or at the
bottom (M58BW32FB) of the address space. The first large parameter block is referred
to as boot block and can be used either to store a boot code or parameters. The
memory array organization is detailed in Table 2: M58BW32F top boot block addresses
and Table 3: M58BW32F bottom boot block addresses.
●
The M58BW16F has an array of 8 parameter blocks of 64 Kbits each and 31 main
blocks of 512 Kbits each. In the M58BW16FT the parameter blocks are located at the
top of the address space whereas in the M58BW16FB, they are located at the bottom.
The memory array organization is detailed in Table 4: M58BW16F top boot block
addresses and Table 5: M58BW16F bottom boot block addresses.
Program and Erase commands are written to the command interface of the memory. An on-
chip Program/Erase controller simplifies the process of programming or erasing the memory
by taking care of all of the special operations that are required to update the memory
contents. The end of a Program or Erase operation can be detected and any error
conditions identified in the Status Register. The command set required to control the
memory is consistent with JEDEC standards.
Erase can be suspended in order to perform either Read or Program in any other block, and
then resumed. Program can be suspended to Read data in any other block, and then
resumed. Each block can be programmed and erased over 100,000 cycles.
7/87
Description
M58BW16F, M58BW32F
All blocks are protected during power-up. The M58BWxxF features five different levels of
hardware and software block protection to avoid unwanted Program/Erase operations:
●
Write/Protect Enable input, WP, hardware protects a combination of blocks from
Program and Erase operations. The blocks to be protected are configured individually
by issuing a Set Block Protection Configuration Register or a Clear Block Protection
Configuration Register command.
●
●
All Program or Erase operations are blocked when Reset, RP, is held Low.
A Program/Erase Enable input, PEN, is used to protect all blocks, preventing Program
and Erase operations from affecting their data.
●
A permanent user-enabled protection against Modify operations is available:
–
on one specific 128-Kbit parameter block in the M58BW32F – block 1 for bottom
devices or block 72 for top devices
–
on two specific 64-Kbit parameter blocks in the M58BW16F – blocks 2 and 3 for
bottom devices or blocks 36 and 35 for top devices.
A Reset/Power-down mode is entered when the RP input is Low. In this mode the power
consumption is reduced to the standby level, the device is write protected and both the
Status and Burst Configuration Registers are cleared. A recovery time is required when the
RP input goes High.
A manufacturer code and a device code are available. They can be read from the memory
allowing programming equipment or applications to automatically match their interface to
the characteristics of the memory.
Finally, the M58BWxxF features a 64-bit unique device identifier (UID) which is programmed
by Numonyx on the production line. It is unique for each die and can be used to implement
cryptographic algorithms to improve security. Information is available in the CFI area (see
Table 32: M58BW16F extended query information).
The memory is offered in PQFP80 (14 x 20 mm) and LBGA80 (1.0 mm pitch) packages and
it is supplied with all the bits erased (set to ’1’).
8/87
M58BW16F, M58BW32F
Figure 1.
Description
Logic diagram
V
V
V
DDQ DDQIN
DD
DQ0-DQ31
(1)
A0-Amax
E
K
PEN
L
M58BW16F
M58BW32F
RP
G
R
GD
W
WP
B
V
V
SSQ
SS
AI13224b
9/87
Description
Table 1.
M58BW16F, M58BW32F
Direction
Signal names
Signal name
Function
A0-Amax(1)
Address inputs
Inputs
I/O
DQ0-DQ7
Data input/output, command input
Data input/output, Burst Configuration Register
Data input/output
DQ8-DQ15
I/O
DQ16-DQ31
I/O
B
Burst Address Advance input
Chip Enable input
Input
Input
Input
Input
Input
Output
Input
Input
Input
Input
E
G
Output Enable input
K
Burst Clock input
L
Latch Enable input
R
Valid Data Ready output
Reset/Power-down input
Write Enable input
RP
W
GD
WP
VDD
VDDQ
VDDQIN
PEN
VSS
VSSQ
NC
DU
Output Disable input
Write Protect input
Supply voltage
Power supply for output buffers
Power supply for input buffers only
Program/Erase Enable
Ground
Input
Input/output ground
Not connected internally
Don’t use as internally connected
1. Amax is equal to A18 in the M58BW16F, and to A19 in the M58BW32F.
10/87
M58BW16F, M58BW32F
Figure 2.
Description
LBGA connections (top view through package)
1
2
3
4
5
6
7
8
A
B
C
D
E
F
A15
A14
V
PEN
V
A6
A3
A2
DD
SS
A16
A17
DQ3
A13
A18
A12
A11
A9
A10
NC
A8
NC
A5
A7
A4
NC
A1
A0
A19/
DQ0
DQ4
DQ7
DQ8
DQ12
DQ14
RP
NC
DQ31
DQ28
DQ25
DQ21
DQ19
G
DQ30
DQ26
DQ24
DQ23
DQ18
R
DQ29
NC(1)
V
DQ2
DQ6
DQ10
DQ11
L
DQ1
DQ5
DQ9
WP
B
DQ27
NC
V
DDQ
DDQ
V
V
SSQ
DDQ
SSQ
G
H
J
V
DQ22
DQ17
E
V
DDQ
DQ13
DQ15
DQ20
DQ16
NC
K
V
K
V
V
W
GD
DDQIN
SS
DD
AI12854b
1. Ball D3 is NC in the M58BW16F and A19 in the M58BW32F.
11/87
Description
M58BW16F, M58BW32F
Figure 3.
PQFP connections (top view through package)
DQ16
1
DQ15
DQ14
DQ13
DQ12
64
DQ17
DQ18
DQ19
V
V
V
DDQ
SSQ
DDQ
V
SSQ
DQ20
DQ11
DQ10
DQ9
DQ8
DQ7
DQ6
DQ5
DQ4
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
M58BW16F
M58BW32F
12
53
V
V
V
DDQ
SSQ
DDQ
V
SSQ
DQ28
DQ3
DQ2
DQ1
DQ0
A19/NC
A18
DQ29
DQ30
DQ31
DU
(1)
A0
A1
A17
A2
A16
41
24
AI13225b
12/87
M58BW16F, M58BW32F
Description
1.1
Block protection
The M58BWxxF features four different levels of block protection.
●
Write Protect pin, WP, - When WP is Low, V , the protection status that has been
IL
configured in the Block Protection Configuration Register is activated. The Block
Protection Configuration Register is volatile. Any combination of blocks is possible. Any
attempt to program or erase a protected block will return an error in the Status Register
(see Table 13: Status Register bits).
●
●
Reset/Power-down pin, RP, - If the device is held in reset mode (RP at V ), no
Program or Erase operation can be performed on any block.
IL
Program/Erase Enable, PEN, - The Program/Erase Enable input, PEN, protects all
blocks by preventing Program and Erase operations from modifying the data.
Prior to issuing a Program or Erase command, the Program/Erase Enable must be set
to High (V ). If it is Low (V ), the Program or Erase operation is not accepted and an
IH
IL
error is generated in the Status Register.
●
Permanent protection against modify operations - specific OTP-like blocks can be
permanently protected against modify operations (Program/Erase):
–
in the M58BW32F, a unique 128-Kbit parameter block – block 1 (01000h-01FFFh)
for bottom devices or block 72 (FE000h-FEFFFh) for top devices
–
in the M58BW16F, two 64-Kbit parameter blocks – blocks 2 and 3 (01000h-
01FFFh) for bottom devices or blocks 36 and 35 (7E000h-7EFFFh) for top devices
This protection is user-enabled. Details of how this protection is activated are provided
in a dedicated application note.
After a device reset the first two kinds of block protection (WP, RP) can be combined to give
a flexible block protection. All blocks are protected at power-up.
13/87
Description
M58BW16F, M58BW32F
Table 2.
#
M58BW32F top boot block addresses
Size (Kbit)
Address range(1)
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
128
128
128
128
64
FF000h-FFFFFh
FE000h-FEFFFh(2)
FD000h-FDFFFh
FC000h-FCFFFh
FB800h-FBFFFh
FB000h-FB7FFh
FA800h-FAFFFh
FA000h-FA7FFh
F9800h-F9FFFh
F9000h-F97FFh
F8800h-F8FFFh
F8000h-F87FFh
F4000h-F7FFFh
F0000h-F3FFFh
EC000h-EFFFFh
E8000h-EBFFFh
E4000h-E7FFFh
E0000h-E3FFFh
DC000h-DFFFFh
D8000h-DBFFFh
D4000h-D7FFFh
D0000h-D3FFFh
CC000h-CFFFFh
C8000h-CBFFFh
C4000h-C7FFFh
C0000h-C3FFFh
BC000h-BFFFFh
B8000h-BBFFFh
B4000h-B7FFFh
B0000h-B3FFFh
AC000h-AFFFFh
A8000h-ABFFFh
A4000h-A7FFFh
A0000h-A3FFFh
9C000h-9FFFFh
98000h-9BFFFh
94000h-97FFFh
90000h-93FFFh
64
64
64
64
64
64
64
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
14/87
M58BW16F, M58BW32F
Description
Table 2.
#
M58BW32F top boot block addresses (continued)
Size (Kbit)
Address range(1)
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
8C000h-8FFFFh
88000h-8BFFFh
84000h-87FFFh
80000h-83FFFh
7C000h-7FFFFh
78000h-7BFFFh
74000h-77FFFh
70000h-73FFFh
6C000h-6FFFFh
68000h-6BFFFh
64000h-67FFFh
60000h-63FFFh
5C000h-5FFFFh
58000h-5BFFFh
54000h-57FFFh
50000h-53FFFh
4C000h-4FFFFh
48000h-4BFFFh
44000h-47FFFh
40000h-43FFFh
3C000h-3FFFFh
38000h-3BFFFh
34000h-37FFFh
30000h-33FFFh
2C000h-2FFFFh
28000h-2BFFFh
24000h-27FFFh
20000h-23FFFh
1C000h-1FFFFh
18000h-1BFFFh
14000h-17FFFh
10000h-13FFFh
0C000h-0FFFFh
08000h-0BFFFh
04000h-07FFFh
00000h-03FFFh
8
7
6
5
4
3
2
1
0
1. Addresses are indicated in 32-bit addressing.
2. OTP block.
15/87
Description
M58BW16F, M58BW32F
Table 3.
#
M58BW32F bottom boot block addresses
Size (Kbit)
Address range(1)
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
FC000h-FFFFFh
F8000h-FBFFFh
F4000h-F7FFFh
F0000h-F3FFFh
EC000h-EFFFFh
E8000h-EBFFFh
E4000h-E7FFFh
E0000h-E3FFFh
DC000h-DFFFFh
D8000h-DBFFFh
D4000h-D7FFFh
D0000h-D3FFFh
CC000h-CFFFFh
C8000h-CBFFFh
C4000h-C7FFFh
C0000h-C3FFFh
BC000h-BFFFFh
B8000h-BBFFFh
B4000h-B7FFFh
B0000h-B3FFFh
AC000h-AFFFFh
A8000h-ABFFFh
A4000h-A7FFFh
A0000h-A3FFFh
9C000h-9FFFFh
98000h-9BFFFh
94000h-97FFFh
90000h-93FFFh
8C000h-8FFFFh
88000h-8BFFFh
84000h-87FFFh
80000h-83FFFh
7C000h-7FFFFh
78000h-7BFFFh
74000h-77FFFh
70000h-73FFFh
6C000h-6FFFFh
68000h-6BFFFh
16/87
M58BW16F, M58BW32F
Description
Table 3.
#
M58BW32F bottom boot block addresses (continued)
Size (Kbit)
Address range(1)
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
64
64000h-67FFFh
60000h-63FFFh
5C000h-5FFFFh
58000h-5BFFFh
54000h-57FFFh
50000h-53FFFh
4C000h-4FFFFh
48000h-4BFFFh
44000h-47FFFh
40000h-43FFFh
3C000h-3FFFFh
38000h-3BFFFh
34000h-37FFFh
30000h-33FFFh
2C000h-2FFFFh
28000h-2BFFFh
24000h-27FFFh
20000h-23FFFh
1C000h-1FFFFh
18000h-1BFFFh
14000h-17FFFh
10000h-13FFFh
0C000h-0FFFFh
08000h-0BFFFh
07800h-07FFFh
07000h-077FFh
06800h-06FFFh
06000h-067FFh
05800h-05FFFh
05000h-057FFh
04800h-04FFFh
04000h-047FFh
03000h-03FFFh
02000h-02FFFh
01000h-01FFFh(2)
00000h-00FFFh
64
64
8
64
7
64
6
64
5
64
4
64
3
128
128
128
128
2
1
0
1. Addresses are indicated in 32-bit word addressing.
2. OTP block.
17/87
Description
M58BW16F, M58BW32F
Table 4.
#
M58BW16F top boot block addresses
Size (Kbit)
Address range
38
37
36(1)
35(1)
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
64
7F800h-7FFFFh
7F000h-7F7FFh
7E800h-7EFFFh
7E000h-7E7FFh
7D800h-7DFFFh
7D000h-7D7FFh
7C800h-7CFFFh
7C000h-7C7FFh
78000h-7BFFFh
74000h-77FFFh
70000h-73FFFh
6C000h-6FFFFh
68000h-6BFFFh
64000h-67FFFh
60000h-63FFFh
5C000h-5FFFFh
58000h-5BFFFh
54000h-57FFFh
50000h-53FFFh
4C000h-4FFFFh
48000h-4BFFFh
44000h-47FFFh
40000h-43FFFh
3C000h-3FFFFh
38000h-3BFFFh
34000h-37FFFh
30000h-33FFFh
2C000h-2FFFFh
28000h-2BFFFh
24000h-27FFFh
20000h-23FFFh
1C000h-1FFFFh
18000h-1BFFFh
14000h-17FFFh
10000h-13FFFh
0C000h-0FFFFh
08000h-0BFFFh
04000h-07FFFh
00000h-03FFFh
64
64
64
64
64
64
64
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
8
7
6
5
4
3
2
1
0
1. OTP block.
18/87
M58BW16F, M58BW32F
Description
Table 5.
#
M58BW16F bottom boot block addresses
Size (Kbit)
Address range
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
512
64
7C000h-7FFFFh
78000h-7BFFFh
74000h-77FFFh
70000h-73FFFh
6C000h-6FFFFh
68000h-6BFFFh
64000h-67FFFh
60000h-63FFFh
5C000h-5FFFFh
58000h-5BFFFh
54000h-57FFFh
50000h-53FFFh
4C000h-4FFFFh
48000h-4BFFFh
44000h-47FFFh
40000h-43FFFh
3C000h-3FFFFh
38000h-3BFFFh
34000h-37FFFh
30000h-33FFFh
2C000h-2FFFFh
28000h-2BFFFh
24000h-27FFFh
20000h-23FFFh
1C000h-1FFFFh
18000h-1BFFFh
14000h-17FFFh
10000h-13FFFh
0C000h-0FFFFh
08000h-0BFFFh
04000h-07FFFh
03800h-03FFFh
03000h-037FFh
02800h-02FFFh
02000h-027FFh
01800h-01FFFh
01000h-017FFh
00800h-00FFFh
00000h-007FFh
8
7
6
64
5
64
4
64
3(1)
2(1)
1
64
64
64
0
64
1. OTP block.
19/87
Signal descriptions
M58BW16F, M58BW32F
2
Signal descriptions
See Figure 1: Logic diagram and Table 1: Signal names, for a brief overview of the signals
connected to this device.
2.1
Address inputs (A0-Amax)
Amax is equal to A18 in the M58BW16F, and to A19 in the M58BW32F.
The Address inputs are used to select the cells to access in the memory array during Bus
operations. During Bus Write operations they control the commands sent to the command
interface of the Program/Erase controller. Chip Enable must be Low when selecting the
addresses.
The Address inputs are latched on the rising edge of Latch Enable L or Burst Clock K,
whichever occurs first, in a Read operation. The Address inputs are latched on the rising
edge of Chip Enable, Write Enable or Latch Enable, whichever occurs first in a Write
operation. The address latch is transparent when Latch Enable is Low, V . The address is
IL
internally latched in an Erase or Program operation.
2.2
Data inputs/outputs (DQ0-DQ31)
The Data inputs/outputs output the data stored at the selected address during a Bus Read
operation, or are used to input the data during a program operation. During Bus Write
operations they represent the commands sent to the command interface of the
Program/Erase controller. When used to input data or Write commands they are latched on
the rising edge of Write Enable or Chip Enable, whichever occurs first.
When Chip Enable and Output Enable are both Low, V , and Output Disable is at V the
IL
IH,
data bus outputs data from the memory array, the Electronic Signature, the Block Protection
Configuration Register, the CFI information or the contents of Burst Configuration Register
or Status Register. The data bus is high impedance when the device is deselected with Chip
Enable at V , Output Enable at V , Output Disable at V or Reset/Power-down at V . The
IH
IH
IL
IL
Status Register content is output on DQ0-DQ7 and DQ8-DQ31 are at V .
IL
2.3
2.4
Chip Enable (E)
The Chip Enable, E, input activates the memory control logic, input buffers, decoders and
sense amplifiers. Chip Enable, E, at V deselects the memory and reduces the power
consumption to the standby level.
IH
Output Enable (G)
The Output Enable, G, gates the outputs through the data output buffers during a Read
operation, when Output Disable GD is at V . When Output Enable G is at V , the outputs
IH
IH
are high impedance independently of Output Disable.
20/87
M58BW16F, M58BW32F
Signal descriptions
2.5
Output Disable (GD)
The Output Disable, GD, deactivates the data output buffers. When Output Disable, GD, is at
V , the outputs are driven by the Output Enable. When Output Disable, GD, is at V , the
IH
IL
outputs are high impedance independently of Output Enable. The Output Disable pin must
be connected to an external pull-up resistor as there is no internal pull-up resistor to drive
the pin.
2.6
2.7
Write Enable (W)
The Write Enable, W, input controls writing to the command interface, input address and
data latches. Both addresses and data can be latched on the rising edge of Write Enable
(also see Latch Enable, L).
Reset/Power-down (RP)
The Reset/Power-down, RP, is used to apply a hardware reset to the memory. A hardware
reset is achieved by holding Reset/Power-down Low, V , for at least t
. Writing is
IL
PLPH
inhibited to protect data, the command interface and the Program/Erase controller are reset.
The Status Register information is cleared and power consumption is reduced to the
standby level (I
impedance.
). The device acts as deselected, that is the data outputs are high
DD1
After Reset/Power-down goes High, V , the memory will be ready for Bus Read operations
IH
after a delay of t
or Bus Write operations after t
.
PHEL
PHWL
If Reset/Power-down goes Low, V , during a Block Erase or a Program operation, the
IL
internal state machine handles the operation as a Program/Erase Suspend, so the
maximum time defined inTable 12: Program, Erase times and endurance cycles must be
applied.
During power-up power should be applied simultaneously to V and V
with RP held
DD
DDQIN
at V . When the supplies are stable RP is taken to V . Output Enable, G, Chip Enable, E,
IL
IH
and Write Enable, W, should be held at V during power-up.
IH
In an application, it is recommended to associate the Reset/Power-down pin, RP, with the
reset signal of the microprocessor. Otherwise, if a Reset operation occurs while the memory
is performing an Erase or program operation, the memory may output the Status Register
information instead of being initialized to the default Asynchronous Random Read mode.
See Table 24 and Figure 22: Reset, Power-down and Power-up AC waveforms - Control
pins Low, for more details.
2.8
Program/Erase Enable (PEN)
The Program/Erase Enable input, PEN, protects all blocks by preventing Program and Erase
operations from modifying the data.
Prior to issuing a Program or Erase command, the Program/Erase Enable must be set to
High (V ). If it is Low (V ), the Program or Erase operation is not accepted and an error is
IH
IL
generated in the Status Register.
21/87
Signal descriptions
M58BW16F, M58BW32F
2.9
Latch Enable (L)
The Bus Interface can be configured to latch the Address inputs on the rising edge of Latch
Enable, L, for Asynchronous Latch Enable Controlled Read or Write or Synchronous Burst
Read operations. In Synchronous Burst Read operations the address is latched on the
active edge of the Clock when Latch Enable is Low, V . Once latched, the addresses may
IL
change without affecting the address used by the memory. When Latch Enable is Low, V ,
IL
the latch is transparent. Latch Enable, L, can remain at V for Asynchronous Random Read
IL
and Write operations.
2.10
2.11
Burst Clock (K)
The Burst Clock, K, is used to synchronize the memory with the external bus during
Synchronous Burst Read operations. Bus signals are latched on the active edge of the
Clock. In Synchronous Burst Read mode the address is latched on the first rising clock edge
when Latch Enable is Low, V , or on the rising edge of Latch Enable, whichever occurs first.
IL
During Asynchronous Bus Operations the Clock is not used.
Burst Address Advance (B)
The Burst Address Advance, B, controls the advancing of the address by the internal
address counter during Synchronous Burst Read operations.
Burst Address Advance, B, is only sampled on the active clock edge of the Clock when the
X-latency time has expired. If Burst Address Advance is Low, V , the internal address
IL
counter advances. If Burst Address Advance is High, V , the internal address counter does
IH
not change; the same data remains on the Data inputs/outputs and Burst Address Advance
is not sampled until the Y-latency expires.
The Burst Address Advance, B, may be tied to V .
IL
2.12
2.13
Valid Data Ready (R)
The Valid Data Ready output, R, can be used during Synchronous Burst Read operations to
identify if the memory is ready to output data or not. The Valid Data Ready output can be
configured to be active on the clock edge of the invalid data read cycle or one cycle before.
Valid Data Ready, at V , indicates that new data is or will be available. When Valid Data
IH
Ready is Low, V , the previous data outputs remain active.
IL
Write Protect (WP)
The Write Protect, WP, provides protection against Program or Erase operations. When
Write Protect, WP, is at V , the protection status that has been configured in the Block
IL
Protection Configuration Register is activated. Program and Erase operations to protected
blocks are disabled. When Write Protect WP is at V all the blocks can be programmed or
IH
erased, if no other protection is used.
22/87
M58BW16F, M58BW32F
Signal descriptions
2.14
2.15
2.16
Supply voltage (VDD)
The supply voltage, V , is the core power supply. All internal circuits draw their current from
DD
the V pin, including the Program/Erase controller.
DD
Output supply voltage (VDDQ
)
The output supply voltage, V
, is the output buffer power supply for all operations (Read,
DDQ
Program and Erase) used for DQ0-DQ31 when used as outputs.
Input supply voltage (VDDQIN
)
The input supply voltage, V
, is the power supply for all input signal. Input signals are: K,
DDQIN
B, L, W, GD, G, E, A0-Amax and DQ0-DQ31, when used as inputs.
2.17
Ground (VSS and VSSQ)
The ground V is the reference for the internal supply voltage V . The ground V is the
SSQ
SS
DD
reference for the output and input supplies V
and V
. It is essential to connect V
DDQ,
DDQIN SS
and V
together.
SSQ
Note:
A 0.1 µF capacitor should be connected between the supply voltages, V , V
and
DD DDQ
V
and the grounds, V and V
to decouple the current surges from the power
DDQIN
SS
SSQ
supply. The PCB track widths must be sufficient to carry the currents required during all
operations of the parts, see Table 18: DC characteristics, for maximum current supply
requirements.
2.18
2.19
Don’t use (DU)
This pin should not be used as it is internally connected. Its voltage level can be between
and V or leave it unconnected.
V
SS
DDQ
Not connected (NC)
This pin is not physically connected to the device.
23/87
Bus operations
M58BW16F, M58BW32F
3
Bus operations
Each bus operations that controls the memory is described in this section, see tables 6 and
7 Bus operations, for a summary. The bus operation is selected through the Burst
Configuration Register; the bits in this register are described at the end of this section.
On power-up or after a hardware reset the memory defaults to Asynchronous Bus Read and
Asynchronous Bus Write. No synchronous operation can be performed until the Burst
Control Register has been configured.
The Electronic Signature, Block Protection Configuration, CFI or Status Register will be read
in asynchronous mode regardless of the Burst Control Register settings.
Typically glitches of less than 5 ns on Chip Enable or Write Enable are ignored by the
memory and do not affect bus operations.
3.1
Asynchronous Bus operations
For asynchronous bus operations refer to Table 6 together with the following text. The read
access will start at whichever of the three following events occurs last: valid address
transition, Chip Enable, E, going Low, V or Latch Enable, L, going Low, V .
IL
IL
3.1.1
Asynchronous Bus Read
Asynchronous Bus Read operations read from the memory cells, or specific registers
(Electronic Signature, Block Protection Configuration Register, Status Register, CFI and
Burst Configuration Register) in the command interface. A valid bus operation involves
setting the desired address on the Address inputs, applying a Low signal, V , to Chip
IL
Enable and Output Enable and keeping Write Enable and Output Disable High, V . The
IH
Data inputs/outputs will output the value, see Figure 7: Asynchronous Bus Read AC
waveforms, and Table 19: Asynchronous Bus Read AC characteristics, for details of when
the output becomes valid.
Asynchronous Read is the default read mode which the device enters on power-up or on
return from Reset/Power-down.
3.1.2
Asynchronous Latch Controlled Bus Read
Asynchronous Latch Controlled Bus Read operations read from the memory cells or specific
registers in the command interface. The address is latched in the memory before the value
is output on the data bus, allowing the address to change during the cycle without affecting
the address that the memory uses.
A valid bus operation involves setting the desired address on the Address inputs, setting
Chip Enable and Latch Enable Low, V and keeping Write Enable High, V ; the address is
IL
IH
latched on the rising edge of Latch Enable. Once latched, the Address inputs can change.
Set Output Enable Low, V , to read the data on the Data inputs/outputs; see Figure 8:
IL
Asynchronous Latch Controlled Bus Read AC waveforms and Table 19: Asynchronous Bus
Read AC characteristics, for details on when the output becomes valid.
Note that, since the Latch Enable input is transparent when set Low, V , Asynchronous Bus
IL
Read operations can be performed when the memory is configured for Asynchronous Latch
Enable bus operations by holding Latch Enable Low, V throughout the bus operation.
IL
24/87
M58BW16F, M58BW32F
Bus operations
3.1.3
Asynchronous Page Read
Asynchronous Page Read operations are used to read from several addresses within the
same memory page. Each memory page is 4 double-words and is addressed by the
address inputs A0 and A1.
Data is read internally and stored in the page buffer. Valid bus operations are the same as
Asynchronous Bus Read operations but with different timings. The first read operation within
the page has identical timings, subsequent reads within the same page have much shorter
access times. If the page changes then the normal, longer timings apply again. Page Read
does not support Latched Controlled Read.
See Figure 11: Asynchronous Page Read AC waveforms, and Table 20: Asynchronous
Page Read AC characteristics, for details on when the outputs become valid.
3.1.4
Asynchronous Bus Write
Asynchronous Bus Write operations write to the command interface in order to send
commands to the memory or to latch addresses and input data to program. Bus Write
operations are asynchronous, the clock, K, is don’t care during Bus Write operations.
A valid Asynchronous Bus Write operation begins by setting the desired address on the
Address inputs, and setting Chip Enable, Write Enable and Latch Enable Low, V , and
IL
Output Enable High, V , or Output Disable Low, V . The Address inputs are latched by the
IH
IL
command interface on the rising edge of Chip Enable or Write Enable, whichever occurs
first. Commands and input data are latched on the rising edge of Chip Enable, E, or Write
Enable, W, whichever occurs first. Output Enable must remain High, and Output Disable
Low, during the whole Asynchronous Bus Write operation.
See Figure 12: Asynchronous Write AC waveforms, and Table 21: Asynchronous Write and
Latch controlled Write AC characteristics, for details of the timing requirements.
3.1.5
Asynchronous Latch Controlled Bus Write
Asynchronous Latch Controlled Bus Write operations write to the command interface in
order to send commands to the memory or to latch addresses and input data to program.
Bus Write operations are asynchronous, the clock, K, is Don’t care during Bus Write
operations.
A valid Asynchronous Latch Controlled Bus Write operation begins by setting the desired
address on the Address inputs and pulsing Latch Enable Low, V . The Address inputs are
IL
latched by the command interface on the rising edge of Latch Enable, Write Enable or Chip
Enable, whichever occurs first. Commands and input data are latched on the rising edge of
Chip Enable, E, or Write Enable, W, whichever occurs first. Output Enable must remain
High, and Output Disable Low, during the whole Asynchronous Bus Write operation.
See Figure 13: Asynchronous Latch controlled Write AC waveforms, and Table 21:
Asynchronous Write and Latch controlled Write AC characteristics, for details of the timing
requirements.
3.1.6
Output Disable
The data outputs are high impedance when the Output Enable, G, is at V or Output
IH
Disable, GD, is at V .
IL
25/87
Bus operations
M58BW16F, M58BW32F
3.1.7
Standby
When Chip Enable is High, V , and the Program/Erase controller is idle, the memory enters
IH
Standby mode, the power consumption is reduced to the standby level (I
) and the Data
DD1
inputs/outputs pins are placed in the high impedance state regardless of Output Enable,
Write Enable or Output Disable inputs.
The Standby mode can be disabled by setting the Standby Disable bit (M14) of the Burst
Configuration Register to ‘1’ (see Table 18: DC characteristics).
3.1.8
Reset/Power-down
The memory is in Reset/Power-down mode when Reset/Power-down, RP, is at V . The
IL
power consumption is reduced to the standby level (I
) and the outputs are high
DD1
impedance, independent of the Chip Enable, E, Output Enable, G, Output Disable, GD, or
Write Enable, W, inputs. In this mode the device is write protected and both the Status and
the Burst Configuration Registers are cleared. A recovery time is required when the RP
input goes High.
(1)
Table 6.
Asynchronous Bus operations
Bus operation
Step
E
G
GD
W
RP
L
A0-Amax
DQ0-DQ31
Asynchronous Bus Read(2)
VIL
VIL
VIH
VIL
VIL
VIH
VIH
VIH
VIH
VIL
X
VIH
VIH
VIH
VIH
X
VIH
VIL
VIH
VIH
VIL
VIH
VIL
VIH
VIH
X
VIH
VIH
VIH
VIH
VIH
VIH
VIH
VIH
VIH
VIH
VIL
VIL
VIL
VIH
X
Address
Data output
High Z
Address Latch VIL
Address
Asynchronous Latch
Controlled Bus Read
Read
VIL
VIL
VIL
X
Data output
Data output
Data input
High Z
Asynchronous Page Read
Asynchronous Bus Write
Address
VIL
VIL
VIH
X
Address
Address Latch VIL
X
Address
Asynchronous Latch
Controlled Bus Write
Write
VIL
VIL
VIL
VIH
X
X
X
X
X
X
X
Data input
High Z
Output Enable, G
Output Disable, GD
Standby
VIH
VIL
X
X
High Z
X
High Z
Reset/Power-down
1. X = Don’t care.
X
X
X
X
High Z
2. Data, Manufacturer code, Device code, Burst Configuration Register, Standby Status and Block Protection Configuration
Register are read using the Asynchronous Bus Read command.
26/87
M58BW16F, M58BW32F
Bus operations
3.2
Synchronous Bus operations
For Synchronous Bus Operations refer to Table 7 together with the following text. The read
access will start at whichever of the three following events occurs last: valid address
transition, Chip Enable, E, going Low, V or Latch Enable, L, going Low, V .
IL
IL
3.2.1
Synchronous Burst Read
Synchronous Burst Read operations are used to read from the memory at specific times
synchronized to an external reference clock. The valid edge of the Clock signal is the rising
edge. Once the Flash memory is configured in Burst mode, it is mandatory to have an active
clock signal since the switching of the output buffer databus is synchronized to the rising
edge of the clock. In the absence of clock, no data is output.
The burst type, length and latency can be configured. The different configurations for
Synchronous Burst Read operations are described in the Burst Configuration Register
section. Refer to Figure 4 for examples of Synchronous Burst operations.
A valid Synchronous Burst Read operation begins when the Burst Clock is active and Chip
Enable and Latch Enable are Low, V . The burst start address is latched and loaded into
IL
the internal Burst Address counter on the valid Burst Clock K edge or on the rising edge of
Latch Enable, whichever occurs first.
After an initial memory latency time, the memory outputs data each clock cycle. The Burst
Address Advance B input controls the memory burst output. The second burst output is on
the next clock valid edge after the Burst Address Advance B has been pulled Low.
Valid Data Ready, R, monitors if the memory burst boundary is exceeded and the Burst
Controller of the microprocessor needs to insert wait states. When Valid Data Ready is Low
on the rising clock edge, no new data is available and the memory does not increment the
internal address counter at the active clock edge even if Burst Address Advance, B, is Low.
Valid Data Ready may be configured (by bit M8 of Burst Configuration Register) to be valid
immediately at the rising clock edge.
Synchronous Burst Read will be suspended if Burst Address Advance, B, goes High, V .
IH
If Output Enable is at V and Output Disable is at V , the last data is still valid.
IL
IH
If Output Enable, G, is at V or Output Disable, GD, is at V , but the Burst Address
IH
IL
Advance, B, is at V the internal Burst Address counter is incremented at each Burst Clock
IL
K rising edge.
The Synchronous Burst Read timing diagrams and AC characteristics are described in the
AC and DC parameters section. See Figures 14, 17, 18 and 19, and Table 22.
27/87
Bus operations
M58BW16F, M58BW32F
3.2.2
Synchronous Burst Read Suspend
During a Synchronous Burst Read operation it is possible to suspend the operation, freeing
the data bus for other higher priority devices.
A valid Synchronous Burst Read operation is suspended when both Output Enable and
Burst Address Advance are High, V . The Burst Address Advance going High, V , stops
IH
IH
the Burst counter and the Output Enable going High, V , inhibits the data outputs. The
IH
Synchronous Burst Read operation can be resumed by setting Output Enable Low.
(1)
Table 7.
Synchronous Burst Read Bus operations
A0-Amax
Bus operation
Step
E
G
GD RP
K
L
B
DQ0-DQ31
Address Latch
Read
VIL VIH
VIL
VIL VIH
VIL
VIL VIH VIH R(3) VIH VIL
X
VIH R(3) VIL
X
Address input
Data output
High Z
VIL VIH VIH R(3) VIH VIL
Read Suspend
Read Resume
X
VIH VIH VIH
X
Synchronous
Burst Read(2)
Data output
Burst Address
Advance
VIL VIH
X
VIH R(3) VIH VIL
High Z
Read Abort, E
VIH
X
X
X
X
X
VIH
VIL
X
X
X
X
X
X
High Z
High Z
Read Abort, RP
1. X = Don't care, VIL or VIH
.
2. M15 = 0, Bit M15 is in the Burst Configuration Register.
3. R = Rising edge.
3.3
Burst Configuration Register
The Burst Configuration Register is used to configure the type of bus access that the
memory will perform.
The Burst Configuration Register is set through the command interface and will retain its
information until it is re-configured, the device is reset, or the device goes into Reset/Power-
down mode. The Burst Configuration Register bits are described in Table 8. They specify the
selection of the Burst length, Burst type, Burst X and Y latencies and the Read operation.
Refer to Figure 4 for examples of Synchronous Burst configurations.
3.3.1
Read Select bit (M15)
The Read Select bit, M15, is used to switch between Asynchronous and Synchronous Bus
Read operations. When the Read Select bit is set to ’1’, Bus Read operations are
asynchronous; when the Read Select bit is set to ’0’, Bus Read operations are synchronous.
On reset or power-up the Read Select bit is set to’1’ for asynchronous accesses.
3.3.2
Standby Disable bit (M14)
The Standby Disable bit, M14, is used to disable the Standby mode. When the Standby bit is
‘1’, the device will not enter Standby mode when Chip Enable goes High, V .
IH
28/87
M58BW16F, M58BW32F
Bus operations
3.3.3
X-Latency bits (M13-M11)
The X-Latency bits are used during Synchronous Bus Read operations to set the number of
clock edges between the address being latched and the edge where the first data become
available. For correct operation the X-Latency bits can only assume the values in Table 8:
Burst Configuration Register.
3.3.4
Y-Latency bit (M9)
The Y-Latency bit is used during Synchronous Bus Read operations to set the number of
clock cycles between consecutive reads. The Y-Latency value depends on both the X-
Latency value and the setting in M9.
When the Y-Latency is 1 the data changes each clock cycle.
3.3.5
3.3.6
3.3.7
Valid Data Ready bit (M8)
The Valid Data Ready bit controls the timing of the Valid Data Ready output pin, R. When
the Valid Data Ready bit is ’0’ the Valid Data Ready output pin is driven Low for the rising
clock edge when invalid data is output on the bus.
Wrap Burst bit (M3)
Burst Read can be confined inside the 4 double-word boundary (wrap) or overcome the
boundary (no wrap). When the wrap burst bit is set to '1' the burst read does not wrap. The
wrap mode is not available (M3 is always ‘1’).
Burst Length bit (M2-M0)
The Burst Length bits set the maximum number of double-words that can be output during a
Synchronous Burst Read operation. Burst lengths of 4 or 8 are available.
Table 8: Burst Configuration Register gives the valid combinations of the Burst Length bits
that the memory accepts.
If a Burst Read operation (no wrap) has been initiated the device will output data
synchronously. Depending on the starting address, the device activates the Valid Data
Ready output to indicate that a delay is necessary before the data is output. If the starting
address is aligned to a 4 double word boundary, the 8-double-word burst mode will run
without activating the Valid Data Ready output. If the starting address is not aligned to a 4
double word boundary, Valid Data Ready is activated to indicate that the device needs an
internal delay to read the successive words in the array.
M10, M7 to M4 are reserved for future use.
29/87
Bus operations
M58BW16F, M58BW32F
Table 8.
Burst Configuration Register
Description Value
Bit
Description
Synchronous Burst Read
0
1
0
1
M15
Read Select
Asynchronous Read (default at power-on)
Standby mode enabled (default at power-up)
Standby mode disabled
Reserved (default value)
3, 3-1-1-1, 3-2-2-2
M14
Standby Disable
000
001
010
011
100
101
110
111
0
4, 4-1-1-1, 4-2-2-2
5, 5-1-1-1, 5-2-2-2
M13-M11
X-Latency(1)
6, 6-1-1-1, 6-2-2-2
7, 7-1-1-1, 7-2-2-2
8, 8-1-1-1, 8-2-2-2
Reserved
Reserved (default value)
Reserved
M10
M9
1
0
One Burst Clock cycle (default value)
Two Burst Clock cycle
Y-Latency(2)
1
R valid Low during valid Burst Clock edge (default
value)
0
1
M8
Valid Data Ready
R valid Low 1 data cycle before valid Burst Clock
edge
0
Reserved (default value)
Reserved
M7
1
0
Falling Burst Clock edge (default value)
Rising Burst Clock edge
Reserved (default value)
Reserved
M6(3)
1
00
01
10
11
0
M5-M4
M3
Reserved
Reserved
Wrap (default value)
No Wrap
Wrapping
1
30/87
M58BW16F, M58BW32F
Bus operations
Table 8.
Bit
Burst Configuration Register (continued)
Description
Value
000
Description
Reserved (default value)
001
010
011
100
101
110
111
4 double-words
8 double-words
Reserved
M2-M0
Burst Length
Reserved
Reserved
Reserved
Continuous
1. X latencies can be calculated as: (tAVQV – tLLKH + tQVKH) + tSYSTEM MARGIN < (X -1) tK. X is an integer
number from 4 to 8, tK is the clock period and tSYSTEM MARGIN is the time margin required for the
calculation.
2. Y latencies can be calculated as: tKHQV + tSYSTEM MARGIN + tQVKH < Y tK.
3. The M6 bit is Don’t care in the M58BW32F and the device has the Rising Burst Clock edge set. To
maintain the compatibility this could be modified and read.
31/87
Bus operations
M58BW16F, M58BW32F
Table 9.
Burst type definition
Start address
× 4 sequential
× 8 sequential
0
1
2
3
4
5
6
7
8
0-1-2-3
1-2-3-4
2-3-4-5
3-4-5-6
4-5-6-7
5-6-7-8
6-7-8-9
7-8-9-10
8-9-10-11
0-1-2-3-4-5-6-7
1-2-3-4-5-6-7-8
2-3-4-5-6-7-8-9
3-4-5-6-7-8-9-10
4-5-6-7-8-9-10-11
5-6-7-8-9-10-11-12
6-7-8-9-10-11-12-13
7-8-9-10-11-12-13-14
8-9-10-11-12-13-14-15
Figure 4.
Example burst configuration X-1-1-1
0
1
2
3
4
5
6
7
8
9
K
ADD
VALID
L
DQ
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
3-1-1-1
DQ
DQ
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
4-1-1-1
5-1-1-1
VALID
VALID
DQ
DQ
DQ
VALID
VALID
VALID
VALID
VALID
VALID
VALID
VALID
6-1-1-1
7-1-1-1
8-1-1-1
AI03841b
32/87
M58BW16F, M58BW32F
Command interface
4
Command interface
All Bus Write operations to the memory are interpreted by the command interface.
Commands consist of one or more sequential Bus Write operations. The commands are
summarized in Table 10: Commands. Refer to Table 10 in conjunction with the text
descriptions below.
4.1
4.2
Read Memory Array command
The Read Memory Array command returns the memory to Read mode. One Bus Write cycle
is required to issue the Read Memory Array command and return the memory to Read
mode. Subsequent Read operations will output the addressed memory array data. Once the
command is issued the memory remains in Read mode until another command is issued.
From Read mode Bus Read commands will access the memory array.
Read Electronic Signature command
The Read Electronic Signature command is used to read the Manufacturer code, the Device
code, the Block Protection Configuration Register and the Burst Configuration Register. One
Bus Write cycle is required to issue the Read Electronic Signature command. Once the
command is issued, subsequent Bus Read operations, depending on the address specified,
read the Manufacturer code, the Device code, the Block Protection Configuration or the
Burst Configuration Register until another command is issued; see Table 11: Read
electronic signature.
4.3
Read Query command
The Read Query command is used to read data from the common Flash interface (CFI)
memory area. One Bus Write cycle is required to issue the Read Query command. Once
the command is issued subsequent Bus Read operations, depending on the address
specified, read from the common Flash interface memory area.
33/87
Command interface
M58BW16F, M58BW32F
4.4
Read Status Register command
The Read Status Register command is used to read the Status Register. One Bus Write
cycle is required to issue the Read Status Register command. Once the command is issued
subsequent Bus Read operations read the Status Register until another command is issued.
The Status Register information is present on the output data bus (DQ0-DQ7) when Chip
Enable E and Output Enable G are at V and Output Disable is at V .
IL
IH
An interactive update of the Status Register bits is possible by toggling Output Enable or
Output Disable. It is also possible during a Program or Erase operation, by de-activating the
device with Chip Enable at V and then reactivating it with Chip Enable and Output Enable
IH
at V and Output Disable at V .
IL
IH
The content of the Status Register may also be read at the completion of a Program, Erase
or Suspend operation. During a Block Erase or Program command, DQ7 indicates the
Program/Erase controller status. It is valid until the operation is completed or suspended.
See the section on the Status Register and Table 13 for details on the definitions of the
Status Register bits.
4.5
4.6
Clear Status Register command
The Clear Status Register command can be used to reset bits 1, 3, 4 and 5 in the Status
Register to ‘0’. One Bus Write is required to issue the Clear Status Register command.
Once the command is issued the memory returns to its previous mode, subsequent Bus
Read operations continue to output the same data.
The bits in the Status Register are sticky and do not automatically return to ‘0’ when a new
Program, Erase, Block Protect or Block Unprotect command is issued. If any error occurs
then it is essential to clear any error bits in the Status Register by issuing the Clear Status
Register command before attempting a new Program, Erase or Resume command.
Block Erase command
The Block Erase command can be used to erase a block. It sets all of the bits in the block to
‘1’. All previous data in the block is lost. If the block is protected then the Erase operation will
abort, the data in the block will not be changed and the Status Register will output the error.
Two Bus Write operations are required to issue the command; the first write cycle sets up
the Block Erase command, the second write cycle confirms the Block Erase command and
latches the block address in the Program/Erase controller and starts the Program/Erase
controller. The sequence is aborted if the Confirm command is not given and the device will
output the Status Register Data with bits 4 and 5 set to '1'.
Once the command is issued subsequent Bus Read operations read the Status Register.
See the section on the Status Register for details on the definitions of the Status Register
bits. During the Erase operation the memory will only accept the Read Status Register
command and the Program/Erase Suspend command. All other commands will be ignored.
If PEN is at V , the operation can be performed. If PEN goes below V the operation
IH
IH,
aborts, the PEN Status bit in the Status Register is set to ‘1’ and the command must be re-
issued.
Typical Erase times are given in Table 12. See Appendix A, Figure 28: Block Erase flowchart
and pseudocode, for a suggested flowchart on using the Block Erase command.
34/87
M58BW16F, M58BW32F
Command interface
4.7
Erase All Main Blocks command
The Erase All Main Blocks command is used to erase all 63 main blocks, without affecting
the parameter blocks.
Issuing the Erase All Main Blocks command sets every bit in each main block to '1'. All data
previously stored in the main blocks are lost.
Two Bus Write cycles are required to issue the Erase All Main Blocks command. The first
cycle sets up the command, the second cycle confirms the command and starts the
Program/Erase controller. If the Confirm command is not given the sequence is aborted,
and Status Register bits 4 and 5 are set to '1'.
If the address given in the second cycle is located in a protected block, the Erase All Main
Blocks operation aborts. The data remains unchanged in all blocks and the Status Register
outputs the error.
Once the Erase All Main Blocks command has been issued, subsequent Bus Read
operations output the Status Register. See the Status Register section for details.
During an Erase All Main Blocks operation, only the Read Status Register command is
accepted by the memory; any other command are ignored. Erase All Main Blocks, once
started, cannot be suspended.
If PEN is at V , the operation will be performed. If PEN is lower than V the operation
IH
IH
aborts and the Status Register PEN bit (bit 3) is set to '1'.
4.8
Program command
The Program command is used to program the memory array. Two Bus Write operations are
required to issue the command; the first write cycle sets up the Program command, the
second write cycle latches the address and data to be programmed and starts the
Program/Erase controller. A program operation can be aborted by writing FFFFFFFFh to
any address after the program set-up command has been given.
The Program command is also used to program the OTP block. Refer to Table 10:
Commands, for details of the address.
Once the command is issued subsequent Bus Read operations read the Status Register.
See the section on the Status Register for details on the definitions of the Status Register
bits. During the Program operation the memory will only accept the Read Status Register
command and the Program/Erase Suspend command. All other commands will be ignored.
If Reset/Power-down, RP, falls to V during programming the operation will be aborted.
IL
If PEN is at V , the operation can be performed. If PEN goes below V the operation
IH
IH,
aborts, the PEN Status bit in the Status Register is set to ‘1’ and the command must be re-
issued.
See Appendix A, Figure 26: Program flowchart and pseudocode, for a suggested flowchart
on using the Program command.
35/87
Command interface
M58BW16F, M58BW32F
4.9
Write to Buffer and Program command
The Write to Buffer and Program command makes use of the device’s double word (32 bit)
Write Buffer to speed up programming.
Up to eight double words can be loaded into the Write Buffer and programmed into the
memory.
Four successive steps are required to issue the command.
1. One Bus Write operation is required to set up the Write to Buffer and Program
command. Any Bus Read operations will start to output the Status Register after the
1st cycle.
2. Use one Bus Write operation to write the selected memory block address (any address
in the block where the values will be programmed can be used) along with the value N
on the Data inputs/outputs, where N+1 is the number of words to be programmed. The
maximum value of N+1 is 8 words.
3. Use N+1 Bus Write operations to load the address and data for each word into the write
buffer. The address must be between Start address and Start address plus N, where
Start address is the first word address.
4. Finally, use one Bus Write operation to issue the final cycle to confirm the command
and start the Program operation.
If any address is outside the block boundaries or if the correct sequence is not followed,
Status Register bits 4 and 5 are set to ‘1’ and the operation will abort without affecting the
data in the memory array. A protected block must be unprotected using the Blocks Unprotect
command.
During a Write to Buffer and Program operation the memory will only accept the Read
Status Register and the Program/Erase Suspend commands. All other commands are
ignored. If PEN is at V , the operation will be performed. If PEN is lower than V the
IH
IH
operation aborts and the Status Register PEN bit (bit 3) is set to '1'.
The Status Register should be cleared before re-issuing the command.
36/87
M58BW16F, M58BW32F
Command interface
4.10
Program/Erase Suspend command
The Program/Erase Suspend command is used to pause a Program or Erase operation. The
command will only be accepted during a Program or Erase operation. It can be issued at
any time during a Program or Erase operation. The command is ignored if the device is
already in suspend mode.
One Bus Write cycle is required to issue the Program/Erase Suspend command and pause
the Program/Erase controller. Once the command is issued it is necessary to poll the
Program/Erase Controller Status bit (bit 7) to find out when the Program/Erase controller
has paused; no other commands will be accepted until the Program/Erase controller has
paused. After the Program/Erase controller has paused, the memory will continue to output
the Status Register until another command is issued.
During the polling period between issuing the Program/Erase Suspend command and the
Program/Erase Controller pausing it is possible for the operation to complete. Once the
Program/Erase Controller Status bit (bit 7) indicates that the Program/Erase controller is no
longer active, the Program Suspend Status bit (bit 2) or the Erase Suspend Status bit (bit 6)
can be used to determine if the operation has completed or is suspended. For timing on the
delay between issuing the Program/Erase Suspend command and the Program/Erase
controller pausing see Table 12.
During Program/Erase Suspend the Read Memory Array, Read Status Register, Read
Electronic Signature, Read Query and Program/Erase Resume commands will be accepted
by the command interface. Additionally, if the suspended operation was Erase then the
Program, the Write to Buffer and Program, the Set/Clear Block Protection Configuration
Register and the Program Suspend commands will also be accepted. When a program
operation is completed inside a Block Erase Suspend the Read Memory Array command
must be issued to reset the device in Read mode, then the Erase Resume command can be
issued to complete the whole sequence. Only the blocks not being erased may be read or
programmed correctly.
Erase operations can be suspended in a systematic and periodical way, however, in order to
ensure the effectiveness of erase operations and avoid infinite erase times, it is imperative to
wait a minimum time between successive Erase Resume and Erase Suspend commands.
This time, called the minimum effective erase time, is given in Table 12 on page 40.
See Appendix A, Figure 27: Program Suspend & Resume flowchart and pseudocode, and
Figure 29: Erase Suspend & Resume flowchart and pseudocode, for suggested flowcharts
on using the Program/Erase Suspend command.
4.11
Program/Erase Resume command
The Program/Erase Resume command can be used to restart the Program/Erase controller
after a Program/Erase Suspend operation has paused it. One Bus Write cycle is required to
issue the Program/Erase Resume command.
See Appendix A, Figure 27: Program Suspend & Resume flowchart and pseudocode, and
Figure 29: Erase Suspend & Resume flowchart and pseudocode, for suggested flowcharts
on using the Program/Erase Suspend command.
37/87
Command interface
M58BW16F, M58BW32F
4.12
Set Burst Configuration Register command
The Set Burst Configuration Register command is used to write a new value to the Burst
Configuration Register which defines the burst length, type, X and Y latencies,
Synchronous/Asynchronous Read mode.
Two Bus Write cycles are required to issue the Set Burst Configuration Register command.
The first cycle writes the setup command. The second cycle writes the address where the
new Burst Configuration Register content is to be written, and confirms the command. If the
command is not confirmed, the sequence is aborted and the device outputs the Status
Register with bits 4 and 5 set to ‘1’. Once the command is issued the memory returns to
Read mode as if a Read Memory Array command had been issued.
The value for the Burst Configuration Register is always presented on A0-A15. M0 is on A0,
M1 on A1, etc.; the other address bits are ignored.
4.13
Set Block Protection Configuration Register command
The Set Block Protection Configuration Register command is used to configure the Block
Protection Configuration Register to ‘protected’, for a specific block. Protected blocks are
fully protected from program or erase when WP pin is Low, V . The status of a protected
IL
block can be changed to ‘unprotected’ by using the Clear Block Protection Configuration
Register command. At power-up, all block are configured as ‘protected’.
Two bus operations are required to issue a Set Block Protection Configuration Register
command:
●
The first cycle writes the setup command
●
The second write cycle specifies the address of the block to protect and confirms the
command. If the command is not confirmed, the sequence is aborted and the device
outputs the Status Register with bits 4 and 5 set to ‘1’.
To protect multiple blocks, the Set Block Protection Configuration Register command must
be repeated for each block.
Any attempt to re-protect a block already protected does not change its status.
4.14
Clear Block Protection Configuration Register command
The Clear Block Protection Configuration Register command is used to configure the Block
Protection Configuration Register to ‘unprotected’, for a specific block thus allowing
program/erase operations to this block, regardless of the WP pin status.
Two bus operations are required to issue a Clear Block Protection Configuration Register
command:
●
The first cycle writes the setup command
●
The second write cycle specifies the address of the block to unprotect and confirms the
command. If the command is not confirmed, the sequence is aborted and the device
outputs the Status Register with bits 4 and 5 set to ‘1’.
To unprotect multiple blocks, the Clear Block Protection Configuration Register command
must be repeated for each block.
Any attempt to unprotect a block already unprotected does not affect its status.
38/87
M58BW16F, M58BW32F
Command interface
(1)
Table 10. Commands
Command
Bus operations
2nd cycle 3rd cycle
Op. Addr. Data Op. Addr. Data Op. Addr. Data Op. Addr. Data
1st cycle
4th cycle
Read Memory Array
≥ 2 Write
X
X
X
X
X
FFh Read RA
90h Read IDA
70h
RD
Read Electronic Signature(2) ≥ 2 Write
IDD
Read Status Register
Read Query
1
Write
≥ 2 Write
98h Read RA
50h
RD
Clear Status Register
Block Erase
1
2
2
Write
Write 55h 20h Write BA
Write 55h 80h Write AAh
40h
D0h
D0h
Erase All Main Blocks
any block
Program
2
2
Write AAh
Write
PA
PD
10h
Write AAh 40h Write
OTP block
PA
PD
N
Write to Buffer and Program N+4 Write AAh E8h Write BA
Write PA PD Write
X
D0h
Program/Erase Suspend
Program/Erase Resume
1
1
Write
Write
X
X
B0h
D0h
Set Burst Configuration
Register
Š3 Write
X
X
X
60h Write BCRh 03h Read RA RD
Set Block Protection
Configuration Register
2
2
Write
Write
60h Write BA
60h Write BA
01h
D0h
Clear Block Protection
Configuration Register
1. X Don’t care; RA Read Address, RD Read Data, ID Device Code, IDA Identifier Address, IDD Identifier Data, SRD Status
Register Data, PA Program Address; PD Program Data, QA Query Address, QD Query Data, BA Any address in the Block,
BCR Burst Configuration Register value, N+1 number of Words to program, BA Block address.
2. The Manufacturer code, the Device code, the Burst Configuration Register, and the Block Protection Configuration Register
of each block are read using the Read Electronic Signature command.
39/87
Command interface
M58BW16F, M58BW32F
DQ31-DQ0
Table 11. Read electronic signature
Code
Device
Amax-A0
Manufacturer
All
00000h
00001h
00001h
00001h
00001h
00000020h
0000883Ah
00008839h
00008838h
00008837h
M58BW16FT
M58BW16FB
M58BW32FT
M58BW32FB
Device
Burst Configuration
Register
00005h
BCR(1)
00000000h (Unprotected)
00000001h (Protected)
Block Protection
Configuration Register
All
SBA+02h(2)
1. BCR = Burst Configuration Register.
2. SBA is the start address of each block.
(1)
Table 12. Program, Erase times and endurance cycles
M58BW16F
Parameters
M58BW32F
Unit
Min
Typ
Max
Min
Typ
Max
Full Chip Program
15
15
1
20
35
15
15
1
20
35
2
s
µs
s
Double Word Program
512 Kbit Block Erase
2
128 Kbit Block Erase
0.8
0.6
45
1.6
1.2
60
0.8
0.6
30
1.6
1.2
50
10
30
40
s
64 Kbit Block Erase
s
Erase all main blocks
s
Program Suspend Latency time
Erase Suspend Latency time
Minimum effective erase time(2)
Program/Erase cycles (per block)
10
µs
µs
µs
30
40
100,000
100,000 cycles
1. TA = –40 to 125 °C, VDD = 2.7 V to 3.6 V, VDDQ = 2.6 V to VDD
.
2. The minimum effective erase time is defined as the minimum time required between the last Erase
Resume command and the next Erase Suspend command for the internal Flash memory Program/Erase
controller to be able to execute its algorithm.
40/87
M58BW16F, M58BW32F
Status Register
5
Status Register
The Status Register provides information on the current or previous Program, Erase or
Block Protect operation. The various bits in the Status Register convey information and
errors on the operation. They are output on DQ7-DQ0.
To read the Status Register the Read Status Register command can be issued. The Status
Register is automatically read after Program, Erase, Block Protect, Program/Erase Resume
commands. The Status Register can be read from any address.
The contents of the Status Register can be updated during an erase or program operation
by toggling the Output Enable or Output Disable pins or by de-activating (Chip Enable, V )
IH
and then reactivating (Chip Enable and Output Enable, V , and Output Disable, V .) the
IL
IH
device.
The Status Register bits are summarized in Table 13: Status Register bits. Refer to Table 13
in conjunction with the following text descriptions.
5.1
Program/Erase Controller Status (bit 7)
The Program/Erase Controller Status bit indicates whether the Program/Erase controller is
active or inactive. When the Program/Erase Controller Status bit is set to ‘0’, the
Program/Erase controller is active; when bit 7 is set to ‘1’, the Program/Erase controller is
inactive.
The Program/Erase Controller Status is set to ‘0’ immediately after a Program/Erase
Suspend command is issued until the Program/Erase Controller pauses. After the
Program/Erase Controller pauses the bit is set to ‘1’.
During Program and Erase operations the Program/Erase Controller Status bit can be polled
to find the end of the operation. The other bits in the Status Register should not be tested
until the Program/Erase controller completes the operation and the bit is set to ‘1’.
After the Program/Erase controller completes its operation the Erase Status (bit 5), Program
Status (bit 4) bits should be tested for errors.
5.2
Erase Suspend Status (bit 6)
The Erase Suspend Status bit indicates that an Erase operation has been suspended and is
waiting to be resumed. The Erase Suspend Status should only be considered valid when the
Program/Erase Controller Status bit is set to ‘1’ (Program/Erase controller inactive); after a
Program/Erase Suspend command is issued the memory may still complete the operation
rather than entering the Suspend mode.
When the Erase Suspend Status bit is set to ‘0’, the Program/Erase controller is active or
has completed its operation; when the bit is set to ‘1’, a Program/Erase Suspend command
has been issued and the memory is waiting for a Program/Erase Resume command.
When a Program/Erase Resume command is issued the Erase Suspend Status bit returns
to ‘0’.
41/87
Status Register
M58BW16F, M58BW32F
5.3
Erase Status (bit 5)
The Erase Status bit can be used to identify if the memory has failed to verify that the block
has erased correctly. The Erase Status bit should be read once the Program/Erase
Controller Status bit is High (Program/Erase controller inactive).
When the Erase Status bit is set to ‘0’, the memory has successfully verified that the block
has erased correctly. When the Erase Status bit is set to ‘1’, the Program/Erase controller
has applied the maximum number of pulses to the block and still failed to verify that the
block has erased correctly.
Once set to ‘1’, the Erase Status bit can only be reset to ‘0’ by a Clear Status Register
command or a hardware reset. If set to ‘1’ it should be reset before a new Program or Erase
command is issued, otherwise the new command will appear to fail.
5.4
Program/Write to Buffer and Program Status (bit 4)
The Program/Write to Buffer and Program Status bit is used to identify a Program failure or
a Write to Buffer and Program failure. Bit 4 should be read once the Program/Erase
Controller Status bit is High (Program/Erase controller inactive).
When bit 4 is set to ‘0’ the memory has successfully verified that the device has
programmed correctly. When bit 4 is set to ‘1’ the device has failed to verify that the data has
been programmed correctly.
Once set to ‘1’, the Program Status bit can only be reset to ‘0’ by a Clear Status Register
command or a hardware reset. If set to ‘1’ it should be reset before a new Program or Erase
command is issued, otherwise the new command will appear to fail.
5.5
PEN Status (bit 3)
The PEN Status bit can be used to identify if a Program or Erase operation has been
attempted when PEN is Low, V .
IL
When bit 3 is set to ‘0’ no Program or Erase operations have been attempted with PEN Low,
V , since the last Clear Status Register command, or hardware reset.
IL
When bit 3 is set to ‘1’ a Program or Erase operation has been attempted with PEN Low, V .
IL
Once set to ‘1’, bit 3 can only be reset by a Clear Status Register command or a hardware
reset. If set to ‘1’ it should be reset before a new Program or Erase command is issued,
otherwise the new command will appear to fail.
42/87
M58BW16F, M58BW32F
Status Register
5.6
Program Suspend Status (bit 2)
The Program Suspend Status bit indicates that a Program operation has been suspended
and is waiting to be resumed. The Program Suspend Status should only be considered valid
when the Program/Erase Controller Status bit is set to ‘1’ (Program/Erase Controller
inactive); after a Program/Erase Suspend command is issued the memory may still
complete the operation rather than entering the Suspend mode.
When the Program Suspend Status bit is set to ‘0’, the Program/Erase controller is active or
has completed its operation; when the bit is set to ‘1’, a Program/Erase Suspend command
has been issued and the memory is waiting for a Program/Erase Resume command.
When a Program/Erase Resume command is issued the Program Suspend Status bit
returns to ‘0’.
5.7
Block Protection Status (bit 1)
The Block Protection Status bit can be used to identify if a Program or Erase operation has
tried to modify the contents of a protected block.
When the Block Protection Status bit is set to ‘0’, no Program or Erase operations have been
attempted to protected blocks since the last Clear Status Register command or hardware
reset; when the Block Protection Status bit is set to ‘1’, a Program or Erase operation has
been attempted on a protected block.
Once set to ‘1’, the Block Protection Status bit can only be reset Low by a Clear Status
Register command or a hardware reset. If set to ‘1’ it should be reset before a new Program
or Erase command is issued, otherwise the new command will appear to fail.
5.8
Bit 0
Reserved bit (set to ‘1’).
43/87
Status Register
M58BW16F, M58BW32F
Definition
Table 13. Status Register bits
Bit
Name
Logic level
’1’
’0’
’1’
’0’
’1’
’0’
’1’
’0’
‘0’
‘1’
’1’
’0’
Ready
Busy
7
6
5
4
3
2
Program/Erase Controller Status
Suspended
Erase Suspend Status
Erase Status
In progress or completed
Erase error
Erase success
Program error
Program Status,
Program success
No program or erase attempted
Program or erase attempted
Suspended
PEN Status bit
Program Suspend Status
In progress or completed
Program/erase on protected block,
abort
’1’
Erase/Program in a protected
block
1
0
’0’
’1’
No operations to protected blocks
Reserved
Reserved
44/87
M58BW16F, M58BW32F
Maximum rating
6
Maximum rating
Stressing the device above the ratings listed in Table 14: Absolute maximum ratings, may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the Numonyx SURE Program
and other relevant quality documents.
Table 14. Absolute maximum ratings
Value
Symbol
Parameter
Unit
Min
Max
TBIAS
TSTG
Temperature under bias
Storage temperature
–40
–55
125
155
°C
°C
VDDQ + 0.6
VIO
Input or output voltage
–0.6
–0.6
V
V
VDDQIN + 0.6
V
DD, VDDQ, VDDQIN Supply voltage
4.2
Table 15. Data retention
Power supply
External temperature
Unit
Unit
VDD
25 °C
20
125 °C
0
V
V
V
7
Years
Years
Years
2.5
2.7
–
–
25
15
45/87
DC and AC parameters
M58BW16F, M58BW32F
7
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristics tables that
follow, are derived from tests performed under the measurement conditions summarized in
Table 16: Operating and AC measurement conditions. Designers should check that the
operating conditions in their circuit match the measurement conditions when relying on the
quoted parameters.
Table 16. Operating and AC measurement conditions
M58BW16F, M58BW32F
Parameter
45 ns
55 ns
Units
Min
Max
Min
Max
Supply voltage (VDD
)
2.7
2.4
–40
3.6
3.6
125
2.5
2.4
–40
3.3
3.6
125
V
V
Input/output supply voltage (VDDQ
Ambient temperature (TA)
Load capacitance (CL)
Clock rise and fall times
Input rise and fall times
Input pulses voltages
)
Grade 3
°C
pF
ns
ns
V
30
30
3
3
3
3
0 to VDDQ
DDQ/2
0 to VDDQ
VDDQ/2
Input and output timing ref. voltages
V
V
Figure 5.
AC measurement input/output waveform
V
DDQ
V
DDQIN
V
/2
/2
DDQ
V
DDQIN
0 V
AI04153
1. VDD = VDDQ
.
Figure 6.
AC measurement load circuit
DEVICE
UNDER
TEST
OUT
C
L
C
includes JIG capacitance
L
AI04154b
46/87
M58BW16F, M58BW32F
DC and AC parameters
(1)(2)
Table 17. Device capacitance
Symbol
Parameter
Test condition
Typ
Max
Unit
CIN
Input capacitance
Output capacitance
VIN = 0 V
6
8
8
pF
pF
COUT
VOUT = 0 V
12
1. TA = 25 °C, f = 1 MHz.
2. Sampled only, not 100% tested.
Table 18. DC characteristics
Symbol
Parameter
Test condition
Min
Typ
Max
Unit
ILI
Input Leakage current
Output Leakage current
0 V≤VIN ≤VDDQIN
0 V ≤VOUT ≤VDDQ
E = VIL, G = VIH,
1
5
µA
µA
ILO
Supply current (Random
Read)
IDD
25
20
50
mA
mA
mA
fadd = 6 MHz
(1)
IDDP-UP
IDDB
Supply current (power-up)
Supply current (Burst
Read)
E = VIL, G = VIH,
fclock = 75 MHz
E = RP =
VDD 0.2 V
(2)
IDD1
Supply current (Standby)
150
30
µA
mA
µA
Supply current (Program
or Erase)
Program, Erase in
progress
IDD2
Supply current
IDD3
E = VIH
150
10
(Erase/Program Suspend)
Supply current (Standby
Disable)
IDD4
VIL
5
mA
V
Input Low voltage
–0.5
0.2VDDQIN
VDDQ + 0.3
Input High voltage (for DQ
lines)
VIH
0.8VDDQIN
V
Input High voltage (for
input only lines)
VIH
VOL
VOH
0.8VDDQIN
3.6
0.1
V
V
V
Output Low voltage
IOL = 100 µA
Output High voltage
CMOS
IOH = –100 µA
VDDQ –0.1
VDD supply voltage (Erase
and Program lockout)
VLKO
2.2
V
1. IDDP-UP is the current needed from the device until RP goes to its logic high level when the power supply is
stable (tVDHPH). See Figure 22and Figure 23.
2. The Standby mode can be disabled by setting the Standby Disable bit (M14) of the Burst Configuration
Register to ‘1’.
47/87
DC and AC parameters
Figure 7.
M58BW16F, M58BW32F
Asynchronous Bus Read AC waveforms
tAVAV
VALID
A0-A19
tAVQV
tEHLX
L
tELQX
tELQV
tAXQX
E
tGLQX
tGLQV
tEHQX
tEHQZ
G
GD
tGHQX
tGHQZ
DQ0-DQ31
OUTPUT
See also Page Read
AI08921b
Figure 8.
Asynchronous Latch Controlled Bus Read AC waveforms
A0-A19
VALID
tLHAX
L
tLHLL
tLLLH
tEHLX
E
tEHQX
tEHQZ
tGLQX
tGLQV
G
tLLQV
tLLQX
tGHQX
GHQZ
DQ0-DQ31
OUTPUT
See also Page Read
AI08922b
48/87
M58BW16F, M58BW32F
DC and AC parameters
Asynchronous Chip Enable Controlled Bus Read AC waveforms
Figure 9.
A0-A19
VALID
tLHAX
L
tEHLX
E
tEHQX
tEHQZ
tGLQX
tGLQV
G
tELQX
tELQV
tGHQX
GHQZ
DQ0-DQ31
OUTPUT
See also Page Read
AI13434
Figure 10. Asynchronous Address Controlled Bus Read AC waveforms
A0-A19
VALID
tLHAX
L
tEHLX
E
tEHQX
tEHQZ
tGLQX
tGLQV
G
tGHQX
GHQZ
tAVQV
DQ0-DQ31
OUTPUT
See also Page Read
AI13435
49/87
DC and AC parameters
M58BW16F, M58BW32F
Table 19. Asynchronous Bus Read AC characteristics
M58BWxxF
Unit
Symbol
Parameter
Test condition
45
55
tAVAV
Address Valid to Address Valid
E = VIL, G = VIL Min
E = VIL, G = VIL Max
45
55
ns
tAVQV Address Valid to Output Valid
45
0
55
0
ns
ns
tAXQX Address Transition to Output Transition L = VIL, G = VIL Min
Chip Enable High to Latch Enable
tEHLX
Min
0
0
ns
Transition
tEHQX Chip Enable High to Output Transition
G = VIL
G = VIL
Min
0
0
ns
ns
tEHQZ Chip Enable High to Output Hi-Z
Max
20
20
(1)
tELQV
Chip Enable Low to Output Valid
G = VIL
Max
45
55
ns
tGHQX Output Enable High to Output Transition
tGHQZ Output Enable High to Output Hi-Z
tGLQV Output Enable Low to Output Valid
tGLQX Output Enable Low to Output Transition
tLHAX Latch Enable High to Address Transition
E = VIL
E = VIL
E = VIL
E = VIL
E = VIL
Min
Max
Max
Min
Min
Min
Min
0
15
15
0
0
15
15
0
ns
ns
ns
ns
ns
ns
ns
5
5
tLHLL
tLLLH
Latch Enable High to Latch Enable Low
Latch Enable Low to Latch Enable High
10
10
10
10
E = VIL
Latch Enable Low to Output Valid
Chip Enable Low to Output Valid
tLLQV
E = VIL, G = VIL Max
45
55
ns
tLLQX Latch Enable Low to Output Transition
tELQX Chip Enable Low to Output Transition
E = VIL, G = VIL Min
L = VIL, G = VIL Min
0
0
0
0
ns
ns
1. Output Enable G may be delayed up to tELQV - tGLQV after the falling edge of Chip Enable E without
increasing tELQV
.
50/87
M58BW16F, M58BW32F
DC and AC parameters
Figure 11. Asynchronous Page Read AC waveforms
A0-A1
A0 and/or A1
tAVQV1
tAXQX
OUTPUT + 1
OUTPUT
DQ0-DQ31
AI03646
(1)
Table 20. Asynchronous Page Read AC characteristics
M58BWxxF
Symbol Parameter Test condition
Unit
45
55
tAVQV1 Address Valid to Output Valid
tAXQX Address Transition to Output Transition
E = VIL, G = VIL
E = VIL, G = VIL
Max
Min
25
0
25
0
ns
ns
1. For other timings see Table 19: Asynchronous Bus Read AC characteristics.
51/87
DC and AC parameters
Figure 12. Asynchronous Write AC waveforms
M58BW16F, M58BW32F
52/87
M58BW16F, M58BW32F
DC and AC parameters
Figure 13. Asynchronous Latch controlled Write AC waveforms
53/87
DC and AC parameters
M58BW16F, M58BW32F
Table 21. Asynchronous Write and Latch controlled Write AC characteristics
M58BWxxF
Symbol
Parameter
Test condition
Unit
45
55
tAVAV
tAVLH
tAVLL
tAVWH
tDVWH
tELLL
Address Valid to Address Valid
Min
45
8
55
8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Address Valid to Latch Enable High
Address Valid to Latch Enable Low
Address Valid to Write Enable High
Data Input Valid to Write Enable High
Chip Enable Low to Latch Enable Low
Chip Enable Low to Write Enable Low
Latch Enable High to Address Transition
Latch Enable Low to Latch Enable High
latch Enable Low to Write Enable High
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
Min
0
0
E = VIL
E = VIL
25
25
0
30
30
0
tELWL
tLHAX
tLLLH
tLLWH
0
0
5
5
10
25
0
10
30
0
E = VIL
tQVVPL Output Valid to PEN Low
tVPHWH PEN High to Write Enable High
0
0
tWHAX
tWHDX
tWHEH
tWHGL
tWHQV
tWHWL
tWLWH
tQVPL
Write Enable High to Address Transition
Write Enable High to Input Transition
Write Enable High to Chip Enable High
Write Enable High to Output Enable Low
Write Enable High to Output Valid
E = VIL
E = VIL
0
0
0
0
0
0
150
165
20
25
0
150
165
20
30
0
Write Enable High to Write Enable Low
Write Enable Low to Write Enable High
Output Valid to Reset/Power-down Low
E = VIL
54/87
M58BW16F, M58BW32F
DC and AC parameters
Figure 14. Synchronous Burst Read, Latch Enable controlled (data valid from ’n’
clock rising edge)
55/87
DC and AC parameters
M58BW16F, M58BW32F
Figure 15. Synchronous Burst Read, Chip Enable controlled (data valid from ’n’
clock rising edge)
56/87
M58BW16F, M58BW32F
DC and AC parameters
Figure 16. Synchronous Burst Read, Valid Address transition controlled (data valid
from ’n’ clock rising edge)
57/87
DC and AC parameters
M58BW16F, M58BW32F
Figure 17. Synchronous Burst Read (data valid from ’n’ clock rising edge)
n
n+1
n+2
n+3
n+4
n+5
K
tKHQV
DQ0-DQ31
Q0
Q1
Q2
Q3
Q4
Q5
tKHQX
SETUP
Burst Read
Q0 to Q3
Note: n depends on Burst X-Latency
AI04408c
1. For set up signals and timings see Synchronous Burst Read.
Figure 18. Synchronous Burst Read - valid data ready output
K
(1)
Output
R
V
V
V
V
V
tRLKH
(2)
AI03649b
1. Valid Data Ready = Valid Low during valid clock edge.
2. V= Valid output.
3. The internal timing of R follows DQ.
58/87
M58BW16F, M58BW32F
DC and AC parameters
Figure 19. Synchronous Burst Read - Burst Address Advance
K
VALID
A0-A19
L
DQ0-DQ31
G
Q0
Q1
Q2
tGLQV
tBLKH
tBHKH
B
AI03650
Figure 20. Clock input AC waveform
tKHKL
K
tKLKH
ai13286
59/87
DC and AC parameters
M58BW16F, M58BW32F
(1)(2)
Table 22. Synchronous Burst Read AC characteristics
M58BWxxF
Unit
Symbol
Parameter
Test condition
45
55
X-Latency = 3
X-Latency = 4
Max
Max
Max
40
56
75
33 MHz
40 MHz
56 MHz
f
Clock frequency
X-Latency = 5 or 6
E = VIL, L = VIL
X-Latency = 3
Min
Min
12
6
13
7
ns
ns
tAVKH Address Valid to Valid Clock Edge
E = VIL, L = VIL
X-Latency = 4, 5 or 6
tKHKL Clock High time
tKLKH Clock Low time
Min
Min
6
6
6
6
ns
ns
Burst Address Advance High to Valid
Clock Edge
tBHKH
E = VIL, G = VIL, L = VIH
E = VIL, G = VIL, L = VIH
Min
Min
Min
8
8
8
8
ns
ns
ns
Burst Address Advance Low to Valid
Clock Edge
tBLKH
L = VIL
X-Latency = 3
12
13
tELKH Chip Enable Low to Valid Clock Edge
tGLQV Output Enable Low to Output Valid
L = VIL
X-Latency = 4, 5 or 6
Min
Max
Min
Min
Min
6
15
5
7
15
5
ns
ns
ns
ns
ns
E = VIL, L = VIH
E = VIL
Valid Clock Edge to Address
Transition
tKHAX
tKHEL Valid Clock Edge to Chip Enable Low
L = VIL
0
0
Valid Clock Edge to Latch Enable
tKHLL
Low
E = VIL
0
0
Valid Clock Edge to Latch Enable
tKHLH
High
E = VIL
Min
Min
Min
0
2
0
2
ns
ns
ns
tKHQX Valid Clock Edge to Output Transition
E = VIL, G = VIL, L = VIH
E = VIL
X-Latency = 3
12
13
Latch Enable Low to Valid Clock
tLLKH
Edge
M58BW16F Min
M58BW32F Min
6
6
5
7
ns
ns
E = VIL
X-Latency = 4, 5 or 6
Valid Data Ready Low to Valid Clock
tRLKH
Edge
E = VIL, G = VIL, L = VIH
E = VIL, G = VIL, L = VIH
Min
6
8
6
8
ns
ns
tKHQV Valid Clock Edge to Output Valid
Max
1. Data output should be read on the valid clock edge.
2. For other timings see Table 19: Asynchronous Bus Read AC characteristics.
60/87
M58BW16F, M58BW32F
Figure 21. Power supply slope specification
DC and AC parameters
Voltage
VDHH
VDH
Time
tVDH
AI14230b
1. Please refer to the application note AN2601.
Table 23. Power supply AC and DC characteristics
Symbol
Description
Min
Max
Unit
(1)
VDH
VDHH
tVDH
Minimum value of power supply (VDD
)
0.9VDD
V
V
Maximum value of power supply (VDD
)
3.6
Time required from power supply to reach the VDH value
300
50000
µs
1. This threshold is 90% of the minimum value allowed to VDD
.
61/87
DC and AC parameters
M58BW16F, M58BW32F
Figure 22. Reset, Power-down and Power-up AC waveforms - Control pins Low
tPHWL
tPHEL
tPHGL
tPHLL
W, E, G, L
Hi-Z
Hi-Z
tPLRZ
R
tPHRH
tPHRH
RP
tVDHPH
tPLPH
VDD, VDDQ
Power-up
Reset
AI14239
Figure 23. Reset, Power-down and Power-up AC waveforms - Control pins toggling
tWLRH
tGLRH
tELRH
tLLRH
tPHWL
tPHEL
tPHGL
tPHLL
W, E, G, L
tPLRZ
Hi-Z
Hi-Z
R
tPHRH
tPHRH
RP
tVDHPH
tPLPH
Reset
VDD, VDDQ
Power-up
AI14240
62/87
M58BW16F, M58BW32F
DC and AC parameters
Table 24. Reset, Power-down and Power-up AC characteristics
Symbol
Parameter
Min
Max
Unit
tPHEL
tPHLL
Reset/Power-down High to Chip Enable Low
Reset/Power-down High to Latch Enable Low
Reset/Power-down High to Output Valid
50
50
ns
ns
ns
ns
ns
ns
ns
µs
ns
ns
ns
ns
ns
(1)
tPHQV
95
tPHWL
tPHGL
tPLPH
Reset/Power-down High to Write Enable Low
Reset/Power-down High to Output Enable Low
Reset/Power-down Low to Reset/Power-down High
Reset/Power-down High to Valid Data Ready High
Supply voltages High to Reset/Power-down High
Reset/Power-down Low to Data Ready High Impedance
Write Enable Low to Data Ready High Impedance
Output Enable Low to Data Ready High Impedance
Chip Enable Low to Data Ready High Impedance
Latch Enable Low to Data Ready High Impedance
50
50
100
(1)
tPHRH
95
tVDHPH
tPLRZ
tWLRH
tGLRH
tELRH
tLLRH
50
80
80
80
80
80
1. This time is tPHEL + tAVQV or tPHEL + tELQV
.
63/87
Package mechanical
M58BW16F, M58BW32F
8
Package mechanical
In order to meet environmental requirements, Numonyx offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of second-level interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
Figure 24. LBGA80 10 × 12 mm - 8 × 10 ball array, 1 mm pitch, bottom view package
outline
D
D1
FD
FE
SD
SE
E
E1 BALL "A1"
ddd
e
e
b
A
A2
A1
JE_ME
1. Drawing is not to scale.
64/87
M58BW16F, M58BW32F
Package mechanical
Table 25. LBGA80 10 × 12 mm - 8 × 10 active ball array, 1 mm pitch, package
mechanical data
millimeters
inches
Min
Symbol
Typ
Min
Max
Typ
Max
A
A1
A2
b
1.60
0.063
0.40
0.016
1.05
0.041
0.60
10.00
7.00
0.024
0.394
0.276
D
–
–
–
–
–
–
–
D1
ddd
E
–
0.15
–
0.006
12.00
9.00
1.00
1.50
1.50
–
–
0.472
0.354
0.039
0.059
0.059
–
–
–
–
–
–
E1
e
–
–
–
–
–
FD
FE
SD
SE
–
–
–
–
–
–
0.50
0.50
0.020
0.020
65/87
Package mechanical
M58BW16F, M58BW32F
Figure 25. PQFP80 - 80 lead plastic quad flat pack, package outline
Ne
A2
N
1
e
b
Nd
D2 D1
D
E2
E1
E
A
c
CP
L1
A1
α
L
QFP-B
1. Drawing is not to scale.
Table 26. PQFP80 - 80 lead plastic quad flat pack, package mechanical data
millimeters
inches
Symbol
Typ
Min
Max
Typ
Min
Max
A
A1
A2
b
3.40
0.134
0.25
2.55
0.30
0.010
0.100
0.012
2.80
3.05
0.45
0.10
0.23
23.45
20.10
–
0.110
0.120
0.018
0.004
0.009
0.923
0.791
–
CP
c
0.13
22.95
19.90
–
0.005
0.903
0.783
–
D
23.20
20.00
18.40
0.80
0.913
0.787
0.724
0.031
0.677
0.551
0.472
0.031
0.063
D1
D2
e
–
–
–
–
E
17.20
14.00
12.00
0.80
16.95
13.90
–
17.45
14.10
–
0.667
0.547
–
0.687
0.555
–
E1
E2
L
0.65
–
0.95
–
0.026
–
0.037
–
L1
α
1.60
0°
7°
0°
7°
N
80
80
Nd
Ne
24
24
16
16
66/87
M58BW16F, M58BW32F
Ordering information
9
Ordering information
Table 27. Ordering information scheme
Example:
M58BW32F
T
4
T
3
T
Device type
M58
Architecture
B = Burst mode
Operating voltage
W = [2.7 V to 3.6 V] VDD range for 45 ns speed class
[2.5 V to 3.3 V] VDD range for 55 ns speed class
[2.4 V to VDD] VDDQ range for 45 ns and 55 ns speed classes
Device function
32F = 32 Mbit (x 32), boot block, burst, 0.11 µm technology
16F = 16 Mbit (x 32), boot block, burst, 0.11 µm technology
Array matrix
T = Top boot
B = Bottom boot
Speed
4 = 45 ns
5 = 55 ns
Package
T = PQFP80
ZA = LBGA80, 1.0 mm pitch
Device grade
3 = Automotive grade certified(1), –40 to 125 °C
Option
Blank = Standard packing
T = Tape & reel packing
F = ECOPACK® package, tape & reel 24 mm packing
1. Qualified & characterized according to AEC Q100 & Q003 or equivalent, advanced screening
according to AEC Q001 & Q002 or equivalent.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (speed, package, etc) or for further information on any aspect
of this device, please contact the Numonyx Sales Office nearest to you.
67/87
Flowcharts
M58BW16F, M58BW32F
Appendix A
Flowcharts
Figure 26. Program flowchart and pseudocode
Start
Program command:
– write 40h, Address AAh
– write Address & Data
Write 40h
(memory enters read status
state after the Program command)
Write Address
& Data
Read Status
Register
do:
– read status register
(E or G must be toggled)
NO
b7 = 1
while b7 = 1
YES
NO
NO
NO
PEN Invalid
Error (1)
If b3 = 1, PEN invalid error:
– error handler
b3 = 0
YES
Program
Error (1)
If b4 = 1, Program error:
– error handler
b4 = 0
YES
Program to Protect
Block Error
If b1 = 1, Program to Protected Block Error:
– error handler
b1 = 0
YES
End
AI03850e
1. If an error is found, the Status Register must be cleared before further P/E operations.
68/87
M58BW16F, M58BW32F
Flowcharts
Figure 27. Program Suspend & Resume flowchart and pseudocode
Start
Write B0h
Program/Erase Suspend command:
– write B0h
– write 70h
Write 70h
do:
Read Status
Register
– read status register
NO
NO
b7 = 1
YES
while b7 = 1
If b2 = 0, Program completed
b2 = 1
YES
Program Complete
Read Memory Array command:
– write FFh
Write FFh
– one or more data reads
from other blocks
Read data from
another block
Program Erase Resume command:
– write D0h
to resume programming
Write D0h
Write FFh
Read Data
– if the program operation completed
then this is not necessary. The device
returns to Read Array as normal
(as if the Program/Erase Suspend
command was not issued).
Program Continues
AI00612b
69/87
Flowcharts
M58BW16F, M58BW32F
Figure 28. Block Erase flowchart and pseudocode
Start
Erase command:
– write 20h, Address 55h
– write Block Address
Write 20h
(A11-A19) & D0h
(memory enters read status
state after the Erase command)
Write Block Address
& D0h
NO
do:
Read Status
– read status register
(E or G must be toggled)
if Erase command given execute
suspend erase loop
Register
Suspend
YES
NO
Suspend
Loop
b7 = 1
while b7 = 1
YES
NO
YES
NO
NO
PEN Invalid
Error (1)
If b3 = 1, PEN invalid error:
– error handler
b3 = 0
YES
Command
Sequence Error
If b4, b5 = 1, Command Sequence error:
– error handler
b4 and b5
= 1
NO
Erase
Error (1)
If b5 = 1, Erase error:
– error handler
b5 = 0
YES
Erase to Protected
Block Error
If b1 = 1, Erase to Protected Block Error:
– error handler
b1 = 0
YES
End
AI08623d
1. If an error is found, the Status Register must be cleared before further Program/Erase operations.
70/87
M58BW16F, M58BW32F
Flowcharts
Figure 29. Erase Suspend & Resume flowchart and pseudocode
Erase cycle in progress
Write B0h
Program/Erase Suspend command
Write 70h
Read Status
Register
Do:
– Read status register while b7 = 1
(b7 = Program/Erase status bit)
NO
NO
b7 = 1
YES
If b6 = 0, Erase is completed
(b6 = Erase Suspend status bit)
b6 = 1
YES
Erase Complete
The device returns to Read mode as normal
(as if the Program/Erase Suspend was not issued).
Write FFh
Write FFh
Read Data
Read Memory Array command:
– Write FFh
– One or more data reads
from other blocks
Read data from
another block
or Program
Write D0h
Program/Erase Resume command:
– Write D0h to resume the Erase
operation
Erase Continues
AI00615c
71/87
Flowcharts
M58BW16F, M58BW32F
Figure 30. Power-up sequence followed by Synchronous Burst Read
Power-up
or Reset
BCR bit 15 = '1'
Asynchronous Read
Set Burst Configuration Register command:
– write 60h
Write 60h command
– write 03h
and BCR on A15-A0
Write 03h with A15-A0
BCR inputs
BCR bit 15 = '0'
BCR bit 14-bit 0 = '1'
Synchronous Read
AI03834
72/87
M58BW16F, M58BW32F
Flowcharts
Figure 31. Command interface and Program/Erase controller flowchart (a)
WAIT FOR
COMMAND
WRITE
READ
ARRAY
NO
90h
YES
READ ELEC.
SIGNATURE
NO
98h
YES
D
READ CFI
NO
70h
YES
READ
STATUS
NO
20h
YES
ERASE
SET-UP
NO
40h
YES
ERASE
COMMAND
ERROR
NO
NO
PROGRAM
SET-UP
D0h
50h
E
YES
YES
A
CLEAR
STATUS
C
D
READ
STATUS
B
AI03835
73/87
Flowcharts
M58BW16F, M58BW32F
Figure 32. Command interface and Program/Erase controller flowchart (b)
E
NO
48h
YES
TP
NO
78h
YES
PROGRAM
SET_UP
F
TP
UNLOCK
SET_UP
NO
60h
YES
NO
FFh
YES
G
SET BCR
SET_UP
NO
03h
YES
D
AI03836
74/87
M58BW16F, M58BW32F
Flowcharts
Figure 33. Command interface and Program/Erase controller flowchart (c)
A
B
ERASE
YES
READY
NO
NO
READ
STATUS
B0h
YES
ERASE
SUSPEND
YES
READY
NO
NO
ERASE
SUSPENDED
READ
STATUS
YES
YES
READ
STATUS
70h
NO
YES
YES
PROGRAM
SET_UP
40h
NO
C
NO
READ
STATUS
READ
ARRAY
D0h
AI03837
75/87
Flowcharts
M58BW16F, M58BW32F
Figure 34. Command interface and Program/Erase controller flowchart (d)
C
B
PROGRAM
YES
READY
NO
NO
READ
STATUS
B0h
YES
PROGRAM
SUSPEND
YES
READY
NO
NO
PROGRAM
SUSPENDED
READ
STATUS
YES
YES
READ
STATUS
70h
NO
NO
YES
READ
STATUS
READ
ARRAY
D0h
AI03838
76/87
M58BW16F, M58BW32F
Flowcharts
Figure 35. Command interface and Program/Erase controller flowchart (e)
F
B
TP
PROGRAM
YES
NO
READ
STATUS
READY
G
B
TP
UNLOCK
YES
NO
READ
STATUS
READY
AI03839
77/87
Common Flash interface (CFI)
M58BW16F, M58BW32F
Appendix B
Common Flash interface (CFI)
The common Flash interface is a JEDEC approved, standardized data structure that can be
read from the Flash memory device. It allows a system software to query the device to
determine various electrical and timing parameters, density information and functions
supported by the memory. The system can interface easily with the device, enabling the
software to upgrade itself when necessary.
When the CFI Query command (RCFI) is issued the device enters CFI Query mode and the
data structure is read from the memory. Table 28, Table 29, Table 30, Table 33 and Table 32
show the addresses used to retrieve the data.
Table 28. Query structure overview
Offset
Sub-section name
Description
00h 0020h
883A
Manufacturer code Numonyx
M58BW16FT (top)
8839
8838
M58BW16FB (bottom)
M58BW32FT (top)
01h
Device code
8837
M58BW32FB (bottom)
10h CFI query identification string
1Bh System interface information
27h Device geometry definition
Command set ID and algorithm data offset
Device timing and voltage information
Flash memory layout
Primary algorithm-specific extended query
table
Additional information specific to the
primary algorithm (optional)
P(h)(1)
Alternate algorithm-specific extended query
table
Additional information specific to the
alternate algorithm (optional)
A(h)(2)
1. Offset 15h defines P which points to the primary algorithm extended query address table.
2. Offset 19h defines A which points to the alternate algorithm extended query address table.
78/87
M58BW16F, M58BW32F
Common Flash interface (CFI)
Instruction
(1)(2)
Table 29. CFI - Query address and data output
Address A0-Amax
Data
10h
11h
12h
13h
14h
51h
52h
59h
"Q"
"R"
"Y"
51h;"Q"
Query ASCII string 52h;"R"
59h; "Y"
03h
00h
Primary vendor:
Command set and control interface ID code
35h (M58BW16F)
39h (M58BW32F)
15h
Primary algorithm extended query address table:
P(h)
16h
17h
18h
19h
1Ah
00h
00h
00h
00h
00h
Alternate vendor:
Command set and control interface ID code
Alternate algorithm extended query address table
1. The x 8 or byte address and the x 16 or word address mode are not available.
2. Query data are always presented on DQ7-DQ0. DQ31-DQ8 are set to '0'.
Table 30. CFI - device voltage and timing specification
Address
Data
Description
Value
A0-Amax
1Bh
1Ch
1Dh
1Eh
1Fh
20h
21h
22h
23h
24h
25h
26h
27h(1)
36h(1)
VDD min
VDD max
Reserved
Reserved
2.7 V
3.6 V
xxxx xxxxh
xxxx xxxxh
04h
2n µs typical for word, double word program
16 µs
1 s
xxxx xxxxh
0Ah
Reserved
2n ms, typical time-out for Erase Block
xxxx xxxxh
xxxx xxxxh
xxxx xxxxh
xxxx xxxxh
xxxx xxxxh
Reserved
Reserved
Reserved
Reserved
Reserved
1. Bits are coded in binary code decimal, bit7 to bit4 are scaled in Volts and bit3 to bit0 in mV.
79/87
Common Flash interface (CFI)
M58BW16F, M58BW32F
Value
Table 31. M58BW16F device geometry definition
Address A0-Amax
Data
Description
27h
28h
29h
2Ah
2Bh
2Ch
2Dh
2Eh
2Fh
30h
31h
32h
33h
34h
15h
03h
00h
00h
00h
02h
1Eh
00h
00h
01h
07h
00h
20h
00h
2n number of bytes memory size
Device interface sync./async.
Organization sync./async.
2 Mbytes
x 32
Async.
Maximum number of byte in multi-byte program = 2n 32 bytes
Bit7-0 = number of Erase Block regions in device
2
Number (n-1) of Erase Blocks of identical size; n=31 31 blocks
Erase Block region information x 256 bytes per Erase
Block (64 Kbytes)
512 Kbits
Number (n-1) of Erase Blocks of identical size; n=8
8 blocks
64 Kbits
Erase Block region information x 256 bytes per Erase
Block (8 Kbytes)
80/87
M58BW16F, M58BW32F
Common Flash interface (CFI)
Description
Table 32. M58BW16F extended query information
Address
Amax-A0
Address offset
Data (hex)
(P)h
35h
36h
37h
38h
39h
50
52
49
P
R
Y
(P+1)h
(P+2)h
(P+3)h
(P+4)h
Query ASCII string - extended table
31h
31h
Major revision number
Minor revision number
Optional feature: (1=yes, 0=no)
bit0, Chip Erase supported (0= no)
bit1, Suspend Erase supported (1=yes)
bit2, Suspend Program supported (1=yes)
bit3, Lock/Unlock supported (0=no)
bit4, Queue Erase supported (0=no)
bit5, Instant individual block locking (0=no)
bit6, Protection bits supported (0=no)
bit7, Page Read supported (1=yes)
bit8, Synchronous Read supported (1=yes)
Bit9, Reserved
(P+5)h
3Ah
86h
(P+6)h
(P+7)h
(P+8)h
3Bh
3Ch
3Dh
01h
00h
00h
Synchronous Read supported
Function allowed after Suspend:
(P+9)h
3Eh
01h
Program allowed after Erase Suspend (1=yes)
Bit 7-1 reserved for future use
(P+A)h-(P+D)h
(P+13)h-(P+40)h
(P+41)h
3Fh-42h
48h-7Fh
80h
Reserved
Reserved
xxxx xxxxh Unique device ID - 1 (16 bits)
xxxx xxxxh Unique device ID - 2 (16 bits)
xxxx xxxxh Unique device ID - 3 (16 bits)
xxxx xxxxh Unique device ID - 4 (16 bits)
(P+42)h
81h
(P+43)h
82h
(P+44)h
83h
81/87
Common Flash interface (CFI)
M58BW16F, M58BW32F
Value
Table 33. M58BW32F device geometry definition
Address A0-Amax
Data
Description
27h
28h
29h
2Ah
2Bh
2Ch
2Dh
2Eh
2Fh
30h
31h
32h
33h
34h
35h
36h
37h
38h
15h
03h
00h
00h
00h
02h
1Eh
00h
00h
01h
07h
00h
20h
00h
03h
00h
40h
00h
2n number of bytes memory size
Device interface sync./async.
Organization sync./async.
4 Mbytes
x 32
Async.
Maximum number of byte in multi-byte program = 2n 32 bytes
Bit7-0 = number of Erase Block regions in device
3
Number (n-1) of Erase Block regions of identical size;
n = 31
62 blocks
Erase Block region information x 256 bytes per Erase
Block (64 Kbytes)
512 Kbits
Number (n-1) of Erase blocks of identical size; n = 8 8 blocks
Erase Block region information x 256 bytes per Erase
Block (8 Kbytes)
64 Kbits
Number (n-1) of Erase Block of identical size; n = 8
8 blocks
Erase Block region information x 256 bytes per Erase
block (16 Kbytes)
128 Kbits
82/87
M58BW16F, M58BW32F
Common Flash interface (CFI)
Description
Table 34. M58BW32F extended query information
Address
Amax-A0
Address offset
Data (hex)
(P)h
39h
3Ah
3Bh
3Ch
3Dh
50
52
49
P
R
Y
(P+1)h
(P+2)h
(P+3)h
(P+4)h
Query ASCII string - extended table
31h
31h
Major revision number
Minor revision number
Optional feature: (1=yes, 0=no)
bit0, Chip Erase supported (0= no)
bit1, Suspend Erase supported (1=yes)
bit2, Suspend Program supported (1=yes)
bit3, Lock/Unlock supported (0=no)
bit4, Queue Erase supported (0=no)
bit5, Instant individual block locking (0=no)
bit6, Protection bits supported (0=no)
bit7, Page Read supported (1=yes)
bit8, Synchronous Read supported (1=yes)
Bit 9, Reserved
(P+5)h
3Eh
86h
(P+6)h
(P+7)h
(P+8)h
3Fh
40h
41h
01h
00h
00h
Synchronous Read supported
Function allowed after Suspend:
(P+9)h
42h
01h
Program allowed after Erase Suspend (1=yes)
Bit 7-1 reserved for future use
(P+A)h-(P+D)h
43h-46h
Reserved
Reserved
(P+13)h-(P+40)h 4Ch-7Fh
(P+41)h
(P+42)h
(P+43)h
(P+44)h
80h
81h
82h
83h
xxxx xxxxh Unique device ID - 1 (16 bits)
xxxx xxxxh Unique device ID - 2 (16 bits)
xxxx xxxxh Unique device ID - 3 (16 bits)
xxxx xxxxh Unique device ID - 4 (16 bits)
83/87
Common Flash interface (CFI)
M58BW16F, M58BW32F
Value
Table 35. Protection register information
Data
Address
A0-Amax
Instruction
M58BW32FT
M58BW32FB
M58BW32FT
M58BW32FB
M58BW16FT
M58BW16FB
M58BW16FT
M58BW16FB
Number of Protection
register field in JEDEC
ID space, Block region
information X256 bytes
0x02
0x02
0x01
0x01
2 x 64 Kb
2 x 64 Kb
1 x 128 Kb
1 x 128 Kb
(P+E)h
0x01
0xFE
0x01
0xFE
Protection field: this field
describes user-available
OTP Protection Register
bytes.
Bits 7-0=physical low
address
(P+F)h
(P+10)h
(P+11)h
-
-
-
-
-
-
0x01
0xFE
0x01
0xFE
0x0
0x0
0x0
0x0
Bits 15-8=physical high
address
Bits 23-16=’n’,
2n=Factory pre-
0x12
0x12
0x12
0x12
2 x 64 Kb
2 x 64 Kb
1 x 128 Kb
1 x 128 Kb
x256
programmed bytes
Bits 31-24=’n’, 2n=user
programmable bytes
84/87
M58BW16F, M58BW32F
Block protection
Appendix C
Block protection
OTP protection
The OTP protection is an user-enabled feature that permanently protects specific blocks, so
called “OTP blocks”, against modify operations (program/erase). It is available:
●
on one specific 128-kbit parameter block in the M58BW32F- block 1 (01000h-01FFFh)
for bottom devices or block 72 (FE000h-FEFFFh) for top devices
●
on two specific 64-kbit parameter blocks in the M58BW16F- block 2 and 3 (01000h-
01FFFh) for bottom devices or block 36 and 35 (7E000h-7EFFFh) for top devices.
The default state is unprotected. However, once the protection has been enabled, it is
impossible to disable it and the OTP blocks will remain “modify protected” for ever.
Obviously, this information is stored in internal non volatile registers.
Activation sequence
If the user wants to make the OTP protection effective on a part, he has to issue the Lock
OTP protection command.
The Lock OTP protection requires 2 write cycles:
●
write (ADD=000AAh, DATA=49h) - Lock OTP Protection command 1
●
write (ADD=00003h, DATA=0000 0000h) - Lock OTP Protection command 2
This sequence of commands has to be given with the Tuning Protection unlocked (if this
protection is enabled on the part) and with Write Protect Enable WP_N=’1’. The user can
check its execution polling on the SR in the same way as a normal Program Word
command.
The program duration lasts about 35 µs like for a standard Program Word command. It is
also possible to detect the end of the operation by polling the Status Register.
Any Erase attempt returns A3h in the Status Register while any Program attempt returns
93h.
Once the first write cycle of the Lock OTP protection command is issued, a wrong address
on second write cycle will cause the activation sequence to fail. The Status Register allows
detecting this event and its value is then B1h (invalid sequence).
As a consequence, the protection is not active and the sequence must be restarted.
The Lock OTP Protection command cannot be suspended.
85/87
Revision history
M58BW16F, M58BW32F
10
Revision history
Table 36. Document revision history
Date
Revision
Changes
09-Jun-2006
1
Initial release.
PEN signal renamed as PEN and Program/Erase Enable (PEN)
V
modified.
Continuous burst and wrap options are not available, X-Latencies 7
and 8 removed (see Table 8: Burst Configuration Register and
Table 9: Burst type definition). Notes removed below Table 8.
tWHQV timing modified in Table 21: Asynchronous Write and Latch
controlled Write AC characteristics.
IDD max modified and IDD4 added to Table 18: DC characteristics.
tAXQX modified in Table 20: Asynchronous Page Read AC
characteristics.
23-Nov-2006
2
Read access specified in Asynchronous Bus Read and
Synchronous Burst Read.
tAVKH and tALKH added and tKHQV for 55 ns modified in Table 22:
Synchronous Burst Read AC characteristics. Figure 9, Figure 10,
Figure 18 and Figure 19 added. Double Word Program max
modified and Minimum effective erase time added to Table 12:
Program, Erase times and endurance cycles.
All Asynchronous Bus Read AC characteristics brought together in
Table 19: Asynchronous Bus Read AC characteristics. tLLEL
removed from Table 19 and Figure 7. Appendix B: Common Flash
interface (CFI) modified.
Table 8: Burst Configuration Register, Table 30: CFI - device
voltage and timing specification and Table 33: M58BW32F device
geometry definition updated.
Minimum values for tKHKL, tKLKH and tLLKH modified in Table 22:
Synchronous Burst Read AC characteristics.
tPHLL, tPHRH, tVDHPH, tWLRH, tGLRH, tELRH, and tLLRH added in
Table 24: Reset, Power-down and Power-up AC characteristics.
tPLRH removed from Table 24.
01-Oct-2007
3
Modified Figure 22: Reset, Power-down and Power-up AC
waveforms - Control pins Low and Section 3.3.3: X-Latency bits
(M13-M11).
Appendix C: Block protection, Figure 23: Reset, Power-down and
Power-up AC waveforms - Control pins toggling and Table 35:
Protection register information added.
Updated mechanical data of the LBGA package and Table 8: Burst
Configuration Register, Table 12: Program, Erase times and
endurance cycles, Table 18: DC characteristics, Table 21:
Asynchronous Write and Latch controlled Write AC characteristics,
Table 22: Synchronous Burst Read AC characteristics, and
Section 2.7: Reset/Power-down (RP).
15-Jan-2008
19-Mar-2008
4
5
Added Figure 21: Power supply slope specification and Table 23:
Power supply AC and DC characteristics.
Minor text changes.
Applied Numonyx branding.
86/87
M58BW16F, M58BW32F
Please Read Carefully:
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH NUMONYX™ PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN NUMONYX'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NUMONYX ASSUMES NO LIABILITY
WHATSOEVER, AND NUMONYX DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF
NUMONYX PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
Numonyx products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility
applications.
Numonyx may make changes to specifications and product descriptions at any time, without notice.
Numonyx, B.V. may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the
presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied,
by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Numonyx reserves
these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
Contact your local Numonyx sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Numonyx literature may be obtained by
visiting Numonyx's website at http://www.numonyx.com.
Numonyx StrataFlash is a trademark or registered trademark of Numonyx or its subsidiaries in the United States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 11/5/7, Numonyx, B.V., All Rights Reserved.
87/87
相关型号:
©2020 ICPDF网 联系我们和版权申明