ISD5008PYI [NUVOTON]

3V, SINGLE-CHIP VOICE RECORD/PLAYBACK DEVICE 4- TO 8-MINUTES DURATION;
ISD5008PYI
型号: ISD5008PYI
厂家: NUVOTON    NUVOTON
描述:

3V, SINGLE-CHIP VOICE RECORD/PLAYBACK DEVICE 4- TO 8-MINUTES DURATION

文件: 总54页 (文件大小:1510K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ISD5008  
ISD5008  
3V, SINGLE-CHIP  
VOICE RECORD/PLAYBACK DEVICE  
4- TO 8-MINUTES DURATION  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 1 -  
ISD5008  
Table of Contents  
1
2
3
4
5
6
GENERAL DESCRIPTION............................................................................................................... 3  
FEATURES ...................................................................................................................................... 4  
BLOCK DIAGRAM............................................................................................................................ 5  
PIN CONFIGURATION .................................................................................................................... 6  
PIN DESCRIPTION.......................................................................................................................... 7  
FUNCTIONAL DESCRIPTION....................................................................................................... 10  
6.1  
DETAILED DESCRIPTION .........................................................................................................................10  
Speech/Sound Quality....................................................................................................................10  
Duration.........................................................................................................................................10  
Flash Storage.................................................................................................................................10  
Microcontroller Interface ..............................................................................................................10  
Memory Architecture .....................................................................................................................11  
Programming.................................................................................................................................11  
ANALOG FUNCTIONAL PINS ....................................................................................................................12  
Mic+, Mic-.....................................................................................................................................12  
ANA IN (Analog Input) ..................................................................................................................12  
AUX IN (Auxillary Input)...............................................................................................................13  
ACAP (AGC Capacitor).................................................................................................................14  
INTERNAL FUNCTIONAL BLOCKS ............................................................................................................15  
SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION ..............................................................................19  
Message Cuing...............................................................................................................................19  
Opcodes .........................................................................................................................................20  
Power-Up Sequence.......................................................................................................................21  
SPI Port .........................................................................................................................................22  
SPI Control Register......................................................................................................................22  
OPERATIONAL MODES DESCRIPTION ......................................................................................................29  
Feed Through Mode.......................................................................................................................29  
Call Record....................................................................................................................................32  
Memo Record.................................................................................................................................33  
Memo and Call Playback...............................................................................................................33  
6.1.1  
6.1.2  
6.1.3  
6.1.4  
6.1.5  
6.1.6  
6.2  
6.2.1  
6.2.2  
6.2.3  
6.2.4  
6.3  
6.4  
6.4.1  
6.4.2  
6.4.3  
6.4.4  
6.4.5  
6.5  
6.5.1  
6.5.2  
6.5.3  
6.5.4  
7
TIMING DIAGRAMS....................................................................................................................... 36  
8
ABSOLUTE MAXIMUM RATINGS [1] ............................................................................................. 38  
8.1  
OPERATING CONDITIONS ........................................................................................................................39  
9
ELECTRICAL CHARACTERISTICS .............................................................................................. 40  
9.1  
9.2  
GENERAL PARAMETERS..........................................................................................................................40  
TIMING PARAMETERS .............................................................................................................................41  
ANALOG PARAMETERS ...........................................................................................................................42  
SPI AC PARAMETERS (1) .........................................................................................................................47  
TYPICAL APPLICATION CIRCUIT ............................................................................................ 48  
9.3  
9.4  
10  
11  
PACKAGE DRAWING AND DIMENSIONS ............................................................................... 49  
11.1 28-LEAD LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1...........................49  
11.2 28-LEAD 600 MIL PLASTIC DUAL INLINE PACKAGE (PDIP) ....................................................................50  
11.3 28-LEAD 300 MIL PLASTIC SMALL OUTLINE IC (SOIC) .........................................................................51  
12  
13  
ORDERING INFORMATION ...................................................................................................... 52  
VERSION HISTORY................................................................................................................... 53  
Publication Release Date: Oct 31 2008  
- 2 -  
Revision 1.2  
ISD5008  
1
GENERAL DESCRIPTION  
The ISD5008 ChipCorder product is a 3V fully-integrated, single-chip solution which provides seamless  
integration of enhanced voice record and playback features for digital cellular phones (GSM, CDMA,  
TDMA, PDC, and PHS), automotive communications, GPS/navigation systems, and portable  
communication products. This low-power, 3-volt device enables customers to quickly and easily  
integrate 4 to 8 minutes of voice storage features such as one-way or two-way (full duplex) call record,  
voice memo record, and call screening/answering machine functionality.  
Like other ChipCorder products, the ISD5008 integrates the sampling clock, anti-aliasing and  
smoothing filters, and the Multi-Level Storage (MLS) array into a single chip. For enhanced voice  
features, the ISD5008 eliminates external circuitry mostly by also integrating automatic gain control  
(AGC), a power amplifier/speaker driver, volume control, summing amplifiers, analog switches, and a  
car kit interface. Input level adjustable amplifiers are also implemented, providing a flexible interface for  
multiple applications.  
Duration/sample rate selection is accomplished via software, allowing customers to optimize quality  
and duration for various features within the same end product.  
The ISD5008 device is designed for use in a microprocessor- or microcontroller-based system.  
Address, control, and duration selection are accomplished through a Serial Peripheral Interface (SPI)  
or Microwire Serial Interface to minimize pin count.  
Recordings are stored into on-chip non-volatile memory cells, providing zero-power message storage.  
This unique, single-chip solution is made possible through Nuvoton’s patented MLS technology. Voice  
and audio signals are stored directly into solid-state memory in their natural, uncompressed form,  
providing superior quality voice and music reproduction.  
Publication Release Date: Oct 31 2008  
- 3 -  
Revision 1.2  
ISD5008  
2
FEATURES  
Fully-Integrated Solution  
Single-chip voice record/playback solution  
Integrated sampling clock, anti-aliasing and smoothing filters, and MLS array  
Integrated analog features such as automatic gain control (AGC), audio gating switches, speaker  
driver, summing amplifiers, volume control, and AUX IN/AUX OUT interface (e.g., for car kits)  
Low-Power Consumption  
Single +3 volt supply  
Operating current:  
o
o
o
ICC_Play = 15 mA (typical)  
ICC_Rec = 25 mA (typical)  
ICC_Feedthru = 12 mA (typical)  
Standby current:  
o
ISB = 1 µA (typical)  
Power consumption controlled by SPI or Microwire control register  
Most stages can be individually powered down for minimum power consumption  
Enhanced Voice Features  
One or two-way (full duplex) conversation record (record signal summation)  
One- or two-way (full duplex) message playback (while on a call)  
Voice memo record and playback  
Private call screening  
Answering machine  
Personalized outgoing message (given caller ID information from host chip set)  
Private call announce while on call (given CIDCW information from host chip set)  
Easy-to-Use and Control  
No compression algorithm development required  
User-selectable sampling rates of 8.0 kHz, 6.4 kHz, 5.3 kHz, or 4.0 kHz  
Microcontroller SPI or Microwire™ Serial Interface  
Fully addressable to handle multiple messages  
High Quality Solution  
High quality voice and music reproduction  
Standard 100-year message retention (typical)  
100,000 record cycles (typical)  
Options  
Available in die, PDIP, SOIC, TSOP, and chip scale packaging (CSP)  
Compact µBGA chip scale package available for portable applications  
Temperature : Commercial, Extended and Industrial  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 4 -  
ISD5008  
3
BLOCK DIAGRAM  
FTHRU  
6dB  
CHIP SET  
ANA OUT+  
INP  
FILTO  
SUM1  
ANA  
OUT  
AMP  
SUM1  
Summing  
AMP  
MICROPHONE  
ANA OUT-  
INP  
SUM2  
Summing  
AMP  
MIC+  
MIC IN  
VOL  
FILTO  
AGC  
1
SUM1 MUX  
Low Pass  
Filter  
SUM2  
SUM1  
ARRAY  
(AOPD)  
MIC -  
1
ANA IN  
(AGPD)  
2
1
3
AGCCAP  
S1M0  
S1M1  
1
(FLPD)  
(
)
2
AOS0  
(FLS0)  
FILTO  
ANA IN  
ARRAY  
AUX IN  
S2M0  
S2M1  
AOS1  
( )  
(
)
AOS2  
CAR KIT  
AUX IN  
1
(INS0)  
AUX IN  
AMP  
1
Internal  
Clock  
Multilevel  
Storage Array  
(AXPD)  
CAR KIT  
AUX OUT  
2
AUX  
OUT  
AMP  
AXG0  
S1S0  
S1S1  
(
)
(
)
FILTO  
VOL  
2
AXG1  
2
FLD0  
(
)
FLD1  
XCLK  
SPEAKER  
SP+  
SUM2  
CHIP SET  
ANA IN  
Spkr.  
AMP  
ANA IN  
ANA IN  
AMP  
SP-  
1
2
SUM1  
INP  
(AIPD)  
2
OPS0  
OPS1  
Volume  
Control  
(
)
OPA0  
OPA1  
(
)
ANA IN  
SUM2  
2
AIG0  
AIG1  
3
1
(
)
(VLPD)  
VOL0  
VOL1  
( )  
2
VOL2  
VLS0  
VLS1  
(
)
Power Conditioning  
Device Control  
SCLK SS MOSI MISO INT RAC  
VCCA VSSA VSSA VSSA VSSD VSSD VCCD VCCD  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 5 -  
ISD5008  
4
PIN CONFIGURATION  
SCLK  
SS  
1
2
3
4
28  
27  
26  
25  
VCCD  
VCCD  
XCLK  
INT  
MOSI  
MISO  
VSSD  
VSSD  
NC  
5
6
7
24  
23  
22  
RAC  
VSSA  
NC  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
NC  
VSSA  
RAC  
INT  
XCLK  
VCCD  
VCCD  
SCLK  
SS  
MOSI  
MISO  
VSSD  
VSSD  
NC  
NC  
2
AUX OUT  
AUX IN  
ANA IN  
VCCA  
SP+  
VSSA  
3
4
MIC+  
VSSA  
MIC-  
8
9
21  
20  
19  
NC  
5
AUX OUT  
AUX IN  
6
7
10  
8
SP-  
ANA OUT+  
ANA OUT-  
11  
12  
18  
17  
ANA IN  
VCCA  
9
ACAP  
ANA OUT-  
ANA OUT+  
MIC-  
MIC+  
VSSA  
10  
11  
12  
13  
14  
ACAP  
SP-  
13  
14  
16  
15  
SP+  
VSSA  
TSOP  
PDIP/SOIC  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 6 -  
ISD5008  
5
PIN DESCRIPTION  
PIN NAME PDIP/SOIC TSOP  
FUNCTION  
SCLK  
1
8
Serial Clock: The SCLK is the clock input to the ISD5008.  
Generated by the master microcontroller, the SCLK  
synchronizes data transfers in and out of the device through the  
MISO and MOSI lines.  
2
3
9
Slave Select: This input, when LOW, selects the device.  
SS  
MOSI  
10  
Master Out Slave In: MOSI is the serial data input to the  
ISD5008 device. The master microcontroller places data to be  
clocked into the ISD5008 device on the MOSI line one-half  
cycle before the rising edge of SCLK. Data is clocked into the  
device with LSB (Least Significant Bit) first.  
MISO  
4
11  
Master In Slave Out: MISO is the serial data output of the  
ISD5008. Data is clocked out on the falling edge of SCLK. This  
output goes into a high-impedance state when the device is not  
selected. Data is clocked out of the device with LSB first.  
VSSD / VSSA  
5, 6 /  
12, 13 /  
Ground: The ISD5008 utilizes separate analog and digital  
ground busses. The analog ground (VSSA) pins should be tied  
together as close to the package as possible and connected  
through a low-impedance path to power supply ground. The  
digital ground (VSSD) pin should be connected through a  
separate low-impedance path to power supply ground. These  
ground paths should be large enough to ensure that the  
impedance between the VSSA pins and the VSSD pins is less than  
3 Ω. The backside of the die is connected to VSSD through the  
substrate resistance. In a chip-on-board design, the die attach  
9, 15, 23  
2, 15,  
22  
area must be connected to VSSD  
.
MIC+ / MIC-  
8 / 10  
16 / 17  
Microphone +/: The microphone inputs transfer the voice  
signal to the on-chip AGC preamplifier or directly to the ANA  
OUT MUX, depending on the selected path. The AGC circuit  
has a range of 45dB in order to deliver a nominal 694 mVp-p  
into the storage array from a typical electret microphone output  
of 2 to 20 mVp-p. The direct path to the ANA OUT MUX has a  
gain of 6dB so a 208 mVp-p signal across the differential  
microphone inputs would give 416 mVp-p across the ANA OUT  
pins. The input impedance is typically 10 kΩ.  
ANAOUT+ /  
ANAOUT-  
11 / 12  
18 / 19  
Analog Outputs: These differential outputs are designed to  
match to the microphone input of the telephone chip set. It is  
designed to drive a minimum of 5 kΩ between the ―+‖ and ―–‖  
pins to a nominal voltage level of 700 mVp-p. Both pins have  
DC bias of approximately 1.2 VDC. The AC signal is  
superimposed upon this analog ground voltage. These pins can  
be used single-ended, getting only half the voltage. Do NOT  
ground the unused pin.  
Publication Release Date: Oct 31 2008  
- 7 -  
Revision 1.2  
ISD5008  
PIN NAME PDIP/SOIC TSOP  
FUNCTION  
ACAP  
13  
20  
AGC Capacitor: This pin provides the capacitor connection for  
setting the parameters of the microphone AGC circuit. It should  
have a 4.7 µF capacitor connected to ground. It cannot be  
floating. This is because the capacitor is also used in the  
playback mode for the AutoMute circuit. This circuit reduces the  
amount of noise present in the output during quiet pauses.  
Tying this pin to ground gives maximum gain, or to VCCA gives  
minimum gain for the AGC amplifier but will cancel the  
AutoMute function.  
SP- / SP+  
14 / 16  
21 / 23  
Speaker Outputs: This differential speaker output is designed  
to drive an 8Ω speaker up to a maximum power of 23.5 mW.  
This stage has two selectable gains, 1.32 and 1.6, which can be  
chosen through the configuration registers. These pins are  
biased to approximately 1.2 VDC and, if used single-ended,  
must be capacitively coupled to their load. Do NOT ground the  
unused pin.  
VCCA / VCCD  
17 /  
24 /  
6, 7  
Power Supplies: To minimize noise, the analog and digital  
circuits in the ISD5008 device uses separate power busses.  
These +3V busses lead to separate pins. Tie the VCCD pins  
together as close as possible and decouple both supplies as  
near to the package as possible  
27, 28  
ANA IN  
18  
25  
Analog Input: The ANA IN pin is the analog input from the  
telephone chip set. It can be switched (by the SPI bus) to the  
speaker output, the array input or to various paths. This pin is  
designed to accept a nominal 1.11 Vp-p when at its minimum  
gain (6dB) setting. See Table 4. There is additional gain  
available in 3dB steps controlled from the SPI bus, if required,  
up to 15dB.  
AUX IN  
19  
20  
26  
27  
Auxiliary Input: The AUX IN is an additional audio input to the  
ISD5008, such as from the microphone circuit in a mobile  
phone ―car kit.‖ This input has a nominal 700 mVp-p level at its  
minimum gain setting (0dB). See Table 5. Additional gain is  
available in 3 dB steps (controlled by the SPI bus) up to 9dB.  
AUX OUT  
Auxiliary Output: The AUXOUT is an additional audio output  
pin, to be used, for example, to drive the speaker circuit in a  
―car kit.‖ It drives a minimum load of 5 kΩ and up to a maximum  
of 1 Vp-p. The AC signal is superimposed on approximately 1.2  
VDC bias and must be capacitively coupled to the load.  
Publication Release Date: Oct 31 2008  
- 8 -  
Revision 1.2  
ISD5008  
PIN NAME PDIP/SOIC TSOP  
FUNCTION  
RAC  
24  
3
Row Address Clock: RAC is an open drain output pin that  
marks the end of a row. At the 8 kHz sampling frequency, the  
duration of this period is 200 ms. There are 1,200 rows of  
memory in the ISD5008 devices. RAC stays HIGH for 175 ms  
and stays LOW for the remaining 25 ms before it reaches the  
end of the row.  
At the 8 kHz sampling frequency, the RAC pin remains HIGH  
for 109.38 µsec and stays LOW for 15.63 µsec under the  
Message Cueing mode. See Table 15 Timing Parameters for  
RAC timing information at other sample rates. When a record  
command is first initiated, the RAC pin remains HIGH for an  
extra TRACLO period, to load sample and hold circuits internal to  
the device. The RAC pin can be used for message  
management techniques.  
A pull-up resistor is required to connect this pin to other device.  
25  
4
INT  
Interrupt: INT is an open drain output pin. The ISD5008  
interrupt pin goes LOW and stays LOW when an Overflow  
(OVF), or End of Message (EOM) marker or Message Cueing is  
detected. The interrupt is cleared the next time an SPI cycle is  
completed. The interrupt status can be read by a RINT  
instruction that will give one of the two flags out the MISO line.  
A pull-up resistor is required to connect this pin to other device.  
OVF Flag. The overflow flag indicates that the end of the  
ISD5008’s analog memory has been reached during a record or  
playback operation.  
EOM Flag. The end of message flag is set only during  
playback, when an EOM is found. There are eight possible  
EOM markers per row.  
XCLK  
26  
5
External Clock: The external clock input has an internal pull-  
down device. Normally, the ISD5008 is operated at one of four  
internal rates selected for its internal oscillator by the Sample  
Rate Select bits. If greater precision is required, the device can  
be clocked through the XCLK pin as described in Table 2.  
Because the anti-alising and smoothing filters track the Sample  
Rate Select bits, one must, for optimum performance, change  
the external clock AND the Sample Rate Configuration bits to  
one of the four values properly to set the filters to the correct  
cutoff frequency as described in Table 1. The duty cycle on the  
input clock is not critical, as the clock is immediately divided by  
two internally. If the XCLK is not used, this input should be  
connected to VSSD  
.
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 9 -  
ISD5008  
6
FUNCTIONAL DESCRIPTION  
6.1 DETAILED DESCRIPTION  
6.1.1 Speech/Sound Quality  
The ISD5008 ChipCorder product can be configured via software to operate at 4.0, 5.3, 6.4, or 8.0 kHz  
sampling frequency, allowing the user a choice of speech quality options. Increasing the duration  
decreases the sampling frequency and bandwidth, which affects sound quality. Table 1 shows the  
relationship between sampling frequency, duration and filter pass band.  
The speech samples are stored directly into on-chip non-volatile memory without the digitization and  
compression associated with other solutions. Direct analog storage provides a natural sounding  
reproduction of voice, music, tones, and sound effects not available with most solid-state solutions.  
6.1.2 Duration  
To meet end system requirements, the ISD5008 device is a single-chip solution which provides from 4  
to 8 minutes of voice record and playback, depending on the sample rates defined by customer  
software.  
TABLE 1: SAMPLING RATE / DURATION / FILTER EDGE  
Sample Rate  
(kHz)  
Duration  
(Minutes)  
4.0  
Filter Pass Band*  
(kHz)  
8
3.4  
2.7  
2.3  
1.7  
6.4  
5.3  
4
5.0  
6.0  
8.0  
*
-3dB point  
6.1.3 Flash Storage  
One of the benefits of Nuvoton’s ChipCorder technology is the use of on-chip nonvolatile memory,  
which provides zero- power message storage. The message is retained for up to 100 years (typically)  
without power. In addition, the device can be re-recorded over 100,000 times (typically).  
6.1.4 Microcontroller Interface  
A four-wire (SCLK, MOSI, MISO, SS) SPI interface is provided for ISD5008 control, addressing  
functions, and sample rate selection. The ISD5008 is configured to operate as a peripheral slave  
device with a microcontroller-based SPI bus interface. Read/Write access to all the internal registers  
occurs through this SPI interface. An interrupt signal (INT) and internal read-only Status Register are  
provided for handshake purposes.  
Publication Release Date: Oct 31 2008  
- 10 -  
Revision 1.2  
ISD5008  
6.1.5 Memory Architecture  
The ISD5008 device contains a total of 1,920K Flash memory cells, which is organized as 1,200 rows  
of 1,600 cells each. The duration is counted according to the number of rows, while the row number is  
represented by the related 16 address bits of MOSI as described in the SPI section.  
6.1.6 Programming  
The ISD5008 device is also ideal for playback-only applications, where single- or multiple-message  
playback is controlled through the SPI port. Once the desired message configuration is created,  
duplicates can easily be generated via a third-party programmer. For more information on available  
application tools and programmers, please see the Nuvoton website at www.Nuvoton-usa.com.  
TABLE 2: EXTERNAL CLOCK INPUT  
Duration  
(Minutes)  
Sample Rate  
(kHz)  
Required Clock  
(kHz)  
4
5
6
8
8.0  
6.4  
5.3  
4.0  
1024  
819.2  
682.7  
512  
TABLE 3: INTERNAL SAMPLING RATE / FILTER EDGE  
FLD1 FLD0  
Sample  
Rate (kHz)  
Filter Pass Band  
(kHz)  
0
0
1
1
0
1
0
1
8
3.4  
2.7  
2.3  
1.7  
6.4  
5.3  
4
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 11 -  
ISD5008  
6.2 ANALOG FUNCTIONAL PINS  
6.2.1 Mic+, Mic-  
VCC  
1.5 k  
+
220  
F
Internal to the device  
MIC+  
1.5 k  
Ra = 10 k  
CCOUP = 0.1  
F
Electret  
Microphone  
WM-54B  
Panasonic  
10 k  
0.1  
F
1.5 k  
MIC  
1
NOTE: fCUTOFF=  
2RaCCOUP  
FIGURE 1: MICROPHONE INPUT  
6.2.2 ANA IN (Analog Input)  
Internal to the device  
Rb  
Gain  
Setting  
Resistor Ratio  
(Rb/Ra) k/k  
Gain Gain 2  
(dB)  
CCOUP = 0.1  
F
Ra  
ANA IN  
Input  
00  
01  
63.9/102  
77.9/88.1  
92.3/73.8  
106/60  
0.625  
0.88  
1.25  
1.77  
-4.1  
-1.1  
1.9  
10  
ANA IN  
Input Apmlifier  
11  
4.9  
1
NOTE: fCUTOFF=  
2RaCCOUP  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 12 -  
ISD5008  
FIGURE 2: ANA IN INPUT MODES  
TABLE 4: ANA IN AMPLIFIER GAIN SETTINGS  
Setting (1) 0TLP Input  
CFG0  
Gain (2)  
Array In/Out  
VPP  
Speaker Out  
(3)  
(4)  
VPP  
VPP  
AIG1  
AIG0  
6 dB  
9 dB  
.694  
.694  
.694  
.694  
1.11  
.785  
.555  
.393  
0
0
1
1
0
1
0
1
.625  
.883  
2.22  
2.22  
2.22  
2.22  
12 dB  
15 dB  
1.250  
1.767  
NOTES:  
1. Gain from ANA IN to SP+ / _  
2. Gain from ANA In to ARRAY IN  
3. 0TLP Input is the reference Transmission Level Point that is used for testing. This level is typically 3 dB  
below clipping.  
4.  
Speaker Out gain set to 1.6 (High). (Differential)  
6.2.3 AUX IN (Auxillary Input)  
Internal to the device  
Rb  
Gain  
Setting  
Resistor Ratio  
(Rb/Ra) k/k  
Gain Gain 2  
(dB)  
CCOUP = 0.1  
F
Ra  
AUX IN  
Input  
00  
01  
10  
11  
40.1/40.1  
47.0/33.2  
53.5/26.7  
58.2/21.0  
1
1.414  
2
0
3
6
9
AUX IN  
Input Apmlifier  
2.82  
1
NOTE: fCUTOFF=  
2RaCCOUP  
FIGURE 3: AUX IN INPUT MODES  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 13 -  
ISD5008  
TABLE 5: AUXIN AMPLIFIER GAIN SETTINGS  
Setting (1) 0TLP Input  
CFG0  
Gain (2)  
Array In/Out  
VPP  
ANA OUT  
VPP  
(3)  
(4)  
VPP  
AXG1  
AXG0  
0 dB  
3 dB  
6 dB  
9 dB  
.694  
.694  
.694  
.694  
.694  
.694  
.694  
.694  
.694  
.491  
.347  
.245  
0
0
1
1
0
1
0
1
1.00  
1.41  
2.00  
2.82  
NOTES:  
1. Gain from AUX IN to ANA OUT  
2. Gain from AUX IN to ARRAY IN  
3. 0TLP Input is the reference Transmission Level Point that is used for testing. This level is typically 3 dB  
below clipping.  
4. Differential  
6.2.4 ACAP (AGC Capacitor)  
This pin provides the capacitor connection for setting the parameters of the microphone AGC circuit. It  
should have a 4.7 F capacitor connected to ground. It cannot be left floating. This is because the  
capacitor is also used for the AutoMute circuit. This circuit reduces the amount of noises present in the  
output during quiet pauses. Tying this pin to ground gives maximum gain; to VCCA gives minimum gain  
for the AGC amplifier but will cancel the AutoMute function.  
Publication Release Date: Oct 31 2008  
- 14 -  
Revision 1.2  
ISD5008  
6.3 INTERNAL FUNCTIONAL BLOCKS  
FIGURE 7: MICROPHONE AMPLIFIER  
FIGURE 7: ANA IN and AUX IN  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 15 -  
ISD5008  
FIGURE 7: ISD5008 CORE (LEFT HALF)  
FIGURE 8: ISD5008 CORE (RIGHT HALF)  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 16 -  
ISD5008  
FIGURE 9: VOLUME CONTROL  
VLPD  
Power Up  
0
1
Power Down  
ANA IN  
SUM 2  
VOL  
MUX  
VOL1  
VOL0 Attenuation  
VOL2  
0 dB  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
-4 dB  
-8 dB  
-12 dB  
-16 dB  
-20 dB  
-24 dB  
-28 dB  
SUM 1  
INP  
Volume  
Control  
VOL  
VLS1 VLS0 SOURCE  
ANA IN  
SUM 2  
0
0
1
1
0
1
0
1
VOL0  
3
1(VLPD)  
VOL1  
( )  
2
VLS0  
VOL2  
SUM 1  
INP  
(VLS1)  
15 14  
13 12  
11 10  
9
8
7
6
5
4
3
2
1
0
AIG1 AIG0 AIPD AXG1 AXG0 AXPD INS0 AOS2 AOS1 AOS0 AOPD OPS1 OPS0 OPA1 OPA0 VLPD  
CFG0  
CFG1  
15 14  
13 12  
11 10  
9
8
7
6
5
4
3
2
1
0
VLS1 VLS0 VOL2 VOL1 VOL0 S1S1 S1S0 S1M1 S1M0 S2M1 S2M0 FLS0 FLD1 FLD0 FLPD AGPD  
FIGURE 10: SPEAKER and AUX OUT  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 17 -  
ISD5008  
FIGURE 11: ANA OUT Output  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 18 -  
ISD5008  
6.4 SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION  
The ISD5008 product operates from a SPI serial interface, which operates with the following protocol:  
The data transfer protocol assumes that the microcontroller’s SPI shift registers are clocked on the  
falling edge of the SCLK. However, for the ISD5008, data is clocked into the MOSI pin at the rising  
clock edge, while data is clocked out onto the MISO pin at the falling clock edge.  
1. All serial data transfers begin with the falling edge of SS pin.  
2. SS is held LOW during all serial communications and held HIGH between instructions.  
3. Data is clocked in on the rising clock edge and data is clocked out on the falling clock edge.  
4. Play and Record operations are initiated by enabling the device by asserting the SS pin LOW,  
shifting in an opcode and an address field to the ISD5008 device (refer to the Opcode  
Summary of Table 6).  
5. The opcodes and address fields are as follows: <8 control bits> and <16 address bits>.  
6. Each operation that ends in an EOM or Overflow will generate an interrupt, including the  
Message Cueing cycles. The Interrupt will be cleared the next time an SPI cycle is completed.  
7. As Interrupt data is shifted out of the ISD5008 MISO pin, control and address data is  
simultaneously being shifted into the MOSI pin. Care should be taken such that the data  
shifted in is compatible with current system operation. It is possible to read interrupt data and  
start a new operation within the same SPI cycle.  
8. A record or playback operation begins with the RUN bit set and the operation ends with the  
RUN bit reset.  
9. All operations begin with the rising edge of SS.  
6.4.1 Message Cuing  
Message cueing allows the user to skip through messages, without knowing the actual physical  
location of the message. This operation is used during playback. In this mode, the messages are  
skipped 1600 times faster than in normal playback mode. It will stop when an EOM marker is reached.  
Then, the internal address counter will point to the next message.  
Publication Release Date: Oct 31 2008  
- 19 -  
Revision 1.2  
ISD5008  
6.4.2 Opcodes  
Instruction  
TABLE 6: OPCODE SUMMARY  
Opcode <8 bits> [1]  
Operational Summary  
Address <16 bits>  
Power-Up: Power-Up the device  
POWERUP  
LOADCFG0 [2]  
LOADCFG1  
SETPLAY  
PLAY  
0110 0000  
01X0 0010 <D15-D0>  
01X0 0100 <D15-D0>  
1110 0000 <A15-A0>  
1111 0000  
Loads a 16-bit value into Configuration Register 0  
Loads a 16-bit value into Configuration Register 1  
Initiates Playback from address <A15-A0>  
Playback from current address (until EOM or OVF)  
Initiates Record at address <A15-A0>  
SETREC  
REC  
1010 0000 <A15-A0>  
1011 0000  
Records from current address until OVF is reached  
Initiates Message Cueing (MC) from address <A15-A0>  
SETMC  
1110 1000 <A15-A0>  
1111 1000  
MC  
Performs a Message Cue. Proceeds to the end of the  
current message (EOM) or enters OVF condition if it  
reaches the end of the array.  
STOP  
0111 0000  
0101 0000  
Stops current operation  
STOPWRDN  
Stops current operation and enters stand-by (power-  
down) mode.  
RINT  
0111 0000  
Read interrupt status bits: OVF and EOM.  
NOTES:  
[1]  
X = Don’t Care.  
[2]  
Changes in CFG0 are not recognized until CFG1 is loaded. The changes will occur at the rising edge of  
SS during the cycle that CFG1 is loaded.  
Publication Release Date: Oct 31 2008  
- 20 -  
Revision 1.2  
ISD5008  
6.4.3 Power-Up Sequence  
The ISD5008 will be ready for an operation after TPUD (25 ms approximately for 8 kHz sample rate).  
The user needs to wait TPUD before issuing an instruction. Below are suggested playback and record  
examples for references.  
6.4.3.1 Record Mode  
1. Send POWERUP command.  
2. Wait TPUD (power-up delay).  
3. Send POWERUP command.  
4. Wait 2 x TPUD (power-up delay).  
5. Load CFG0 and CFG1 for desired operation.  
6. Wait TPUD.  
7. Send SETREC command with address xx, or send REC command.  
8. Send STOP to halt the record operation or when the end of memory (OVF) is reached, then  
record stops automatically.  
9. Wait TStop/Pause.  
.
6.4.3.2 Playback Mode  
1.  
2.  
3.  
4.  
5.  
6.  
Send POWERUP command.  
Wait TPUD (power-up delay).  
Load CFG0 and CFG1 for desired operation.  
Wait TPUD.  
Send SETPLAY command with address xx, or send PLAY command.  
Send STOP to halt the playback operation or wait until an EOM is reached, then playback  
stops automatically.  
7.  
Wait TStop/Pause..  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 21 -  
ISD5008  
6.4.4 SPI Port  
The following diagram describes the SPI port and the control bits associated with it.  
Byte 1  
Byte 2  
Byte 3  
D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 C0 C1 C2 C3 C4 C5 C6 C7  
MOSI  
Reserved  
Load CFG0 (LC0)  
Load CFG1 (LC1)  
Message Cueing  
Ignore Address Bit  
PowerUp  
Play/Record  
Run  
6.4.5 SPI Control Register  
The SPI control register provides control of individual device functions such as Play, Record, Message  
Cueing, Power-Up and Power-Down, Start and Stop operations, Ignore Address Pointers and Load  
Configuration Registers.  
TABLE 7: SPI CONTROL REGISTER  
Control  
Control  
Bit  
Device Function  
Bit  
Device Function  
Master power control  
Register  
Register  
RUN  
Enable or Disable an operation  
PU  
=
1
Start  
=
1
Power-Up  
=
0
Stop  
=
0
Power-Down  
Selects Play or Record operation  
IAB  
Ignore address control bit  
P/  
R
=
=
1
0
Ignore input address register (A15-  
A0)  
1
0
Play  
=
=
Record  
Use the input address register  
contents for an operation (A15-A0)  
MC  
Enable or Disable Message  
Cueing  
A15-A0  
D15-D0  
Output of the row pointer register  
Input control and address register  
=
=
Enable Message Cueing  
Disable Message Cueing  
1
0
LC0  
LC1  
=
=
1
0
Load Configuration Reg 0  
No Load  
=
=
1
0
Load Configuration Reg 1  
No Load  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 22 -  
ISD5008  
TABLE 8: CONFIGURATION REGISTER 0  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
CFGO  
AIG1  
AIG0  
AIPD  
AXG1  
AXG0  
AXPD  
INS0  
AOS2  
AOS1  
AOS0  
AOPD  
OPS1  
OPS0  
OPA1  
OPA0  
VLPD  
NOTE: See details on following pages  
TABLE 9: CONFIGURATION REGISTER 1  
D15  
D14  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
CFG1  
VLS1  
VLS0  
VOL2  
VOL1  
VOL0  
S1S1  
S1S0  
S1M1  
S1M0  
S2M1  
S2M0  
FLSO  
FLD1  
FLD0  
FLPD  
AGPD  
NOTE: See details on following pages  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 23 -  
ISD5008  
Detail of Configuration Register 0  
Volume Control Power Bit  
Bit 0  
0
= Power ON  
(VLPD)  
1
= Power OFF  
SPEAKER and AUX OUT  
Control Bits  
Bits 2,1  
00 = Power down SPKR and AUX  
(OPA1, OPA0)  
01 = SPKR ON, HIGH GAIN, AUX Power down  
10 = SPKR ON, LOW GAIN, AUX Power down  
11 = SPKR Powered down, AUX ON  
OUTPUT MUX Con trol Bits  
Bits 4,3  
00 = Source is VOL CONTROL (VOL)  
(OPS1, OPS0)  
01 = Source is ANA IN Input (ANA IN AMP)  
10 = Source is LOW PASS FILTER (FILT0)  
11 = Source is SUM2 SUMMING AMP (SUM2)  
ANA OUT Power Bit  
Bit 5  
0
1
= Power ON  
= Power OFF  
(AOPD)  
ANA OUT MUX Con trol Bits Bits 8,7,6  
(AOS2, AOS1,  
000 = Source is MICROPHONE AMP (FTHRU)  
001 = Source is INPUT MUX (INP)  
010 = Source is VOLUME CONTROL (VOL)  
011 = Source is LOW PASS FILTER (FILT0)  
100 = Source is SUM1 SUMMING AMP (SUM1)  
101 = Source is SUM2 SUMMING AMP (SUM2)  
110 = Unused  
AOS0)  
111 = Unused  
INPUT SOURCE MUX  
Control Bit  
Bit 9  
0
= Source is Microphone AGC AMP (AGC)  
= Source is AUX IN Input (AUX IN AMP)  
= Power ON  
(INS0)  
1
AUX IN AMP Power Bit  
Bit 10  
0
(AXPD)  
Bits 12,11  
(AXG1, AXG0)  
1
= Power OFF  
AUX IN AMP Control Bits  
00  
01  
10  
11  
0
= Input Gain = 1, OTLP input Level = 0.694  
= Input Gain = 1.414, OTLP input Level = 0.491  
= Input Gain = 2, OTLP input Level = 0.347  
= Input Gain = 2.828, OTLP input Level = 0.245  
= Power ON  
ANA IN AMP Power Bit  
ANA IN AMP Control Bits  
Bit 13  
(AIPD)  
1
= Power OFF  
Bits 15,14  
(AIG1, AIG0)  
00  
01  
10  
11  
= Input Gain = 0.625, OTLP input Level = 1.11  
= Input Gain = 0.883, OTLP input Level = 0.7l85  
= Input Gain = 1.250, OTLP input Level = 0.555  
= Input Gain = 1.767, OTLP input Level = 0.393  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 24 -  
ISD5008  
Detail of Configuration Register 1  
AGC Power Control Bit  
Bit 0  
0
1
0
1
= Power ON  
= Power OFF  
= Power ON  
= Power OFF  
(AGPD)  
Bit 1  
LOW PASS FILTER Power  
Control Bit  
(FLPD)  
SAMPLE RATE and LOW PASSBits 3,2  
FILTER Control Bits  
00 = Sample Rate = 8 KHz, FPB = 3.4 KHz  
01 = Sample Rate = 6.4 KHz, FPB = 2.7 KHz  
10 = Sample Rate = 5.3 KHz, FPB = 2.3 KHz  
11 = Sample Rate = 4 KHz, FPB = 1.7 KHz  
(FLD1, FLD0)  
FILTER MUX Control bits  
Bit 4  
(FLS0)  
0
1
= Source is SUM1 SUMMING AMP (SUM1)  
= Source is Analog Memory Array (ARRAY)  
SUM 2 SUMMING AMP Control Bits 6,5  
Bits  
00 = Source is both ANA IN AMP and FILT0  
01 = Source is ANA IN Input (ANA IN AMP) ONLY  
10 = Source is LOW PASS FILTER (FILT0) ONLY  
11 = Power Down SUM2 SUMMING AMP  
00 = Source is both SUM1 and INP  
(S2M1, S2M0)  
SUM1 SUMMING AMP Control Bit 8,7  
Bits  
(S1M1, S1M0)  
01 = Source is SUM1 SUMMING AMP (SUM1) ONLY  
10 = Source is INPUT MUX (INP) ONLY  
11 = Power Down SUM1 SUMMING AMP  
00 = Source is ANA IN Input (ANA IN AMP)  
01 = Source is Analog Memory Array (ARRAY)  
10 = Source is LOW PASS FILTER (FILT0)  
11 = UNUSED  
SUM1MUX Control Bits  
Bit 10,9  
(S1S1, S1S0)  
VOLUME CONTROL Control  
Bits  
Bits 13,12,11  
000 = Attenuation = 0 dB  
(VOL2, VOL1, VOL0) 001 = Attenuation = 4 dB  
010 = Attenuation = 8 dB  
011 = Attenuation = 12 dB  
100 = Attenuation = 16 dB  
101 = Attenuation = 20 dB  
110 = Attenuation = 24 dB  
111 = Attenuation = 28 dB  
VOL MUX Control Bits  
Bit 15,14 (VLS1, VLS0) 00 = Source is ANA IN Input (ANA IN AMP)  
01 = Source is SUM2 SUMMING AMP (SUM2)  
10 = Source is SUM1 SUMMING AMP (SUM1)  
11 = Source is INPUT MUX (INP)  
Configuration Register Notes  
1. Important: All changes to the internal settings of the ISD5008 are synchronized with the load of  
Configuration Register 1. A command to load Configuration Register 1 immediately transfers the  
input data to the internal settings of the device and the changes take place immediately at the end  
of the command when SS goes HIGH. A load to Configuration Register 0 sends the new data to  
Publication Release Date: Oct 31 2008  
- 25 -  
Revision 1.2  
ISD5008  
a temporary register in the ISD5008 and does not affect the internal settings of the device. The  
next time Configuration Register 1 is loaded, data will also transfer from the temporary register to  
the Configuration Register 0 and effect the desire changes. See Figure & Table 13.  
2. Configuration Registers may be loaded with data at any time, including when the chip is powered  
down using the PU bit in the SPI Control Resgister. The PU bit in the SPI Control Word will have to  
be set to a ―1‖ before the changes in configurarion will be seen.  
FIGURE 13: Configuration Register Programming Sequence  
Temporary Register  
Configuration Register 0  
Configuration Register 1  
Command =  
Load Configuration Register 0  
Command =  
Load Configuration Register 1  
LSB  
A0  
C
0
C
7
A15  
Input Shift Register  
MOSI  
FIGURE 14: SPI Interface Simplified Block Diagram  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 26 -  
ISD5008  
D0  
D0  
D15  
D15  
CFG1  
CFG0  
Configuration  
Registers  
LSB  
A0  
A15  
C
0
C
7
Input Shift Register  
MOSI  
(Loaded to Row Counter  
only if IAB = 0)  
A0-A15  
Select Logic  
Row Counter  
P0-P15  
LSB  
OVF EOM P0 ...  
MISO  
Output Shift Register  
P15  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 27 -  
ISD5008  
FIGURE 15: TypicalDigital Cellular Phone Integration  
Baseband Section  
MIC+  
MIC-  
MIC IN+  
MIC IN-  
ANA OUT+  
ANA OUT-  
RF  
Section  
VB  
Codec  
BB  
Codec  
DSP  
ISD5008  
SP OUT-  
SP OUT+  
ANA IN  
SP+  
SP-  
Earpiece  
SPI  
AUX IN AUX OUT  
(INT, RAC)  
Microcontroller  
Car Kit  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 28 -  
ISD5008  
6.5 OPERATIONAL MODES DESCRIPTION  
The ISD5008 can operate in many different modes. It’s flexibility allows the user to configure the chip  
such that almost any input can mixed with any other input and then be directed to any output. The  
variable settings for the ANA and AUX input amplifiers plus the microphone AGC and speaker volume  
controls make it possible to use the device with most existing cell phone or cordless phone chip sets  
with no external level adjustment. Several modes will be found in most applications, however, please  
refer to the ISD5008 block diagram to better understand the following modes. In all cases, we are  
assuming that the chip has been powered up with the PU bit in the SPI control register and that a time  
period of TPUD has elapsed after that bit was set.  
6.5.1 Feed Through Mode  
This mode enables the ISD5008 to connect to a base band cell phone or cordless phone chip set  
without affecting the audio source or destination. There are two paths involved, the transmit path and  
the receive path. The transmit path connects the ISD chip’s microphone source through to the  
microphone input on the base band chip set. The receive path connects the base band chip set’s  
speaker output through to the speaker driver on the ISD chip. This allows the ISD chip to substitute for  
those functions and incidentally gain access to the audio to and from the base band chip set. Figure 15  
shows one possible connection to such a chip set.  
Figure 16 shows the part of the ISD5008 block diagram that is used in Feed Through Mode. The rest  
of the chip will be powered down to conserve power. The bold lines highlight the audio paths. Note that  
the Microphone to ANA OUT +/path is differential  
FIGURE 16: BASIC FEED THRU MODE  
Publication Release Date: Oct 31 2008  
- 29 -  
Revision 1.2  
ISD5008  
To select this mode, the following control bits must be configured in the ISD5008 configuration  
registers. To set up the transmit path:  
1.  
Select the FTHRU path through the ANA OUT MUXBits AOS0, AOS1 and AOS2 control  
the state of the ANAOUT MUX. These are the D6, D7 and D8 bits respectively of  
Configura tion Register 0 (CFG0) and they should all be ZERO to select the FTHRU path.  
2.  
Power up the ANA OUT amplifierBit AOPD controls the power up state of ANA OUT.  
This is bit D5 of CFG0 and it should be a ZERO to power up the amplifier.  
To set up the receive path:  
1. Set up the ANA IN amplifier for the correct gainBits AIG0 and AIG1 control the gain settings  
of this amplifier. These are bits D14 and D15 respectively of CFG0. The input level at this pin  
determines the setting of this gain stage. Table 4 will help determine this setting. In this  
example we will assume that the peak signal never goes above 1 volt p-p single ended. That  
would enable us to use the 9dB attenuation setting, or where D14 is ONE and D15 is ZERO.  
2. Power up the ANA IN amplifierBit AIPD controls the power up state of ANA IN. This is bit  
D13 of CFG0 and should be a ZERO to power up the amplifier.  
3. Select the ANA IN path through the OUTPUT MUXBits OPS0 and OPS1 control the state of  
the OUTPUT MUX. These are bits D3 and D4 respectively of CFG0 and they should be set to  
the state where D3 is ONE and D4 is ZERO to select the ANA IN path.  
4. Power up the Speaker AmplifierBits OPA0 and OPA1 control the state of the Speaker and  
AUX amplifiers. These are bits D1 and D2 respectively of CFG0. They should be set to the  
state where D1 is ONE and D2 is ZERO. This powers up the Speaker Amplifier and configures  
Publication Release Date: Oct 31 2008  
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Revision 1.2  
ISD5008  
it for it’s higher gain setting for use with a piezo speaker element and also powers down the  
AUX output stage.  
The status of the rest of the functions in the ISD5008 chip must be defined before the configuration  
registers settings are updated:  
1. Power down the Volume Control ElementBit VLPD controls the power up state of the  
Volume Control. This is bit D0 fo CFG0 and it should be set to a ONE to power down the  
statge.  
2. Power down the AUX IN amplifierBit AXPD controls the power up state of the AUX IN input  
amplifier. This is bit D10 of CFG0 and it should be set to a ONE to power down the stage.  
3. Power down the SUM1 and SUM2 Mixer amplifiersBits S1M0 and S1M1 control the SUM  
mixer and bits S2M0 and S2M1 control the SUM2 mixer. These are bits D7 and D8 in CFG1  
and bits D5 and D6 in CFG1 respectively. All 4 bits should be set to a ONE to power down the  
stage.  
4. Power down the FILTER stageBit FLPD controls the power up state of the FILTER stage in  
the device. This is bit D0 in CFG1 and should be set to a ONE to power down the stage.  
5. Power down the AGC amplifierBit AGPD controls the power up state of the AGC amplifier.  
This is bit D0 in CFG1 and should be set to a ONE to power down the stage.  
6. Don’t Care bitsThe following stages are not used in Feed Through Mode. Their bits may be  
set to either level. In this example we will set all the following bits to ZERO.  
a. Bit INS0, bit D9 of CFG0 controls the Input Source Mux.  
b. Bits AXG0 and AXG1 are bits D11 and D12 respectively in CFG0. They control the  
AUX IN amplifier gain setting.  
c. Bits FLD0 and FLD1 are bits D2 and D3 respectively in CFG1. They control the  
sample rate and filter band pass setting.  
d. Bit FLS0 is bit D4 in CFG1. It controls the FILTER MUX.  
e. Bits S1S0 and S1S1 are bits D9 and D10 of CFG1. They control the SUM1 MUX.  
f. Bits VOL0, VOL1 and VOL2 are bits D11, D12 and D13 of CFG1. They control the  
setting of the Volume Control.  
g. Bits VLS0 and VLS1 are bits D14 and D15 of CFG1. They control the Volume Control  
Mux.  
The end result of the above set up is:  
CFG0 = 0100 0100 0000 1011 (hex 4408)  
and  
CFG1 = 0000 0001 1110 0011 (hex 01E3)  
Since both registers are being loaded, CFG0 is loaded followed by the loading of CFG1. These two  
registers must be loaded in this order. The internal set up for both registers will take effect  
synchronously with the rising edge of SS  
.
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 31 -  
ISD5008  
6.5.2 Call Record  
The call record mode adds the ability to record the incoming phone call. In most applications, the  
ISD5008 would first be set up for Feed Through Mode as described above. When the user wishes to  
record the incoming call, the set up of the chip is modified to add that ability. For the purpose of this  
explanation, we will use the 6.4 kHz sample rate during recording.  
The block diagram of the ISD5008 shows that the Multilevel Storage array is always driven from the  
SUM2 SUMMING amplifier. The path traces back from there through the LOW PASS Filter, THE  
FILTER MUX, THE SUM1 SUMMING amplifier, the SUM1 MUX, then from the ANA in amplifier. Feed  
Through Mode has already powered up the ANA IN amp so we only need to power up and enable the  
path to the Multilevel Storage array from that point:  
1.  
2.  
Select the ANA IN path through the SUM1 MUXBits S1S0 and S1S1 control the state of  
the SUM1 MUX. These are bits D9 and D10 respectively of CFG1 and they should be set  
to the state where both D9 and D10 are ZERO to select the ANA IN path.  
Select the SUM1 MUX input (only) to the S1 SUMMING amplifierBits S1M0 and S1M1  
control the state of the SUM1 SUMMING amplifier. These are bits D7 and D8 respectively  
of CFG1 and they should be set to the state where D7 is ONE and D8 is ZERO to select  
the SUM1 MUX (only) path.  
3.  
4.  
5.  
6.  
Select the SUM1 SUMMING amplifier path through the FILTER MUXBit FLS0 controls  
the state of the FILTER MUX. This is bit D4 of CFG1 and it should be set to ZERO to  
select the SUM1 SUMMING amplifier path.  
Power up the LOWPASS FILTERBit FLPD controls the power up state of the LOWPASS  
FILTER stage. This is bit D1 of CFG1 and it should be set to ZERO to power up the LOW  
PASS FILTER STAGE.  
Select the 6.4 kHz sample rateBits FLD0 and FLD1 select the Low Pass filter setting and  
sample rate to be used during record and playback. These are bits D2 and D3 of CFG1.  
To enable the 6.4 kHz sample rate, D2 should be set to ONE and D3 to ZERO.  
Select the LOW PASS FILTER input (only) to the SUM2 SUMMING amplifierBits S2M0  
and S2M1 control the state of the SUM2 SUMMING amplifier. These are bits D5 and D6  
respectively of CFG1 and they should be set to the state where D5 is ZERO and D6 is  
ONE to select the LOW PASS FILTER (only) path.  
In this mode, the elements of the original PASS THROUGH mode do not change. The sections of the  
chip not required to add the record path remain powered down. In fact, CFG0 does not change and  
remains  
CFG0=0100 0100 0000 1011 (hex 440B).  
CFG1 changes to  
CFG1=0000 0000 1100 0101 (hex 00C5).  
Since CFG0 is not changed, it is only necessary to load CFG1. Note that if only CFG0 was changed, it  
would be necessary to load both registers.  
Publication Release Date: Oct 31 2008  
- 32 -  
Revision 1.2  
ISD5008  
6.5.3 Memo Record  
The Memo Record mode sets the chip up to record from the local microphone into the chip’s Multilevel  
Storage Array. A connected cellular telephone or cordless phone chip set may remain powered down  
and is not active in this mode. The path to be used is microphone input to AGC amplifier, then through  
the INPUT SOURCE MUX to the SUM1 SUMMING amplifier. From there the path goes through the  
FILTER MUX, the LOW PASS FILTER, the SUM2 SUMMING amplifier, then to the MULTILEVEL  
STORAGE ARRAY. In this instance, we will select the 5.3 kHz sample rate. The rest of the chip may  
be powered down.  
1.  
2.  
Power up the AGC amplifierBit AGPD controls the power up state of the AGC amplifier.  
This is bit D0 of CFG1 and should be set to ZERO to power up the stage.  
Select the AGC amplifier through the INPUT SOURCE MUXBit INS0 controls the state  
of the INPUT SOURCE MUX. This is bit D9 of CFG0 and should be set to a ZERO to  
select the AGC amplifier.  
3.  
Select the INPUT SOURCE MUX (only) to the SUM1 SUMMING amplifierBits S1M0 and  
S1M1 control the state of the SUM1 SUMMING amplifier. These are bits D7 and D8  
respectively of CFG1 and they should be set to the state where D7 is ZERO and D8 is  
ONE to select the INPUT SOURCE MUX (only) path.  
4.  
5.  
6.  
7.  
Select the SUM1 SUMMING amplifier path through the FILTER MUXBit FLS0 controls  
the state of the FILTER MUX. This is bit D4 of CFG1 and it should be set to ZERO to  
select the SUM1 SUMMING amplifier path.  
Power up the LOW PASS FILTERBit FLPD controls the power up state of the LOW  
PASS FILTER stage. This is bit D1 of CFG1 and it should be set to ZERO to power up the  
LOW PASS FILTER stage.  
Select the 5.3 kHz sample rateBits FLD0 and FLD1 select the Low Pass filter setting and  
sample rate to be used during record and playback. These are bits D2 and D3 of CFG1.  
To enable the 5.3 kHz sample rate, D2 should be set to ZERO and D3 set to ONE.  
Select the LOW PASS FILTER input (only) to the SUM2 SUMMING amplifierBits S2M0  
and S2M1 control the state of the SUM2 SUMMING amplifier. These bits are D5 and D6  
respectively of CFG1 and they should be set to the state where D5 is ZERO and D6 is  
ONE to select the LOW PASS FILTER (only) path.  
To set up the chip for Memo Record, the configuration registers are set up as follows:  
CFG0=0010 0100 0010 0001 (hex 2421).  
CFG1=0000 0001 0100 1000 (hex 0148).  
Only those portions necessary for this mode are powered up.  
6.5.4 Memo and Call Playback  
This mode sets the chip up for local playback of messages recorded earlier. The playback path is from  
the MULTILEVEL STORAGE ARRAY to the FILTER MUX, then to the LOW PASS FILTER stage.  
Publication Release Date: Oct 31 2008  
- 33 -  
Revision 1.2  
ISD5008  
From there the audio path goes through the SUM2 SUMMING amplifier to the VOLUME MUX, through  
the VOLUME CONTROL then to the SPEAKER output stage. We will assume that we are driving a  
pizeo speaker element. This audio was previously recorded at 8 kHz. All unnecessary stages will be  
powered down.  
1.  
2.  
3.  
4.  
Select the MULTILEVEL STORAGE ARRAY path through the FILTER MUXBit FLS0  
controls the state of the FILTER MUX. This is bit D4 of CFG1 and should be set to ONE to  
select the MULTILEVEL STORAGE ARRAY.  
Power up the LOW PASS FILTERBit FLPD controls the power up of the LOW PASS  
FILTER stage. This is bit D1 of CFG1 and it should be set to ZERO to power up the LOW  
PASS FILTER stage.  
Select the 8.0 kHz sample rateBits FLD0 and FLD1 select the Low Pass filter setting and  
sample rate to be used during record and playback. These are bits D2 and D3 of CFG1.  
To enable the 8.0 kHz sample rate, D2 and D3 must be set to ZERO.  
Select the LOW PASS FILTER input (only) to the S2 SUMMING amplifier Bits S2M0 and  
S2M1 control the state of the SUM2 SUMMING amplifier. These are bits D5 and D6  
respectively of CFG1 and they should be set to the state where D5 is ZERO and D6 is  
ONE to select the LOW PASS FILTER (only) path.  
5.  
Select the SUM2 SUMMING amplifier path through the VOLUME MUXBits VLS0 and  
VLS1 control the state VOLUME MUX. These bits are D14 and D15, respectively of CFG1.  
They should be set to the state where D14 is ONE and D15 is ZERO to select the SUM2  
SUMMING amplifier.  
6.  
7.  
Power up the VOLUME CONTROL LEVELBit VLPD controls the power up state of the  
VOLUME CONTROL attenuator. This is bit D0 of CFG0. This bit should be set a ZERO to  
power up the VOLUME CONTROL.  
Select a VOLUME CONTROL LEVELBits VOL0, VOL1 and VOL2 control the state fo  
the VOLUME CONTROL LEVEL. Theses are bits D11, D12 and D13, repectively of CFG1.  
A binary count of 000 through 111 controls the amount of attenuation throught that state. In  
most cases, the software will select an attenuation level according to the desires of the  
current users of the product. In this example, we will assume the user wants an  
attenuation of 12 dB. For that setting, D11 should be set to ONE, D12 should be set to  
ONE, and D13 shoulde be set to ZERO.  
8.  
9.  
Select the VOLUME CONTROL path through the OUTPUT MUXBits OPS0 and OPS1  
control the state of the OUTPUT MUX. These are bits D3 and D4, respectively of CFG0.  
They should be set to the state where D3 and D4 are ZERO to select the VOLUME  
CONTROL.  
Power up the SPEAKER amplifier and select the HIGH GAIN modeBits OPA0 and  
OPA1 control the state of the speaker (SP+ and SP-) and AUX OUT outputs. These are  
bits D1 and D2 of CFG0. They should be set to the state where D1 is ONE and D2 is  
ZERO to power up the speaker outputs in the HIGH GAIN mode and to power down the  
AUX OUT.  
To set up the chip for Memo or Call Playback, the configuration registers are set up as follows:  
CFG0=0010 0100 0010 0010 (hex 2422).  
Publication Release Date: Oct 31 2008  
- 34 -  
Revision 1.2  
ISD5008  
CFG1=0101 1001 1101 0001 (hex 59D1).  
Only those portions necessary for this mode are powered up.  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 35 -  
ISD5008  
7
TIMING DIAGRAMS  
SS  
BYTE 1  
BYTE 2  
BYTE 3  
SCLK  
LSB  
C0  
C4 C5 C6 C7  
C1 C2  
C3  
MOSI  
MISO  
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15  
LSB  
OVFEOMA0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15  
X
X
X
X
X
X
FIGURE 17: 24-BIT SPI COMMAND FORMAT  
TSSH  
SS  
TSSmin  
TSCKhi  
TSSS  
SCLK  
MOSI  
TDIH  
TSCKlow  
TDIS  
TPD  
TPD  
TDF  
(TRISTATE)  
LSB  
MISO  
FIGURE 18: SPI TIMING DIAGRAM  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 36 -  
ISD5008  
SS  
SCLK  
MOSI  
Stop  
Play/Record  
Data  
Data  
MISO  
TSTOP/PAUSE  
(Rec)  
ANA IN  
TSTOP/PAUSE  
(Play)  
ANA OUT  
FIGURE 19: PLAYBACK/RECORD AND STOP CYCLE  
SS  
SCLK  
MOSI  
LSB  
A8  
A9  
A10  
C0  
C1  
C2  
C3  
C4  
LSB  
OVF  
EOM  
P0  
P1  
P2  
P3  
P4  
P5  
MISO  
FIGURE 20: 8-Bit SPI Command Format  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 37 -  
ISD5008  
8
ABSOLUTE MAXIMUM RATINGS [1]  
TABLE 10: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS)  
CONDITIONS VALUES  
Junction temperature  
150ºC  
-65ºC to +150ºC  
Storage temperature range  
Voltage applied to any pin  
(VSS 0.3V) to (VCC + 0.3V)  
(VSS 1.0V) to 5.5V  
Voltage applied to MOSI, SCLK, INT , RAC and SS pins  
(Input current limited to ±20mA)  
Lead temperature (Soldering 10sec)  
VCC VSS  
300ºC  
-0.3V to +7.0V  
TABLE 11: ABSOLUTE MAXIMUM RATINGS (DIE)  
CONDITIONS  
VALUES  
150ºC  
Junction temperature  
Storage temperature range  
-65ºC to +150ºC  
(VSS 0.3V) to 5.5V  
Voltage applied to MOSI, SCLK, INT , RAC and SS pins  
(Input current limited to ±20mA)  
VCC VSS  
-0.3V to +7.0V  
[1]  
Note:  
Stresses above those listed may cause permanent damage to the device. Exposure to the  
absolute maximum ratings may affect device reliability and performance. Functional operation is  
not implied at these conditions.  
Publication Release Date: Oct 31 2008  
- 38 -  
Revision 1.2  
ISD5008  
8.1 OPERATING CONDITIONS  
TABLE 12: OPERATING CONDITIONS (PACKAGED PARTS)  
CONDITION  
Commercial operating temperature range (Case temperature)  
Extended operating temperature (Case temperature)  
Industrial operating temperature (Case temperature)  
Supply voltage (VCC) [1]  
VALUE  
0ºC to +70ºC  
-20ºC to +70ºC  
-40ºC to +85ºC  
+2.7V to 3.3V  
Ground voltage (VSS) [2]  
TABLE 13: OPERATING CONDITIONS (DIE)  
CONDITION  
Commercial operating temperature range  
Supply voltage (VCC) [1]  
VALUE  
0ºC to +50ºC  
+2.7V to +3.3V  
0V  
Ground voltage (VSS) [2]  
[1]  
V
V
= VCCA = VCCD  
= VSSA = VSSD  
CC  
[2]  
SS  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 39 -  
ISD5008  
9
ELECTRICAL CHARACTERISTICS  
9.1 GENERAL PARAMETERS  
TABLE 14: GENERAL PARAMETERS  
PARAMETERS  
Input Low Voltage  
Input High Voltage  
Output Low Voltage  
SYMBOLS  
MIN(2)  
TYP(1)  
MAX(2)  
UNITS  
CONDITIONS  
VIL  
VCC x 0.2  
V
V
V
V
VIH  
VCC x 0.8  
VOL  
VOL1  
0.4  
0.4  
IOL = 10 µA  
IOL = 1 mA  
RAC, INT Output Low  
Voltage  
Output High Voltage  
Operating Current :  
- Playback  
VOH  
ICC  
VCC - 0.4  
V
IOH = -10 µA  
15  
25  
12  
1
mA  
mA  
mA  
µA  
No load (3)  
No load (3)  
No load (3)  
- Record  
- Feedthru  
(3) (4)  
Standby Current  
Input Leakage Current  
MISO Tristate Current  
ISB  
IIL  
10  
1  
10  
µA  
IHZ  
30  
1
µA  
1. Typical values @ TA = 25º and 3.0V.  
2. All Min/Max limits are guaranteed by Nuvoton via electronical testing or characterization. Not all  
specifications are 100 percent tested.  
3. VCCA and VCCD summed together.  
4.  
SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSD and all other pins floating.  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 40 -  
ISD5008  
9.2 TIMING PARAMETERS  
TABLE 15: TIMING PARAMETERS  
CHARACTERISTICS  
SYMBOLS  
FS  
MIN(2)  
TYP(1)  
MAX(2) UNITS  
CONDITIONS  
(4)  
Sampling Frequency  
8.0  
kHz  
kHz  
kHz  
kHz  
(4)  
(4)  
(4)  
6.4  
5.3  
4.0  
3-dB Roll-Off  
Point(3)(7)  
Filter Pass Band  
FCF  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
Record Duration  
3.4  
2.7  
2.3  
1.7  
kHz  
kHz  
kHz  
kHz  
TREC  
(6)  
(6)  
(6)  
(6)  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
Playback Duration  
4
5
6
8
min  
min  
min  
min  
TPLAY  
(6)  
(6)  
(6)  
(6)  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
Power-Up Delay  
4
5
6
8
min  
min  
min  
min  
TPUD  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
Stop or Pause  
25  
31.25  
37.5  
50  
msec  
msec  
msec  
msec  
TSTOP or PAUSE  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
50  
62.5  
75  
msec  
msec  
msec  
msec  
100  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 41 -  
ISD5008  
RAC Clock Period  
TRAC  
(9)  
(9)  
(9)  
(9)  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
RAC Clock Low Time  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
200  
250  
300  
400  
msec  
msec  
msec  
msec  
TRACLO  
25  
31.25  
37.5  
50  
msec  
msec  
msec  
msec  
RAC Clock Periond in  
Messge Cueing Mode  
TRACM  
125  
156.3  
187.5  
250  
µsec  
µsec  
µsec  
µsec  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
RAC Clock Low Time in  
Message Cueing Mode  
TRACML  
15.63  
19.53  
23.44  
31.25  
µsec  
µsec  
µsec  
µsec  
8.0 kHz (sample rate)  
6.4 kHz (sample rate)  
5.3 kHz (sample rate)  
4.0 kHz (sample rate)  
Total Harmonic Distortion THD  
1
2
%
@ 1 kHz at  
0TLP, sample  
rate = 5.3 kHz  
ANA IN to ARRAY,  
ARRAY to SPKR  
9.3 ANALOG PARAMETERS  
TABLE 16: ANALOG PARAMETERS  
CHARACTERISTICS  
MICROPHONE INPUT (14)  
MIC+/- Input Voltage  
SYMBOL  
MIN (2)  
TYP (1)  
MAX (2)  
UNITS  
CONDITIONS  
VMIC+/-  
3
mV  
mV  
Peak-to-Peak (4)(8)  
Peak-to-Peak (4)(10)  
300  
MIX+/- input reference VMIC (0TLP)  
transmission level point  
(0TLP)  
208  
6.0  
(4)  
Gain from MIC+/- input to AMIC  
ANA OUT  
5.5  
6.5  
dB  
1kHz at VMIC (0TLP)  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 42 -  
ISD5008  
MIC+/- Gain Tracking  
AMIC (GT)  
input RMIC  
AGC AAGC  
±0.1  
10  
dB  
Ω
1kHz, +3 to 40 dB 0TLP  
Input  
Microphone  
resistance  
5
6
15  
40  
MIC- and MIC+ pins  
Microphone  
Amplifier Range  
dB  
Over 3-300 mV Input  
Range  
ANA IN (9)  
ANA IN Input Voltage  
VANA IN  
1.6  
V
V
Peak-to-Peak (6dB gain  
setting)  
ANA IN (0TLP) Input VANA  
Voltage  
1.11  
Peak-to-Peak (6dB gain  
setting) (10)  
IN  
(0TLP)  
Gain from ANA IN to AANA IN (SP)  
SP+/-  
6 to 15  
-4 to +5  
dB  
dB  
4 Steps of 3 dB  
Gain from ANA IN to AUX AANA IN (AUX  
4 Steps of 3 dB  
OUT  
OUT)  
(11)  
ANA IN Gain Accuracy  
ANA IN Gain Tracking  
AANA IN (GA)  
AANA IN (GT)  
-0.5  
+0.5  
dB  
dB  
±0.1  
1000 Hz, +3 to -40dB  
0TLP Input, 6dB setting  
ANA IN Input Resistance  
RANA IN  
60 to  
102  
kΩ  
See Ra in Figure 2  
AUX IN (9)  
AUX IN Iput Voltage  
VAUX IN  
1.0  
V
Peak-to-Peak (0dB gain  
setting)  
AUX IN (0TLP) Input VAUX  
694.2  
0 to 9  
mV  
dB  
Peak-to-Peak (0dB gain  
setting) (10)  
IN  
Voltage  
(0TLP)  
Gain from AUX IN to ANA AAUX IN (ANA  
4 Steps of 3dB  
OUT  
OUT)  
(11)  
AUX IN Gain Accuracy  
AUX IN Gain Tracking  
AAUX IN (GA)  
AAUX IN (GT)  
-0.5  
+0.5  
dB  
dB  
±0.1  
1000 Hz, +3 to -40dB  
0TLP Input, 0dB setting  
AUX IN Input Resistance  
RAUX IN  
21 to  
40  
kΩ  
See Ra in Figure 3  
SPEAKER OUTPUTS (9)  
SP+/- Output Voltage VSPHG  
(High Gain setting)  
3.6  
V
Peak-to-Peak, differential  
load = 150 Ω; OPA1,  
OPA0 = 01  
SP+/- Output Load Imp. RSPLG  
(Low Gain)  
8
Ω
Ω
OPA1, OPA0 = 10  
SP+/- Output Load Imp. RSPHG  
(High Gain)  
70  
OPA1, OPA0 = 01  
SP+/- Output Load Cap.  
CSP  
100  
pF  
SP+/- Output Bias Voltage VSPAG  
(analog ground)  
1.2  
VDC  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 43 -  
ISD5008  
Speaker Output DC Offset VSPDCO  
ANA IN to SP+/- Idle ICNANA  
-100  
100  
mVDC  
With ANA IN to Speaker,  
ANA IN AC coupled to  
VSSA  
-65  
-65  
dB  
dB  
Speaker load = 150 Ω  
(12)(13)  
Channel Noise  
IN/(SP+/-)  
SP+/- to ANA OUT Cross CRT(SP+/-)  
1kHz 0TLP input to ANA  
IN, with MIC+/ and AUX  
Talk  
ANA OUT  
IN AC coupled to VSSA  
,
and measured at ANA  
OUT feedthrough mode  
(12)  
Power Supply Rejection PSRR  
Ratio  
-50  
dB  
dB  
Measured  
with  
a
1kHz,100 mVpp sine  
wave input at VCCA and  
VCCD pins  
Frequency  
Response FR  
-0.25  
23.5  
62.5  
+0.25  
With 0TLP input to ANA  
IN, 6dB setting (12)  
(300-3400 Hz)  
Power Output (Low Gain POUTLG  
Setting)  
mW  
RMS  
Differential load at 8 Ω  
SINAD ANA IN to SP+/-  
SINAD  
dB  
0TLP ANA IN input  
minimum gain, 150  
Ω
load (12)(13)  
ANA OUT (9)  
SINAD MIC IN to ANA SINAD  
Out+/-  
62.5  
62.5  
dB  
dB  
dB  
dB  
dB  
Load = 5 kΩ (12)(13)  
Load = 5 kΩ (12)(13)  
Load = 5 kΩ (12)(13)  
Load = 5 kΩ (12)(13)  
SINAD AUX IN to ANA SINAD  
OUT+/-  
Idle Channel Noise  
Microphone  
ICNMIC/ANA  
OUT  
-65  
-65  
Idle Channel Noise AUX ICNAUX  
IN  
IN (0 to 9 dB)  
/NA OUT  
Power Supply Rejection PSRR(ANA  
-50  
1.2  
Measured with a 1kHz,  
100mVpp sine wave to  
VCCA, VCCD pins  
Ratio  
OUT)  
ANA OUT+ and ANA VBIAS  
OUT-  
VDC  
mVDC  
kΩ  
Inputs AC coupled to  
VSSA  
ANA OUT+ and ANA VOFFSET  
OUT-  
-100  
5
+100  
Inputs AC coupled to  
VSSA  
Minimum  
Load RL  
Differential Load  
Impedence  
Frequency  
(300-3400 Hz)  
Response FR  
-0.25  
+0.25  
dB  
0TLP input to MIC+/- in  
feedthrough mode.  
0TLP input to AUX IN in  
feedthrough mode (12)  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 44 -  
ISD5008  
ANA OUT to SP+/- Cross CRTANA  
-65  
-65  
dB  
dB  
1kHz 0TLP output from  
ANA OUT, with ANA IN  
AC coupled to VSSA, and  
measured at SP+/- (12)  
Talk  
OUT/(SP+/-)  
ANA OUT to AUX OUT CRTANA  
1kHz 0TLP output from  
ANA OUT, with ANA IN  
AC coupled to VSSA, and  
Cross Talk  
OUT/AUX OUT  
measured at AUX OUT  
(12)  
AUX OUT (9)  
AUX OUT  
Output Swing  
Maximum VAUX OUT  
Load RL  
1.0  
Vpp  
kΩ  
5 kΩ Load  
Minimum  
5
Impedence  
Maximum  
Load CL  
100  
pF  
Capacitance  
AUX OUT  
VBIAS  
1.2  
VDC  
dB  
SINAD ANA IN to AUX SINAD  
62.5  
0TLP ANA IN input,  
OUT  
minimum gain, 5k load  
(12)(13)  
Idle Channel Noise ANA ICN(AUX  
-65  
-65  
dB  
dB  
Load = 5 kΩ (12)(13)  
IN to AUX OUT  
OUT)  
AUX OUT to ANA OUT CRTAUX  
Cross Talk  
1 kHz 0TLP input to ANA  
IN, with MIC +/- and AUX  
OUT/ANA OUT  
IN AC coupled to VSSA  
,
and measured at SP+/-,  
load = 5 kΩ. Referenced  
to nominal 0TLP  
output  
@
VOLUME CONTROL (9)  
Output Gain  
AOUT  
-28 to 0  
dB  
dB  
8
Steps of  
4
dB,  
referenced to output  
Gain Accuracy  
-0.5  
0.5  
ANA IN = 1 kHz 0TLP,  
6dB Gain setting  
Notes:  
1. Typical values: TA = 25°C and Vcc = 3.0V.  
2. All min/max limits are guaranteed by ISD via electrical testing or characterization. Not all specifications  
are 100 percent tested.  
3. Low-frequency cut off depends upon the value of external capacitors (see Pin Descriptions).  
4. Differential input mode. Nominal differential input is 208 mVp-p. (0 dBm0)  
5. Sampling frequency can vary as much as 6/+4 percent over the industrial temperature and voltage  
ranges. For greater stability, an external clock can be utilized (see Pin Descriptions). Sampling  
frequency will be accurate within ±1% for 5.3kHz, and ±5% for 4.0, 6.4 and 8.0 kHz sampling rates at  
room temperature.  
Publication Release Date: Oct 31 2008  
- 45 -  
Revision 1.2  
ISD5008  
6. Playback and Record Duration can vary as much as 6/+4 percent over the industrial temperature and  
voltage ranges. For greater stability, an external clock can be utilized (See Pin Descriptions). Playback  
and record durations are accurate within ±1% for 5.3kHz, and ±5% for 4.0, 6.4 and 8.0kHz sampling  
rates at room temperature.  
7. Filter specification applies to the low pass filter. Therefore, from input to output, expect a 6 dB drop by  
nature of passing through the filter twice.  
8. For optimal signal quality, this maximum limit is recommended.  
9. When a record command is sent, TRAC = TRAC + TRACLO on the first row addressed.  
10. The maximum signal level at any input is defined as 3.17dB higher than the reference transmission  
level point. (0TLP) This is the point where signal clipping may begin.  
11. Measured at 0TLP point for each gain setting. See Table 4 and Table 5.  
12. 0TLP is the reference test level through inputs and outputs. See Table 4 and Table 5.  
13. Referenced to 0TLP input at 1kHz, measured over 300 to 3,400 Hz bandwidth.  
14. For die, only typical values from Analog Parameters are applicable.  
Publication Release Date: Oct 31 2008  
- 46 -  
Revision 1.2  
ISD5008  
9.4  
SPI AC PARAMETERS (1)  
TABLE 17: SPI AC PARAMETERS  
CHARACTERISTIC  
SYMBOL  
TSSS  
MIN  
MAX  
UNITS  
CONDITIONS  
500  
nsec  
SS Setup Time  
TSSH  
500  
nsec  
SS Hold Time  
Data in Setup Time  
Data in Hold Time  
Output Delay  
TDIS  
TDIH  
TPD  
200  
200  
nsec  
nsec  
nsec  
nsec  
µsec  
500  
500  
(2)  
Output Delay to hiZ  
TDF  
TSSmin  
1
SS HIGH  
SCLK High Time  
SCLK Low Time  
CLK Frequency  
Notes:  
TSCKhi  
TSCKlow  
F0  
400  
400  
nsec  
nsec  
kHz  
1,000  
1. Typical values @ TA = 25º and VCC = 3.0V. Timing measured at 50 percent of the VCC level.  
2. Tristate test condition.  
VCC  
6.32K  
MISO  
10.91K  
50pF (Includes scope and fixture capacitance)  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 47 -  
ISD5008  
10 TYPICAL APPLICATION CIRCUIT  
1
To μC I/O  
for message  
management  
(optional)  
SClk  
24  
25  
μ
To C  
RAC  
INT  
2
3
4
SS  
SPI Interface  
& Address  
Setting  
MOSI  
MISO  
VCC  
27  
28  
17  
VCC  
VCCD  
VCCD  
VCCA  
0.1 F  
μ
Ω
1.5K  
0.1 F  
μ
Ω
1.5K  
8
MIC+  
0.1μF  
5
6
VSSD  
VSSD  
VSSA  
VSSA  
VSSA  
220  
F
μ
Electret  
ISD5008  
0.1 F  
μ
9
microphone  
10  
13  
MIC-  
15  
23  
Ω
1.5K  
4.7 F  
μ
20  
11  
ACAP  
Aux Out  
AnaOut+  
12  
AnaOut-  
18  
19  
Ana In  
Aux In  
16  
14  
SP+  
SP-  
SOIC / PDIP  
FIGURE 21: Recording via Microphone  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 48 -  
ISD5008  
11 PACKAGE DRAWING AND DIMENSIONS  
11.1 28-LEAD LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1  
A
B
G
1
2
3
4
5
6
7
8
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
F
C
9
10  
18  
17  
16  
15  
11  
12  
13  
14  
E
J
H
INCHES  
Nom  
MILLIMETERS  
Nom  
Min  
Max  
0.711  
0.104  
0.299  
0.0115  
0.016  
Min  
Max  
A
0.701  
0.097  
0.292  
0.005  
0.014  
0.706  
0.101  
0.296  
0.009  
0.016  
0.050  
0.406  
0.032  
17.81  
2.46  
17.93  
2.56  
18.06  
2.64  
7.59  
0.29  
0.48  
0
B
C
D
E
F
7.42  
7.52  
0.127  
0.35  
0.22  
0.41  
1.27  
G
H
0.400  
0.024  
0.410  
0.040  
10.16  
0.61  
10.31  
0.81  
10.41  
1.02  
Note: Lead coplanarity to be within 0.004 inches.  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 49 -  
ISD5008  
11.2 28-LEAD 600 MIL PLASTIC DUAL INLINE PACKAGE (PDIP)  
INCHES  
Nom  
MILLIMETERS  
Min  
Max  
Min  
Nom  
36.83  
3.81  
Max  
A
B1  
B2  
C1  
C2  
D
1.445  
1.450  
0.150  
0.070  
1.455  
36.70  
36.96  
0.065  
0.600  
0.530  
0.075  
0.625  
0.550  
0.19  
1.65  
15.24  
13.46  
1.78  
1.91  
15.88  
13.97  
4.83  
0.540  
13.72  
D1  
E
0.015  
0.125  
0.015  
0.055  
0.38  
3.18  
0.38  
1.40  
0.135  
0.022  
0.065  
3.43  
0.56  
1.62  
F
0.018  
0.060  
0.100  
0.010  
0.075  
0.46  
1.52  
2.54  
0.25  
1.91  
G
H
J
0.008  
0.070  
0°  
0.012  
0.080  
15°  
0.20  
1.78  
0°  
0.30  
2.03  
15°  
S
θ
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 50 -  
ISD5008  
11.3 28-LEAD 300 MIL PLASTIC SMALL OUTLINE IC (SOIC)  
28  
26 25  
23 22 21 20 19 18 17  
15  
16  
27  
24  
1
2
3
4
5
6 7  
9 10 11 12 13 14  
8
A
G
C
B
D
F
E
H
INCHES  
Nom  
MILLIMETERS  
Nom  
Min  
Max  
0.711  
0.104  
0.299  
0.0115  
0.019  
Min  
17.81  
2.46  
Max  
18.06  
2.64  
7.59  
0.29  
0.48  
A
B
C
D
E
F
0.701  
0.097  
0.292  
0.005  
0.014  
0.706  
0.101  
0.296  
0.009  
0.016  
0.050  
0.406  
0.032  
17.93  
2.56  
7.42  
7.52  
0.127  
0.35  
0.22  
0.41  
1.27  
G
H
0.400  
0.024  
0.410  
0.040  
10.16  
0.61  
10.31  
0.81  
10.41  
1.02  
Note: Lead coplanarity to be within 0.004 inches.  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 51 -  
ISD5008  
12 ORDERING INFORMATION  
ISD5008xxx  
Product Series :  
ISD5008 Series  
Temperature :  
Industrial (-40C to +85C)  
I
=
(4 to 8 minutes duration)  
Blank = Commerical (0C to +70C)  
Package Option :  
Y
= Lead-free  
Package Type :  
P
S
E
=
=
=
Plastic Dual Inline Package (PDIP) Package  
Small Outline Integrated Circuit (SOIC) Package  
Thin Small Outline Package (TSOP) Package  
When ordering, please refer to the above valid part number scheme that are supported in volume for  
this product series. Contact the local Nuvoton Sales Representative or Distributor for availability  
information.  
For the latest product information, access Nuvoton’s worldwide website at  
http://www.Nuvoton-usa.com  
Publication Release Date: Oct 31 2008  
- 52 -  
Revision 1.2  
ISD5008  
13 VERSION HISTORY  
VERSION  
DATE  
DESCRIPTION  
0
Before 2004  
April, 2004  
Initial issue  
1.0  
Reformat the document.  
Add application diagram.  
Revise die info.  
Revise ordering information.  
1.1  
Feb, 2008  
Update Opcode  
Update power-up sequence.  
Update pin description of RAC and INT.  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 53 -  
ISD5008  
The contents of this document are provided only as a guide for the applications of Nuvoton products. Nuvoton  
makes no representation or warranties with respect to the accuracy or completeness of the contents of this  
publication and reserves the right to discontinue or make changes to specifications and product descriptions at  
any time without notice. No license, whether express or implied, to any intellectual property or other right of  
Nuvoton or others is granted by this publication. Except as set forth in Nuvoton's Standard Terms and  
Conditions of Sale, Nuvoton assumes no liability whatsoever and disclaims any express or implied warranty of  
merchantability, fitness for a particular purpose or infringement of any Intellectual property.  
Nuvoton products are not designed, intended, authorized or warranted for use as components in systems or  
equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship  
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other  
applications intended to support or sustain life. Further more, Nuvoton products are not intended for  
applications wherein failure of Nuvoton products could result or lead to a situation wherein personal injury, death  
or severe property or environmental injury could occur.  
Application examples and alternative uses of any integrated circuit contained in this publication are for illustration  
only and Nuvoton makes no representation or warranty that such applications shall be suitable for the use  
specified.  
ISD® and ChipCorder® are treademarks of Nuvoton Electronics Corporation. SuperFlash® is the trademark of  
Silicon Storage Technology, Inc.  
The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as  
published in the Nuvoton Reliability Report, and are neither warranted nor guaranteed by Nuvoton.  
Information contained in this ISD® ChipCorder® data sheet supersedes all data for the ISD ChipCorder products  
published by ISD® prior to August, 1998.  
This data sheet and any future addendum to this data sheet is(are) the complete and controlling ISD®  
ChipCorder® product specifications. In the event any inconsistencies exist between the information in this and  
other product documentation, or in the event that other product documentation contains information in addition to  
the information in this, the information contained herein supersedes and governs such other information in its  
entirety.  
Copyright© 2003, Nuvoton Technology Corporation. All rights reserved. ISD® is a registered trademark of  
Nuvoton. ChipCorder® is a treademark of Nuvoton. All other trademarks are properties of their respective  
owners.  
Headquarters  
Nuvoton Technology Corporation America  
Nuvoton Technology (Shanghai) Ltd.  
No. 4, Creation Rd. III  
Science-Based Industrial Park,  
Hsinchu, Taiwan  
2727 North First Street, San Jose,  
CA 95134, U.S.A.  
TEL: 1-408-9436666  
27F, 299 Yan An W. Rd. Shanghai,  
200336 China  
TEL: 86-21-62365999  
FAX: 86-21-62356998  
TEL: 886-3-5770066  
FAX: 1-408-5441797  
FAX: 886-3-5665577  
http://www.Nuvoton-usa.com/  
http://www.Nuvoton.com.tw/  
Taipei Office  
Nuvoton Technology Corporation Japan  
Nuvoton Technology (H.K.) Ltd.  
9F, No. 480, Pueiguang Rd.  
Neihu District  
Taipei, 114 Taiwan  
TEL: 886-2-81777168  
FAX: 886-2-87153579  
7F Daini-ueno BLDG. 3-7-18  
Shinyokohama Kohokuku,  
Yokohama, 222-0033  
TEL: 81-45-4781881  
Unit 9-15, 22F, Millennium City,  
No. 378 Kwun Tong Rd.,  
Kowloon, Hong Kong  
TEL: 852-27513100  
FAX: 852-27552064  
FAX: 81-45-4781800  
Please note that all data and specifications are subject to change without notice.  
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.  
This product incorporates SuperFlash® technology licensed From SST.  
Publication Release Date: Oct 31 2008  
Revision 1.2  
- 54 -  

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