1N4446/A52R [NXP]

DIODE 0.2 A, 75 V, SILICON, SIGNAL DIODE, DO-35, HERMETIC SEALED, GLASS, SC-40, 2 PIN, Signal Diode;
1N4446/A52R
型号: 1N4446/A52R
厂家: NXP    NXP
描述:

DIODE 0.2 A, 75 V, SILICON, SIGNAL DIODE, DO-35, HERMETIC SEALED, GLASS, SC-40, 2 PIN, Signal Diode

二极管
文件: 总7页 (文件大小:46K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
1N4148; 1N4446; 1N4448  
High-speed diodes  
1996 Sep 03  
Product specification  
Supersedes data of April 1996  
File under Discrete Semiconductors, SC01  
Philips Semiconductors  
Product specification  
High-speed diodes  
1N4148; 1N4446; 1N4448  
FEATURES  
DESCRIPTION  
Hermetically sealed leaded glass  
SOD27 (DO-35) package  
The 1N4148, 1N4446, 1N4448 are high-speed switching diodes fabricated in  
planar technology, and encapsulated in hermetically sealed leaded glass  
SOD27 (DO-35) packages.  
High switching speed: max. 4 ns  
General application  
Continuous reverse voltage:  
max. 75 V  
handbook, halfpage  
k
Repetitive peak reverse voltage:  
a
max. 75 V  
MAM246  
Repetitive peak forward current:  
max. 450 mA.  
The diodes are type branded.  
APPLICATIONS  
Fig.1 Simplified outline (SOD27; DO-35) and symbol.  
High-speed switching.  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VRRM  
VR  
repetitive peak reverse voltage  
continuous reverse voltage  
continuous forward current  
repetitive peak forward current  
75  
75  
V
V
IF  
see Fig.2; note 1  
200  
450  
mA  
mA  
IFRM  
IFSM  
non-repetitive peak forward current square wave; Tj = 25 °C prior to  
surge; see Fig.4  
t = 1 µs  
t = 1 ms  
t = 1 s  
4
1
A
A
0.5  
A
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
Tamb = 25 °C; note 1  
500  
+200  
200  
mW  
°C  
°C  
65  
Note  
1. Device mounted on an FR4 printed circuit-board; lead length 10 mm.  
1996 Sep 03  
2
Philips Semiconductors  
Product specification  
High-speed diodes  
1N4148; 1N4446; 1N4448  
ELECTRICAL CHARACTERISTICS  
Tj = 25 °C; unless otherwise specified.  
SYMBOL  
PARAMETER  
forward voltage  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VF  
see Fig.3  
1N4148  
1N4446  
1N4448  
IF = 10 mA  
1.0  
1.0  
0.72  
1.0  
25  
50  
3
V
V
V
V
IF = 20 mA  
IF = 5 mA  
0.62  
IF = 100 mA  
IR  
reverse current  
VR = 20 V; see Fig.5  
VR = 20 V; Tj = 150 °C; see Fig.5  
VR = 20 V; Tj = 100 °C; see Fig.5  
f = 1 MHz; VR = 0; see Fig.6  
nA  
µA  
µA  
pF  
ns  
IR  
reverse current; 1N4448  
diode capacitance  
Cd  
trr  
4
reverse recovery time  
when switched from IF = 10 mA to  
IR = 60 mA; RL = 100 ;  
4
measured at IR = 1 mA; see Fig.7  
Vfr  
forward recovery voltage  
when switched from IF = 50 mA;  
2.5  
V
tr = 20 ns; see Fig.8  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-tp  
PARAMETER  
CONDITIONS  
thermal resistance from junction to tie-point lead length 10 mm  
thermal resistance from junction to ambient lead length 10 mm; note 1  
VALUE  
240  
UNIT  
K/W  
K/W  
Rth j-a  
350  
Note  
1. Device mounted on a printed circuit-board without metallization pad.  
1996 Sep 03  
3
Philips Semiconductors  
Product specification  
High-speed diodes  
1N4148; 1N4446; 1N4448  
GRAPHICAL DATA  
MBG451  
MBG464  
300  
600  
handbook, halfpage  
handbook, halfpage  
I
I
F
F
(mA)  
(mA)  
200  
400  
(1)  
(2)  
(3)  
100  
200  
0
0
0
o
0
100  
200  
1
2
T
( C)  
V
(V)  
amb  
F
(1) Tj = 175 °C; typical values.  
(2) Tj = 25 °C; typical values.  
(3) Tj = 25 °C; maximum values.  
Device mounted on an FR4 printed-circuit board; lead length 10 mm.  
Fig.2 Maximum permissible continuous forward  
current as a function of ambient  
temperature.  
Fig.3 Forward current as a function of forward  
voltage.  
MBG704  
2
10  
I
FSM  
(A)  
10  
1
1  
10  
2
3
4
1
10  
10  
10  
10  
t
(µs)  
p
Based on square wave currents.  
Tj = 25 °C prior to surge.  
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.  
1996 Sep 03  
4
Philips Semiconductors  
Product specification  
High-speed diodes  
1N4148; 1N4446; 1N4448  
MGD290  
MGD004  
3
10  
1.2  
handbook, halfpage  
handbook, halfpage  
I
R
C
d
(µA)  
(pF)  
1.0  
2
10  
(1)  
(2)  
10  
1
0.8  
0.6  
1  
10  
2  
10  
0.4  
0
0
100  
200  
o
10  
20  
T ( C)  
V
(V)  
j
R
(1) VR = 75 V; typical values.  
(2) VR = 20 V; typical values.  
f = 1 MHz; Tj = 25 °C.  
Fig.5 Reverse current as a function of junction  
temperature.  
Fig.6 Diode capacitance as a function of reverse  
voltage; typical values.  
1996 Sep 03  
5
Philips Semiconductors  
Product specification  
High-speed diodes  
1N4148; 1N4446; 1N4448  
t
t
p
r
t
D.U.T.  
10%  
I
F
I
t
R
= 50  
F
rr  
S
SAMPLING  
t
OSCILLOSCOPE  
R = 50 Ω  
V = V  
I x R  
F S  
R
i
(1)  
90%  
V
R
MGA881  
input signal  
output signal  
(1) IR = 1 mA.  
Fig.7 Reverse recovery voltage test circuit and waveforms.  
I
1 kΩ  
450 Ω  
I
V
90%  
R
= 50 Ω  
S
OSCILLOSCOPE  
V
fr  
D.U.T.  
R = 50 Ω  
i
10%  
MGA882  
t
t
t
t
p
r
input  
signal  
output  
signal  
Fig.8 Forward recovery voltage test circuit and waveforms.  
6
1996 Sep 03  
Philips Semiconductors  
Product specification  
High-speed diodes  
1N4148; 1N4446; 1N4448  
PACKAGE OUTLINE  
a
0.56  
max  
1.85  
max  
4.25  
max  
MLA428 - 1  
25.4 min  
25.4 min  
Dimensions in mm.  
Fig.9 SOD27 (DO-35).  
DEFINITIONS  
Data Sheet Status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale  
1996 Sep 03  
7

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