2N5064T/R [NXP]

Silicon Controlled Rectifier, 0.8 A, 200 V, SCR, TO-92;


型号：	2N5064T/R
厂家：	NXP
描述：	Silicon Controlled Rectifier, 0.8 A, 200 V, SCR, TO-92 栅栅极
文件：	总6页 (文件大小：79K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ꢃDISCRETE SEMICONDUCTORSꢃ

ꢀ

ꢁꢂꢁ

ꢃ

ꢄ

ꢅꢆꢆꢂ

2N5064

Thyristor

sensitive gate

Product specification

October 1997

ꢇꢈꢉ Semiconductors

Product specification

Thyristor

sensitive gate

2N5064

GENERAL DESCRIPTION

QUICK REFERENCE DATA

Glass passivated sensitive gate

SYMBOL PARAMETER

MAX. UNIT

thyristor in

intended for use in general purpose

switching and phase control

applications. This device is intended

to be interfaced directly to

microcontrollers, logic integreated

circuits and other low power gate

trigger circuits.

plastic envelope,

V_DRM

V_RRM

I_T(AV)

I_T(RMS)

I_TSM

Repetitive peak off-state voltages

200

Average on-state current

RMS on-state current

Non-repetitive peak on-state current

0.5

0.8

PINNING - TO92 variant

PIN CONFIGURATION

SYMBOL

DESCRIPTION

anode

gate

cathode

2 1

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER

CONDITIONS

MIN. MAX. UNIT

V_DRM, V_RRMRepetitive peak off-state

voltages

200

I_T(AV)

Average on-state current half sine wave

T_c≤ 67 ˚C

0.51

0.255

0.8

T_c≤ 102 ˚C

all conduction angles

I_T(RMS)

I_TRM

RMS on-state current

Repetitive peak on-state

current

I_TSM

Non-repetitive peak

on-state current

half sine wave; T_a= 25 ˚C prior to surge;

t = 8.3 ms

T_a= 25˚C, t_p= 300μs; f = 120 Hz

I²t

I_GM

V_GM

V_RGM

P_GM

P_G(AV)

T_stg

T_j

I²t for fusing

0.4

A²s

Peak gate current

Peak gate voltage

Peak reverse gate voltage

Peak gate power

Average gate power

Storage temperature

Operating junction

temperature

T_a= 25˚C

T_a= 25˚C, over any 16 ms period

0.1

0.01

150

125

˚C

-65

October 1997

Rev 1.200

ꢀꢁꢂ Semiconductors

Product specification

Thyristor

sensitive gate

2N5064

THERMAL RESISTANCES

SYMBOL PARAMETER

CONDITIONS

see note:¹

MIN. TYP. MAX. UNIT

R_{th j-c}

Thermal resistance

junction to case

K/W

R_{th j-a}

Thermal resistance

junction to ambient

200

K/W

STATIC CHARACTERISTICS

T_c= 25 ˚C, R_GK= 1 kΩ unless otherwise stated

SYMBOL PARAMETER CONDITIONS

MIN. TYP. MAX. UNIT

I_GT

Gate trigger current

T_c= 25 ˚C

T_c= -65 ˚C

200

350

μA

V_D= V_DRM(max); R_L= 100 Ω; gate open

circuit

I_L

I_H

V_T

V_GT

Latching current

Holding current

On-state voltage

Gate trigger voltage

V_D= 12 V; R_GK= 1 kΩ

I_T= 1.2 A peak; t_p= 300 μs; δ ≤ 0.01

T_j= 25 ˚C

T_j= -65 ˚C

T_j= 125 ˚C

1.7

0.8

1.2

0.1

V_D= V_DRM(max); R_L= 100 Ω; gate open

circuit

I_D, I_R

Off-state leakage current V_D= V_DRM(max); V_R= V_RRM(max)

T_j= 25 ˚C

T_j= 125 ˚C

μA

DYNAMIC CHARACTERISTICS

T_c= 25 ˚C, R_GK= 1 kΩ unless otherwise stated

SYMBOL PARAMETER

CONDITIONS

MIN. TYP. MAX. UNIT

dV_D/dt

Critical rate of rise of

V_DM= 67% V_DRM(max); T_j= 125 ˚C;

exponential waveform; R_GK= 1 kΩ

I_TM= 2 A; V_D= V_DRM(max); I_G= 10 mA;

dI_G/dt = 0.1 A/μs

V_DM= 67% V_DRM(max); T_j= 125 ˚C;

I_TM= 1.6 A; V_R= 35 V; dI_TM/dt = 30 A/μs;

dV_D/dt = 2 V/μs; R_GK= 1 kΩ

V/μs

μs

off-state voltage

Gate controlled turn-on

time

Circuit commutated

turn-off time

t_gt

t_q

100

μs

1 This measurement is made with the case mounted "flat side down" on a heatsink and held in position by means of

a metal clamp over the curved surface.

October 1997

Rev 1.200

ꢀꢁꢂ Semiconductors

Product specification

Thyristor

sensitive gate

2N5064

MECHANICAL DATA

Dimensions in mm

Net Mass: 0.2 g

2.54

0.66

0.56

1.6

4.2 max

4.8 max

5.2 max

2.5 max

12.7 min

0.48

0.40

min

3 2 1

Fig.1. TO92; plastic envelope.

Notes

1. Epoxy meets UL94 V0 at 1/8".

October 1997

Rev 1.200

NXP Semiconductors

Legal information

DATA SHEET STATUS

DOCUMENT

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾

DEFINITION

Objective data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary data sheet

Product data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product status of device(s) described in this document may have changed since this document was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DEFINITIONS

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to information

published in this document, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereof.

Product specification ⎯ The information and data

provided in a Product data sheet shall define the

specification of the product as agreed between NXP

Semiconductors and its customer, unless NXP

Semiconductors and customer have explicitly agreed

otherwise in writing. In no event however, shall an

agreement be valid in which the NXP Semiconductors

product is deemed to offer functions and qualities beyond

those described in the Product data sheet.

Suitability for use ⎯ NXP Semiconductors products are

not designed, authorized or warranted to be suitable for

use in life support, life-critical or safety-critical systems or

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reasonably be

expected to result in personal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at

the customer’s own risk.

DISCLAIMERS

Limited warranty and liability ⎯ Information in this

document is believed to be accurate and reliable.

However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to

the accuracy or completeness of such information and

shall have no liability for the consequences of use of such

information.

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use without further testing or modification.

In no event shall NXP Semiconductors be liable for any

indirect, incidental, punitive, special or consequential

damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the

removal or replacement of any products or rework

charges) whether or not such damages are based on tort

(including negligence), warranty, breach of contract or any

other legal theory.

Customers are responsible for the design and operation of

their applications and products using NXP

Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or

customer product design. It is customer’s sole

responsibility to determine whether the NXP

Notwithstanding any damages that customer might incur

for any reason whatsoever, NXP Semiconductors’

aggregate and cumulative liability towards customer for

the products described herein shall be limited in

accordance with the Terms and conditions of commercial

sale of NXP Semiconductors.

Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as

for the planned application and use of customer’s third

party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks

associated with their applications and products.

NXP Semiconductors

Legal information

NXP Semiconductors does not accept any liability related

to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications

or products, or the application or use by customer’s third

party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and

products using NXP Semiconductors products in order to

avoid a default of the applications and the products or of

the application or use by customer’s third party

customer(s). NXP does not accept any liability in this

respect.

that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national authorities.

Quick reference data ⎯ The Quick reference data is an

extract of the product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaustive or legally binding.

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) will cause permanent damage to

the device. Limiting values are stress ratings only and

(proper) operation of the device at these or any other

conditions above those given in the Recommended

operating conditions section (if present) or the

Characteristics sections of this document is not warranted.

Constant or repeated exposure to limiting values will

permanently and irreversibly affect the quality and

reliability of the device.

Non-automotive qualified products ⎯ Unless this data

sheet expressly states that this specific NXP

Semiconductors product is automotive qualified, the

product is not suitable for automotive use. It is neither

qualified nor tested in accordance with automotive testing

or application requirements. NXP Semiconductors accepts

no liability for inclusion and/or use of non-automotive

qualified products in automotive equipment or

applications.

In the event that customer uses the product for design-in

and use in automotive applications to automotive

specifications and standards, customer (a) shall use the

product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and

specifications, and (b) whenever customer uses the

product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at

customer’s own risk, and (c) customer fully indemnifies

NXP Semiconductors for any liability, damages or failed

product claims resulting from customer design and use of

the product for automotive applications beyond NXP

Semiconductors’ standard warranty and NXP

Terms and conditions of commercial sale ⎯ NXP

Semiconductors products are sold subject to the general

terms and conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an

individual agreement is concluded only the terms and

conditions of the respective agreement shall apply. NXP

Semiconductors hereby expressly objects to applying the

customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

Semiconductors’ product specifications.

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions

and disclaimers. No changes were made to the content, except for the legal definitions and disclaimers.

Contact information

For additional information please visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without

notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or

other industrial or intellectual property rights.

Printed in The Netherlands

2N5064T/R [NXP]

相关型号：

2N5064TRB

2N5064TRE

2N5064TRG

2N5064TRH

2N5065

2N5066

2N5067

2N5067

2N5067

2N5067

2N5067

2N5067