74ABT827 [NXP]
10-bit buffer/line driver, non-inverting 3-State; 10位缓冲器/线路驱动器，非反相三态
| 型号： | 74ABT827 |
| 厂家： | 
NXP |
| 描述： | 10-bit buffer/line driver, non-inverting 3-State |
| 文件： | 总11页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
74ABT827
10-bit buffer/line driver, non-inverting
(3-State)
Product specification
Supersedes data of 1995 Sep 06
1998 Jan 16
IC23 Data Handbook
Philips
Semiconductors
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
FEATURES
DESCRIPTION
The 74ABT827 high-performance BiCMOS device combines low
static and dynamic power dissipation with high speed and high
output drive.
• Ideal where high speed, light loading, or increased fan-in are
required
• Flow through pinout architecture for microprocessor oriented
The 74ABT827 10-bit buffers provide high performance bus
interface buffering for wide data/address paths or buses carrying
parity. They have NOR Output Enables (OE0, OE1) for maximum
control flexibility.
applications
• Output capability: +64mA/–32mA
• Slim 300 mil-wide plastic 24-pin package
• Latch-up protection exceeds 500mA per Jedec Std 17
• ESD protection exceeds 2000 V per MIL STD 883 Method 3015
and 200 V per Machine Model
• Power-up 3-State
• Inputs are disabled during 3-State mode
QUICK REFERENCE DATA
CONDITIONS
= 25°C; GND = 0V
SYMBOL
PARAMETER
TYPICAL
UNIT
T
amb
t
t
Propagation delay
An to Yn
PLH
PHL
C = 50pF; V = 5V
3.0
4
ns
pF
pF
nA
L
CC
C
Input capacitance
V = 0V or V
I CC
IN
Outputs disabled;
= 0V or V
C
Output capacitance
Total supply current
7
OUT
CCZ
V
O
CC
I
Outputs disabled; V = 5.5V
500
CC
ORDERING INFORMATION
PACKAGES
TEMPERATURE RANGE OUTSIDE NORTH AMERICA
NORTH AMERICA
74ABT827 N
DWG NUMBER
SOT222-1
24-Pin Plastic DIP
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
74ABT827 N
74ABT827 D
74ABT827 DB
74ABT827 PW
24-Pin plastic SO
74ABT827 D
SOT137-1
24-Pin Plastic SSOP Type II
24-Pin Plastic TSSOP Type I
74ABT827 DB
74ABT827PW DH
SOT340-1
SOT355-1
2
1998 Jan 16
853-1618 18866
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
PIN CONFIGURATION
LOGIC SYMBOL
2
3
4
5
6
7
8
9
10 11
24
OE0
A0
A1
A2
A3
A4
A5
A6
A7
1
2
3
4
5
6
7
8
9
V
CC
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9
23 Y0
22 Y1
21 Y2
20 Y3
19 Y4
18 Y5
17 Y6
16 Y7
1
OE0
OE1
13
Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9
23 22 21 20 19 18 17 16 15 14
SA00234
FUNCTION TABLE
A8 10
A9 11
15
14
13
Y8
INPUTS
OUTPUTS
OPERATING
MODE
Transparent
Y9
OEn
L
An
L
Yn
L
GND 12
OE1
TOP VIEW
L
H
H
Z
Transparent
H
X
High impedance
SA00233
H
L
X
Z
=
=
=
=
High voltage level
Low voltage level
Don’t care
PIN DESCRIPTION
PIN NUMBER
SYMBOL
FUNCTION
High impedance “off” state
Output enable input
(active-Low)
1, 13
OE0, OE1
A0-A9
2, 3, 4, 5, 6,
7, 8, 9, 10, 11
Data inputs
23, 22, 21, 20, 19,
18, 17, 16, 15, 14
Y0-Y9
GND
Data outputs
Ground (0V)
10
20
V
CC
Positive supply voltage
LOGIC SYMBOL (IEEE/IEC)
1
&
EN1
13
2
23
22
21
20
19
18
17
16
15
14
1
3
4
5
6
7
8
9
10
11
SA00235
3
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
LOGIC DIAGRAM
A0
A1
A2
A3
A4
A5
A6
A7
A8
10
A9
11
2
3
4
5
6
7
8
9
1
OE0
OE1
13
23
Y0
22
Y1
21
Y2
20
Y3
19
Y4
18
Y5
17
Y6
16
Y7
15
Y8
14
Y9
SA00236
1, 2
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
DC supply voltage
CONDITIONS
RATING
–0.5 to +7.0
–18
UNIT
V
V
CC
IK
I
DC input diode current
V < 0
I
mA
V
3
V
I
DC input voltage
–1.2 to +7.0
–50
I
DC output diode current
V
O
< 0
mA
V
OK
3
V
DC output voltage
output in Off or High state
output in Low state
–0.5 to +5.5
128
OUT
OUT
I
DC output current
mA
°C
T
stg
Storage temperature range
–65 to 150
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.
3. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARAMETER
UNIT
Min
4.5
0
Max
V
CC
DC supply voltage
5.5
V
V
V
I
Input voltage
V
CC
V
High-level input voltage
Low-level input voltage
High-level output current
Low-level output current
Input transition rise or fall rate
2.0
V
IH
V
0.8
–32
64
V
IL
I
mA
mA
ns/V
°C
OH
I
OL
∆t/∆v
0
5
T
amb
Operating free-air temperature range
–40
+85
4
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
DC ELECTRICAL CHARACTERISTICS
LIMITS
T
= –40°C
to +85°C
amb
T
amb
= +25°C
SYMBOL
PARAMETER
TEST CONDITIONS
UNIT
Min
Typ
Max
Min
Max
V
Input clamp voltage
V
CC
V
CC
V
CC
V
CC
V
CC
= 4.5V; I = –18mA
–0.9
2.9
–1.2
–1.2
V
V
V
V
V
IK
IK
= 4.5V; I = –3mA; V = V or V
2.5
3.0
2.0
2.5
3.0
2.0
OH
I
IL
IH
IH
V
OH
High-level output voltage
Low-level output voltage
= 5.0V; I = –3mA; V = V or V
3.4
OH
I
IL
= 4.5V; I = –32mA; V = V or V
IH
2.4
OH
I
IL
V
OL
= 4.5V; I = 64mA; V = V or V
IH
0.42
0.55
0.55
OL
I
IL
I
Input leakage current
V
V
= 5.5V; V = GND or 5.5V
±0.01
±5.0
±1.0
±1.0
µA
µA
I
CC
I
I
Power-off leakage current
Power-up/down 3-State
= 0.0V; V or V ≤ 4.5V
±100
±100
OFF
CC
O
I
V
CC
V
OE
= 2.0V; V = 0.5V; V = GND or V
;
O
I
CC
CC
I
/I
±5.0
±50
±50
µA
PU PD
3
output current
= V
CC
I
3-State output High current
3-State output Low current
Output HIgh leakage current
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 5.5V; V = 2.7V; V = V or V
5.0
–5.0
5.0
–80
0.5
25
50
–50
50
50
–50
50
µA
µA
µA
mA
µA
mA
OZH
O
I
IL
IH
IH
I
= 5.5V; V = 0.5V; V = V or V
O I IL
OZL
I
= 5.5V; V = 5.5V; V = GND or V
O I
CEX
1
I
O
Output current
= 5.5V; V = 2.5V
–50
–180
250
38
–50
–180
250
38
O
I
= 5.5V; Outputs High, V = GND or V
CCH
I
CC
I
Quiescent supply current
= 5.5V; Outputs Low, V = GND or V
CCL
I
CC
= 5.5V; Outputs 3–State;
I
0.5
0.5
250
1.5
50
250
1.5
50
µA
mA
mA
mA
CCZ
V = GND or V
I
CC
Outputs enabled, one input at 3.4V, other
inputs at V or GND; V = 5.5V
CC
CC
Additional supply current per Outputs 3-State, one data input at 3.4V, other
∆I
CC
0.01
0.5
2
input pin
inputs at V or GND; V = 5.5V
CC CC
Outputs 3–State, one enable input at 3.4V,
other inputs at V or GND; V = 5.5V
1.5
1.5
CC
CC
NOTES:
1. Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
2. This is the increase in supply current for each input at 3.4V.
3. This parameter is valid for any V between 0V and 2.1V with a transition time of up to 10msec. For V = 2.1V to V = 5V " 10%, a
CC
CC
CC
transition time of up to 100µsec is permitted.
5
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
AC CHARACTERISTICS
GND = 0V, t = t = 2.5ns, C = 50pF, R = 500Ω
R
F
L
L
LIMITS
Max
T
= -40 to
+85 C
= +5.0V ±0.5V
amb
o
T
V
= +25 C
amb
CC
o
SYMBOL
PARAMETER
WAVEFORM
UNIT
= +5.0V
V
CC
Min
Typ
Min
Max
t
t
Propagation delay
An to Yn
1.1
1.1
3.0
2.9
4.4
4.1
1.1
1.1
4.8
4.7
PLH
PHL
1
2
2
ns
ns
ns
t
t
Output enable time
to High and Low level
1.6
2.6
3.7
4.6
5.1
5.9
1.6
2.6
5.9
6.9
PZH
PZL
t
t
Output disable time
from High and Low level
2.0
2.5
4.8
5.1
6.3
6.6
2.0
2.5
6.8
6.9
PHZ
PLZ
AC WAVEFORMS
V
M
= 1.5V, V = GND to 3.0V
IN
3 V
V
V
t
OEn
INPUT
M
M
1.5V
1.5V
INPUT
t
PLZ
PZL
3.5V
0 V
V
t
t
PHL
PLH
V
Yn
OUTPUT
M
V
V
+ 0.3V
OH
OL
OL
t
t
PHZ
PZH
1.5V
1.5V
V
V
OH
Yn
OUTPUT
– 0.3V
OUTPUT
OH
V
M
V
OL
0V
SA00028
SA00206
Waveform 2. Waveforms Showing the 3-State Output Enable
and Disable Times
Waveform 1. Waveforms Showing the Input (An) to Output (Yn)
Propagation Delays
TEST CIRCUIT AND WAVEFORM
7 V
500 Ω
S1
From Output
Under Test
Open
GND
500 Ω
C
= 50 pF
L
Load Circuit
TEST
S1
t
open
7 V
pd
t
/t
PLZ PZL
t
/t
open
PHZ PZH
DEFINITIONS
C
=
Load capacitance includes jig and probe capacitance;
see AC CHARACTERISTICS for value.
L
SA00012
6
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
DIP24: plastic dual in-line package; 24 leads (300 mil)
SOT222-1
7
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
8
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
9
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting (3-State)
74ABT827
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
10
1998 Jan 16
Philips Semiconductors
Product specification
10-bit buffer/line driver, non-inverting
(3-State)
74ABT827
DEFINITIONS
Data Sheet Identification
Product Status
Definition
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
Objective Specification
Formative or in Design
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Preliminary Specification
Product Specification
Preproduction Product
Full Production
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. PhilipsSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertesting
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
orsystemswheremalfunctionofaPhilipsSemiconductorsandPhilipsElectronicsNorthAmericaCorporationProductcanreasonablybeexpected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
(print code)
Date of release: July 1994
9397-750-03474
Document order number:
相关型号：
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