74AHC123A [NXP]
Dual retriggerable monostable multivibrator with reset; 双可再触发单稳多谐振荡器与重置
| 型号： | 74AHC123A |
| 厂家： | 
NXP |
| 描述： | Dual retriggerable monostable multivibrator with reset |
| 文件： | 总24页 (文件大小：115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
74AHC123A; 74AHCT123A
Dual retriggerable monostable
multivibrator with reset
Product specification
2000 Mar 15
File under Integrated Circuits, IC06
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
FEATURES
Once triggered, the basic output pulse width may be
extended by retriggering the gated active LOW-going edge
input (nA) or the active HIGH-going edge input (nB).
By repeating this process, the output pulse period
(nQ = HIGH, nQ = LOW) can be made as long as desired.
Alternatively an output delay can be terminated at any time
by a LOW-going edge on input nRD, which also inhibits the
triggering.
• ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
CDM EIA/JESD22-C101 exceeds 1000 V
• All inputs have Schmitt-trigger actions
• Inputs accept voltages higher than VCC
• For AHC only: operates with CMOS input levels
• For AHCT only: operates with TTL input levels
• Specified from −40 to +85 °C and −40 to +125 °C
• DC triggered from active HIGH or active LOW inputs
An internal connection from nRD to the input gate makes it
possible to trigger the circuit by a positive-going signal at
input nRD as shown in the function table. Figs 8 and 9
illustrate pulse control by retriggering and early reset. The
basic output pulse width is essentially determined by the
value of the external timing components REXT and CEXT
.
• Retriggerable for very long pulses up to 100% duty
When CEXT ≥ 10 nF, the typical output pulse width is
factor
defined as: tW = REXT × CEXT where tW = pulse width in ns;
EXT = external resistor in kΩ; CEXT = external capacitor
in pF. Schmitt-trigger action at all inputs makes the circuit
highly tolerant to slower input rise and fall times. The ‘123’
is identical to the ‘423’ but can be triggered via the reset
input.
• Direct reset terminates output pulse
R
• Output capability: standard (except for nREXT/CEXT).
DESCRIPTION
The 74AHC/AHCT123A are high-speed Si-gate CMOS
devices and are pin compatible with Low power Schottky
TTL (LSTTL). They are specified in compliance with
JEDEC standard no.7A.
The 74AHC/AHCT123A are dual retriggerable monostable
multivibrators with output pulse width control by three
methods. The basic pulse time is programmed by
selection of an external resistor (REXT) and capacitor
(CEXT). The external resistor and capacitor are normally
connected as shown in Fig.6.
2000 Mar 15
2
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf ≤ 3.0 ns.
TYPICAL
UNIT
AHC AHCT
SYMBOL
tPHL/tPLH
PARAMETER
propagation delay
CONDITIONS
CL = 15 pF; VCC = 5 V;
REXT = 5 kΩ; CEXT = 0 pF
nA, nB to nQ, nQ
nRD to nQ, nQ
5.1
5.6
5
5.0
5.2
3
ns
ns
pF
pF
pF
CI
input capacitance
VI = VCC or GND
CO
CPD
output capacitance
power dissipation capacitance
4
4
CL = 50 pF; f = 1 MHz; notes 1
and 2
57
58
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) × CEXT × VCC2 × fo + D × 16 × VCC where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑ (CL × VCC2 × fo) = sum of outputs;
D = duty factor in %;
CL = output load capacitance in pF;
CEXT = timing capacitance in pF;
VCC = supply voltage in Volts.
2. The condition is VI = GND to VCC
.
2000 Mar 15
3
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
FUNCTION TABLE
See note 1.
INPUTS
OUTPUTS
nRD
nA
nB
nQ
nQ
L
X
X
H
H
↑
X
H
X
L
X
X
L
L
H
H(2)
H(2)
L(2)
L(2)
(3)
(3)
(3)
(4)
↑
(4)
(4)
↓
H
H
L
Notes
1
H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
↑ = LOW-to-HIGH CP transition;
↓ = HIGH-to-LOW CP transition.
2
If the monostable multivibrator was triggered before this condition was established, the pulse will be continued as
programmed.
3
4
One HIGH-level output pulse.
One LOW-level output pulse.
ORDERING INFORMATION
TYPE NUMBER
PACKAGES
PACKAGE
TEMPERATURE
PINS
MATERIAL
CODE
RANGE
74AHC123AD
−40 to +125 °C
16
16
16
16
SO
plastic
plastic
plastic
plastic
SOT109-1
SOT403-1
SOT109-1
SOT403-1
74AHC123APW
74AHCT123AD
74AHCT123APW
TSSOP
SO
TSSOP
2000 Mar 15
4
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
PINNING
PIN
SYMBOL
DESCRIPTION
1, 9
1A, 2A
1B, 2B
trigger inputs (negative-edge triggered)
trigger inputs (positive-edge triggered)
direct reset LOW and trigger action at positive edge
outputs (active LOW)
2, 10
3, 11
4, 12
5, 13
6, 14
7, 15
8
1RD, 2RD
1Q, 2Q
2Q, 1Q
outputs (active HIGH)
2CEXT, 1CEXT
2REXT/CEXT, 1REXT/CEXT
GND
external capacitor connection
external resistor/capacitor connection
ground (0 V)
16
VCC
DC supply voltage
1C
2C
handbook, halfpage
14
6
EXT
EXT
handbook, halfpage
V
1A
1B
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CC
1R
/C
1R
2R
/C
EXT EXT
15
7
EXT EXT
/C
1R
1C
EXT EXT
D
EXT
S
1Q
1Q
1Q 13
123
Q
2Q
5
1
9
1A
2Q
2R
2B
2A
2Q
T
2A
2C
/C
D
EXT
1Q
4
Q
2
1B
2Q 12
2R
R
EXT EXT
GND
D
10 2B
3
1R
2R
D
D
MNA515
11
MNA514
Fig.1 Pin configuration.
Fig.2 Logic diagram.
2000 Mar 15
5
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
handbook, halfpage
14
15
CX
handbook, halfpage
13
4
1C
RCX
14
6
EXT
EXT
1
2
2C
/C
&
1R
2R
15
7
EXT EXT
/C
EXT EXT
3
R
S
1Q 13
Q
2Q
5
1
9
1A
6
7
T
2A
CX
1Q
4
5
RCX
Q
2
1B
2Q 12
9
R
D
10 2B
&
10
3
1R
2R
D
D
12
11
11
MNA517
R
MNA516
Fig.3 IEC logic symbol.
Fig.4 Functional diagram.
2000 Mar 15
6
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
nR /C
EXT EXT
V
CC
Q
Q
R
D
R
R
CL
CL
V
CC
V
CC
R
CL
MNA518
CL
CL
A
B
R
For minimum noise generation, it is recommended to ground pins 6 (2CEXT) and 14 (1CEXT) externally to pin 8 (GND).
Fig.5 Logic diagram (one flip-flop).
2000 Mar 15
7
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
V
handbook, halfpage
CC
R
EXT
C
EXT
to nC
EXT
(pin 14 or 6)
to nR
/C
(pin 15 or 7)
EXT EXT
MNA519
Fig.6 Timing component connections.
RECOMMENDED OPERATING CONDITIONS
74AHC
74AHCT
UNIT
SYMBOL
VCC
PARAMETER
CONDITIONS
MIN. TYP. MAX. MIN. TYP. MAX.
DC supply voltage
input voltage
2.0
0
5.0
−
5.5
4.5
0
5.0
−
5.5
V
VI
5.5
5.5
V
VO
output voltage
0
−
VCC
+85
0
−
VCC
+85
V
Tamb
operating ambient see DC and AC
temperature
−40
−40
−
+25
+25
−
−40
+25
+25
−
°C
characteristics per device
VCC = 3.3 ±0.3 V
CC = 5 ±0.5 V
VCC = 2 V
CC > 3 V
+125 −40
+125 °C
tr, tf
input rise and fall
time ratios
100
20
−
−
−
5
1
−
ns/V
V
−
−
−
20
−
ns/V
kΩ
REXT
external timing
resistor
5
−
−
V
1
−
−
−
−
kΩ
CEXT
external timing
capacitor
no limits
pF
2000 Mar 15
8
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC DC supply voltage
−0.5
−0.5
−
+7.0
+7.0
−20
±20
V
VI
input voltage
V
IIK
IOK
DC input diode current
DC output clamping diode current
VI < −0.5 V; note 1
mA
mA
VO < −0.5 V or VO > VCC + 0.5
−
V; note 1
IO
DC output sink current
DC VCC or GND current
storage temperature
−0.5 V < VO < VCC + 0.5 V
−
±25
±75
mA
mA
ICC
Tstg
PD
−
−65
−
+150 °C
500 mW
power dissipation per package
for temperature range:
−40 to +125 °C; note 2
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. For SO packages: above 70 °C the value of PD derates linearly with 8 mW/K.
For TSSOP packages: above 60 °C the value of PD derates linearly with 5.5 mW/K.
2000 Mar 15
9
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
DC CHARACTERISTICS
Family 74AHC
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
T
amb (°C)
−40 to +85 −40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
SYMBOL
PARAMETER
25
OTHER VCC (V)
VIH
HIGH-level input
voltage
2.0
3.0
5.5
2.0
3.0
5.5
2.0
3.0
4.5
3.0
1.5
2.1
3.85
−
−
−
1.5
2.1
3.85
−
−
1.5
2.1
3.85
−
−
V
V
V
V
V
V
V
V
V
V
−
−
−
−
−
−
−
−
VIL
LOW-level input
voltage
−
0.5
0.9
1.65
−
0.5
0.9
1.65
−
0.5
0.9
1.65
−
−
−
−
−
−
−
−
−
VOH
HIGH-level output VI = VIH or VIL;
voltage
1.9
2.9
4.4
2.58
2.0
3.0
4.5
−
1.9
2.9
4.4
2.48
1.9
2.9
4.4
2.40
IO = −50 µA
−
−
−
−
−
−
VI = VIH or VIL;
−
−
−
IO = −4.0 mA
VI = VIH or VIL;
4.5
3.94
−
−
3.8
−
3.70
−
V
IO = −8.0 mA
VOL
LOW-level output VI = VIH or VIL;
2.0
3.0
4.5
3.0
−
−
−
−
0
0
0
−
0.1
0.1
0.1
0.36
−
−
−
−
0.1
0.1
0.1
0.44
−
−
−
−
0.1
0.1
0.1
0.55
V
V
V
V
voltage
IO = 50 µA
VI = VIH or VIL;
IO = 4.0 mA
VI = VIH or VIL;
IO = 8.0 mA
4.5
5.5
−
−
−
−
0.36
−
0.44
−
−
0.55
V
II
input leakage
current;
VI = VCC
or GND; note 1
±0.25 −
±2.5
±10.0 µA
±2.0 µA
REXT/CEXT
input leakage
current;
nA, nB, nRD
VI = VCC or GND 5.5
−
−
−
−
±0.1
−
−
±1.0
−
−
ICC
quiescent supply VI = VCC
5.5
4.0
40
80
µA
current
or GND; IO = 0
quiescent supply VI = VCC
3
−
−
−
−
160
380
560
5
250
500
750
10
−
−
−
−
280
650
975
10
−
−
−
−
280
650
975
10
µA
µA
µA
pF
current active
or GND; note 1
4.5
5.5
−
state (per circuit)
CI
input capacitance
Note
1. Voltage on pin nREXT/CEXT = 0.5 × VCC and pin REXT/CEXT in OFF-state during test.
2000 Mar 15
10
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Family 74AHCT
Over recommended operating conditions; voltage are referenced to GND (ground = 0 V).
TEST CONDITIONS
T
amb (°C)
−40 to +85 −40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
SYMBOL
PARAMETER
25
OTHER VCC (V)
VIH
VIL
HIGH-level input
voltage
4.5 to 5.5 2.0
−
−
2.0
−
2.0
−
V
V
V
V
V
V
LOW-level input
voltage
4.5 to 5.5 −
−
0.8
−
−
0.8
−
−
0.8
−
VOH
HIGH-level output VI = VIH or VIL; 4.5
voltage
4.4
3.94
−
4.5
−
4.4
3.8
−
4.4
3.70
−
IO = −50 µA
VI = VIH or VIL; 4.5
−
−
−
IO = −8.0 mA
VOL
LOW-level output VI = VIH or VIL; 4.5
voltage
0
0.1
0.36
0.1
0.44
±2.5
0.1
0.55
IO = 50 µA
VI = VIH or VIL; 4.5
IO = 8.0 mA
−
−
−
−
II
input leakage
current;
REXT/CEXT
VI = VCC
or GND; note 1
5.5
5.5
5.5
−
−
±0.25 −
−
±10.0 µA
±2.0 µA
input leakage
current;
nA, nB, nRD
VI = VCC
or GND
−
−
−
−
±0.1
−
−
±1.0
−
−
ICC
quiescent supply VI = VCC
4.0
40
80
µA
current
or GND; IO = 0
quiescent supply VI = VCC
4.5
5.5
−
−
380
560
500
750
−
−
650
975
−
−
650
975
µA
µA
current active
or GND; note 1
state (per circuit)
CI
input capacitance
−
−
3
10
−
10
−
10
pF
Note
1. Voltage on pin nREXT/CEXT = 0.5 × VCC and pin REXT/CEXT in OFF-state during test.
2000 Mar 15
11
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
AC CHARACTERISTICS
Type 74AHC123A
GND = 0 V; tr = tf ≤ 3.0 ns.
TEST CONDITIONS
Tamb (°C)
−40 to +85 −40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
SYMBOL
PARAMETER
25
WAVEFORMS
CL
VCC = 3.0 to 3.6 V; note 1
tPHL/tPLH propagationdelay; CEXT = 0 pF;
15 pF −
7.4
8.2
6.4
20.6 1.0
22.4 1.0
15.8 1.0
24.0 1.0
26.0 1.0
18.5 1.0
27.5 1.0
29.5 1.0
22.0 1.0
26.0 ns
26.0 ns
20.0 ns
30.0 ns
32.0 ns
24.5 ns
nA, nB to nQ, nQ REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
−
nRD to nQ, nQ
REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
−
nRD to nQ, nQ
(reset)
REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
nA, nB to nQ , nQ REXT = 5 kΩ;
50 pF −
10.5 24.1 1.0
11.7 25.9 1.0
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
−
−
nRD to nQ, nQ
REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
9.2
19.3 1.0
nRD to nQ, nQ
(reset)
REXT = 5 kΩ;
see Figs 7 and 11
tW
trigger pulse
width; nA = LOW
see Fig 8
5.0
−
−
−
−
−
−
5.0
5.0
5.0
−
−
5.0
5.0
5.0
−
−
ns
ns
ns
ns
trigger pulse
width; nB = HIGH
see Fig 8
5.0
5.0
−
−
−
reset pulse width; see Fig 9
nRD = LOW
−
−
output pulse
CEXT = 28 pF;
115 240
300
300
width; nQ = HIGH; REXT = 2 kΩ;
nQ = LOW
note 3; see Figs 8,
9 and 10
EXT = 0.01 µF;
C
90
100 110
90
110
1.1
85
115
µs
REXT = 10 kΩ;
note 3; see Figs 8,
9 and 10
CEXT = 0.1 µF;
0.9
1
1.1
0.9
0.85 1.15 ms
REXT = 10 kΩ;
note 3; see Figs 8,
9 and 10
2000 Mar 15
12
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
TEST CONDITIONS
T
amb (°C)
−40 to +85 −40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
SYMBOL
PARAMETER
25
WAVEFORMS
CL
VCC = 3.0 to 3.6 V; note 1
trt
retrigger time;
nA to nB
CEXT = 100 pF;
REXT = 1 kΩ; see
Figs 8, 9 and 10
50 pF −
60
−
−
−
−
−
−
−
−
−
−
ns
CEXT = 0.01 µF;
REXT = 1 kΩ; see
Figs 8, 9 and 10
−
1.5
µs
VCC = 4.5 to 5.5 V; note 2
tPHL/tPLH propagationdelay; CEXT = 0 pF;
15 pF −
5.1
5.6
4.4
7.3
8.1
6.3
12
1.0
14.0 1.0
15.0 1.0
11.0 1.0
16.0 1.0
17.0 1.0
13.0 1.0
15.5 ns
16.5 ns
12.0 ns
17.5 ns
19.0 ns
14.5 ns
nA, nB to nQ, nQ REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
−
12.9 1.0
nRD to nQ, nQ
REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
−
9.4
14
1.0
1.0
nRD to nQ, nQ
(reset)
REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
nA, nB to nQ, nQ EXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
50 pF −
R
−
−
14.9 1.0
11.4 1.0
nRD to nQ, nQ
REXT = 5 kΩ;
see Figs 7 and 11
propagationdelay; CEXT = 0 pF;
nRD to nQ, nQ
(reset)
REXT = 5 kΩ;
see Figs 7 and 11
2000 Mar 15
13
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
TEST CONDITIONS
Tamb (°C)
−40 to +85 −40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
SYMBOL
PARAMETER
25
WAVEFORMS
CL
VCC = 4.5 to 5.5 V; note 2
tW
trigger pulse
width; nA = LOW
see Fig 8
see Fig 8
50 pF 5.0
−
−
−
−
−
−
5.0
5.0
5.0
−
−
5.0
5.0
5.0
−
−
ns
ns
ns
ns
trigger pulse
width; nB = HIGH
5.0
5.0
−
−
−
reset pulse width; see Fig 9
nRD = LOW
−
−
output pulse
CEXT = 28 pF;
100 200
240
240
width; nQ = HIGH; REXT = 2 kΩ;
nQ = LOW
note 3; see Figs 8,
9 and 10
EXT = 0.01 µF;
C
90
100 110
90
110
1.1
85
115
µs
REXT = 10 kΩ;
note 3; see
Figs 8, 9 and 10
CEXT = 0.1 µF;
0.9
1
1.1
0.9
0.85 1.15 ms
REXT = 10 kΩ;
note 3; see Figs 8,
9 and 10
trt
retrigger time;
nA to nB
CEXT = 100 pF;
REXT = 1 kΩ; see
Figs 8, 9 and 10
−
−
39
−
−
−
−
−
−
−
−
−
−
ns
CEXT = 0.01 µF;
1.2
µs
REXT = 1 kΩ; see
Figs 8, 9 and 10
Notes
1. Typical values are measured at VCC = 3.3 V and Tamb = 25 °C.
2. Typical values are measured at VCC = 5.0 V and Tamb = 25 °C.
3. For CEXT ≥ 10 nF the typical value of the pulse width tW (µs) = REXT (kΩ) × CEXT (nF).
2000 Mar 15
14
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Type 74AHCT123A
GND = 0 V; tr = tf ≤ 3.0 ns.
TEST CONDITIONS
T
amb (°C)
−40 to +85 −40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
SYMBOL
PARAMETER
25
WAVEFORMS
CL
VCC = 4.5 to 5.5 V; note 1
tPHL/tPLH propagation delay; CEXT = 0 pF;
nA, nB to nQ, nQ REXT = 5 kΩ; see
Figs 7 and 11
15 pF
−
−
−
−
−
−
5.0
5.2
4.7
7.1
7.5
6.7
12
1.0
14
1.0
15.5 ns
16.5 ns
12.0 ns
17.5 ns
18.5 ns
14.5 ns
propagation delay; CEXT = 0 pF;
12.9 1.0
15.0 1.0
nRD to nQ, nQ
REXT = 5 kΩ; see
Figs 7 and 11
propagation delay; CEXT = 0 pF;
9.4
14
1.0
1.0
11
16
1.0
1.0
nRD to nQ, nQ
(reset)
REXT = 5 kΩ; see
Figs 7 and 11
propagation delay; CEXT = 0 pF;
nA, nB to nQ, nQ EXT = 5 kΩ; see
Figs 7 and 11
propagation delay; CEXT = 0 pF;
nRD to nQ, nQ REXT = 5 kΩ; see
Figs 7 and 11
propagation delay; CEXT = 0 pF;
50 pF
R
14.9 1.0
11.4 1.0
17.0 1.0
13
1.0
nRD to nQ, nQ
(reset)
REXT = 5 kΩ; see
Figs 7 and 11
tW
trigger pulse
width; nA = LOW
see Fig 8
50 pF 5.0
−
−
−
−
−
−
5.0
5.0
5.0
−
−
5.0
5.0
5.0
−
−
ns
ns
ns
ns
trigger pulse
width; nB = HIGH
see Fig 8
5.0
5.0
−
−
−
reset pulse width; see Fig 9
nRD = LOW
−
−
output pulse width; CEXT = 28 pF;
nQ = HIGH;
nQ = LOW
100 200
100 110
240
240
REXT = 2 kΩ; note 2;
see Figs 8, 9 and 10
EXT = 0.01 µF;
C
90
90
110
1.1
85
115
µs
REXT = 10 kΩ;
note 2; see
Figs 8, 9 and 10
CEXT = 0.1 µF;
REXT = 10 kΩ;
note 2; see
0.9
1
1.1
0.9
0.85 1.15 ms
Figs 8, 9 and 10
2000 Mar 15
15
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
TEST CONDITIONS
T
amb (°C)
−40 to +85 −40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
SYMBOL
PARAMETER
25
WAVEFORMS
CL
VCC = 4.5 to 5.5 V; note 1
trt
retrigger time;
nA to nB
CEXT = 100 pF;
REXT = 1 kΩ; see
Figs 8, 9 and 10
50 pF
−
−
60
−
−
−
−
−
−
−
−
−
−
ns
CEXT = 0.01 µF;
REXT = 1 kΩ; see
Figs 8, 9 and 10
1.5
µs
Notes
1. Typical values are measured at VCC = 5.0 V and Tamb = 25 °C.
2. For CEXT ≥ 10 nF the typical value of the pulse width tW (µs) = REXT (kΩ) × CEXT (nF).
2000 Mar 15
16
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
AC WAVEFORMS
(1)
(1)
t
V
V
M
nA input
nB input
M
W
(1)
t
V
M
W
(1)
t
nR input
D
V
M
t
rt
t
PLH
W
(2)
V
V
nQ output
M
t
PHL
t
PLH
t
t
W
W
(2)
nQ output
M
t
+ t
t
PHL
W
rt
t
t
PHL
MNA520
PLH
(1)
(2)
VI INPUT
VM
VM
FAMILY
REQUIREMENTS
INPUT
OUTPUT
AHC
AHCT
GND to VCC
50% VCC
1.5 V
50% VCC
50% VCC
GND to 3.0 V
Fig.7 Input (nA, nB, nRD) to output (nQ, nQ) propagation delays, the input and output pulse widths and the input
retrigger time.
2000 Mar 15
17
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
nB input
t
W
nA input
t
t
W
rt
nQ output
t
t
W
W
t
MNA521
W
Fig.8 Output pulse control using retrigger pulse; nRD = HIGH.
nB input
nR input
D
t
W
nQ output
t
t
W
W
MNA522
Fig.9 Output pulse control using reset input nRD; nA = LOW.
18
2000 Mar 15
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
t
nA input
rt
nB input
nR input
D
nR
/C
EXT EXT
nQ output
nQ output
t
t
t
+ t
W rt
MNA523
W
W
Fig.10 Input and output timing.
S1
V
CC
open
GND
V
CC
1000 Ω
V
V
O
I
PULSE
GENERATOR
D.U.T.
C
R
L
T
MNA183
TEST
PLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
S1
t
open
VCC
Definitions for test circuit.
L = load capacitance including jig and probe capacitance (See Chapter “AC characteristics”).
C
GND
RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.11 Load circuitry for switching times.
2000 Mar 15
19
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
PACKAGE OUTLINES
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT109-1
076E07
MS-012
2000 Mar 15
20
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.10
0.65
0.25
1.0
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-04-04
99-12-27
SOT403-1
MO-153
2000 Mar 15
21
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Mar 15
22
Philips Semiconductors
Product specification
Dual retriggerable monostable multivibrator
with reset
74AHC123A;
74AHCT123A
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
suitable
suitable
suitable
suitable
suitable
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
2000 Mar 15
23
Philips Semiconductors – a worldwide company
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Philippines: Philips Semiconductors Philippines Inc.,
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For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
69
SCA
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613507/01/pp24
Date of release: 2000 Mar 15
Document order number: 9397 750 06696
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