74AHC132PW-Q100 [NXP]
IC NAND GATE, Gate;型号: | 74AHC132PW-Q100 |
厂家: | NXP |
描述: | IC NAND GATE, Gate 栅 光电二极管 逻辑集成电路 |
文件: | 总18页 (文件大小:154K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
Rev. 1 — 8 November 2013
Product data sheet
1. General description
The 74AHC132-Q100; 74AHCT132-Q100 is a high-speed Si-gate CMOS device and is
pin compatible with Low-power Schottky TTL (LSTTL). It is specified in compliance with
JEDEC standard No. 7-A.
The 74AHC132-Q100; 74AHCT132-Q100 contains four 2-input NAND gates which accept
standard input signals. They can transform slowly changing input signals into sharply
defined, jitter free output signals. The gate switches at different points for positive-going
and negative-going signals. The difference between the positive voltage VT+ and the
negative VT is defined as the hysteresis voltage VH.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
Balanced propagation delays
Inputs accept voltages higher than VCC
Input levels:
For 74AHC132-Q100: CMOS level
For 74AHCT132-Q100: TTL level
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V
Multiple package options
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74AHC132D-Q100
74AHCT132D-Q100
40 C to +125 C
SO14
plastic small outline package; 14 leads;
body width 3.9 mm
SOT108-1
74AHC132PW-Q100 40 C to +125 C
TSSOP14
plastic thin shrink small outline package; 14 leads; SOT402-1
body width 4.4 mm
74AHCT132PW-Q100
74AHC132BQ-Q100
74AHCT132BQ-Q100
40 C to +125 C
DHVQFN14 plastic dual in-line compatible thermal enhanced SOT762-1
very thin quad flat package; no leads;
14 terminals; body 2.5 3 0.85 mm
4. Functional diagram
1A
1
1Y
2Y
3Y
4Y
3
1B
2
2A
4
1
&
6
3
2B
5
2
4
&
&
&
3A
9
6
8
5
8
3B
10
9
10
4A
12
12
13
11
11
4B
13
mna407
mna408
Fig 1. Logic symbol
Fig 2. IEC logic symbol
A
B
Y
mna409
Fig 3. Logic diagram (one Schmitt trigger)
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
2 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
5. Pinning information
5.1 Pinning
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(1) The die substrate is attached to this pad using
conductive die attach material. It cannot be used as a
supply pin or input.
Fig 4. Pin configuration SO14 and TSSOP14
Fig 5. Pin configuration DHVQFN14
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
1A, 2A, 3A, 4A
1B, 2B, 3B, 4B
1Y, 2Y, 3Y, 4Y
GND
1, 4, 9, 12
2, 5, 10, 13
3, 6, 8, 11
7
data input nA
data input nB
data output nY
ground (0 V)
supply voltage
VCC
14
6. Functional description
Table 3.
Function table[1]
Input
nA
L
Output
nB
L
nY
H
L
H
L
H
H
H
H
H
L
[1] H = HIGH voltage level;
L = LOW voltage level.
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
3 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
0.5
0.5
20
20
25
-
Max
+7.0
+7.0
-
Unit
V
VCC
VI
supply voltage
input voltage
V
[1]
[1]
IIK
input clamping current
output clamping current
output current
VI < 0.5 V
mA
mA
mA
mA
mA
C
IOK
IO
VO <0.5 V or VO > VCC + 0.5 V
VO =0.5 V to (VCC + 0.5 V)
+20
+25
+75
-
ICC
IGND
Tstg
Ptot
supply current
ground current
75
65
-
storage temperature
total power dissipation
+150
500
[2]
Tamb = 40 C to +125 C
mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For SO14 package: above 70 C the value of Ptot derates linearly at 8 mW/K.
For TSSOP14 package: above 60 C the value of Ptot derates linearly at 5.5 mW/K.
For DHVQFN14 package: above 60 C the value of Ptot derates linearly at 4.5 mW/K.
8. Recommended operating conditions
Table 5.
Operating conditions
Symbol Parameter
74AHC132-Q100
Conditions
Min
Typ
Max
Unit
VCC
VI
supply voltage
2.0
5.0
5.5
V
input voltage
0
-
5.5
V
VO
output voltage
0
-
VCC
+125
100
20
V
Tamb
t/V
ambient temperature
input transition rise and fall rate
40
+25
C
ns/V
ns/V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
-
-
-
-
74AHCT132-Q100
VCC
VI
supply voltage
4.5
0
5.0
5.5
V
input voltage
-
5.5
V
VO
output voltage
0
-
VCC
+125
20
V
Tamb
t/V
ambient temperature
input transition rise and fall rate
40
-
+25
-
C
ns/V
VCC = 4.5 V to 5.5 V
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
4 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 C
Min Typ
40 C to +85 C 40 C to +125 C Unit
Max
Min
Max
Min
Max
74AHC132-Q100
VOH
HIGH-level
VI = VT+ or VT
output voltage
IO = 50 A; VCC = 2.0 V
IO = 50 A; VCC = 3.0 V
IO = 50 A; VCC = 4.5 V
1.9
2.9
4.4
2.0
3.0
4.5
-
-
-
-
-
-
1.9
2.9
2.2
3.15
3.85
-
1.9
2.9
-
-
-
-
-
V
V
V
V
V
4.4
4.4
IO = 4.0 mA; VCC = 3.0 V 2.58
IO = 8.0 mA; VCC = 4.5 V 3.94
VI = VT+ or VT
2.48
3.80
2.40
3.70
-
-
VOL
LOW-level
output voltage
IO = 50 A; VCC = 2.0 V
IO = 50 A; VCC = 3.0 V
IO = 50 A; VCC = 4.5 V
IO = 4.0 mA; VCC = 3.0 V
IO = 8.0 mA; VCC = 4.5 V
-
-
-
-
-
-
0
0
0
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
V
V
0.1
0.1
0.1
V
0.36
0.36
0.1
0.44
0.44
1.0
0.55
0.55
2.0
V
-
V
II
input leakage VI = 5.5 V or GND;
current VCC = 0 V to 5.5 V
-
A
ICC
CI
CO
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
-
-
2.0
10
-
-
-
-
20
10
-
-
-
-
40
10
-
A
pF
pF
input
VI = VCC or GND
3
4
capacitance
output
capacitance
74AHCT132-Q100
VOH
HIGH-level
output voltage
VI = VT+ or VT; VCC = 4.5 V
IO = 50 A
4.4
4.5
-
-
-
4.4
-
-
4.4
-
-
V
V
IO = 8.0 mA
3.94
3.80
3.70
VOL
LOW-level
output voltage
VI = VT+ or VT; VCC = 4.5 V
IO = 50 A
-
-
-
0
-
0.1
0.36
0.1
-
-
-
0.1
0.44
1.0
-
-
-
0.1
0.55
2.0
V
IO = 8.0 mA
V
II
input leakage VI = 5.5 V or GND;
current CC = 0 V to 5.5 V
-
A
V
ICC
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
-
-
2.0
-
-
20
-
-
40
A
additional
per input pin;
1.35
1.5
1.5
mA
supply current VI = VCC 2.1 V; other pins
at VCC or GND; IO = 0 A;
VCC = 4.5 V to 5.5 V
CI
input
capacitance
VI = VCC or GND
-
-
3
4
10
-
-
-
10
-
-
-
10
-
pF
pF
CO
output
capacitance
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
5 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 7.
Symbol Parameter Conditions
74AHC132-Q100
25 C
Min Typ[1] Max
40 C to +85 C 40 C to +125 C Unit
Min
Max
Min
Max
[2]
tpd
propagation nA, nB to nY; see Figure 6
delay
VCC = 3.0 V to 3.6 V
CL = 15 pF
-
-
4.4 11.9
6.2 15.4
1.0
1.0
14.0
17.5
1.0
1.0
15.0
19.5
ns
ns
CL = 50 pF
VCC = 4.5 V to 5.5 V
CL = 15 pF
-
-
-
3.3
4.7
11
7.7
9.7
-
1.0
1.0
-
9.0
11.0
-
1.0
1.0
-
10.0
12.5
-
ns
ns
pF
CL = 50 pF
[3]
[2]
CPD
power
dissipation
capacitance
fi = 1 MHz; VI = GND to VCC
74AHCT132-Q100
tpd
propagation nA, nB to nY; see Figure 6
delay
VCC = 4.5 V to 5.5 V
CL = 15 pF
CL = 50 pF
-
-
-
3.5
5.0
14
7.0
8.0
-
1.0
1.0
-
8.0
9.0
-
1.0
1.0
-
9.0
10.0
-
ns
ns
pF
[3]
CPD
power
fi = 1 MHz; VI = GND to VCC
dissipation
capacitance
[1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).
[2] tpd is the same as tPLH and tPHL
[3] PD is used to determine the dynamic power dissipation (PD in W).
.
C
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of the outputs.
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
6 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
11. Waveforms
V
I
V
nA, nB input
GND
M
t
t
PHL
PLH
V
OH
V
nY output
M
V
OL
001aaa662
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Input to output propagation delays
Table 8.
Type
Measurement points
Input
VM
Output
VM
74AHC132-Q100
74AHCT132-Q100
0.5 VCC
1.5 V
0.5 VCC
0.5 VCC
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
7 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
GND
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
GND
t
W
V
CC
V
V
O
I
G
DUT
R
T
C
L
001aah768
Test data is given in Table 9.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
Fig 7. Test circuit for measuring switching times
Table 9.
Type
Test data
Input
VI
Load
Test
tr, tf
CL
74AHC132-Q100
74AHCT132-Q100
VCC
3.0 V
3.0 ns
3.0 ns
50 pF, 15 pF
50 pF, 15 pF
tPLH, tPHL
tPLH, tPHL
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
8 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
12. Transfer characteristics
Table 10. Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 C
Min Typ
40 C to +85 C 40 C to +125 C Unit
Max
Min
Max
Min
Max
74AHC132-Q100
VT+
VT
VH
positive-going threshold
voltage
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
-
-
-
-
-
-
-
-
-
-
-
2.2
3.15
3.85
-
-
-
2.2
3.15
3.85
-
-
2.2
3.15
3.85
-
V
V
V
V
V
V
V
V
V
-
-
-
-
negative-going threshold
voltage
0.9
1.35
1.65
0.3
0.4
0.5
0.9
1.35
1.65
0.3
0.4
0.5
0.9
1.35
1.65
0.25
0.35
0.45
-
-
-
-
-
-
hysteresis voltage
1.2
1.4
1.6
1.2
1.4
1.6
1.2
1.4
1.6
74AHCT132-Q100
VT+
VT
VH
positive-going threshold
voltage
VCC = 4.5 V
VCC = 5.5 V
VCC = 4.5 V
VCC = 5.5 V
VCC = 4.5 V
VCC = 5.5 V
-
-
-
-
-
-
-
1.9
2.1
-
-
1.9
2.1
-
-
1.9
2.1
-
V
V
V
V
V
V
-
-
-
negative-going threshold
voltage
0.5
0.6
0.3
0.3
0.5
0.6
0.3
0.3
0.5
0.6
0.3
0.3
-
-
-
hysteresis voltage
1.4
1.5
1.4
1.5
1.4
1.5
13. Transfer characteristics waveforms
V
O
V
T+
V
I
V
H
V
T−
V
I
V
V
O
H
V
V
T+
T−
mna207
mna208
Fig 8. Transfer characteristics
Fig 9. Definition of VT+, VT and VH
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
9 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
mna411
mna412
1.5
5
I
CC
(mA)
I
CC
(mA)
4
1
3
2
1
0
0.5
0
0
1
2
3
0
1
2
3
4
5
V (V)
I
V (V)
I
a. VCC = 3.0 V
b. VCC = 4.5 V
mna413
6
I
CC
(mA)
4
2
0
0
2
4
6
V (V)
I
c. VCC = 5.5 V
Fig 10. Typical 74AHC132-Q100 transfer characteristics
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
10 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
mna414
mna415
8
6
I
I
CC
CC
(mA)
(mA)
6
4
4
2
0
2
0
0
1
2
3
4
5
0
2
4
6
V (V)
I
V (V)
I
a. VCC = 4.5 V.
b. VCC = 5.5 V.
Fig 11. Typical 74AHCT132-Q100 transfer characteristics
14. Application information
V
V
CC
CC
R
A
Y
B
C
001aac440
1
T
1
-- ------------------------
For 74AHC132-Q100: f =
0.55 RC
1
T
1
-- ------------------------
For 74AHCT132-Q100: f =
0.60 RC
Fig 12. Relaxation oscillator
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
11 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
15. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 13. Package outline SOT108-1 (SO14)
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
12 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT402-1
MO-153
Fig 14. Package outline SOT402-1 (TSSOP14)
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
13 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
SOT762-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14
13
9
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.
0.05 0.30
0.00 0.18
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT762-1
- - -
MO-241
- - -
Fig 15. Package outline SOT762-1 (DHVQFN14)
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
14 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
16. Abbreviations
Table 11. Abbreviations
Acronym
CDM
CMOS
DUT
Description
Charged Device Model
Complementary Metal-Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
LSTTL
MIL
Low-power Schottky Transistor-Transistor Logic
Military
MM
Machine Model
17. Revision history
Table 12. Revision history
Document ID
Release date Data sheet status
20131108 Product data sheet
Change notice Supersedes
74AHC_AHCT132_Q100 v.1
-
-
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
15 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
18.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
16 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74AHC_AHCT132_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 8 November 2013
17 of 18
NXP Semiconductors
74AHC132-Q100; 74AHCT132-Q100
Quad 2-input NAND Schmitt trigger
20. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Transfer characteristics . . . . . . . . . . . . . . . . . . 9
Transfer characteristics waveforms. . . . . . . . . 9
Application information. . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
7
8
9
10
11
12
13
14
15
16
17
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 8 November 2013
Document identifier: 74AHC_AHCT132_Q100
相关型号:
74AHC132PW-T
IC AHC/VHC/H/U/V SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14, Gate
NXP
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