74AHC373_08 [NXP]

Octal D-type transparant latch; 3-state; 八路D型TRANSPARANT锁存器;三态
74AHC373_08
型号: 74AHC373_08
厂家: NXP    NXP
描述:

Octal D-type transparant latch; 3-state
八路D型TRANSPARANT锁存器;三态

锁存器
文件: 总17页 (文件大小:100K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74AHC373; 74AHCT373  
Octal D-type transparant latch; 3-state  
Rev. 03 — 20 May 2008  
Product data sheet  
1. General description  
The 74AHC373; 74AHCT373 is a high-speed Si-gate CMOS device and is pin compatible  
with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard  
No. 7-A.  
The 74AHC373; 74AHCT373 consists of eight D-type transparent latches featuring  
separate D-type inputs for each latch and 3-state true outputs for bus oriented  
applications. A latch enable input (LE) and an output enable input (OE) are common to all  
latches.  
When pin LE is HIGH, data at the Dn inputs enters the latches. In this condition the  
latches are transparent, i.e. a latch output will change state each time its corresponding  
Dn input changes. When pin LE is LOW, the latches store the information that is present  
at the Dn inputs, after a set-up time preceding the HIGH-to-LOW transition of LE.  
When pin OE is LOW, the contents of the 8 latches are available at the outputs. When  
pin OE is HIGH, the outputs go to the high-impedance OFF-state. Operation of the OE  
input does not affect the state of the latches.  
The 74AHC373; 74AHCT373 is functionally identical to the 74AHC573; 74AHCT573, but  
has a different pin arrangement.  
2. Features  
I Balanced propagation delays  
I All inputs have a Schmitt-trigger action  
I Common 3-state output enable input  
I Inputs accepts voltages higher than VCC  
I Functionally identical to the 74AHC573; 74AHCT573  
I Input levels:  
N For 74AHC373: CMOS input level  
N For 74AHCT373: TTL input level  
I ESD protection:  
N HBM EIA/JESD22-A114E exceeds 2000 V  
N MM EIA/JESD22-A115-A exceeds 200 V  
N CDM EIA/JESD22-C101C exceeds 1000 V  
I Multiple package options  
I Specified from 40 °C to +85 °C and from 40 °C to +125 °C  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range  
Name  
Description  
Version  
74AHC373  
74AHC373D  
40 °C to +125 °C  
40 °C to +125 °C  
SO20  
plastic small outline package; 20 leads;  
body width 7.5 mm  
SOT163-1  
74AHC373PW  
TSSOP20  
plastic thin shrink small outline package; 20 leads; SOT360-1  
body width 4.4 mm  
74AHCT373  
74AHCT373D  
40 °C to +125 °C  
SO20  
plastic small outline package; 20 leads;  
body width 7.5 mm  
SOT163-1  
74AHCT373PW 40 °C to +125 °C  
TSSOP20  
plastic thin shrink small outline package; 20 leads; SOT360-1  
body width 4.4 mm  
4. Functional diagram  
D0  
Q0  
2
3
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Q1  
5
4
7
Q2  
6
Q3  
8
9
LATCH  
1 TO 8  
3-STATE  
OUTPUTS  
Q4  
Q5  
Q6  
Q7  
13  
14  
17  
18  
12  
15  
16  
19  
LE  
11  
1
OE  
001aae050  
Fig 1. Functional diagram  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
2 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
1
OE  
LE  
EN  
C1  
11  
11  
3
2
1D  
D0  
Q0  
LE  
3
4
2
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
4
7
8
5
6
9
D1  
D2  
D3  
Q1  
Q2  
Q3  
5
7
6
8
9
13  
14  
17  
18  
12  
15  
16  
19  
13  
14  
17  
18  
12  
15  
16  
19  
D4  
D5  
D6  
D7  
Q4  
Q5  
Q6  
Q7  
OE  
1
001aae048  
001aae049  
Fig 2. Logic symbol  
Fig 3. IEC logic symbol  
D0  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
LATCH  
1
LATCH  
2
LATCH  
3
LATCH  
4
LATCH  
5
LATCH  
6
LATCH  
7
LATCH  
8
LE LE  
LE LE  
LE LE  
LE LE  
LE LE  
LE LE  
LE LE  
LE LE  
LE  
OE  
Q0  
Q1  
Q2  
Q3  
Q4  
Q5  
Q6  
Q7  
001aae052  
Fig 4. Logic diagram  
LE  
LE  
LE  
D
Q
LE  
001aae051  
Fig 5. Logic diagram (one latch)  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
3 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
5. Pinning information  
5.1 Pinning  
74AHC373  
74AHCT373  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE  
Q0  
V
CC  
Q7  
D7  
D6  
Q6  
Q5  
D5  
D4  
Q4  
LE  
3
D0  
4
D1  
5
Q1  
6
Q2  
7
D2  
8
D3  
9
Q3  
10  
GND  
001aai132  
Fig 6. Pin configuration SO20 and TSSOP20  
5.2 Pin description  
Table 2.  
Symbol  
OE  
Pin description  
Pin  
1
Description  
3-state output enable input (active LOW)  
3-state latch output  
data input  
Q0  
2
D0  
3
D1  
4
data input  
Q1  
5
3-state latch output  
3-state latch output  
data input  
Q2  
6
D2  
7
D3  
8
data input  
Q3  
9
3-state latch output  
ground (0 V)  
GND  
LE  
10  
11  
12  
13  
14  
15  
16  
17  
latch enable input (active HIGH)  
3-state latch output  
data input  
Q4  
D4  
D5  
data input  
Q5  
3-state latch output  
3-state latch output  
data input  
Q6  
D6  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
4 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
Table 2.  
Symbol  
D7  
Pin description …continued  
Pin  
18  
19  
20  
Description  
data input  
Q7  
3-state latch output  
supply voltage  
VCC  
6. Functional description  
Table 3.  
Function table[1]  
Operating mode  
Control  
Input  
Internal  
latch  
Output  
OE  
LE  
Dn  
L
Q0 to Q7  
Enable and read register (transparent mode)  
Latch and read register  
L
H
L
L
H
l
H
L
H
L
L
L
h
H
X
X
H
Z
Z
Latch register and disable outputs  
H
X
X
X
[1] H = HIGH voltage level;  
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW LE transition;  
L = LOW voltage level;  
l = LOW voltage level one set-up time prior to the HIGH-to-LOW LE transition;  
X = don’t care;  
Z = high-impedance OFF-state.  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
0.5  
0.5  
20  
20  
25  
-
Max  
+7.0  
+7.0  
-
Unit  
V
supply voltage  
input voltage  
V
[1]  
[1]  
IIK  
input clamping current  
output clamping current  
output current  
VI < 0.5 V  
mA  
mA  
mA  
mA  
mA  
°C  
IOK  
VO < 0.5 V or VO > VCC + 0.5 V  
VO = 0.5 V to (VCC + 0.5 V)  
+20  
+25  
+75  
-
IO  
ICC  
supply current  
IGND  
Tstg  
Ptot  
ground current  
75  
65  
-
storage temperature  
total power dissipation  
+150  
500  
[2]  
Tamb = 40 °C to +125 °C  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For SO20 packages: above 70 °C the value of Ptot derates linearly at 8 mW/K.  
For TSSOP20 packages: above 60 °C the value of Ptot derates linearly at 5.5 mW/K.  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
5 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
8. Recommended operating conditions  
Table 5.  
Symbol  
74AHC373  
VCC  
Operating conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
2.0  
5.0  
5.5  
V
VI  
input voltage  
0
-
5.5  
V
VO  
output voltage  
0
-
VCC  
+125  
100  
20  
V
Tamb  
ambient temperature  
input transition rise and fall rate  
40  
+25  
°C  
ns/V  
ns/V  
t/V  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
-
-
-
-
74AHCT373  
VCC  
VI  
supply voltage  
4.5  
0
5.0  
5.5  
V
input voltage  
-
5.5  
V
VO  
output voltage  
0
-
VCC  
+125  
20  
V
Tamb  
t/V  
ambient temperature  
input transition rise and fall rate  
40  
-
+25  
-
°C  
ns/V  
VCC = 4.5 V to 5.5 V  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
74AHC373  
VIH  
HIGH-level  
input voltage  
VCC = 2.0 V  
1.5  
-
-
-
-
-
-
-
-
1.5  
-
-
1.5  
-
-
V
V
V
V
V
V
VCC = 3.0 V  
2.1  
2.1  
2.1  
VCC = 5.5 V  
3.85  
-
3.85  
-
3.85  
-
VIL  
LOW-level  
input voltage  
VCC = 2.0 V  
-
-
-
0.5  
0.9  
1.65  
-
-
-
0.5  
0.9  
1.65  
-
-
-
0.5  
0.9  
1.65  
VCC = 3.0 V  
VCC = 5.5 V  
VOH  
HIGH-level  
VI = VIH or VIL  
output voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
VI = VIH or VIL  
1.9  
2.9  
2.0  
3.0  
4.5  
-
-
-
-
-
-
1.9  
2.9  
-
-
-
-
-
1.9  
2.9  
-
-
-
-
-
V
V
V
V
V
4.4  
4.4  
4.4  
2.58  
3.94  
2.48  
3.80  
2.40  
3.70  
-
VOL  
LOW-level  
output voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
0
0
0
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
0.1  
0.1  
V
V
V
V
V
0.1  
0.1  
0.1  
0.36  
0.36  
0.44  
0.44  
0.55  
0.55  
-
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
6 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
IOZ  
OFF-state  
VI = VIH or VIL;  
-
-
±0.2  
-
±2.5  
-
±10.0 µA  
output current VO = VCC or GND;  
CC = 5.5 V  
5
V
II  
input leakage VI = VCC or GND;  
current CC = 0 V to 5.5 V  
-
-
-
-
-
-
0.1  
4.0  
10  
-
-
-
-
-
1.0  
40  
10  
-
-
-
-
-
2.0  
80  
10  
10  
µA  
µA  
pF  
pF  
V
ICC  
CI  
CO  
supply current VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
input  
VI = VCC or GND  
3
4
capacitance  
output  
capacitance  
74AHCT373  
VIH  
HIGH-level  
input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
-
-
-
2.0  
-
-
2.0  
-
-
V
V
VIL  
LOW-level  
0.8  
0.8  
0.8  
input voltage  
VOH  
HIGH-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 50 µA  
4.4  
4.5  
-
-
-
4.4  
-
-
4.4  
-
-
V
V
IO = 8.0 mA  
3.94  
3.80  
3.70  
VOL  
LOW-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 50 µA  
-
-
-
0
-
0.1  
-
-
-
0.1  
-
-
-
0.1  
V
V
IO = 8.0 mA  
0.36  
0.44  
±2.5  
0.55  
IOZ  
OFF-state  
VI = VIH or VIL;  
-
±0.2  
±10.0 µA  
output current VO = VCC or GND per input  
pin; other inputs at VCC or  
5
GND; IO = 0 A; VCC = 5.5 V  
II  
input leakage VI = 5.5 V or GND;  
-
-
-
-
-
-
0.1  
4.0  
-
-
-
1.0  
40  
-
-
-
2.0  
80  
µA  
µA  
µA  
current  
supply current VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
per input pin;  
supply current VI = VCC 2.1 V; other pins at  
VCC = 0 V to 5.5 V  
ICC  
ICC  
V
additional  
1.35  
1.5  
1.5  
V
V
CC or GND; IO = 0 A;  
CC = 4.5 V to 5.5 V  
CI  
input  
capacitance  
VI = VCC or GND  
-
-
3
4
10  
-
-
-
10  
-
-
-
10  
10  
pF  
pF  
CO  
output  
capacitance  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
7 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11.  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min Typ[1] Max  
Min  
Max  
Min  
Max  
74AHC373  
[2]  
[2]  
[3]  
[4]  
tpd  
propagation Dn to Qn; see Figure 7  
delay  
VCC = 3.0 V to 3.6 V  
CL = 15 pF  
CL = 50 pF  
-
-
6.0  
7.8  
11.4  
14.9  
1.0  
1.0  
13.5  
17.0  
1.0  
1.0  
14.5  
19.0  
ns  
ns  
VCC = 4.5 V to 5.5 V  
CL = 15 pF  
-
-
4.0  
5.3  
7.2  
9.2  
1.0  
1.0  
8.5  
1.0  
1.0  
9.0  
ns  
ns  
CL = 50 pF  
10.5  
11.5  
LE to Qn; see Figure 8  
VCC = 3.0 V to 3.6 V  
CL = 15 pF  
-
-
6.3  
8.3  
11.0  
14.5  
1.0  
1.0  
13.0  
16.5  
1.0  
1.0  
14.0  
18.5  
ns  
ns  
CL = 50 pF  
VCC = 4.5 V to 5.5 V  
CL = 15 pF  
-
-
4.3  
5.6  
7.2  
9.7  
1.0  
1.0  
8.5  
1.0  
1.0  
9.0  
ns  
ns  
CL = 50 pF  
11.1  
12.5  
ten  
enable time  
OE to Qn; see Figure 9  
VCC = 3.0 V to 3.6 V  
CL = 15 pF  
-
-
5.6  
7.5  
11.4  
14.9  
1.0  
1.0  
13.5  
17.0  
1.0  
1.0  
14.5  
19.0  
ns  
ns  
CL = 50 pF  
VCC = 4.5 V to 5.5 V  
CL = 15 pF  
-
-
3.8  
5.2  
8.1  
1.0  
1.0  
9.5  
1.0  
1.0  
10.5  
13.0  
ns  
ns  
CL = 50 pF  
10.1  
11.5  
tdis  
disable time OE to Qn; see Figure 9  
VCC = 3.0 V to 3.6 V  
CL = 15 pF  
-
-
5.6  
9.2  
10.0  
13.3  
1.0  
1.0  
12.0  
15.0  
1.0  
1.0  
13.0  
17.0  
ns  
ns  
CL = 50 pF  
VCC = 4.5 V to 5.5 V  
CL = 15 pF  
-
-
4.3  
6.4  
7.2  
9.2  
1.0  
1.0  
8.5  
1.0  
1.0  
9.5  
ns  
ns  
CL = 50 pF  
10.5  
11.5  
tW  
pulse width  
set-up time  
LE HIGH or LOW;  
see Figure 8  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
Dn to LE; see Figure 10  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
5.0  
5.0  
-
-
-
-
5.0  
5.0  
-
-
5.0  
5.0  
-
-
ns  
ns  
tsu  
4.0  
4.0  
-
-
-
-
4.0  
4.0  
-
-
4.0  
4.0  
-
-
ns  
ns  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
8 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
Table 7.  
Dynamic characteristics …continued  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 11.  
Symbol Parameter  
Conditions  
25 °C  
40 °C to +85 °C 40 °C to +125 °C Unit  
Min Typ[1] Max  
Min  
Max  
Min  
Max  
th  
hold time  
Dn to LE; see Figure 10  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
1.0  
1.0  
-
-
-
-
-
-
1.0  
1.0  
-
-
-
-
1.0  
1.0  
-
-
-
-
ns  
ns  
pF  
[5]  
[4]  
CPD  
power  
dissipation  
capacitance  
fi = 1 MHz;  
VI = GND to VCC  
10  
74AHCT373; VCC = 4.5 V to 5.5 V  
tpd  
propagation Dn to Qn; see Figure 7  
delay  
CL = 15 pF  
CL = 50 pF  
-
-
4.0  
5.2  
8.5  
9.5  
1.0  
1.0  
9.5  
1.0  
1.0  
11.0  
12.0  
ns  
ns  
10.5  
LE to Qn; see Figure 8  
CL = 15 pF  
[4]  
[4]  
-
-
4.3  
5.5  
12.3  
13.3  
1.0  
1.0  
13.5  
14.5  
1.0  
1.0  
15.5  
17.0  
ns  
ns  
CL = 50 pF  
ten  
enable time  
OE to Qn; see Figure 9  
CL = 15 pF  
-
-
4.0  
5.2  
10.9  
11.9  
1.0  
1.0  
12.5  
13.5  
1.0  
1.0  
14.0  
15.0  
ns  
ns  
CL = 50 pF  
tdis  
disable time OE to Qn; see Figure 9  
CL = 15 pF  
-
4.4  
6.5  
-
10.2  
1.0  
1.0  
6.5  
3.5  
1.5  
-
11.0  
1.0  
1.0  
6.5  
3.5  
1.5  
-
13.0  
ns  
ns  
ns  
ns  
ns  
pF  
CL = 50 pF  
-
11.2  
12.0  
14.0  
[4]  
[5]  
tW  
pulse width  
set-up time  
hold time  
LE HIGH; see Figure 8  
Dn to LE; see Figure 10  
Dn to LE; see Figure 10  
6.5  
3.5  
1.5  
-
-
-
-
-
-
-
-
-
-
-
-
-
tsu  
th  
-
-
CPD  
power  
fi = 1 MHz;  
12  
dissipation  
capacitance  
VI = GND to VCC  
[1] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).  
[2] tpd is the same as tPHL and tPLH  
[3] ten is the same as tPZH and tPZL  
[4] tdis is the same as tPHZ and tPLZ  
.
.
.
[5] CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
9 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
11. Waveforms  
V
I
V
M
Dn input  
GND  
t
t
PLH  
PHL  
V
OH  
V
Qn output  
M
mna811  
V
OL  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 7. Data input to output propagation delays  
1/f  
max  
V
I
LE input  
V
M
GND  
t
W
t
t
PLH  
PHL  
V
OH  
V
M
Qn output  
mna812  
V
OL  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 8. Latch enable pulse width and input to output propagation delays  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
10 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
V
I
OE input  
V
M
t
GND  
t
PLZ  
PZL  
V
CC  
Qn output  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
X
V
OL  
t
t
PZH  
PHZ  
V
OH  
V
Y
Qn output  
V
HIGH-to-OFF  
OFF-to-HIGH  
M
GND  
outputs  
enabled  
outputs  
enabled  
outputs  
disabled  
mna813  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 9. Enable and disable times  
V
I
V
M
Dn input  
GND  
t
t
h
h
t
t
su  
su  
V
I
LE input  
V
M
GND  
mna814  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
The shaded areas indicate when the input is permitted to change for predicable output performance.  
Fig 10. Data set-up and hold times  
Table 8.  
Type  
Measurement points  
Input  
VM  
Output  
VM  
VX  
VY  
74AHC373  
0.5 × VCC  
1.5 V  
0.5 × VCC  
0.5 × VCC  
VOL + 0.3 V  
VOL + 0.3 V  
V
V
OH 0.3 V  
74AHCT373  
OH 0.3 V  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
11 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
V
CC  
CC  
V
V
O
I
R
L
S1  
G
open  
DUT  
R
T
C
L
001aad983  
Test data is given in Table 9.  
Definitions test circuit:  
RT = termination resistance should be equal to output impedance Zo of the pulse generator.  
CL = load capacitance including jig and probe capacitance.  
RL = load resistance.  
S1 = test selection switch.  
Fig 11. Test circuitry for switching times  
Table 9.  
Type  
Test data  
Input  
Load  
CL  
S1 position  
tPHL, tPLH  
open  
VI  
tr, tf  
RL  
tPZH, tPHZ  
GND  
tPZL, tPLZ  
VCC  
74AHC373  
VCC  
3.0 V  
3.0 ns  
3.0 ns  
15 pF, 50 pF 1 kΩ  
15 pF, 50 pF 1 kΩ  
74AHCT373  
open  
GND  
VCC  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
12 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
12. Package outline  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
mm  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3  
0.1  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
2.65  
0.1  
0.25  
0.01  
1.27  
0.05  
1.4  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT163-1  
075E04  
MS-013  
Fig 12. Package outline SOT163-1 (SO20)  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
13 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm  
SOT360-1  
D
E
A
X
c
H
v
M
A
y
E
Z
11  
20  
Q
A
2
(A )  
3
A
A
1
pin 1 index  
θ
L
p
L
1
10  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
6.6  
6.4  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.5  
0.2  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT360-1  
MO-153  
Fig 13. Package outline SOT360-1 (TSSOP20)  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
14 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
CDM  
CMOS  
ESD  
Description  
Charged Device Model  
Complementary Metal-Oxide Semiconductor  
ElectroStatic Discharge  
Human Body Model  
HBM  
MM  
Machine Model  
TTL  
Transistor-Transistor Logic  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
74AHC_AHCT373_3 20080520  
Product data sheet  
-
74AHC_AHCT373_2  
Modifications:  
The format of this data sheet has been redesigned to comply with the new identity guidelines of  
NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
Table 6: conditions for the input leakage current have been changed.  
74AHC_AHCT373_2 19991123  
Product specification  
-
74AHC_AHCT373_1  
74AHC_AHCT373_1 19981211  
Product specification  
-
-
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
15 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
15.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
15.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74AHC_AHCT373_3  
© NXP B.V. 2008. All rights reserved.  
Product data sheet  
Rev. 03 — 20 May 2008  
16 of 17  
74AHC373; 74AHCT373  
NXP Semiconductors  
Octal D-type transparant latch; 3-state  
17. Contents  
1
2
3
4
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
6
Functional description . . . . . . . . . . . . . . . . . . . 5  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Recommended operating conditions. . . . . . . . 6  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 16  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2008.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 20 May 2008  
Document identifier: 74AHC_AHCT373_3  

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