74AHC3G14DP-G [NXP]
Inverting Schmitt trigger - Description: Triple Inverter Schmitt-Trigger ; Logic switching levels: CMOS ; Number of pins: 8 ; Output drive capability: +/- 8 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@5V ns; Voltage: 2.0-5,5 V;
| 型号： | 74AHC3G14DP-G |
| 厂家： | 
NXP |
| 描述： | Inverting Schmitt trigger - Description: Triple Inverter Schmitt-Trigger ; Logic switching levels: CMOS ; Number of pins: 8 ; Output drive capability: +/- 8 mA ; Power dissipation considerations: Low Power or Battery Applications ; Propagation delay: 3.2@5V ns; Voltage: 2.0-5,5 V 电池 |
| 文件： | 总16页 (文件大小：97K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74AHC3G14; 74AHCT3G14
Inverting Schmitt trigger
Rev. 04 — 5 May 2009
Product data sheet
1. General description
74AHC3G14 and 74AHCT3G14 are high-speed Si-gate CMOS devices. They provide an
inverting buffer function with Schmitt trigger action. These devices are capable of
transforming slowly changing input signals into sharply defined, jitter-free output signals.
The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V.
The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
2. Features
I Symmetrical output impedance
I High noise immunity
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
N CDM JESD22-C101C exceeds 1000 V
I Low power dissipation
I Balanced propagation delays
I Multiple package options
I Specified from −40 °C to +125 °C
3. Applications
I Wave and pulse shaper for highly noisy environment
I Astable multivibrator
I Monostable multivibrator
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
4. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74AHC3G14DP
74AHCT3G14DP
74AHC3G14DC
74AHCT3G14DC
74AHC3G14GD
74AHCT3G14GD
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
VSSOP8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
XSON8U plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
5. Marking
Table 2.
Marking codes
Type number
74AHC3G14DP
74AHCT3G14DP
74AHC3G14DC
74AHCT3G14DC
74AHC3G14GD
74AHCT3G14GD
Marking code[1]
A14
C14
A14
C14
A14
C14
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
6. Functional diagram
1A
3Y
2A
1Y
3A
2Y
A
Y
001aah728
mna025
001aah729
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram
(one Schmitt trigger)
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
2 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
7. Pinning information
7.1 Pinning
74AHC3G14
74AHCT3G14
1A
3Y
1
2
3
4
8
7
6
5
V
CC
74AHC3G14
74AHCT3G14
1Y
3A
2Y
2A
1
2
3
4
8
7
6
5
1A
3Y
V
CC
1Y
3A
2Y
GND
2A
GND
001aai260
Transparent top view
001aai259
Fig 4. Pin configuration SOT505-2 (TSSOP8) and
SOT765-1 (VSSOP8)
Fig 5. Pin configuration SOT996-2 (XSON8U)
7.2 Pin description
Table 3.
Symbol
1A, 2A, 3A
GND
Pin description
Pin
Description
data input
1, 3, 6
4
ground (0 V)
data output
supply voltage
1Y, 2Y, 3Y
VCC
7, 5, 2
8
8. Functional description
Table 4.
Function table [1]
Input nA
Output nY
L
H
L
H
[1] H = HIGH voltage level; L = LOW voltage level
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
3 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
9. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
VI
Parameter
Conditions
Min
−0.5
−0.5
−20
-
Max
+7.0
+7.0
-
Unit
V
supply voltage
input voltage
V
IIK
input clamping current
output clamping current
output current
VI < −0.5 V
mA
mA
mA
mA
mA
°C
[1]
IOK
VO < −0.5 V or VO > VCC + 0.5 V
−0.5 V < VO < VCC + 0.5 V
±20
±25
75
IO
-
ICC
supply current
-
IGND
Tstg
Ptot
ground current
−75
−65
-
-
storage temperature
total power dissipation
+150
250
[2]
Tamb = −40 °C to +125 °C
mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For TSSOP8 package: above 55 °C the value of Ptot derates linearly at 2.5 mW/K.
For VSSOP8 package: above 110 °C the value of Ptot derates linearly at 8 mW/K.
For XSON8U packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
10. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions
74AHC3G14
74AHCT3G14
Unit
Min
2.0
0
Typ
5.0
-
Max
5.5
Min
4.5
0
Typ
5.0
-
Max
VCC
VI
supply voltage
input voltage
5.5
5.5
V
V
V
5.5
VO
output voltage
ambient temperature
0
-
VCC
+125
0
-
VCC
Tamb
−40
+25
−40
+25
+125 °C
11. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 °C
−40 °C to +85 °C −40 °C to +125 °C Unit
Min Typ Max
Min
Max
Min
Max
74AHC3G14
VOH
HIGH-level
VI = VT+ or VT−
output voltage
IO = −50 µA; VCC = 2.0 V
IO = −50 µA; VCC = 3.0 V
IO = −50 µA; VCC = 4.5 V
IO = −4.0 mA; VCC = 3.0 V
IO = −8.0 mA; VCC = 4.5 V
1.9
2.9
2.0
3.0
4.5
-
-
-
-
-
-
1.9
2.9
-
-
-
-
-
1.9
2.9
-
-
-
-
-
V
V
V
V
V
4.4
4.4
4.4
2.58
3.94
2.48
3.8
2.40
3.70
-
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
4 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
Table 7.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 °C
−40 °C to +85 °C −40 °C to +125 °C Unit
Min Typ Max
Min
Max
Min
Max
VOL
LOW-level
VI = VT+ or VT−
output voltage
IO = 50 µA; VCC = 2.0 V
IO = 50 µA; VCC = 3.0 V
IO = 50 µA; VCC = 4.5 V
IO = 4.0 mA; VCC = 3.0 V
IO = 8.0 mA; VCC = 4.5 V
-
-
-
-
-
-
0
0
0
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
V
V
0.1
0.1
0.1
V
0.36
0.36
0.1
0.44
0.44
1.0
0.55
0.55
2.0
V
-
V
II
input leakage VI = 5.5 V or GND;
current CC = 0 V to 5.5 V
-
µA
V
ICC
CI
supply current VI = VCC or GND; IO = 0 A;
CC = 5.5 V
-
-
-
1.0
10
-
-
10
10
-
-
40
10
µA
V
input
1.5
pF
capacitance
74AHCT3G14
VOH HIGH-level
VI = VT+ or VT−; VCC = 4.5 V
IO = −50 µA
output voltage
4.4
4.5
-
-
-
4.4
3.8
-
-
4.4
-
-
V
V
IO = −8.0 mA
3.94
3.70
VOL
LOW-level
output voltage
VI = VT+ or VT−; VCC = 4.5 V
IO = 50 µA
-
-
-
0
-
0.1
0.36
0.1
-
-
-
0.1
0.44
1.0
-
-
-
0.1
0.55
2.0
V
IO = 8.0 mA
V
II
input leakage VI = 5.5 V or GND;
current CC = 0 V to 5.5 V
-
µA
V
ICC
∆ICC
supply current VI = VCC or GND; IO = 0 A;
CC = 5.5 V
-
-
-
-
1.0
-
-
10
-
-
40
µA
V
additional
per input pin; VI = 3.4 V;
1.35
1.5
1.5
mA
supply current other inputs at VCC or GND;
IO = 0 A; VCC = 5.5 V
CI
input
-
1.5
10
-
10
-
10
pF
capacitance
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
5 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
11.1 Transfer characteristics
Table 8.
Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 8 and Figure 9.
Symbol Parameter
Conditions
25 °C
−40 °C to +85 °C −40 °C to +125 °C Unit
Min Typ Max
Min
Max
Min
Max
74AHC3G14
VT+
VT−
VH
positive-going
threshold
voltage
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
-
-
-
-
-
-
-
-
-
-
-
2.2
3.15
3.85
-
-
-
2.2
3.15
3.85
-
-
2.2
3.15
3.85
-
V
V
V
V
V
V
V
V
V
-
-
-
-
negative-going
threshold
voltage
0.9
1.35
1.65
0.3
0.4
0.5
0.9
1.35
1.65
0.3
0.4
0.5
0.9
1.35
1.65
0.25
0.35
0.45
-
-
-
-
-
-
hysteresis
voltage
1.2
1.4
1.6
1.2
1.4
1.6
1.2
1.4
1.6
74AHCT3G14
VT+
VT−
VH
positive-going
threshold
voltage
V
CC = 4.5 V
-
-
-
-
2.0
2.0
-
-
2.0
2.0
-
-
2.0
2.0
V
V
VCC = 5.5 V
negative-going
threshold
voltage
V
CC = 4.5 V
0.5
0.6
-
-
-
-
0.5
0.6
-
-
0.5
0.6
-
-
V
V
VCC = 5.5 V
hysteresis
voltage
VCC = 4.5 V
VCC = 5.5 V
0.4
0.4
-
-
1.4
1.6
0.4
0.4
1.4
1.6
0.35
0.35
1.4
1.6
V
V
12. Dynamic characteristics
Table 9.
Dynamic characteristics
GND = 0 V; tr = tf ≤ 3.0 ns; for test circuit see Figure 7.
Symbol Parameter Conditions
25 °C
−40 °C to +85 °C −40 °C to +125 °C Unit
Min Typ Max
Min
Max
Min
Max
74AHC3G14
[1]
[2]
tpd
propagation nA to nY; see Figure 6
delay
VCC = 3.0 V to 3.6 V
CL = 15 pF
CL = 50 pF
-
-
4.2 12.8
6.0 16.3
1.0
1.0
15.0
18.5
1.0
1.0
16.5
20.5
ns
ns
[3]
[4]
VCC = 4.5 V to 5.5 V
CL = 15 pF
-
-
-
3.2
4.6 10.6
10
8.6
1.0
1.0
-
10.0
12.0
-
1.0
1.0
-
11.0
13.5
-
ns
ns
pF
CL = 50 pF
CPD
power
per buffer;
-
dissipation
CL = 50 pF; fi = 1 MHz;
capacitance VI = GND to VCC
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
6 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
Table 9.
Dynamic characteristics …continued
GND = 0 V; tr = tf ≤ 3.0 ns; for test circuit see Figure 7.
Symbol Parameter Conditions
74AHCT3G14
25 °C
−40 °C to +85 °C −40 °C to +125 °C Unit
Min Typ Max
Min
Max
Min
Max
[1]
[3]
tpd
propagation nA to nY;
delay
V
CC = 4.5 V to 5.5 V
CL = 15 pF
-
-
-
4.1
5.9
12
7.0
8.5
-
1.0
1.0
-
8.0
10.0
-
1.0
1.0
-
9.0
11.0
-
ns
ns
pF
CL = 50 pF
[4]
CPD
power
per buffer;
dissipation
CL = 50 pF; fi = 1 MHz;
capacitance VI = GND to VCC
[1] tpd is the same as tPLH and tPHL
.
[2] Typical values are measured at VCC = 3.3 V.
[3] Typical values are measured at VCC = 5.0 V.
[4] CPD is used to determine the dynamic power dissipation PD (µW).
PD = CPD × VCC2 × fi + Σ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
Σ(CL × VCC2 × fo) = sum of the outputs.
13. Waveforms
V
A input
M
V
CC
t
t
PHL
PLH
V
V
O
I
PULSE
GENERATOR
DUT
C
L
Y output
V
M
R
T
mna033
mna101
The test data is given in Table 10
Test data is given in Table 10.
Definitions for test circuit:
CL = Load capacitance.
RT = Termination resistance should be equal to output
impedance Zo of the pulse generator.
Fig 6. The input (nA) to output (nY) propagation
delays
Fig 7. Load circuit for measuring switching times
Table 10. Test data
Type number
Input
Output
VI
VM
VM
74AHC3G14
GND to VCC
GND to 3.0 V
0.5 × VCC
0.5 × VCC
0.5 × VCC
74AHCT3G14
1.5 V
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
7 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
13.1 Transfer characteristic waveforms
V
O
V
T+
V
V
I
H
V
T−
V
V
H
V
I
O
V
V
T+
T−
mna027
mna026
Fig 8. Transfer characteristic
Fig 9. The definitions of VT+, VT− and VH
mna402
mna401
1.5
5
I
CC
(mA)
I
CC
(mA)
4
1
3
2
1
0
0.5
0
0
1
2
3
0
1
2
3
4
5
V (V)
I
V (V)
I
VCC = 3.0 V.
VCC = 4.5 V.
Fig 10. Typical 74AHC3G14 transfer characteristics
Fig 11. Typical 74AHC3G14 transfer characteristics
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
8 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
mna403
8
I
CC
(mA)
6
4
2
0
0
2
4
6
V (V)
I
VCC = 5.5 V.
Fig 12. Typical 74AHC3G14 transfer characteristics
mna405
mna404
8
5
I
CC
I
CC
(mA)
(mA)
4
6
3
2
1
0
4
2
0
0
1
2
3
4
5
0
2
4
6
V (V)
I
V (V)
I
VCC = 4.5 V.
VCC = 5.5 V.
Fig 13. Typical 74AHCT3G14 transfer characteristics
Fig 14. Typical 74AHCT3G14 transfer characteristics
14. Application information
The slow input rise and fall times cause additional power dissipation, which can be
calculated using the following formula:
Padd = fi × (tr × ∆ICC(AV) + tf × ∆ICC(AV)) × VCC where:
Padd = additional power dissipation (µW);
fi = input frequency (MHz);
tr = input rise time (ns); 10 % to 90 %;
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
9 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
tf = input fall time (ns); 90 % to 10 %;
∆ICC(AV) = average additional supply current (µA).
∆ICC(AV) differs with positive or negative input transitions, as shown in Figure 15
and Figure 16.
For 74AHC3G14 and 74AHCT3G14 used in relaxation oscillator circuit, see Figure 17.
Note to the application information:
1. All values given are typical unless otherwise specified.
mna058
mna036
200
200
∆I
∆I
CC(AV)
CC(AV)
(µA)
(µA)
150
100
50
150
100
50
positive-going
edge
positive-going
edge
negative-going
edge
negative-going
edge
0
0
0
2.0
4.0
6.0
0
2
4
6
V
(V)
CC
V
(V)
CC
Linear change of VI between 0.1VCC to 0.9VCC
Linear change of VI between 0.1VCC to 0.9VCC
Fig 15. Average additional ICC for 74AHC3G14 Schmitt
trigger devices
Fig 16. Average additional ICC for 74AHCT3G14
Schmitt trigger devices
R
C
mna035
1
T
1
For 74AHC3G14: f =
For 74AHCT3G14: f =
≈
--- ------------------------
0.55 × RC
1
1
≈
--- ------------------------
T
0.60 × RC
Fig 17. Relaxation oscillator using the 74AHC3G14 and 74AHCT3G14
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
10 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
15. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 18. Package outline SOT505-2 (TSSOP8)
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
11 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )
3
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
3.2
3.0
0.40
0.15
0.21
0.19
0.4
0.1
8°
0°
mm
1
0.5
0.12
0.4
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-06-07
SOT765-1
MO-187
Fig 19. Package outline SOT765-1 (VSSOP8)
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
12 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
XSON8U: plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A
1
detail X
terminal 1
index area
e
1
C
M
M
v
C
C
A
B
b
e
L
1
y
y
w
C
1
1
4
L
2
L
8
5
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
E
e
e
1
L
L
L
v
w
y
y
1
1
2
max
0.05 0.35
0.00 0.15
2.1
1.9
3.1
2.9
0.5
0.3
0.15
0.05
0.6
0.4
mm
0.5
0.5
1.5
0.1
0.05 0.05
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
07-12-18
07-12-21
SOT996-2
- - -
Fig 20. Package outline SOT996-2 (XSON8U)
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
13 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
16. Abbreviations
Table 11. Abbreviations
Acronym
CDM
CMOS
DUT
Description
Charged Device Model
Complementary Metal-Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
TTL
Transistor-Transistor Logic
17. Revision history
Table 12. Revision history
Document ID
Release date
20090505
Data sheet status
Change notice
Supersedes
74AHC_AHCT3G14_4
Modifications:
Product data sheet
-
74AHC_AHCT3G14_3
• Table 7: the conditions for HIGH-level output voltage and LOW-level output voltage have
been changed.
74AHC_AHCT3G14_3
74AHC_AHCT3G14_2
74AHC_AHCT3G14_1
20080617
20041018
20031127
Product data sheet
Product specification
Product specification
-
-
-
74AHC_AHCT3G14_2
74AHC_AHCT3G14_1
-
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
14 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
18.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74AHC_AHCT3G14_4
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 5 May 2009
15 of 16
74AHC3G14; 74AHCT3G14
NXP Semiconductors
Inverting Schmitt trigger
20. Contents
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
7
7.1
7.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Transfer characteristics. . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Transfer characteristic waveforms. . . . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
9
10
11
11.1
12
13
13.1
14
15
16
17
18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
18.1
18.2
18.3
18.4
19
20
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 May 2009
Document identifier: 74AHC_AHCT3G14_4
相关型号：
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