74ALVC74PW [NXP]
Dual D-type flip-flop with set and reset; positive-edge trigger; 双D- FL型IP- FL运算与置位和复位;正边沿触发
| 型号： | 74ALVC74PW |
| 厂家： | 
NXP |
| 描述： | Dual D-type flip-flop with set and reset; positive-edge trigger |
| 文件： | 总20页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
74ALVC74
Dual D-type flip-flop with set and
reset; positive-edge trigger
Product specification
2003 May 26
Supersedes data of 2003 Jan 24
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
FEATURES
DESCRIPTION
• Wide supply voltage range from 1.65 to 3.6 V
The 74ALVC74 is a dual positive-edge triggered, D-type
flip-flop with individual data (D), clock (CP), set (SD) and
reset (RD) inputs and complementary Q and Q outputs.
• Complies with JEDEC standard:
JESD8-7 (1.65 to 1.95 V)
JESD8-5 (2.3 to 2.7 V)
JESD8B/JESD36 (2.7 to 3.6 V).
The set and reset are asynchronous active LOW inputs
and operate independently of the clock input. Information
on the data input is transferred to the Q output on the
LOW-to-HIGH transition of the clock pulse. The D inputs
must be stable one set-up time prior to the LOW-to-HIGH
clock transition for predictable operation.
• 3.6 V tolerant inputs/outputs
• CMOS low power consumption
• Direct interface with TTL levels (2.7 to 3.6 V)
• Power-down mode
Schmitt-trigger action in the clock input makes the circuit
highly tolerant to slower clock rise and fall times.
• Latch-up performance exceeds 250 mA
• ESD protection:
HBM EIA/JESD22-A114-A exceeds 2000 V
MM EIA/JESD22-A115-A exceeds 200 V.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C.
SYMBOL
PARAMETER
CONDITIONS
TYPICAL
UNIT
ns
t
PHL/tPLH
propagation delay nCP to nQ, nQ
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ
3.7
V
V
V
CC = 2.5 V; CL = 30 pF; RL = 500 Ω 2.6
ns
CC = 2.7 V; CL = 50 pF; RL = 500 Ω 2.8
CC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.7
ns
ns
t
PHL/tPLH
propagation delay nSD, nRD to nQ, nQ
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ
3.5
ns
V
V
V
CC = 2.5 V; CL = 30 pF; RL = 500 Ω 2.5
ns
CC = 2.7 V; CL = 50 pF; RL = 500 Ω 3.1
ns
CC = 3.3 V; CL = 50 pF; RL = 500 Ω 2.3
ns
fmax
CI
maximum clock frequency
input capacitance
425
3.5
MHz
pF
pF
CPD
power dissipation capacitance per buffer
VCC = 3.3 V; notes 1 and 2
35
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
Σ(CL × VCC2 × fo) = sum of the outputs.
2. The condition is VI = GND to VCC
.
2003 May 26
2
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
ORDERING INFORMATION
PACKAGE
PACKAGE
TYPE NUMBER
TEMPERATURE
PINS
MATERIAL
CODE
RANGE
74ALVC74D
74ALVC74PW
74ALVC74BQ
−40 to +85 °C
−40 to +85 °C
−40 to +85 °C
14
14
14
SO14
plastic
plastic
plastic
SOT108-1
SOT402-1
SOT762-1
TSSOP14
DHVQFN14
FUNCTION TABLES
Table 1 See note 1
INPUT
OUTPUT
nSD
nRD
nCP
nD
nQ
nQ
L
H
L
H
L
L
X
X
X
X
X
X
H
L
L
H
H
H
Table 2 See note 1
INPUT
OUTPUT
nSD
nRD
nCP
nD
nQn+1
nQn+1
H
H
H
H
↑
↑
L
L
H
L
H
H
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
↑ = LOW-to-HIGH CP transition;
Qn+1 = state after the next LOW-to-HIGH transition of CP.
2003 May 26
3
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
PINNING
PIN
SYMBOL
DESCRIPTION
1
1RD
asynchronous reset-direct input
(active LOW)
2
3
1D
data input
handbook, halfpage
1CP
clock input (LOW-to-HIGH,
edge-triggered)
1RD
1D
1
2
3
4
5
6
7
14
13
12
11
V
CC
2RD
2D
4
1SD
asynchronous set-direct input
(active LOW)
1CP
1SD
1Q
5
6
1Q
true flip-flop output
2CP
74
1Q
complement flip-flop output
ground (0 V)
10 2SD
7
GND
2Q
1Q
9
8
2Q
2Q
8
complement flip-flop output
true flip-flop output
GND
9
2Q
MNA417
10
2SD
asynchronous set-direct input
(active LOW)
11
2CP
clock input (LOW-to-HIGH,
edge-triggered)
12
13
2D
data input
2RD
asynchronous reset-direct input
(active LOW)
Fig.1 Pin configuration SO14 and TSSOP14.
14
VCC
supply voltage
V
1RD
1
handbook, halfpage
CC
14
4 10
handbook, halfpage
1D
2
3
13 2RD
12 2D
1SD 2SD
1CP
SD
1Q
2Q
5
9
2
12
3
1D
2D
1CP
2CP
D
Q
Q
(1)
GND
1SD
1Q
4
5
6
11 2CP
10 2SD
CP
11
FF
1Q
2Q
6
8
RD
1Q
9
2Q
1RD 2RD
1 13
7
8
MNA418
GND 2Q
Top view
MDB105
(1) The die substrate is attached to this pad using conductive die
attach material. It can not be used as a supply pin or input.
Fig.2 Pin configuration DHVQFN14.
Fig.3 Logic symbol.
2003 May 26
4
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
handbook, halfpage
1SD
4
SD
1Q
1Q
1D
2
3
Q
Q
D
5
6
4
3
2
1
handbook, halfpage
S
1CP
5
6
CP
C1
FF
1D
R
RD
1RD
2SD
1
10
11
12
13
S
9
8
10
C1
SD
2Q
2Q
1D
R
2D
9
8
12
11
D
Q
Q
2CP
CP
MNA419
FF
RD
2RD
MNA420
13
Fig.4 IEC logic symbol.
Fig.5 Functional diagram.
Q
C
C
C
C
C
C
C
C
D
Q
RD
SD
CP
MNA421
C
C
Fig.6 Logic diagram (one flip-flop).
5
2003 May 26
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
RECOMMENDED OPERATING CONDITIONS
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
1.65
MAX.
3.6
UNIT
V
V
V
V
VI
input voltage
0
3.6
VCC
3.6
+85
20
VO
output voltage
VCC = 1.65 to 3.6 V
CC = 0 V; Power-down mode
0
V
0
Tamb
tr, tf
operating ambient temperature
input rise and fall times
−40
0
°C
VCC = 1.65 to 2.7 V
CC = 2.7 to 3.6 V
ns/V
ns/V
V
0
10
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCC supply voltage −0.5 +4.6
V
IIK
input diode current
input voltage
VI < 0
−
−50
mA
V
VI
−0.5
−
+4.6
±50
IOK
VO
output diode current
output voltage
VO > VCC or VO < 0
note 1
mA
V
−0.5
−0.5
−
VCC + 0.5
+4.6
±50
Power-down mode; note 2
VO = 0 to VCC
V
IO
output source or sink current
VCC or GND current
storage temperature
power dissipation
mA
mA
°C
mW
ICC, IGND
−
±100
+150
500
Tstg
Ptot
−65
−
Tamb = −40 to +85 °C; note 3
Notes
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. When VCC = 0 V (Power-down mode), the output voltage can be 3.6 V in normal operation.
3. For SO14 packages: above 70 °C the value of Ptot derates linearly with 8 mW/K.
For TSSOP14 packages: above 60 °C the value of Ptot derates linearly with 5.5 mW/K.
For DHVQFN14 packages: above 60 °C the value of Ptot derates linearly with 4.5 mW/K.
2003 May 26
6
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
DC CHARACTERISTICS
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.(1)
MAX.
UNIT
OTHER
VCC (V)
Tamb = −40 to +85 °C
VIH HIGH-level input
1.65 to 1.95 0.65 × VCC
−
−
−
−
−
−
−
−
−
V
V
V
V
V
V
voltage
2.3 to 2.7
2.7 to 3.6
1.65 to 1.95
2.3 to 2.7
2.7 to 3.6
1.7
2
VIL
LOW-level input
voltage
−
0.35 × VCC
0.7
−
−
0.8
VOL
LOW-level output
voltage
VI = VIH or VIL
IO = 100 µA
IO = 6 mA
1.65 to 3.6
1.65
2.3
−
−
−
−
−
−
−
−
0.2
0.3
0.4
0.6
0.4
0.4
0.55
V
V
V
V
V
V
V
0.11
0.17
0.25
0.16
0.23
0.30
IO = 12 mA
IO = 18 mA
2.3
IO = 12 mA
2.7
IO = 18 mA
3.0
IO = 24 mA
3.0
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = −100 µA
IO = −6 mA
1.65 to 3.6
1.65
2.3
V
CC − 0.2
−
−
V
1.25
1.8
1.7
2.2
2.4
2.2
−
1.51
2.10
2.01
2.53
2.76
2.68
±0.1
−
V
IO = −12 mA
IO = −18 mA
IO = −12 mA
IO = −18 mA
IO = −24 mA
VI = 3.6 V or GND
−
V
2.3
−
V
2.7
−
V
3.0
−
V
3.0
−
V
ILI
input leakage
current
3.6
±5
µA
Ioff
power OFF leakage VI or VO = 3.6 V
current
0.0
−
−
−
±0.1
0.2
5
±10
10
µA
µA
µA
ICC
∆ICC
quiescent supply
current
VI = VCC or GND; IO = 0 3.6
additional
VI = VCC − 0.6 V; IO = 0 3.0 to 3.6
750
quiescent supply
current per input
pin
Note
1. All typical values are measured at Tamb = 25 °C.
2003 May 26
7
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
AC CHARACTERISTICS
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.(1)
MAX.
UNIT
OTHER
VCC (V)
Tamb = −40 to +85 °C
tPHL/tPLH propagation delay
nCP to nQ, nQ
see Figs 6 and 8
1.65 to 1.95 1.0
3.7
2.6
2.8
2.7
3.4
2.4
3.2
2.3
3.5
2.5
3.1
2.3
0.9
0.6
1.3
1.3
0.9
0.9
1.0
0.7
−0.2
−0.1
−0.1
−0.1
0.6
0.8
0.5
0.4
−0.4
−0.3
−0.4
−0.1
6.2
ns
2.3 to 2.7
2.7
1.0
4.2
4.2
3.8
5.4
3.8
4.2
3.5
5.4
3.8
4.3
3.5
−
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1.0
1.0
3.0 to 3.6
tPHL/tPLH propagation delay
nSD to nQ, nQ
see Figs 7 and 8
see Figs 7 and 8
see Figs 6 and 8
1.65 to 1.95 1.0
2.3 to 2.7
2.7
1.0
1.0
1.0
3.0 to 3.6
tPHL/tPLH propagation delay
1.65 to 1.95 1.0
nRD to nQ, nQ
2.3 to 2.7
2.7
1.0
1.0
1.0
3.0 to 3.6
tW
tW
trem
tsu
th
clock pulse width
HIGH or LOW
1.65 to 1.95 2.5
2.3 to 2.7
2.7
2.5
2.5
2.5
−
−
3.0 to 3.6
−
set or reset pulse width LOW see Figs 7 and 8
1.65 to 1.95 2.5
−
2.3 to 2.7
2.7
2.5
2.5
2.5
−
−
3.0 to 3.6
−
removal time set or reset
set-up time nD to nCP
hold time nD to nCP
see Figs 7 and 8
see Figs 6 and 8
see Figs 6 and 8
1.65 to 1.95 0.7
−
2.3 to 2.7
2.7
0.7
0.7
0.7
−
−
3.0 to 3.6
−
1.65 to 1.95 1.2
−
2.3 to 2.7
2.7
1.2
0.9
0.8
−
−
3.0 to 3.6
−
1.65 to 1.95 0.6
−
2.3 to 2.7
2.7
0.6
0.7
0.8
−
−
3.0 to 3.6
−
2003 May 26
8
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
TEST CONDITIONS
SYMBOL
PARAMETER
MIN.
TYP.(1)
MAX.
UNIT
MHz
OTHER
VCC (V)
fmax
maximum clock pulse
frequency
see Figs 6 and 8
1.65 to 1.95 150
275
325
375
425
−
2.3 to 2.7
2.7
200
−
−
−
MHz
MHz
MHz
250
300
3.0 to 3.6
Note
1. All typical values are measured at Tamb = 25 °C.
AC WAVEFORMS
V
I
V
nD input
M
GND
t
t
h
h
t
t
su
su
1/f
max
V
I
V
nCP input
M
GND
t
W
t
t
PLH
PHL
V
OH
V
nQ output
nQ output
M
V
OL
V
OH
V
M
V
OL
MNA422
t
t
PHL
PLH
INPUT
VCC
VM
VI
VCC
tr = tf
1.65 to 1.95 V
2.3 to 2.7 V
2.7 V
0.5 × VCC
≤ 2.0 ns
≤ 2.0 ns
≤ 2.5 ns
≤ 2.5 ns
0.5 × VCC
1.5 V
VCC
2.7 V
2.7 V
3.0 to 3.6 V
1.5 V
Fig.6 The clock (nCP) to output (nQ, nQ) propagation delays, the clock pulse width, the nD to nCP set-up, the
nCP to nD hold times, the output transition times and the maximum clock pulse frequency.
2003 May 26
9
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
V
I
V
nCP input
M
GND
t
rem
V
I
V
nSD input
nRD input
M
GND
t
t
W
W
V
I
V
M
GND
t
t
PHL
PLH
V
OH
nQ output
nQ output
V
V
M
V
OL
V
OH
M
t
V
OL
MNA423
t
PHL
PLH
INPUT
tr = tf
VCC
VM
VI
1.65 to 1.95 V
2.3 to 2.7 V
2.7 V
0.5 × VCC
VCC
≤ 2.0 ns
≤ 2.0 ns
≤ 2.5 ns
≤ 2.5 ns
0.5 × VCC
1.5 V
VCC
2.7 V
2.7 V
3.0 to 3.6 V
1.5 V
Fig.7 The set (nSD) and reset (nRD) input to output (nQ, nQ) propagation delays, the set and reset pulse widths
and the nRD to nCP removal time.
2003 May 26
10
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
V
EXT
V
CC
R
L
V
V
O
I
PULSE
GENERATOR
D.U.T.
C
R
R
L
L
T
MNA616
VEXT
VCC
VI
VCC
CL
RL
tPLH/tPHL
tPZH/tPHZ
tPZL/tPLZ
1.65 to 1.95 V
2.3 to 2.7 V
2.7 V
30 pF
30 pF
50 pF
50 pF
1 kΩ
open
open
open
open
GND
GND
GND
GND
2 × VCC
2 × VCC
6 V
VCC
500 Ω
500 Ω
500 Ω
2.7 V
2.7 V
3.0 to 3.6 V
6 V
Definitions for test circuits:
RL = Load resistor.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.8 Load circuitry for switching times.
2003 May 26
11
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
PACKAGE OUTLINES
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
2003 May 26
12
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT402-1
MO-153
2003 May 26
13
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
SOT762-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14
13
9
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.
0.05 0.30
0.00 0.18
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT762-1
- - -
MO-241
- - -
2003 May 26
14
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
SOLDERING
To overcome these problems the double-wave soldering
method was specifically developed.
Introduction to soldering surface mount packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all the BGA packages
Manual soldering
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
volume ≥ 350 mm3 so called thick/large packages.
• below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2003 May 26
15
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended(4)(5) suitable
not recommended(6)
suitable
SSOP, TSSOP, VSO, VSSOP
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2003 May 26
16
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 May 26
17
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
NOTES
2003 May 26
18
Philips Semiconductors
Product specification
Dual D-type flip-flop with set and reset;
positive-edge trigger
74ALVC74
NOTES
2003 May 26
19
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/03/pp20
Date of release: 2003 May 26
Document order number: 9397 750 11261
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