74AUP1G157GM,115 [NXP]
74AUP1G157 - Low-power 2-input multiplexer SON 6-Pin;
| 型号： | 74AUP1G157GM,115 |
| 厂家： | 
NXP |
| 描述： | 74AUP1G157 - Low-power 2-input multiplexer SON 6-Pin 光电二极管 逻辑集成电路 |
| 文件： | 总20页 (文件大小：198K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74AUP1G157
Low-power 2-input multiplexer
Rev. 5 — 22 June 2012
Product data sheet
1. General description
The 74AUP1G157 is a single 2-input multiplexer which selects data from two data inputs
(I0 and I1) under control of a common data select input (S). The state of the common data
select input determines the particular register from which the data comes. The output (Y)
presents the selected data in the true (non-inverted) form.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF
.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; ICC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Multiple package options
Specified from −40 °C to +85 °C and −40 °C to +125 °C
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
plastic surface-mounted package; 6 leads
Version
74AUP1G157GW
74AUP1G157GM
−40 °C to +125 °C
−40 °C to +125 °C
SC-88
SOT363
XSON6
plastic extremely thin small outline package; no leads; SOT886
6 terminals; body 1 × 1.45 × 0.5 mm
74AUP1G157GF
74AUP1G157GN
74AUP1G157GS
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
XSON6
XSON6
XSON6
plastic extremely thin small outline package; no leads; SOT891
6 terminals; body 1 × 1 × 0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9 × 1.0 × 0.35 mm
SOT1115
SOT1202
extremely thin small outline package; no leads;
6 terminals; body 1.0 × 1.0 × 0.35 mm
4. Marking
Table 2.
Marking
Type number
Marking code[1]
74AUP1G157GW
74AUP1G157GM
74AUP1G157GF
74AUP1G157GN
74AUP1G157GS
aP
aP
aP
aP
aP
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
1
3
6
G1
I1 I0
6
S
3
1
1
1
MUX
Y
4
4
001aac653
001aac652
Fig 1. Logic symbol
Fig 2. IEC logic symbol
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
2 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
1
3
I1
I0
4
MULTIPLEXER
OUTPUT S
SELECTOR
Y
6
001aac655
S
Fig 3. Functional diagram
S
I1
I0
Y
001aac654
Fig 4. Logic diagram
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
3 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
6. Pinning information
6.1 Pinning
74AUP1G157
74AUP1G157
I1
GND
I0
1
2
3
6
5
4
S
V
Y
74AUP1G157
1
2
3
6
5
4
I1
GND
I0
S
V
Y
I1
GND
I0
1
2
3
6
5
4
S
V
Y
CC
CC
CC
001aae016
001aae017
001aae015
Transparent top view
Transparent top view
Fig 5. Pin configuration SOT363
Fig 6. Pin configuration SOT886
Fig 7. Pin configuration SOT891,
SOT1115 and SOT1202
6.2 Pin description
Table 3.
Pin description
Pin
Symbol
Description
I1
1
2
3
4
5
6
data input from source 1
ground (0 V)
GND
I0
data input from source 0
multiplexer output
supply voltage
Y
VCC
S
common data select input
7. Functional description
Table 4.
Function table[1]
Input
Output
S
L
I1
X
X
L
I0
L
Y
L
L
H
X
X
H
L
H
H
H
H
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care.
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
4 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
−0.5
−50
−0.5
−50
−0.5
Max
+4.6
-
Unit
V
supply voltage
input clamping current
input voltage
VI < 0 V
mA
V
[1]
[1]
VI
+4.6
-
IOK
output clamping current VO < 0 V
mA
V
VO
output voltage
Active mode and Power-down
mode
+4.6
IO
output current
VO = 0 V to VCC
-
20
50
mA
mA
mA
°C
ICC
IGND
Tstg
Ptot
supply current
-
ground current
−50
−65
-
-
storage temperature
total power dissipation
+150
250
[2]
Tamb = −40 °C to +125 °C
mW
[1] The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For SC-88 packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.
For XSON6 packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K.
9. Recommended operating conditions
Table 6.
Symbol
VCC
Recommended operating conditions
Parameter
Conditions
Min
0.8
0
Max
3.6
Unit
supply voltage
input voltage
output voltage
V
VI
3.6
V
VO
Active mode
0
VCC
3.6
V
Power-down mode; VCC = 0 V
0
V
Tamb
ambient temperature
−40
0
+125
200
°C
ns/V
Δt/ΔV
input transition rise and fall rate VCC = 0.8 V to 3.6 V
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
5 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tamb = 25 °C
VIH
HIGH-level input voltage
VCC = 0.8 V
0.70 × VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
VCC = 0.9 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 0.8 V
0.65 × VCC
-
1.6
-
2.0
-
VIL
LOW-level input voltage
-
-
-
-
0.30 × VCC
0.35 × VCC
0.7
VCC = 0.9 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
0.9
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −20 μA; VCC = 0.8 V to 3.6 V
VCC − 0.1
0.75 × VCC
1.11
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
IO = −1.1 mA; VCC = 1.1 V
IO = −1.7 mA; VCC = 1.4 V
IO = −1.9 mA; VCC = 1.65 V
IO = −2.3 mA; VCC = 2.3 V
IO = −3.1 mA; VCC = 2.3 V
IO = −2.7 mA; VCC = 3.0 V
IO = −4.0 mA; VCC = 3.0 V
VI = VIH or VIL
1.32
2.05
1.9
2.72
2.6
VOL
LOW-level output voltage
IO = 20 μA; VCC = 0.8 V to 3.6 V
IO = 1.1 mA; VCC = 1.1 V
IO = 1.7 mA; VCC = 1.4 V
IO = 1.9 mA; VCC = 1.65 V
IO = 2.3 mA; VCC = 2.3 V
IO = 3.1 mA; VCC = 2.3 V
IO = 2.7 mA; VCC = 3.0 V
IO = 4.0 mA; VCC = 3.0 V
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.1
V
0.3 × VCC
0.31
0.31
0.31
0.44
0.31
0.44
0.1
V
V
V
V
V
V
V
II
input leakage current
μA
μA
μA
IOFF
ΔIOFF
power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V
0.2
additional power-off
leakage current
VI or VO = 0 V to 3.6 V;
VCC = 0 V to 0.2 V
0.2
ICC
supply current
VI = GND or VCC; IO = 0 A;
-
-
-
-
0.5
40
μA
μA
VCC = 0.8 V to 3.6 V
[1]
ΔICC
additional supply current
VI = VCC − 0.6 V; IO = 0 A;
VCC = 3.3 V
CI
input capacitance
output capacitance
VCC = 0 V to 3.6 V; VI = GND or VCC
VO = GND; VCC = 0 V
-
-
0.8
1.7
-
-
pF
pF
CO
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
6 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +85 °C
VIH
HIGH-level input voltage
VCC = 0.8 V
0.70 × VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
VCC = 0.9 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 0.8 V
0.65 × VCC
-
1.6
-
2.0
-
VIL
LOW-level input voltage
-
-
-
-
0.30 × VCC
0.35 × VCC
0.7
VCC = 0.9 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
0.9
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −20 μA; VCC = 0.8 V to 3.6 V
VCC − 0.1
0.7 × VCC
1.03
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
IO = −1.1 mA; VCC = 1.1 V
IO = −1.7 mA; VCC = 1.4 V
IO = −1.9 mA; VCC = 1.65 V
IO = −2.3 mA; VCC = 2.3 V
IO = −3.1 mA; VCC = 2.3 V
IO = −2.7 mA; VCC = 3.0 V
IO = −4.0 mA; VCC = 3.0 V
VI = VIH or VIL
1.30
1.97
1.85
2.67
2.55
VOL
LOW-level output voltage
IO = 20 μA; VCC = 0.8 V to 3.6 V
IO = 1.1 mA; VCC = 1.1 V
IO = 1.7 mA; VCC = 1.4 V
IO = 1.9 mA; VCC = 1.65 V
IO = 2.3 mA; VCC = 2.3 V
IO = 3.1 mA; VCC = 2.3 V
IO = 2.7 mA; VCC = 3.0 V
IO = 4.0 mA; VCC = 3.0 V
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.1
V
0.3 × VCC
0.37
0.35
0.33
0.45
0.33
0.45
0.5
V
V
V
V
V
V
V
II
input leakage current
μA
μA
μA
IOFF
ΔIOFF
power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V
0.5
additional power-off
leakage current
VI or VO = 0 V to 3.6 V;
CC = 0 V to 0.2 V
0.6
V
ICC
supply current
VI = GND or VCC; IO = 0 A;
VCC = 0.8 V to 3.6 V
-
-
-
-
0.9
50
μA
μA
[1]
ΔICC
additional supply current
VI = VCC − 0.6 V; IO = 0 A;
VCC = 3.3 V
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
7 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Tamb = −40 °C to +125 °C
VIH
HIGH-level input voltage
VCC = 0.8 V
0.75 × VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
VCC = 0.9 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 0.8 V
0.70 × VCC
-
1.6
-
2.0
-
VIL
LOW-level input voltage
-
-
-
-
0.25 × VCC
0.30 × VCC
0.7
VCC = 0.9 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
0.9
VOH
HIGH-level output voltage VI = VIH or VIL
IO = −20 μA; VCC = 0.8 V to 3.6 V
VCC − 0.11 -
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
IO = −1.1 mA; VCC = 1.1 V
IO = −1.7 mA; VCC = 1.4 V
IO = −1.9 mA; VCC = 1.65 V
IO = −2.3 mA; VCC = 2.3 V
IO = −3.1 mA; VCC = 2.3 V
IO = −2.7 mA; VCC = 3.0 V
IO = −4.0 mA; VCC = 3.0 V
VI = VIH or VIL
0.6 × VCC
0.93
-
-
-
-
-
-
-
1.17
1.77
1.67
2.40
2.30
VOL
LOW-level output voltage
IO = 20 μA; VCC = 0.8 V to 3.6 V
IO = 1.1 mA; VCC = 1.1 V
IO = 1.7 mA; VCC = 1.4 V
IO = 1.9 mA; VCC = 1.65 V
IO = 2.3 mA; VCC = 2.3 V
IO = 3.1 mA; VCC = 2.3 V
IO = 2.7 mA; VCC = 3.0 V
IO = 4.0 mA; VCC = 3.0 V
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.11
V
0.33 × VCC
0.41
V
V
0.39
V
0.36
V
0.50
V
0.36
V
0.50
V
II
input leakage current
0.75
μA
μA
μA
IOFF
ΔIOFF
power-off leakage current VI or VO = 0 V to 3.6 V; VCC = 0 V
0.75
additional power-off
leakage current
VI or VO = 0 V to 3.6 V;
CC = 0 V to 0.2 V
0.75
V
ICC
supply current
VI = GND or VCC; IO = 0 A;
VCC = 0.8 V to 3.6 V
-
-
-
-
1.4
75
μA
μA
[1]
ΔICC
additional supply current
VI = VCC − 0.6 V; IO = 0 A;
VCC = 3.3 V
[1] One input at VCC − 0.6 V, other input at VCC or GND.
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
8 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9.
Symbol Parameter
Conditions
25 °C
−40 °C to +125 °C
Unit
Min Typ[1] Max
Min
Max
Max
(85 °C) (125 °C)
CL = 5 pF
[2]
[2]
[2]
[2]
tpd
propagation delay I0, I1 or S to Y; see Figure 8
VCC = 0.8 V
-
19.9
5.7
4.0
3.2
2.5
2.2
-
-
-
-
ns
ns
ns
ns
ns
ns
VCC = 1.1 V to 1.3 V
2.3
1.7
1.6
1.4
1.2
11.2
6.5
5.2
3.8
3.2
2.1
1.9
1.5
1.1
0.9
11.4
7.0
5.8
4.2
3.5
12.6
7.7
6.4
4.7
3.9
VCC = 1.4 V to 1.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
CL = 10 pF
tpd
propagation delay I0, I1 or S to Y; see Figure 8
VCC = 0.8 V
-
23.5
6.6
4.6
3.8
3.0
2.8
-
-
-
-
ns
ns
ns
ns
ns
ns
VCC = 1.1 V to 1.3 V
VCC = 1.4 V to 1.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
2.7
2.1
2.0
1.8
1.6
12.8
7.5
6.0
4.5
3.9
2.4
2.3
1.8
1.5
1.3
13.0
8.1
6.7
5.0
4.2
14.3
9.0
7.4
5.5
4.7
CL = 15 pF
tpd
propagation delay I0, I1 or S to Y; see Figure 8
VCC = 0.8 V
-
27.2
7.4
5.1
4.2
3.5
3.2
-
-
-
-
ns
ns
ns
ns
ns
ns
VCC = 1.1 V to 1.3 V
3.1
2.4
2.3
2.1
1.9
14.3
8.5
6.8
5.1
4.5
2.7
2.6
2.0
1.8
1.6
14.8
9.2
7.6
5.7
4.9
16.3
10.2
8.4
VCC = 1.4 V to 1.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
6.3
VCC = 3.0 V to 3.6 V
5.4
CL = 30 pF
tpd
propagation delay I0, I1 or S to Y; see Figure 8
VCC = 0.8 V
-
35.3
9.6
6.7
5.5
4.6
4.3
-
-
-
-
ns
ns
ns
ns
ns
ns
VCC = 1.1 V to 1.3 V
VCC = 1.4 V to 1.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
4.1
3.2
3.0
2.8
2.6
19.1
11.1
8.9
6.6
6.0
3.5
3.3
2.6
2.5
2.3
19.9
12.1
10.1
7.5
21.9
13.4
11.2
8.3
6.4
7.1
74AUP1G157
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 22 June 2012
9 of 20
74AUP1G157
NXP Semiconductors
Low-power 2-input multiplexer
Table 8.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 9.
Symbol Parameter
Conditions
25 °C
−40 °C to +125 °C
Unit
Min Typ[1] Max
Min
Max
Max
(85 °C) (125 °C)
CL = 5 pF, 10 pF, 15 pF and 30 pF
CPD power dissipation fi = 1 MHz; VI = GND to VCC
[3]
capacitance
VCC = 0.8 V
-
-
-
-
-
-
2.6
2.7
2.8
2.9
3.4
4.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
pF
pF
pF
pF
pF
pF
VCC = 1.1 V to 1.3 V
VCC = 1.4 V to 1.6 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
[1] All typical values are measured at nominal VCC
[2] tpd is the same as tPLH and tPHL
[3] PD is used to determine the dynamic power dissipation (PD in μW).
.
.
C
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of the outputs.
12. Waveforms
V
I
V
I0, I1, S input
M
GND
t
t
PLH
PHL
V
OH
Y output
V
M
V
OL
001aac658
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 8. The data inputs (I0, I1) and common data select input (S) to output (Y) propagation delays
Table 9. Measurement points
Supply voltage
VCC
Output
VM
Input
VM
VI
tr = tf
0.8 V to 3.6 V
0.5 × VCC
0.5 × VCC
VCC
≤ 3.0 ns
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V
CC
V
EXT
5 kΩ
V
V
O
I
G
DUT
R
T
C
L
R
L
001aac521
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
EXT = External voltage for measuring switching times.
V
Fig 9. Test circuit for measuring switching times
Table 10. Test data
Supply voltage
VCC
Load
VEXT
[1]
CL
RL
5 kΩ or 1 MΩ
tPLH, tPHL
open
tPZH, tPHZ
tPZL, tPLZ
0.8 V to 3.6 V
5 pF, 10 pF, 15 pF and 30 pF
GND
2 × VCC
[1] For measuring enable and disable times RL = 5 kΩ, for measuring propagation delays, set-up and hold times and pulse width
RL = 1 MΩ.
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13. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1
index
A
A
1
1
2
3
c
e
1
b
L
p
w
M B
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-08
06-03-16
SOT363
SC-88
Fig 10. Package outline SOT363 (SC-88)
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XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm
SOT886
b
1
2
3
4x
(2)
L
L
1
e
6
5
4
e
1
e
1
6x
(2)
A
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
(1)
Unit
A
A
1
b
D
E
e
e
L
L
1
1
max 0.5 0.04 0.25 1.50 1.05
0.35 0.40
0.20 1.45 1.00 0.6 0.5 0.30 0.35
0.17 1.40 0.95 0.27 0.32
mm nom
min
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
sot886_po
References
Outline
version
European
projection
Issue date
IEC
JEDEC
MO-252
JEITA
04-07-22
12-01-05
SOT886
Fig 11. Package outline SOT886 (XSON6)
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Low-power 2-input multiplexer
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm
SOT891
b
1
2
3
4×
(1)
L
L
1
e
6
5
4
e
1
e
1
6×
A
(1)
A
1
D
E
terminal 1
index area
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
A
1
UNIT
b
D
E
e
e
L
L
1
1
max max
0.20 1.05 1.05
0.12 0.95 0.95
0.35 0.40
0.27 0.32
mm
0.5 0.04
0.55 0.35
Note
1. Can be visible in some manufacturing processes.
REFERENCES
JEDEC JEITA
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
05-04-06
07-05-15
SOT891
Fig 12. Package outline SOT891 (XSON6)
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XSON6: extremely thin small outline package; no leads;
6 terminals; body 0.9 x 1.0 x 0.35 mm
SOT1115
b
3
(2)
(4×)
1
2
L
L
1
e
6
5
4
e
1
e
1
(2)
(6×)
A
1
A
D
E
terminal 1
index area
0
L
0.5
scale
1 mm
Dimensions
Unit
(1)
A
A
b
D
E
e
e
1
L
1
1
max 0.35 0.04 0.20 0.95 1.05
0.35 0.40
0.15 0.90 1.00 0.55 0.3 0.30 0.35
0.12 0.85 0.95 0.27 0.32
mm nom
min
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
sot1115_po
References
Outline
version
European
Issue date
projection
IEC
JEDEC
JEITA
10-04-02
10-04-07
SOT1115
Fig 13. Package outline SOT1115 (XSON6)
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Low-power 2-input multiplexer
XSON6: extremely thin small outline package; no leads;
6 terminals; body 1.0 x 1.0 x 0.35 mm
SOT1202
b
3
(2)
1
2
(4×)
L
L
1
e
6
5
4
e
1
e
1
(2)
(6×)
A
1
A
D
E
terminal 1
index area
0
L
0.5
1 mm
scale
Dimensions
Unit
(1)
A
A
b
D
E
e
e
1
L
1
1
max 0.35 0.04 0.20 1.05 1.05
0.35 0.40
0.15 1.00 1.00 0.55 0.35 0.30 0.35
0.12 0.95 0.95 0.27 0.32
mm nom
min
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
sot1202_po
References
Outline
version
European
Issue date
projection
IEC
JEDEC
JEITA
10-04-02
10-04-06
SOT1202
Fig 14. Package outline SOT1202 (XSON6)
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14. Abbreviations
Table 11. Abbreviations
Acronym
CDM
DUT
Description
Charged Device Model
Device Under Test
ElectroStatic Discharge
Human Body Model
Machine Model
ESD
HBM
MM
15. Revision history
Table 12. Revision history
Document ID
Release date
20120622
Data sheet status
Change notice
Supersedes
74AUP1G157 v.5
Modifications:
Product data sheet
-
74AUP1G157 v.4
• Package outline drawing of SOT886 (Figure 11) modified.
74AUP1G157 v.4
Modifications:
20111129
Product data sheet
-
74AUP1G157 v.3
• Legal pages updated.
74AUP1G157 v.3
74AUP1G157 v.2
74AUP1G157 v.1
20101028
20080205
20061109
Product data sheet
-
-
-
74AUP1G157 v.2
Product data sheet
Product data sheet
74AUP1G157 v.1
-
74AUP1G157
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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18. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 22 June 2012
Document identifier: 74AUP1G157
相关型号：
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