74F1804 [NXP]
Hex 2-input NAND drivers; 十六进制2输入与非驱动程序型号: | 74F1804 |
厂家: | NXP |
描述: | Hex 2-input NAND drivers |
文件: | 总8页 (文件大小:80K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
74F804, 74F1804
Hex 2-input NAND drivers
Product specification
IC15 Data Handbook
1990 Sep 14
Philips
Semiconductors
Philips Semiconductors
Product specification
Hex 2-input NAND drivers
74F804/1804
FEATURES
INPUT AND OUTPUT
LOADING AND FAN OUT TABLE
• High capacitive drive capability
PINS
DESCRIPTION
74F (U.L.)
LOAD VALUE
HIGH/LOW
• Choice of configuration
HIGH/LOW
1.0/0.033
2400/80
Corner V and GND – 74F804
CC
Dna – Dnb
Q0 – Q5
Data inputs
20µA/20µA
Center V and GND – 74F1804
CC
Data outputs
48mA/48mA
• Typical propagation delay of 2.5ns
NOTE: One (1.0) FAST unit load is defined as: 20µA in the high
state and 0.6mA in the low state.
TYPE
TYPICAL
PROPAGATION
DELAY
TYPICAL SUPPLY
CURRENT
( TOTAL)
74F804
2.5ns
2.5ns
9mA
9mA
74F1804
ORDERING INFORMATION
ORDER CODE
COMMERCIAL RANGE
= 5V ±10%, T = 0°C to +70°C
DESCRIPTION
PKG DWG #
V
CC
amb
20–pin plastic DIP
20–pin plastic SOL
N74F804N, N74F1804N
N74F804D, N74F1804D
SOT146-1
SOT163-1
PIN CONFIGURATION
IEC/IEEE SYMBOL
74F804
74F804
1
2
3
6
V
&
D0a
D0b
Q0
1
2
20
19
18
17
16
15
14
13
12
CC
D5b
D5a
Q5
4
3
5
D1a
D1b
Q1
4
7
9
8
5
D4b
D4a
Q4
12
13
15
16
18
19
6
11
14
7
D2a
D2b
Q2
8
D3b
D3a
9
10
11 Q3
GND
17
SF00448
SF00450
LOGIC SYMBOL
PIN CONFIGURATION
74F1804
74F804
D4b
Q5
1
2
3
4
5
6
7
8
9
20
D4a
1
2
4
5
7
8
12 13 15 16 18 19
19 Q4
18 D3b
17 D3a
16 Q3
15 GND
14 Q2
13 D2b
12 D2a
11 Q1
D5a
D5b
D0a D0bD1a D1bD2a D2b D3aD3bD4aD4bD5a D5b
Q0 Q1 Q2 Q3 Q4 Q5
V
CC
D0a
D0b
Q0
D1a
3
6
9 11 14 17
D1b 10
V
= Pin 20
CC
GND = Pin 10
SF00451
SF00449
2
September 14, 1990
853-1313 00423
Philips Semiconductors
Product specification
Hex 2-input NAND drivers
74F804/1804
LOGIC SYMBOL
LOGIC DIAGRAM
74F1804
74F1804
74F804
1
6
D0a
Dob
3
8
D0a
2
6
7
9
10 12 13 17 18 20
1
3
4
QO
Q1
Q2
Q3
Q4
Q5
7
QO
Q1
Q2
Q3
Q4
Q5
Dob
4
9
6
D1a
D1b
11
14
16
19
2
D1a
5
10
D1b
D0a D0bD1a D1bD2a D2b D3a D3b
D4a D4bD5a D5b
7
12
13
9
D2a
D2b
D2a
8
D2b
Q0 Q1 Q2 Q3 Q4 Q5
12
17
18
11
14
17
D3a
D3b
D3a
13
D3b
15
D4a
16
20
1
D4a
D4b
2
8
11 14 16 19
D4b
18
3
4
D5a
D5b
D5a
V
= Pin 5
CC
19
D5b
GND = Pin 15
SF00452
V
= Pin 20
V
= Pin 5
CC
CC
GND = Pin 10
GND = Pin 15
SF00454
IEC/IEEE SYMBOL
74F1804
6
FUNCTION TABLE
8
&
7
9
INPUTS
OUTPUT
11
Da
Db
H
Q
L
10
12
H
14
L
X
X
H
H
13
17
18
L
16
19
NOTES:
20
1
H
L
X
=
=
=
High voltage level
Low voltage level
Don’t care
3
4
2
SF00453
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free air temperature range.)
SYMBOL
PARAMETER
RATING
–0.5 to +7.0
–0.5 to +7.0
–30 to +5
UNIT
V
V
CC
V
IN
Supply voltage
Input voltage
Input current
V
I
IN
mA
V
I
Voltage applied to output in high output state
Current applied to output in low output state
–0.5 to V
V
OUT
CC
96
mA
OUT
T
Operating free–air temperature range
Storage temperature range
0 to +70
°C
°C
amb
T
stg
–65 to +150
3
September 14, 1990
Philips Semiconductors
Product specification
Hex 2-input NAND drivers
74F804/1804
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
LIMITS
NOM
5.0
T =
A
–40 to
+85°C
V
UNIT
MIN
4.5
MAX
V
Supply voltage
5.5
CC
IH
IL
V
V
High–level input voltage
Low–level input voltage
Input clamp current
2.0
V
0.8
–18
–48
48
V
I
I
I
mA
mA
mA
Ik
High–level output current
Low–level output current
OH
OL
T
amb
Operating free air temperature range
0
+70
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
1
SYMBOL
PARAMETER
TEST CONDITIONS
LIMITS
UNIT
2
MIN
2.0
TYP
MAX
V
High-level output voltage
V
V
V
V
= MIN, V = MAX
V
V
V
V
±10%V
±5%V
OH
CC
IL
CC
= MIN, I = MAX
2.0
IH
OH
CC
V
OL
Low-level output voltage
= MIN, V = MAX
0.38
0.38
-0.73
0.55
0.55
±10%V
CC
IL
CC
= MIN, I = MAX
±5%V
IH
OL
CC
V
IK
Input clamp voltage
V
V
= MIN, I = I
IK
-1.2
100
V
CC
I
I
I
I
I
I
Input current at maximum input voltage
= MAX, V = 7.0V
µA
I
CC
I
High–level input current
Low–level input current
V
CC
V
CC
V
CC
V
CC
V
CC
= MAX, V = 2.7V
20
-20
-160
3.0
20
µA
µA
IH
IL
I
= MAX, V = 0.5V
I
3
Output current
= MAX
= MAX
= MAX
-60
mA
mA
mA
O
Supply current (total)
I
V
IN
= GND
= 4.5V
2.0
15
CC
CCH
I
V
IN
CCL
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V = 5V, T = 25°C.
CC
amb
3. The output conditions have been chosen to produce a current that closely approximates one half of the true short–circuit output current, I
.
OS
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
= +25°C
= +5.0V
T
= 0°C to +70°C
= +5.0V ± 10%
amb
amb
V
SYMBOL
PARAMETER
TEST
V
UNIT
CC
CC
CONDITION
C = 50pF,
L
C = 50pF,
L
R = 500Ω
L
R = 500Ω
L
MIN
TYP
MAX
MIN
MAX
t
t
Propagation delay
Dna, Dnb to Qn
1.0
1.0
2.0
3.0
4.0
4.5
1.0
1.0
4.0
5.0
PLH
PHL
Waveform 1
Waveform 2
ns
ns
1,2
t
Output skew
1.5
1.5
sk(o)
NOTES:
1. [t actual – t actual] for any output compared to any other output where N and M are either LH or HL.
PN
PM
2. Skew times are valid only under same test conditions (temperature, V , loading, etc.,).
CC
4
September 14, 1990
Philips Semiconductors
Product specification
Hex 2-input NAND drivers
74F804/1804
AC WAVEFORMS
Dna, Dnb
Qn
Qn
V
M
t
V
V
M
t
M
sk(0)
t
PHL
PLH
V
M
V
V
M
M
Qn
SF00005
SF00455
Waveform 1. Propagation delay for inverting outputs
Waveform 2. Output skew
NOTE: For all waveforms, V = 1.5V.
M
TEST CIRCUIT AND WAVEFORMS
t
AMP (V)
0V
V
w
CC
90%
90%
NEGATIVE
PULSE
V
V
M
M
10%
10%
V
V
OUT
IN
PULSE
GENERATOR
D.U.T.
t
t )
t
t )
THL ( f
TLH ( r
R
C
R
L
t
t )
T
L
t
t )
TLH ( r
THL ( f
AMP (V)
0V
90%
M
90%
POSITIVE
PULSE
V
V
M
10%
10%
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
t
w
Input Pulse Definition
INPUT PULSE REQUIREMENTS
R
L
C
L
R
T
=
=
=
Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
family
V
rep. rate
t
w
t
t
THL
amplitude
M
TLH
Termination resistance should be equal to Z
pulse generators.
of
OUT
2.5ns 2.5ns
74F
3.0V
1.5V
1MHz
500ns
SF00006
5
September 14, 1990
Philips Semiconductors
Product specification
Hex 2-input NAND drivers
74F804, 74F1804
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1
6
1990 Sep 14
Philips Semiconductors
Product specification
Hex 2-input NAND drivers
74F804, 74F1804
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
7
1990 Sep 14
Philips Semiconductors
Product specification
Hex 2-input NAND drivers
74F804, 74F1804
Data sheet status
[1]
Data sheet
status
Product
status
Definition
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Date of release: 10-98
9397-750-05182
Document order number:
Philips
Semiconductors
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