74F1804 [NXP]

Hex 2-input NAND drivers; 十六进制2输入与非驱动程序
74F1804
型号: 74F1804
厂家: NXP    NXP
描述:

Hex 2-input NAND drivers
十六进制2输入与非驱动程序

驱动
文件: 总8页 (文件大小:80K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
74F804, 74F1804  
Hex 2-input NAND drivers  
Product specification  
IC15 Data Handbook  
1990 Sep 14  
Philips  
Semiconductors  
Philips Semiconductors  
Product specification  
Hex 2-input NAND drivers  
74F804/1804  
FEATURES  
INPUT AND OUTPUT  
LOADING AND FAN OUT TABLE  
High capacitive drive capability  
PINS  
DESCRIPTION  
74F (U.L.)  
LOAD VALUE  
HIGH/LOW  
Choice of configuration  
HIGH/LOW  
1.0/0.033  
2400/80  
Corner V and GND – 74F804  
CC  
Dna – Dnb  
Q0 – Q5  
Data inputs  
20µA/20µA  
Center V and GND – 74F1804  
CC  
Data outputs  
48mA/48mA  
Typical propagation delay of 2.5ns  
NOTE: One (1.0) FAST unit load is defined as: 20µA in the high  
state and 0.6mA in the low state.  
TYPE  
TYPICAL  
PROPAGATION  
DELAY  
TYPICAL SUPPLY  
CURRENT  
( TOTAL)  
74F804  
2.5ns  
2.5ns  
9mA  
9mA  
74F1804  
ORDERING INFORMATION  
ORDER CODE  
COMMERCIAL RANGE  
= 5V ±10%, T = 0°C to +70°C  
DESCRIPTION  
PKG DWG #  
V
CC  
amb  
20–pin plastic DIP  
20–pin plastic SOL  
N74F804N, N74F1804N  
N74F804D, N74F1804D  
SOT146-1  
SOT163-1  
PIN CONFIGURATION  
IEC/IEEE SYMBOL  
74F804  
74F804  
1
2
3
6
V
&
D0a  
D0b  
Q0  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
CC  
D5b  
D5a  
Q5  
4
3
5
D1a  
D1b  
Q1  
4
7
9
8
5
D4b  
D4a  
Q4  
12  
13  
15  
16  
18  
19  
6
11  
14  
7
D2a  
D2b  
Q2  
8
D3b  
D3a  
9
10  
11 Q3  
GND  
17  
SF00448  
SF00450  
LOGIC SYMBOL  
PIN CONFIGURATION  
74F1804  
74F804  
D4b  
Q5  
1
2
3
4
5
6
7
8
9
20  
D4a  
1
2
4
5
7
8
12 13 15 16 18 19  
19 Q4  
18 D3b  
17 D3a  
16 Q3  
15 GND  
14 Q2  
13 D2b  
12 D2a  
11 Q1  
D5a  
D5b  
D0a D0bD1a D1bD2a D2b D3aD3bD4aD4bD5a D5b  
Q0 Q1 Q2 Q3 Q4 Q5  
V
CC  
D0a  
D0b  
Q0  
D1a  
3
6
9 11 14 17  
D1b 10  
V
= Pin 20  
CC  
GND = Pin 10  
SF00451  
SF00449  
2
September 14, 1990  
853-1313 00423  
Philips Semiconductors  
Product specification  
Hex 2-input NAND drivers  
74F804/1804  
LOGIC SYMBOL  
LOGIC DIAGRAM  
74F1804  
74F1804  
74F804  
1
6
D0a  
Dob  
3
8
D0a  
2
6
7
9
10 12 13 17 18 20  
1
3
4
QO  
Q1  
Q2  
Q3  
Q4  
Q5  
7
QO  
Q1  
Q2  
Q3  
Q4  
Q5  
Dob  
4
9
6
D1a  
D1b  
11  
14  
16  
19  
2
D1a  
5
10  
D1b  
D0a D0bD1a D1bD2a D2b D3a D3b  
D4a D4bD5a D5b  
7
12  
13  
9
D2a  
D2b  
D2a  
8
D2b  
Q0 Q1 Q2 Q3 Q4 Q5  
12  
17  
18  
11  
14  
17  
D3a  
D3b  
D3a  
13  
D3b  
15  
D4a  
16  
20  
1
D4a  
D4b  
2
8
11 14 16 19  
D4b  
18  
3
4
D5a  
D5b  
D5a  
V
= Pin 5  
CC  
19  
D5b  
GND = Pin 15  
SF00452  
V
= Pin 20  
V
= Pin 5  
CC  
CC  
GND = Pin 10  
GND = Pin 15  
SF00454  
IEC/IEEE SYMBOL  
74F1804  
6
FUNCTION TABLE  
8
&
7
9
INPUTS  
OUTPUT  
11  
Da  
Db  
H
Q
L
10  
12  
H
14  
L
X
X
H
H
13  
17  
18  
L
16  
19  
NOTES:  
20  
1
H
L
X
=
=
=
High voltage level  
Low voltage level  
Don’t care  
3
4
2
SF00453  
ABSOLUTE MAXIMUM RATINGS  
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the  
operating free air temperature range.)  
SYMBOL  
PARAMETER  
RATING  
–0.5 to +7.0  
–0.5 to +7.0  
–30 to +5  
UNIT  
V
V
CC  
V
IN  
Supply voltage  
Input voltage  
Input current  
V
I
IN  
mA  
V
I
Voltage applied to output in high output state  
Current applied to output in low output state  
–0.5 to V  
V
OUT  
CC  
96  
mA  
OUT  
T
Operating free–air temperature range  
Storage temperature range  
0 to +70  
°C  
°C  
amb  
T
stg  
–65 to +150  
3
September 14, 1990  
Philips Semiconductors  
Product specification  
Hex 2-input NAND drivers  
74F804/1804  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
PARAMETER  
LIMITS  
NOM  
5.0  
T =  
A
–40 to  
+85°C  
V
UNIT  
MIN  
4.5  
MAX  
V
Supply voltage  
5.5  
CC  
IH  
IL  
V
V
High–level input voltage  
Low–level input voltage  
Input clamp current  
2.0  
V
0.8  
–18  
–48  
48  
V
I
I
I
mA  
mA  
mA  
Ik  
High–level output current  
Low–level output current  
OH  
OL  
T
amb  
Operating free air temperature range  
0
+70  
°C  
DC ELECTRICAL CHARACTERISTICS  
(Over recommended operating free-air temperature range unless otherwise noted.)  
1
SYMBOL  
PARAMETER  
TEST CONDITIONS  
LIMITS  
UNIT  
2
MIN  
2.0  
TYP  
MAX  
V
High-level output voltage  
V
V
V
V
= MIN, V = MAX  
V
V
V
V
±10%V  
±5%V  
OH  
CC  
IL  
CC  
= MIN, I = MAX  
2.0  
IH  
OH  
CC  
V
OL  
Low-level output voltage  
= MIN, V = MAX  
0.38  
0.38  
-0.73  
0.55  
0.55  
±10%V  
CC  
IL  
CC  
= MIN, I = MAX  
±5%V  
IH  
OL  
CC  
V
IK  
Input clamp voltage  
V
V
= MIN, I = I  
IK  
-1.2  
100  
V
CC  
I
I
I
I
I
I
Input current at maximum input voltage  
= MAX, V = 7.0V  
µA  
I
CC  
I
High–level input current  
Low–level input current  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= MAX, V = 2.7V  
20  
-20  
-160  
3.0  
20  
µA  
µA  
IH  
IL  
I
= MAX, V = 0.5V  
I
3
Output current  
= MAX  
= MAX  
= MAX  
-60  
mA  
mA  
mA  
O
Supply current (total)  
I
V
IN  
= GND  
= 4.5V  
2.0  
15  
CC  
CCH  
I
V
IN  
CCL  
NOTES:  
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.  
2. All typical values are at V = 5V, T = 25°C.  
CC  
amb  
3. The output conditions have been chosen to produce a current that closely approximates one half of the true short–circuit output current, I  
.
OS  
AC ELECTRICAL CHARACTERISTICS  
LIMITS  
T
= +25°C  
= +5.0V  
T
= 0°C to +70°C  
= +5.0V ± 10%  
amb  
amb  
V
SYMBOL  
PARAMETER  
TEST  
V
UNIT  
CC  
CC  
CONDITION  
C = 50pF,  
L
C = 50pF,  
L
R = 500  
L
R = 500Ω  
L
MIN  
TYP  
MAX  
MIN  
MAX  
t
t
Propagation delay  
Dna, Dnb to Qn  
1.0  
1.0  
2.0  
3.0  
4.0  
4.5  
1.0  
1.0  
4.0  
5.0  
PLH  
PHL  
Waveform 1  
Waveform 2  
ns  
ns  
1,2  
t
Output skew  
1.5  
1.5  
sk(o)  
NOTES:  
1. [t actual – t actual] for any output compared to any other output where N and M are either LH or HL.  
PN  
PM  
2. Skew times are valid only under same test conditions (temperature, V , loading, etc.,).  
CC  
4
September 14, 1990  
Philips Semiconductors  
Product specification  
Hex 2-input NAND drivers  
74F804/1804  
AC WAVEFORMS  
Dna, Dnb  
Qn  
Qn  
V
M
t
V
V
M
t
M
sk(0)  
t
PHL  
PLH  
V
M
V
V
M
M
Qn  
SF00005  
SF00455  
Waveform 1. Propagation delay for inverting outputs  
Waveform 2. Output skew  
NOTE: For all waveforms, V = 1.5V.  
M
TEST CIRCUIT AND WAVEFORMS  
t
AMP (V)  
0V  
V
w
CC  
90%  
90%  
NEGATIVE  
PULSE  
V
V
M
M
10%  
10%  
V
V
OUT  
IN  
PULSE  
GENERATOR  
D.U.T.  
t
t )  
t
t )  
THL ( f  
TLH ( r  
R
C
R
L
t
t )  
T
L
t
t )  
TLH ( r  
THL ( f  
AMP (V)  
0V  
90%  
M
90%  
POSITIVE  
PULSE  
V
V
M
10%  
10%  
Test Circuit for Totem-Pole Outputs  
DEFINITIONS:  
t
w
Input Pulse Definition  
INPUT PULSE REQUIREMENTS  
R
L
C
L
R
T
=
=
=
Load resistor;  
see AC ELECTRICAL CHARACTERISTICS for value.  
Load capacitance includes jig and probe capacitance;  
see AC ELECTRICAL CHARACTERISTICS for value.  
family  
V
rep. rate  
t
w
t
t
THL  
amplitude  
M
TLH  
Termination resistance should be equal to Z  
pulse generators.  
of  
OUT  
2.5ns 2.5ns  
74F  
3.0V  
1.5V  
1MHz  
500ns  
SF00006  
5
September 14, 1990  
Philips Semiconductors  
Product specification  
Hex 2-input NAND drivers  
74F804, 74F1804  
DIP20: plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
6
1990 Sep 14  
Philips Semiconductors  
Product specification  
Hex 2-input NAND drivers  
74F804, 74F1804  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
7
1990 Sep 14  
Philips Semiconductors  
Product specification  
Hex 2-input NAND drivers  
74F804, 74F1804  
Data sheet status  
[1]  
Data sheet  
status  
Product  
status  
Definition  
Objective  
specification  
Development  
This data sheet contains the design target or goal specifications for product development.  
Specification may change in any manner without notice.  
Preliminary  
specification  
Qualification  
This data sheet contains preliminary data, and supplementary data will be published at a later date.  
Philips Semiconductors reserves the right to make chages at any time without notice in order to  
improve design and supply the best possible product.  
Product  
specification  
Production  
This data sheet contains final specifications. Philips Semiconductors reserves the right to make  
changes at any time without notice in order to improve design and supply the best possible product.  
[1] Please consult the most recently issued datasheet before initiating or completing a design.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or  
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended  
periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips  
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or  
modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.  
RighttomakechangesPhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard  
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Copyright Philips Electronics North America Corporation 1998  
All rights reserved. Printed in U.S.A.  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
print code  
Date of release: 10-98  
9397-750-05182  
Document order number:  
Philips  
Semiconductors  

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