74HC1G126GW,115 [NXP]
74HC(T)1G126 - Bus buffer/line driver; 3-state TSSOP 5-Pin;
| 型号： | 74HC1G126GW,115 |
| 厂家： | 
NXP |
| 描述： | 74HC(T)1G126 - Bus buffer/line driver; 3-state TSSOP 5-Pin |
| 文件： | 总12页 (文件大小：67K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74HC1G126; 74HCT1G126
Bus buffer/line driver; 3-state
Rev. 04 — 20 July 2007
Product data sheet
1. General description
The 74HC1G126 and 74HCT1G126 are high-speed, Si-gate CMOS devices. They
provide one non-inverting buffer/line driver with 3-state output. The 3-state output is
controlled by the output enable input pin (OE). A LOW at pin OE causes the output as
assume a high-impedance OFF-state.
The HC device has CMOS input switching levels and supply voltage range 2 V to 6 V.
The HCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V.
The bus driver output currents are equal to those of the 74HC126 and 74HCT126.
2. Features
I Symmetrical output impedance
I High noise immunity
I Low power dissipation
I Balanced propagation delays
I SOT353-1 and SOT753 package options
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC1G126GW
74HCT1G126GW
74HC1G126GV
74HCT1G126GV
−40 °C to +125 °C
−40 °C to +125 °C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
SC-74A
plastic surface-mounted package; 5 leads
SOT753
4. Marking
Table 2.
Marking codes
Type number
74HC1G126GW
74HCT1G126GW
74HC1G126GV
74HCT1G126GV
Marking
HN
TN
H26
T26
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
5. Functional diagram
A
Y
Y
4
A
2
1
2
1
4
OE
OE
OE
mna125
mna126
mna127
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram
6. Pinning information
6.1 Pinning
74HC1G126
74HCT1G126
1
2
3
5
4
OE
A
V
CC
GND
Y
001aaf103
Fig 4. Pin configuration
6.2 Pin description
Table 3.
Symbol
OE
Pin description
Pin
1
Description
output enable input
data input
A
2
GND
Y
3
ground (0 V)
data output
4
VCC
5
supply voltage
7. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state
Inputs
Output
OE
H
A
L
Y
L
H
H
X
H
Z
L
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
2 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). [1]
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7.0
±20
±20
±35.0
70
Unit
V
supply voltage
−0.5
input clamping current
output clamping current
output current
VI < −0.5 V or VI > VCC + 0.5 V
VO < −0.5 V or VO > VCC + 0.5 V
−0.5 V < VO < VCC + 0.5 V
-
mA
mA
mA
mA
mA
°C
IOK
-
IO
-
ICC
supply current
-
IGND
Tstg
Ptot
ground current
−70
−65
-
-
storage temperature
total power dissipation
+150
200
[2]
Tamb = −40 °C to +125 °C
mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] Above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74HC1G126
74HCT1G126
Unit
Min
Typ
Max
6.0
Min
Typ
Max
5.5
VCC
VI
supply voltage
input voltage
2.0
5.0
4.5
5.0
V
V
V
0
-
VCC
VCC
+125
625
139
83
0
-
VCC
VCC
VO
output voltage
ambient temperature
0
-
0
-
Tamb
∆t/∆V
−40
+25
−40
+25
+125 °C
input transition rise
and fall rate
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
-
-
-
-
-
-
-
-
-
-
-
-
-
139
-
ns/V
ns/V
ns/V
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C.
Symbol
Parameter
Conditions
−40 °C to +85 °C
−40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
For type 74HC1G126
VIH HIGH-level input
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
1.5
1.2
2.4
3.2
0.8
2.1
2.8
-
-
1.5
-
-
V
V
V
V
V
V
voltage
3.15
3.15
4.2
-
4.2
-
VIL
LOW-level input
voltage
-
-
-
0.5
1.35
1.8
-
-
-
0.5
1.35
1.8
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
3 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
Table 7.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C.
Symbol
Parameter
Conditions
−40 °C to +85 °C
−40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = −20 µA; VCC = 2.0 V
IO = −20 µA; VCC = 4.5 V
IO = −20 µA; VCC = 6.0 V
IO = −6.0 mA; VCC = 4.5 V
IO = −7.8 mA; VCC = 6.0 V
VI = VIH or VIL
1.9
4.4
2.0
4.5
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
6.0
3.84
5.34
4.32
5.81
VOL
LOW-level output
voltage
IO = 20 µA; VCC = 2.0 V
IO = 20 µA; VCC = 4.5 V
IO = 20 µA; VCC = 6.0 V
IO = 6.0 mA; VCC = 4.5 V
IO = 7.8 mA; VCC = 6.0 V
-
-
-
-
-
-
-
0
0.1
0.1
0.1
0.33
0.33
1.0
5
-
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
1.0
10
V
0
V
0
0.15
0.16
-
V
V
V
II
input leakage current VI = VCC or GND; VCC = 6.0 V
µA
µA
IOZ
OFF-state output
current
VI = VIH or VIL; VO = VCC or
GND; VCC = 6.0 V
-
ICC
CI
supply current
VI = VCC or GND; IO = 0 A;
-
-
-
10
-
-
-
20
-
µA
VCC = 6.0 V
input capacitance
1.5
pF
For type 74HCT1G126
VIH
HIGH-level input
voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2.0
-
1.6
1.2
-
2.0
-
-
V
V
VIL
LOW-level input
voltage
0.8
0.8
VOH
HIGH-level output
voltage
VI = VIH or VIL; VCC = 4.5 V
IO = −20 µA
4.4
4.5
-
-
4.4
3.7
-
-
V
V
IO = −6.0 mA
3.84
4.32
VOL
LOW-level output
voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 µA
-
-
-
-
0
0.1
0.33
1.0
5
-
-
-
-
0.1
0.4
1.0
10
V
IO = 6.0 mA
0.16
V
II
input leakage current VI = VCC or GND; VCC = 5.5 V
-
-
µA
IOZ
OFF-state output
current
VI = VIH or VIL; VO = VCC or
GND; VCC = 5.5 V
ICC
∆ICC
CI
supply current
VI = VCC or GND; IO = 0 A;
-
-
-
-
-
10
500
-
-
-
-
20
850
-
µA
µA
pF
VCC = 5.5 V
additional supply
current
per input; VCC = 4.5 V to 5.5 V;
VI = VCC − 2.1 V; IO = 0 A
input capacitance
1.5
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
4 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
11. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; tr = tf ≤ 6.0 ns; CL = 50 pF unless otherwise specified. All typical values are measured at Tamb = 25 °C. For test
circuit see Figure 7
Symbol Parameter
Conditions
−40 °C to +85 °C
−40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
For type 74HC1G126
[1]
tpd
propagation delay A to Y; see Figure 5
VCC = 2.0 V
-
-
-
-
24
10
9
125
25
-
-
-
-
-
150
30
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5.0 V; CL = 15 pF
VCC = 6.0 V
OE to Y; see Figure 6
VCC = 2.0 V
9
21
26
[1]
[1]
ten
enable time
disable time
-
-
-
24
10
8
155
31
-
-
-
190
38
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
26
32
tdis
OE to Y; see Figure 6
VCC = 2.0 V
-
-
-
-
16
12
11
30
155
31
26
-
-
-
-
-
190
38
32
-
ns
ns
ns
pF
VCC = 4.5 V
VCC = 6.0 V
[2]
[1]
CPD
power dissipation VI = GND to VCC
capacitance
For type 74HCT1G126
tpd
propagation delay A to Y; see Figure 5
VCC = 4.5 V
-
-
-
-
-
11
10
10
12
27
30
-
-
-
-
-
-
36
-
ns
ns
ns
ns
pF
VCC = 5.0 V; CL = 15 pF
[1]
[1]
[2]
ten
enable time
disable time
OE to Y; see Figure 6; VCC = 4.5 V
OE to Y; see Figure 6; VCC = 4.5 V
35
31
-
42
38
-
tdis
CPD
power dissipation VI = GND to VCC − 1.5 V
capacitance
[1] tpd is the same as tPLH and tPHL
ten is the same as tPZL and tPZH
tdis is the same as tPLZ and tPHZ
.
.
.
[2] CPD is used to determine the dynamic power dissipation PD (µW).
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz
fo = output frequency in MHz
CL = output load capacitance in pF
VCC = supply voltage in Volts
∑ (CL × VCC2 × fo) = sum of outputs
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
5 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
12. Waveforms
V
I
V
A input
M
GND
t
t
PLH
PHL
V
Y output
M
mna121
Measurement points are given in Table 9.
Fig 5. The input (A) to output (Y) propagation delays
V
I
V
M
OE input
GND
t
t
PZL
PLZ
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
+ 0.3 V
OL
t
t
PHZ
PZH
V
− 0.3 V
OH
output
V
M
HIGH-to-OFF
OFF-to-HIGH
GND
output
enabled
output
enabled
output
disabled
mna129
Measurement points are given in Table 9.
Fig 6. The 3-state enable and disable times
Table 9.
Type
Measurement points
Input
Output
VM
VI
VM
74HC1G126
0.5 × VCC
1.3 V
GND to VCC
0.5 × VCC
1.3 V
74HCT1G126
GND to 3.0 V
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
6 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
S
1
V
CC
open
GND
V
CC
R
L
=
1000 Ω
V
V
O
I
PULSE
GENERATOR
D.U.T.
C
L
R
T
mna232
Test data is given in Table 8. Definitions for test circuit:
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
RL = Load resistance
For tPLH, tPHL, S1 = open
For tPLZ, tPZL, S1 = VCC
For tPHZ, tPZH, S1 = GND
Fig 7. Load circuitry for switching times
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
7 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
4
A
2
A
(A )
3
A
1
θ
L
L
p
1
3
e
w M
b
p
detail X
e
1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
e
1
H
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.1
0
1.0
0.8
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
2.25
2.0
0.46
0.21
0.60
0.15
7°
0°
mm
1.1
0.65
1.3
0.15
0.425
0.3
0.1
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-09-01
03-02-19
SOT353-1
MO-203
SC-88A
Fig 8. Package outline SOT353-1 (TSSOP5)
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
8 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
Plastic surface-mounted package; 5 leads
SOT753
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X
e
b
p
w
M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.100
0.013
0.40
0.25
1.1
0.9
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
0.95
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
02-04-16
06-03-16
SOT753
SC-74A
Fig 9. Package outline SOT753 (SC-74A)
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
9 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
14. Abbreviations
Table 10. Abbreviations
Acronym
DUT
Description
Device Under Test
TTL
Transistor-Transistor Logic
15. Revision history
Table 11. Revision history
Document ID
Release date
20070720
Data sheet status
Change notice
Supersedes
74HC_HCT1G126_4
Modifications:
Product data sheet
-
74HC_HCT1G126_3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Package SOT353 changed to SOT353-1 in Table 1 and Figure 8.
• Quick Reference Data and Soldering sections removed.
• Section 2 “Features” updated.
74HC_HCT1G126_3
74HC_HCT1G126_2
74HC_HCT1G126
20020515
20010406
19970924
Product specification
Product specification
Preliminary specification
-
-
-
74HC_HCT1G126_2
74HC_HCT1G126
-
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
10 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
16.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
17. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
74HC_HCT1G126_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 20 July 2007
11 of 12
74HC1G126; 74HCT1G126
NXP Semiconductors
Bus buffer/line driver; 3-state
18. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
Functional description . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 3
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 10
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 July 2007
Document identifier: 74HC_HCT1G126_4
相关型号：
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