74HCT08DB,118 [NXP]

74HC(T)08 - Quad 2-input AND gate SSOP1 14-Pin;
74HCT08DB,118
型号: 74HCT08DB,118
厂家: NXP    NXP
描述:

74HC(T)08 - Quad 2-input AND gate SSOP1 14-Pin

文件: 总20页 (文件大小:103K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
74HC08; 74HCT08  
Quad 2-input AND gate  
Product specification  
2003 Jul 25  
Supersedes data of 1990 Dec 01  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
FEATURES  
DESCRIPTION  
Complies with JEDEC standard no. 8-1A  
The 74HC/HCT08 are high-speed Si-gate CMOS devices  
and are pin compatible with low power Schottky TTL  
(LSTTL). They are specified in compliance with JEDEC  
standard no. 7A. The 74HC/HCT08 provide the 2-input  
AND function.  
ESD protection:  
HBM EIA/JESD22-A114-A exceeds 2000 V  
MM EIA/JESD22-A115-A exceeds 200 V.  
Specified from 40 to +85 °C and 40 to +125 °C.  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns.  
TYPICAL  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
74HC08  
74HCT08  
11  
tPHL/tPLH propagation delay nA, nB to nY  
CL = 15 pF; VCC = 5 V  
7
ns  
pF  
pF  
CI  
input capacitance  
power dissipation capacitance per gate notes 1 and 2  
3.5  
10  
3.5  
20  
CPD  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = total load switching outputs;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
2. For 74HC08: the condition is VI = GND to VCC  
.
For 74HCT08: the condition is VI = GND to VCC 1.5 V.  
FUNCTION TABLE  
INPUT  
OUTPUT  
nA  
L
nB  
nY  
L
L
H
L
L
L
H
H
L
H
H
Note  
1. H = HIGH voltage level;  
L = LOW voltage level.  
2003 Jul 25  
2
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
ORDERING INFORMATION  
TYPE NUMBER  
PACKAGE  
TEMPERATURE RANGE  
PINS  
PACKAGE  
MATERIAL  
CODE  
74HC08N  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
DIP14  
DIP14  
plastic  
plastic  
plastic  
plastic  
plastic  
plastic  
plastic  
plastic  
plastic  
plastic  
SOT27-1  
SOT27-1  
74HCT08N  
74HC08D  
SO14  
SOT108-1  
SOT108-1  
SOT337-1  
SOT337-1  
SOT402-1  
SOT402-1  
SOT762-1  
SOT762-1  
74HCT08D  
74HC08DB  
74HCT08DB  
74HC08PW  
74HCT08PW  
74HC08BQ  
74HCT08BQ  
SO14  
SSOP14  
SSOP14  
TSSOP14  
TSSOP14  
DHVQFN14  
DHVQFN14  
PINNING  
PIN  
SYMBOL  
1A  
DESCRIPTION  
1
2
data input  
1B  
1Y  
2A  
2B  
2Y  
GND  
3Y  
3A  
3B  
4Y  
4A  
4B  
VCC  
data input  
data output  
data input  
data input  
data output  
ground (0 V)  
data output  
data input  
data input  
data output  
data input  
data input  
supply voltage  
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
2003 Jul 25  
3
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
V
1A  
1
handbook, halfpage  
CC  
14  
handbook, halfpage  
1A  
1B  
1
2
3
4
5
6
7
V
CC  
14  
13  
12  
11  
10  
9
1B  
2
3
13 4B  
12 4A  
4B  
4A  
4Y  
3B  
3A  
3Y  
1Y  
1Y  
(1)  
2A  
2B  
2Y  
4
5
6
11 4Y  
10 3B  
GND  
2A  
08  
2B  
2Y  
9
3A  
8
GND  
7
8
MNA220  
GND 3Y  
Top view  
MCE183  
(1) The die substrate is attached to this pad using conductive die  
attach material. It can not be used as a supply pin or input.  
Fig.1 Pin configuration DIP14, SO14 and  
(T)SSOP14.  
Fig.2 Pin configuration DHVQFN14.  
1
2
handbook, halfpage  
&
&
&
&
3
6
handbook, halfpage  
1
2
1A  
1B  
1Y  
2Y  
3Y  
3
6
8
4
5
4
5
2A  
2B  
9
3A  
3B  
9
10  
8
10  
12  
13  
4A  
4B  
4Y 11  
12  
13  
MNA222  
11  
MNA223  
Fig.3 Logic symbol.  
Fig.4 IEC logic symbol.  
2003 Jul 25  
4
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
handbook, halfpage  
A
A
handbook, halfpage  
Y
Y
B
B
MNB037  
MNA221  
Fig.5 HC logic diagram (one gate).  
Fig.6 HCT logic diagram (one gate).  
RECOMMENDED OPERATING CONDITIONS  
74HC08  
74HCT08  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
MIN.  
2.0  
TYP. MAX. MIN. TYP. MAX.  
VCC  
VI  
supply voltage  
input voltage  
output voltage  
5.0  
6.0  
4.5  
0
5.0  
5.5  
V
0
VCC  
VCC  
VCC  
VCC  
V
V
VO  
0
0
Tamb  
ambient  
temperature  
see DC and AC  
characteristics per device  
40  
+25  
+125 40  
+25  
+125 °C  
tr, tf  
input rise and fall VCC = 2.0 V  
1000  
500  
ns  
ns  
ns  
times  
VCC = 4.5 V  
6.0  
6.0  
500  
VCC = 6.0 V  
400  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
0.5  
MAX.  
+7.0  
UNIT  
VCC  
IIK  
V
input diode current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
0.5 V < VO < VCC + 0.5 V  
±20  
±20  
±25  
±50  
+150  
mA  
mA  
mA  
mA  
°C  
IOK  
IO  
output diode current  
output source or sink current  
I
CC, IGND VCC or GND current  
Tstg  
Ptot  
storage temperature  
power dissipation  
DIP14 package  
65  
T
amb = 40 to +125 °C; note 1  
amb = 40 to +125 °C; note 2  
750  
500  
mW  
mW  
other packages  
T
Notes  
1. For DIP14 packages: above 70 °C derate linearly with 12 mW/K.  
2. For SO14 packages: above 70 °C derate linearly with 8 mW/K.  
For SSOP14 and TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K.  
For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K.  
2003 Jul 25  
5
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
DC CHARACTERISTICS  
Family 74HC08  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 25 °C  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
2.0  
1.5  
1.2  
V
4.5  
6.0  
2.0  
4.5  
6.0  
3.15  
4.2  
2.4  
3.2  
0.8  
2.1  
2.8  
V
V
V
V
V
VIL  
0.5  
1.35  
1.8  
VOH  
HIGH-level output voltage VI = VIH or VIL  
IO = 20 µA  
IO = 20 µA  
IO = 4.0 mA  
IO = 20 µA  
IO = 5.2 mA  
2.0  
4.5  
4.5  
6.0  
6.0  
1.9  
2.0  
V
V
V
V
V
4.4  
4.5  
3.98  
5.9  
4.32  
6.0  
5.48  
5.81  
VOL  
LOW-level output voltage  
VI = VIH or VIL  
IO = 20 µA  
2.0  
4.5  
4.5  
6.0  
6.0  
6.0  
6.0  
0
0.1  
V
IO = 20 µA  
0
0.1  
V
IO = 4.0 mA  
IO = 20 µA  
0.15  
0
0.26  
0.1  
V
V
IO = 5.2 mA  
VI = VCC or GND  
0.16  
0.1  
0.26  
±.0.1  
±.0.5  
V
ILI  
input leakage current  
µA  
µA  
IOZ  
3-state output OFF current VI = VIH or VIL;  
VO = VCC or GND  
ICC  
quiescent supply current  
VI = VCC or GND; IO = 0 6.0  
2
µA  
2003 Jul 25  
6
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
TEST CONDITIONS  
OTHER  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
VCC (V)  
Tamb = 40 to +85 °C  
VIH HIGH-level input voltage  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
1.5  
V
3.15  
4.2  
V
V
V
V
V
VIL  
LOW-level input voltage  
0.5  
1.35  
1.8  
VOH  
HIGH-level output voltage VI = VIH or VIL  
IO = 20 µA  
IO = 20 µA  
IO = 4.0 mA  
IO = 20 µA  
IO = 5.2 mA  
2.0  
4.5  
4.5  
6.0  
6.0  
1.9  
V
V
V
V
V
4.4  
3.84  
5.9  
5.34  
VOL  
LOW-level output voltage  
VI = VIH or VIL  
IO = 20 µA  
2.0  
4.5  
4.5  
6.0  
6.0  
6.0  
6.0  
0.1  
V
IO = 20 µA  
0.1  
V
IO = 4.0 mA  
IO = 20 µA  
0.33  
0.1  
V
V
IO = 5.2 mA  
VI = VCC or GND  
0.33  
±1.0  
±.5.0  
V
ILI  
input leakage current  
µA  
µA  
IOZ  
3-state output OFF current VI = VIH or VIL;  
VO = VCC or GND  
ICC  
quiescent supply current  
VI = VCC or GND; IO = 0 6.0  
20  
µA  
2003 Jul 25  
7
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
TEST CONDITIONS  
OTHER  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
VCC (V)  
Tamb = 40 to +125 °C  
VIH HIGH-level input voltage  
2.0  
4.5  
6.0  
2.0  
4.5  
6.0  
1.5  
V
3.15  
4.2  
V
V
V
V
V
VIL  
LOW-level input voltage  
0.5  
1.35  
1.8  
VOH  
HIGH-level output voltage VI = VIH or VIL  
IO = 20 µA  
IO = 20 µA  
IO = 4.0 mA  
IO = 20 µA  
IO = 5.2 mA  
2.0  
4.5  
4.5  
6.0  
6.0  
1.9  
4.4  
3.7  
5.9  
5.2  
V
V
V
V
V
VOL  
LOW-level output voltage  
VI = VIH or VIL  
IO = 20 µA  
2.0  
4.5  
4.5  
6.0  
6.0  
6.0  
6.0  
0.1  
V
IO = 20 µA  
0.1  
V
IO = 4.0 mA  
IO = 20 µA  
0.4  
V
0.1  
V
IO = 5.2 mA  
VI = VCC or GND  
0.4  
V
ILI  
input leakage current  
±1.0  
±10.0  
µA  
µA  
IOZ  
3-state output OFF current VI = VIH or VIL;  
VO = VCC or GND  
ICC  
quiescent supply current  
VI = VCC or GND; IO = 0 6.0  
40  
µA  
2003 Jul 25  
8
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
Family 74HCT08  
At recommended operating conditions; voltages are referenced to GND (ground = 0).  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX. UNIT  
OTHER  
VCC (V)  
Tamb = 25 °C  
VIH  
VIL  
HIGH-level input voltage  
LOW-level input voltage  
HIGH-level output voltage  
4.5 to 5.5 2.0  
1.6  
V
V
4.5 to 5.5  
1.2  
0.8  
VOH  
VI = VIH or VIL  
IO = 20 µA  
4.5  
4.5  
4.4  
4.5  
V
V
IO = 4.0 mA  
VI = VIH or VIL  
IO = 20 µA  
3.84  
4.32  
VOL  
LOW-level output voltage  
4.5  
4.5  
5.5  
5.5  
0
0.1  
V
IO = 4.0 mA  
0.15  
0.26  
±0.1  
±0.5  
V
ILI  
input leakage current  
VI = VCC or GND  
µA  
µA  
IOZ  
3-state output OFF current  
VI = VIH or VIL;  
VO = VCC or GND;  
IO = 0  
ICC  
quiescent supply current  
VI = VCC or GND; 5.5  
IO = 0  
2
µA  
µA  
ICC  
additional supply current per input VI = VCC 2.1 V;  
4.5 to 5.5  
60  
216  
IO = 0  
Tamb = 40 to +85 °C  
VIH  
VIL  
HIGH-level input voltage  
4.5 to 5.5 2.0  
V
V
LOW-level input voltage  
HIGH-level output voltage  
4.5 to 5.5  
0.8  
VOH  
VI = VIH or VIL  
IO = 20 µA  
4.5  
4.5  
4.4  
V
V
IO = 4.0 mA  
VI = VIH or VIL  
IO = 20 µA  
3.84  
VOL  
LOW-level output voltage  
4.5  
4.5  
5.5  
5.5  
0.1  
V
IO = 4.0 mA  
0.33  
±1.0  
±5.0  
V
ILI  
input leakage current  
VI = VCC or GND  
µA  
µA  
IOZ  
3-state output OFF current  
VI = VIH or VIL;  
VO = VCC or GND;  
IO = 0  
ICC  
quiescent supply current  
VI = VCC or GND; 5.5  
IO = 0  
20  
µA  
µA  
ICC  
additional supply current per input VI = VCC 2.1 V;  
4.5 to 5.5  
270  
IO = 0  
2003 Jul 25  
9
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX. UNIT  
OTHER  
VCC (V)  
Tamb = 40 to +125 °C  
VIH  
VIL  
HIGH-level input voltage  
LOW-level input voltage  
HIGH-level output voltage  
4.5 to 5.5 2.0  
V
V
4.5 to 5.5  
0.8  
VOH  
VI = VIH or VIL  
IO = 20 µA  
4.5  
4.5  
4.4  
3.7  
V
V
IO = 4.0 mA  
VI = VIH or VIL  
IO = 20 µA  
VOL  
LOW-level output voltage  
4.5  
4.5  
5.5  
5.5  
0.1  
V
IO = 4.0 mA  
0.4  
V
ILI  
input leakage current  
VI = VCC or GND  
±1.0  
±10  
µA  
µA  
IOZ  
3-state output OFF current  
VI = VIH or VIL;  
VO = VCC or GND;  
IO = 0  
ICC  
quiescent supply current  
VI = VCC or GND; 5.5  
IO = 0  
40  
µA  
µA  
ICC  
additional supply current per input VI = VCC 2.1 V;  
4.5 to 5.5  
294  
IO = 0  
2003 Jul 25  
10  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
AC CHARACTERISTICS  
Family 74HC08  
GND = 0 V; tf = tf = 6 ns; CL = 50 pF.  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
WAVEFORMS  
VCC (V)  
Tamb = 25 °C  
tPHL/tPLH  
propagation delay nA,  
nB to nY  
see Figs 7 and 8 2.0  
25  
90  
18  
15  
75  
15  
13  
ns  
4.5  
9
ns  
ns  
ns  
ns  
ns  
6.0  
7
tTHL/tTLH  
output transition time  
see Figs 7 and 8 2.0  
19  
7
4.5  
6.0  
6
Tamb = 40 to +85 °C  
tPHL/tPLH  
propagation delay nA,  
nB to nY  
see Figs 7 and 8 2.0  
115  
23  
20  
95  
19  
16  
ns  
ns  
ns  
ns  
ns  
ns  
4.5  
6.0  
tTHL/tTLH  
output transition time  
see Figs 7 and 8 2.0  
4.5  
6.0  
Tamb = 40 to +125 °C  
tPHL/tPLH  
propagation delay nA,  
nB to nY  
see Figs 7 and 8 2.0  
135  
27  
ns  
ns  
ns  
ns  
ns  
ns  
4.5  
6.0  
23  
tTHL/tTLH  
output transition time  
see Figs 7 and 8 2.0  
110  
22  
4.5  
6.0  
19  
2003 Jul 25  
11  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
Family 74HCT08  
GND = 0 V; tf = tf = 6 ns; CL = 50 pF.  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
WAVEFORMS  
VCC (V)  
Tamb = 25 °C  
tPHL/tPLH  
propagation delay nA,  
nB to nY  
see Figs 7 and 8 4.5  
see Figs 7 and 8 4.5  
14  
24  
15  
ns  
tTHL/tTLH  
output transition time  
7
ns  
Tamb = 40 to +85 °C  
tPHL/tPLH propagation delay nA,  
see Figs 7 and 8 4.5  
see Figs 7 and 8 4.5  
30  
19  
ns  
ns  
nB to nY  
tTHL/tTLH  
output transition time  
Tamb = 40 to +125 °C  
tPHL/tPLH propagation delay nA,  
see Figs 7 and 8 4.5  
see Figs 7 and 8 4.5  
36  
22  
ns  
ns  
nB to nY  
tTHL/tTLH  
output transition time  
AC WAVEFORMS  
V
handbook, halfpage  
I
V
V
M
nA, nB input  
M
GND  
t
t
PHL  
PLH  
V
OH  
90%  
V
V
nY output  
M
M
10%  
V
OL  
t
t
TLH  
MNA726  
THL  
74HC08: VM = 50%; VI = GND to VCC  
.
74HCT08: VM = 1.3 V; VI = GND to 3 V.  
Fig.7 Waveforms showing the input (nA, nB) to output (nY) propagation delays and the output transition times.  
2003 Jul 25  
12  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
V
handbook, halfpage  
CC  
V
V
I
O
PULSE  
GENERATOR  
D.U.T  
R
C
50 pF  
T
L
MGK565  
Definitions for test circuit:  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig.8 Load circuitry for switching times.  
2003 Jul 25  
13  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
PACKAGE OUTLINES  
DIP14: plastic dual in-line package; 14 leads (300 mil)  
SOT27-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
M
H
14  
8
pin 1 index  
E
1
7
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.  
min.  
max.  
max.  
1.73  
1.13  
0.53  
0.38  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
2.2  
0.068  
0.044  
0.021  
0.015  
0.014  
0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT27-1  
050G04  
MO-001  
SC-501-14  
2003 Jul 25  
14  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT108-1  
076E06  
MS-012  
2003 Jul 25  
15  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm  
SOT337-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
7
1
detail X  
w M  
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.4  
0.9  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT337-1  
MO-150  
2003 Jul 25  
16  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
7
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.72  
0.38  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT402-1  
MO-153  
2003 Jul 25  
17  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;  
14 terminals; body 2.5 x 3 x 0.85 mm  
SOT762-1  
B
A
D
A
A
1
E
c
detail X  
terminal 1  
index area  
C
terminal 1  
index area  
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14  
13  
9
D
h
X
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.  
0.05 0.30  
0.00 0.18  
3.1  
2.9  
1.65  
1.35  
2.6  
2.4  
1.15  
0.85  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
2
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-10-17  
03-01-27  
SOT762-1  
- - -  
MO-241  
- - -  
2003 Jul 25  
18  
Philips Semiconductors  
Product specification  
Quad 2-input AND gate  
74HC08; 74HCT08  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2003 Jul 25  
19  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2003  
SCA75  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613508/03/pp20  
Date of release: 2003 Jul 25  
Document order number: 9397 750 11265  

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