74HCT14BQ,115 [NXP]
74HC(T)14 - Hex inverting Schmitt trigger QFN 14-Pin;型号: | 74HCT14BQ,115 |
厂家: | NXP |
描述: | 74HC(T)14 - Hex inverting Schmitt trigger QFN 14-Pin |
文件: | 总21页 (文件大小:165K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74HC14; 74HCT14
Hex inverting Schmitt trigger
Rev. 6 — 19 September 2012
Product data sheet
1. General description
The 74HC14; 74HCT14 is a high-speed Si-gate CMOS device and is pin compatible with
Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard
No. 7A.
The 74HC14; 74HCT14 provides six inverting buffers with Schmitt-trigger action. It is
capable of transforming slowly changing input signals into sharply defined, jitter-free
output signals.
2. Features and benefits
Low-power dissipation
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from 40 C to +85 C and from 40 C to +125 C
3. Applications
Wave and pulse shapers
Astable multivibrators
Monostable multivibrators
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
4. Ordering information
Table 1.
Type number Package
Temperature range Name
Ordering information
Description
Version
74HC14N
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
DIP14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
74HCT14N
74HC14D
SO14
plastic small outline package; 14 leads; body width
3.9 mm
SOT108-1
SOT337-1
SOT402-1
74HCT14D
74HC14DB
74HCT14DB
74HC14PW
74HCT14PW
74HC14BQ
74HCT14BQ
SSOP14
TSSOP14
DHVQFN14
plastic shrink small outline package; 14 leads; body
width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very SOT762-1
thin quad flat package; no leads; 14 terminals;
body 2.5 3 0.85 mm
5. Functional diagram
1
3
2
4
1A
2A
3A
4A
5A
6A
1Y
2Y
3Y
4Y
5Y
6Y
2
1
3
5
6
4
6
5
9
8
8
9
11
13
10
12
10
12
11
13
A
Y
mna025
mna204
001aac497
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram
(one Schmitt trigger)
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
2 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
6. Pinning information
6.1 Pinning
terminal 1
index area
2
3
4
5
6
13
12
11
10
9
1Y
6A
6Y
5A
5Y
4A
1
2
3
4
5
6
7
14
13
12
11
10
9
2A
2Y
3A
3Y
1A
1Y
V
CC
6A
6Y
5A
5Y
4A
4Y
14
2A
(1)
GND
2Y
14
3A
3Y
001aac499
GND
8
Transparent top view
001aac498
(1) The die substrate is attached to this pad using
conductive die attach material. It cannot be used as a
supply pin or input.
Fig 4. Pin configuration DIP14, SO14 and (T)SSOP14
Fig 5. Pin configuration DHVQFN14
6.2 Pin description
Table 2.
Symbol
1A to 6A
1Y to 6Y
GND
Pin description
Pin
Description
data input 1
data output 1
ground (0 V)
supply voltage
1, 3, 5, 9, 11, 13
2, 4, 6, 8, 10, 12
7
VCC
14
7. Functional description
Table 3.
Function table[1]
Input
nA
L
Output
nY
H
H
L
[1] H = HIGH voltage level;
L = LOW voltage level.
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
3 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7
Unit
V
supply voltage
0.5
[1]
[1]
input clamping current
output clamping current
output current
VI < 0.5 V or VI > VCC + 0.5 V
VO < 0.5 V or VO > VCC + 0.5 V
0.5 V < VO < VCC + 0.5 V
-
20
20
25
50
mA
mA
mA
mA
mA
C
IOK
-
IO
-
ICC
supply current
-
IGND
Tstg
Ptot
ground current
50
65
-
storage temperature
total power dissipation
DIP14 package
+150
[2]
-
-
750
500
mW
mW
SO14, (T)SSOP14 and
DHVQFN14 packages
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For DIP14 package: Ptot derates linearly with 12 mW/K above 70 C.
For SO14 package: Ptot derates linearly with 8 mW/K above 70 C.
For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 C.
9. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions
74HC14
74HCT14
Unit
Min
2.0
0
Typ
5.0
-
Max
6.0
Min
4.5
0
Typ
5.0
-
Max
5.5
VCC
VI
supply voltage
input voltage
V
V
V
VCC
VCC
+125
VCC
VCC
VO
output voltage
ambient temperature
0
-
0
-
Tamb
40
+25
40
+25
+125 C
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
4 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
10. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C
to +85 C
Tamb = 40 C
to +125 C
Unit
Min Typ Max
Min
Max
Min
Max
74HC14
VOH
HIGH-level
VI = VT+ or VT
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
VI = VT+ or VT
1.9
4.4
5.9
2.0
4.5
6.0
-
-
-
-
-
1.9
4.4
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
3.98 4.32
5.48 5.81
3.84
5.34
VOL
LOW-level
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
-
-
-
-
-
-
0
0
0
0.1
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
1.0
V
V
0.1
V
0.15 0.26
0.16 0.26
0.33
0.33
1.0
V
V
II
input leakage VI = VCC or GND; VCC = 6.0 V
current
-
0.1
2.0
-
A
ICC
CI
supply current VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
-
-
-
20
-
-
-
40
-
A
input
3.5
pF
capacitance
74HCT14
VOH
HIGH-level
output voltage
VI = VT+ or VT; VCC = 4.5 V
IO = 20 A
4.4
4.5
-
-
4.4
-
-
4.4
3.7
-
-
V
V
IO = 4.0 mA
3.98 4.32
3.84
VOL
LOW-level
output voltage
VI = VT+ or VT; VCC = 4.5 V
IO = 20 A;
-
-
-
0
0.1
-
-
-
0.1
-
-
-
0.1
0.4
V
IO = 4.0 mA;
0.15 0.26
0.33
1.0
V
II
input leakage VI = VCC or GND; VCC = 5.5 V
current
-
0.1
1.0
A
ICC
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
-
2.0
-
-
20
-
-
40
A
A
additional
per input pin;
30
108
135
147
supply current VI = VCC 2.1 V; other pins
at VCC or GND; IO = 0 A;
VCC = 4.5 V to 5.5 V
CI
input
-
3.5
-
-
-
-
-
pF
capacitance
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
5 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
11. Dynamic characteristics
Table 7.
Dynamic characteristics
GND = 0 V; CL = 50 pF; for test circuit see Figure 7.
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C to Unit
+125 C
Min
Typ
Max
Max
Max
(85 C) (125 C)
74HC14
[1]
tpd
propagation delay nA to nY; see Figure 6
VCC = 2.0 V
-
-
-
-
41
15
12
12
125
25
-
155
31
-
190
38
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5.0 V; CL = 15 pF
VCC = 6.0 V
21
26
32
[2]
tt
transition time
see Figure 6
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
-
-
-
-
19
7
75
15
13
-
95
19
15
-
110
22
19
-
ns
ns
ns
pF
6
[3]
[1]
CPD
power dissipation per package; VI = GND to VCC
capacitance
7
74HCT14
tpd
propagation delay nA to nY; see Figure 6
VCC = 4.5 V
-
-
-
-
20
17
7
34
-
43
-
51
-
ns
ns
ns
pF
VCC = 5.0 V; CL = 15 pF
[2]
[3]
tt
transition time
power dissipation per package;
capacitance VI = GND to VCC 1.5 V
VCC = 4.5 V; see Figure 6
15
-
19
-
22
-
CPD
8
[1] tpd is the same as tPHL and tPLH
.
[2] tt is the same as tTHL and tTLH
.
[3] CPD is used to determine the dynamic power dissipation (PD in W):
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
6 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
12. Waveforms
V
I
V
V
M
nA input
GND
M
t
t
PHL
PLH
V
OH
90 %
V
V
nY output
M
M
10 %
V
OL
t
t
TLH
THL
mna722
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Input to output propagation delays
Table 8.
Type
Measurement points
Input
VM
Output
VM
VX
VY
74HC14
0.5VCC
1.3 V
0.5VCC
1.3 V
0.1VCC
0.1VCC
0.9VCC
0.9VCC
74HCT14
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
GND
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
GND
t
W
V
CC
V
V
O
I
G
DUT
R
T
C
L
001aah768
Test data is given in Table 9.
Definitions test circuit:
RT = termination resistance should be equal to output impedance Zo of the pulse generator.
CL = load capacitance including jig and probe capacitance.
Fig 7. Load circuitry for measuring switching times
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
7 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
Table 9.
Type
Test data
Input
VI
Load
CL
Test
tr, tf
74HC14
VCC
3.0 V
6.0 ns
6.0 ns
15 pF, 50 pF
15 pF, 50 pF
tPLH, tPHL
tPLH, tPHL
74HCT14
13. Transfer characteristics
Table 10. Transfer characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Figure 8 and Figure 9.
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C
to +85 C
Tamb = 40 C
to +125 C
Unit
Min Typ Max
Min
Max
Min
Max
74HC14
VT+
VT
VH
positive-going VCC = 2.0 V
0.7 1.18 1.5
1.7 2.38 3.15
2.1 3.14 4.2
0.3 0.52 0.9
0.7
1.7
2.1
0.3
0.9
1.2
0.2
0.4
0.6
1.5
3.15
4.2
0.9
2.0
2.6
1.0
1.4
1.6
0.7
1.7
2.1
0.3
0.9
1.2
0.2
0.4
0.6
1.5
3.15
4.2
0.9
2.0
2.6
1.0
1.4
1.6
V
V
V
V
V
V
V
V
V
threshold
voltage
VCC = 4.5 V
VCC = 6.0 V
negative-going VCC = 2.0 V
threshold
voltage
VCC = 4.5 V
0.9
1.4
2.0
VCC = 6.0 V
1.2 1.89 2.6
0.2 0.66 1.0
0.4 0.98 1.4
0.6 1.25 1.6
hysteresis
voltage
VCC = 2.0 V
CC = 4.5 V
VCC = 6.0 V
V
74HCT14
VT+
positive-going VCC = 4.5 V
1.2 1.41 1.9
1.4 1.59 2.1
1.2
1.4
1.9
2.1
1.2
1.4
1.9
2.1
V
V
threshold
VCC = 5.5 V
voltage
VT
negative-going VCC = 4.5 V
0.5 0.85 1.2
0.6 0.99 1.4
0.5
0.6
1.2
1.4
0.5
0.6
1.2
1.4
V
V
threshold
VCC = 5.5 V
voltage
VH
hysteresis
voltage
VCC = 4.5 V
VCC = 5.5 V
0.4 0.56
0.4 0.6
-
-
0.4
0.4
-
-
0.4
0.4
-
-
V
V
14. Transfer characteristics waveforms
V
O
V
T+
V
I
V
H
V
T−
V
I
V
V
O
H
V
V
T+
T−
mna207
mna208
Fig 8. Transfer characteristics
Fig 9. Transfer characteristics definitions
74HC_HCT14
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
8 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
mna846
mna847
50
1.0
CC
I
I
CC
(μA)
(mA)
40
0.8
30
20
0.6
0.4
10
0
0.2
0
0
0.4
0.8
1.2
1.6
2.0
0
1
2
3
4
5
V (V)
I
V (V)
I
a. VCC = 2.0 V
b. VCC = 4.5 V
mna848
1.0
CC
I
(mA)
0.8
0.6
0.4
0.2
0
0
1.2
2.4
3.6
4.8
6.0
V (V)
I
c. VCC = 6.0 V
Fig 10. Typical 74HC transfer characteristics
74HC_HCT14
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
9 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
mna849
mna850
1.5
1.8
I
CC
I
CC
(mA)
(mA)
1.5
1.2
1.2
0.9
0.9
0.6
0.6
0.3
0.3
0
0
0
1
2
3
4
5
0
1
2
3
4
5
6
V (V)
I
V (V)
I
a. VCC = 4.5 V
b. VCC = 5.5 V
Fig 11. Typical 74HCT transfer characteristics
15. Application information
The slow input rise and fall times cause additional power dissipation, this can be
calculated using the following formula:
Padd = fi (tr ICC(AV) + tf ICC(AV)) VCC where:
Padd = additional power dissipation (W);
fi = input frequency (MHz);
tr = rise time (ns); 10 % to 90 %;
tf = fall time (ns); 90 % to 10 %;
ICC(AV) = average additional supply current (A).
Average ICC(AV) differs with positive or negative input transitions, as shown in Figure 12
and Figure 13.
An example of a relaxation circuit using the 74HC14; 74HCT14 is shown in Figure 14.
74HC_HCT14
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
10 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
mna852
400
I
CC(AV)
(μA)
300
200
100
0
positive - going
edge
negative - going
edge
0
2
4
6
V
(V)
CC
(1) Positive-going edge.
(2) Negative-going edge.
Fig 12. Average additional supply current as a function of VCC for 74HC14; linear change of VI between 0.1VCC to
0.9VCC
.
mna853
400
I
CC(AV)
(μA)
positive - going
edge
300
200
100
0
negative - going
edge
0
2
4
6
V
(V)
CC
(1) Positive-going edge.
(2) Negative-going edge.
Fig 13. Average additional supply current as a function of VCC for 74HCT14; linear change of VI between 0.1VCC
to 0.9VCC
.
74HC_HCT14
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
11 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
R
C
mna035
1
T
1
-- -----------------
For 74HC14 and 74HCT14: f =
K RC
For K-factor see Figure 15
Fig 14. Relaxation oscillator
ꢀꢀꢀꢁꢂꢂꢃꢄꢂꢅ
ꢀꢀꢀꢁꢂꢂꢃꢄꢆꢂ
ꢅꢋꢌ
ꢍ
ꢌꢆꢊ
ꢍ
ꢌꢆꢈ
ꢈꢆꢋ
ꢈꢆꢉ
ꢈꢆꢅ
ꢈꢆꢊ
ꢈ
ꢊꢋꢇ
ꢊꢋꢌ
ꢌꢋꢇ
ꢌ
ꢅ
ꢈ
ꢉ
ꢇ
ꢆ
ꢅꢆꢇ
ꢇꢆꢈ
ꢇꢆꢇ
ꢀ
ꢂꢃꢀꢄ
ꢁꢁ
ꢀ
ꢂꢃꢀꢄ
ꢁꢁ
K-factor for 74HC14
K-factor for 74HCT14
Fig 15. Typical K-factor for relaxation oscillator
74HC_HCT14
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
12 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
16. Package outline
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
M
H
14
8
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.
min.
max.
max.
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
2.2
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT27-1
050G04
MO-001
SC-501-14
Fig 16. Package outline SOT27-1 (DIP14)
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
13 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 17. Package outline SOT108-1 (SO14)
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
14 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
7
1
detail X
w M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT337-1
MO-150
Fig 18. Package outline SOT337-1 (SSOP14)
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
15 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT402-1
MO-153
Fig 19. Package outline SOT402-1 (TSSOP14)
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
16 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
SOT762-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14
13
9
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.
0.05 0.30
0.00 0.18
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT762-1
- - -
MO-241
- - -
Fig 20. Package outline SOT762-1 (DHVQFN14)
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
17 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
17. Abbreviations
Table 11. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal-Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
LSTTL
MM
Low-power Schottky Transistor-Transistor Logic
Machine Model
18. Revision history
Table 12. Revision history
Document ID
Release date
20120919
Data sheet status
Change notice
Supersedes
74HC_HCT14 v.6
Modifications:
Product data sheet
-
74HC_HCT14 v.5
• Figure 15 added (typical K-factor for relaxation oscillator).
74HC_HCT14 v.5
Modifications:
20111219
Product data sheet
-
74HC_HCT14 v.4
• Legal pages updated.
74HC_HCT14 v.4
74HC_HCT14 v.3
74HC_HCT14_CNV v.2
20110117
20031030
19970826
Product data sheet
-
-
-
74HC_HCT14 v.3
Product specification
Product specification
74HC_HCT14_CNV v.2
-
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
18 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
19. Legal information
19.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
19.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
19.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
19 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT14
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 6 — 19 September 2012
20 of 21
74HC14; 74HCT14
NXP Semiconductors
Hex inverting Schmitt trigger
21. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Transfer characteristics . . . . . . . . . . . . . . . . . . 8
Transfer characteristics waveforms. . . . . . . . . 8
Application information. . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
8
9
10
11
12
13
14
15
16
17
18
19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
19.1
19.2
19.3
19.4
20
21
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 September 2012
Document identifier: 74HC_HCT14
相关型号:
74HCT14BQ-Q100
HCT SERIES, HEX 1-INPUT INVERT GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
NXP
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