74HCT153PW [NXP]

IC HCT SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, SOT-403-1, TSSOP-16, Multiplexer/Demultiplexer;
74HCT153PW
型号: 74HCT153PW
厂家: NXP    NXP
描述:

IC HCT SERIES, DUAL 4 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16, SOT-403-1, TSSOP-16, Multiplexer/Demultiplexer

光电二极管 输出元件
文件: 总17页 (文件大小:145K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74HC153; 74HCT153  
Dual 4-input multiplexer  
Rev. 4 — 28 November 2013  
Product data sheet  
1. General description  
The 74HC153; 74HCT153 is a dual 4-input multiplexer. The device features independent  
enable inputs (nE) and common data select inputs (S0 and S1). For each multiplexer, the  
select inputs select one of the four binary inputs and routes it to the multiplexer output  
(nY). A HIGH on E forces the corresponding multiplexer outputs LOW. Inputs include  
clamp diodes. This enables the use of current limiting resistors to interface inputs to  
voltages in excess of VCC  
.
2. Features and benefits  
Input levels:  
For 74HC153: CMOS level  
For 74HCT153: TTL level  
Non-inverting outputs  
Separate enable input for each output  
Common select inputs  
Complies with JEDEC standard no. 7A  
Permits multiplexing from n lines to 1 line  
Enable line provided for cascading (n lines to 1 line)  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
Multiple package options  
Specified from 40 C to +85 C and 40 C to +125 C.  
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
3. Ordering information  
Table 1.  
Type number Package  
Temperature range Name  
Ordering information  
Description  
Version  
74HC153N  
40 C to +125 C  
40 C to +125 C  
40 C to +125 C  
DIP14  
plastic dual in-line package; 14 leads (300 mil)  
SOT27-1  
74HCT153N  
74HC153D  
SO14  
plastic small outline package; 14 leads; body width  
3.9 mm  
SOT108-1  
74HCT153D  
74HC153DB  
74HCT153DB  
SSOP14  
TSSOP14  
plastic shrink small outline package; 14 leads; body SOT337-1  
width 5.3 mm  
74HC153PW 40 C to +125 C  
plastic thin shrink small outline package; 14 leads;  
body width 4.4 mm  
SOT402-1  
74HCT153PW  
4. Functional diagram  
1
2E  
1I0  
6
1I1  
1Y  
5
7
MUX  
1I2  
1I3  
4
3
S0  
S1  
14  
2
6
5
4
3
10 11 12 13  
1I0 1I1 1I2 1I3 2I0 2I1 2I2 2I3  
S0  
2I0  
2I1  
2I2  
2I3  
14  
2
10  
11  
12  
13  
2Y  
S1  
1E  
2E  
9
MUX  
1
15  
1Y  
7
2Y  
9
2E  
15  
001aal843  
001aal844  
Fig 1. Logic symbol  
Fig 2. Functional diagram  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
2 of 17  
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
1E  
1I3  
1I2  
1I1  
1I0  
S0  
S1  
2I3  
2I2  
2I1  
2I0  
2E  
1Y  
2Y  
001aal845  
Fig 3. Logic diagram  
5. Pinning information  
5.1 Pinning  
ꢀꢁ+&ꢂꢃꢄ  
ꢀꢁ+&7ꢂꢃꢄ  
ꢀꢆ  
ꢀꢅ  
ꢀꢄ  
ꢀꢂ  
ꢀꢁ  
ꢀꢀ  
ꢀꢃ  
ꢀ(  
6ꢀ  
9
&&  
ꢀꢁ+&ꢂꢃꢄ  
ꢀꢁ+&7ꢂꢃꢄ  
ꢁ(  
6ꢃ  
ꢁ,ꢂ  
ꢁ,ꢁ  
ꢁ,ꢀ  
ꢁ,ꢃ  
ꢁ<  
ꢀ,ꢂ  
ꢀꢆ  
ꢀꢅ  
ꢀꢄ  
ꢀꢂ  
ꢀꢁ  
ꢀꢀ  
ꢀꢃ  
ꢀ(  
6ꢀ  
9
&&  
ꢁ(  
6ꢃ  
ꢁOꢂ  
ꢁOꢁ  
ꢁOꢀ  
ꢁOꢃ  
ꢁ<  
ꢀ,ꢁ  
ꢀOꢂ  
ꢀ,ꢀ  
ꢀOꢁ  
ꢀOꢀ  
ꢀ,ꢃ  
ꢀOꢃ  
ꢀ<  
ꢀ<  
*1'  
*1'  
DDDꢀꢁꢁꢂꢃꢄꢅ  
DDDꢀꢁꢁꢂꢃꢄꢃ  
Fig 4. Pin configuration DIP16, SO16  
Fig 5. Pin configuration (T)SSOP16  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
3 of 17  
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
5.2 Pin description  
Table 2.  
Symbol  
1E, 2E  
Pin description  
Pin  
Description  
1, 15  
output enable inputs (active LOW)  
data select inputs  
S0, S1  
14, 2  
1I0, 1I1, 1I2, 1I3  
1Y  
6, 5, 4, 3  
data inputs source 1  
multiplexer output source 1  
ground (0 V)  
7
GND  
8
2Y  
9
multiplexer output source 2  
data inputs source 2  
supply voltage  
2I0, 2I1, 2I2, 2I3  
VCC  
10, 11, 12, 13  
16  
6. Functional description  
Table 3.  
Function table  
H = HIGH voltage level; L = LOW voltage level; X = don’t care.  
select Inputs  
data inputs  
output enable output  
S0  
X
L
S1  
X
L
nI0  
X
nI1  
X
nI2  
X
nI3  
X
nE  
H
L
nY  
L
L
X
X
X
L
L
L
H
X
X
X
X
L
H
L
H
H
L
L
L
X
X
L
L
X
H
X
X
X
L
H
L
H
H
H
H
X
L
X
L
L
X
X
H
X
X
L
H
L
H
H
X
X
L
L
X
X
X
H
L
H
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
Max  
+7  
Unit  
V
supply voltage  
0.5  
[1]  
[1]  
input clamping current  
output clamping current  
output current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
0.5 V < VO < VCC + 0.5 V  
-
20  
20  
25  
50  
mA  
mA  
mA  
mA  
mA  
C  
IOK  
-
IO  
-
ICC  
supply current  
-
IGND  
Tstg  
ground current  
50  
65  
-
storage temperature  
+150  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
4 of 17  
 
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
Table 4.  
Limiting values …continued  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
[2]  
Ptot  
total power dissipation  
DIP16 package  
-
-
750  
500  
mW  
mW  
SO16 and (T)SSOP16  
packages  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.  
For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.  
For (T)SSOP16 packages: Ptot derates linearly with 5.5 mW/K above 60 C.  
8. Recommended operating conditions  
Table 5.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V)  
Symbol Parameter Conditions  
74HC153  
74HCT153  
Unit  
Min  
Typ  
Max  
6.0  
Min  
Typ  
Max  
VCC  
VI  
supply voltage  
2.0  
5.0  
4.5  
5.0  
5.5  
VCC  
VCC  
+125  
-
V
input voltage  
0
-
VCC  
VCC  
+125  
625  
139  
83  
0
-
V
VO  
output voltage  
0
-
0
-
V
Tamb  
t/V  
ambient temperature  
input transition rise and fall rate VCC = 2.0 V  
VCC = 4.5 V  
40  
+25  
40  
+25  
C  
-
-
-
-
-
-
-
-
ns/V  
ns/V  
ns/V  
1.67  
-
1.67  
-
139  
-
VCC = 6.0 V  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 C  
40 C to +85 C 40 C to +125 C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
74HC153  
VIH  
HIGH-level  
input voltage  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
1.5  
1.2  
2.4  
3.2  
0.8  
-
-
1.5  
-
-
1.5  
-
-
V
V
V
V
V
V
3.15  
3.15  
3.15  
4.2  
-
4.2  
-
4.2  
-
VIL  
LOW-level  
input voltage  
-
-
-
0.5  
-
-
-
0.5  
1.35  
1.8  
-
-
-
0.5  
1.35  
1.8  
2.1 1.35  
2.8 1.8  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
5 of 17  
 
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
25 C  
40 C to +85 C 40 C to +125 C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
VOH  
HIGH-level  
VI = VIH or VIL  
output voltage  
IO = 20 A; VCC = 2.0 V  
IO = 20 A; VCC = 4.5 V  
IO = 20 A; VCC = 6.0 V  
1.9  
4.4  
5.9  
2.0  
4.5  
6.0  
-
-
-
-
-
1.9  
4.4  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
V
V
V
V
V
5.9  
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32  
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81  
VI = VIH or VIL  
3.84  
5.34  
VOL  
LOW-level  
output voltage  
IO = 20 A; VCC = 2.0 V  
IO = 20 A; VCC = 4.5 V  
IO = 20 A; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
-
-
-
-
-
-
0
0
0
0.1  
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
1  
V
V
0.1  
V
0.15 0.26  
0.16 0.26  
0.33  
0.33  
1  
V
V
II  
input leakage  
current  
VI = VCC or GND;  
VCC = 6.0 V  
-
0.1  
8.0  
-
A  
ICC  
CI  
supply current VI = VCC or GND; IO = 0 A;  
VCC = 6.0 V  
-
-
-
-
-
80  
-
-
-
160  
-
A  
input  
3.5  
pF  
capacitance  
74HCT153  
VIH  
HIGH-level  
input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
1.6  
1.2  
-
2.0  
-
-
2.0  
-
-
V
V
VIL  
LOW-level  
0.8  
0.8  
0.8  
input voltage  
VOH  
HIGH-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 A  
4.4  
4.5  
-
-
4.4  
-
-
4.4  
3.7  
-
-
V
V
IO = 4.0 mA  
3.98 4.32  
3.84  
VOL  
LOW-level  
output voltage  
VI = VIH or VIL; VCC = 4.5 V  
IO = 20 A; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
-
-
-
0
0.1  
-
-
-
0.1  
0.33  
1  
-
-
-
0.1  
0.4  
1  
V
0.15 0.26  
V
II  
input leakage  
current  
VI = VCC or GND;  
VCC = 5.5 V  
-
0.1  
A  
ICC  
ICC  
supply current VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
-
-
8
-
80  
-
160  
A  
additional  
per input pin;  
supply current VI = VCC 2.1 V; IO = 0 A;  
other inputs at VCC or GND;  
V
CC = 4.5 V to 5.5 V  
1In, 2In  
nE  
-
-
-
-
45  
60  
162  
216  
486  
-
-
-
-
-
203  
270  
608  
-
-
-
-
-
221  
294  
662  
-
A  
A  
A  
pF  
Sn  
135  
3.5  
CI  
input  
capacitance  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
6 of 17  
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; for test circuit, see Figure 8; unless otherwise specified  
Symbol Parameter  
Conditions  
25 C  
40 C to +85 C 40 C to +125 C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
74HC153  
[1]  
tpd  
propagation  
delay  
1In to nY, 2In to nY; see  
Figure 6  
VCC = 2.0 V  
-
-
-
-
47 145  
-
-
-
-
180  
36  
-
-
-
-
-
220  
44  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
17  
14  
14  
29  
-
VCC = 5.0 V; CL = 15 pF  
VCC = 6.0 V  
25  
31  
38  
Sn to nY; see Figure 7  
VCC = 2.0 V  
-
-
-
-
50 150  
-
-
-
-
190  
38  
-
-
-
-
-
225  
45  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
18  
15  
14  
30  
-
VCC = 5.0 V; CL = 15 pF  
VCC = 6.0 V  
26  
33  
38  
nE to nY; see Figure 7  
VCC = 2.0 V  
-
-
-
-
33 100  
-
-
-
-
125  
25  
-
-
-
-
-
150  
30  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
12  
10  
10  
20  
-
VCC = 5.0 V; CL = 15 pF  
VCC = 6.0 V  
17  
21  
26  
[2]  
tt  
transition time see Figure 6  
VCC = 2.0 V  
-
-
-
-
19  
7
75  
15  
13  
-
-
-
-
-
95  
19  
16  
-
-
-
-
-
110  
22  
19  
-
ns  
ns  
ns  
pF  
VCC = 4.5 V  
VCC = 6.0 V  
6
[3]  
[1]  
CPD  
power  
dissipation  
capacitance  
per package;  
VI = GND to VCC  
30  
74HCT153  
tPHL HIGH to LOW 1In to nY, 2In to nY; see  
propagation  
Figure 6  
VCC = 4.5 V  
VCC = 5.0 V; CL = 15 pF  
LOW to HIGH 1In to nY, 2In to nY; see  
delay  
-
-
19  
16  
34  
-
-
-
43  
-
-
-
51  
-
ns  
ns  
[1]  
tPLH  
propagation  
delay  
Figure 6  
VCC = 4.5 V  
VCC = 5.0 V; CL = 15 pF  
-
-
13  
16  
24  
-
-
-
30  
-
-
-
36  
-
ns  
ns  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
7 of 17  
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
Table 7.  
Dynamic characteristics …continued  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF; for test circuit, see Figure 8; unless otherwise specified  
Symbol Parameter  
Conditions  
25 C  
40 C to +85 C 40 C to +125 C Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
[1]  
[1]  
tpd  
propagation  
delay  
Sn to nY; see Figure 7  
VCC = 4.5 V  
-
-
20  
17  
34  
-
-
-
43  
-
-
-
51  
-
ns  
ns  
VCC = 5.0 V; CL = 15 pF  
nE to nY; see Figure 7  
VCC = 4.5 V  
-
-
14  
11  
27  
-
-
-
34  
-
-
-
41  
-
ns  
ns  
VCC = 5.0 V; CL = 15 pF  
[2]  
[3]  
tt  
transition time see Figure 6  
VCC = 4.5 V  
-
-
7
15  
-
-
-
19  
-
-
-
22  
-
ns  
CPD  
power  
per package;  
30  
pF  
dissipation  
capacitance  
VI = GND to VCC 1.5 V  
[1] tpd is the same as tPHL and tPLH  
[2] tt is the same as tTHL and tTLH  
[3] PD is used to determine the dynamic power dissipation (PD in W):  
.
.
C
PD = CPD VCC2 fi N + (CL VCC2 fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL VCC2 fo) = sum of outputs.  
9
,
9
9
0
ꢀ,QꢊꢋꢁOQꢋLQSXW  
*1'  
0
W
W
3/+  
3+/  
9
2+  
9
<
9
9
0
Q<ꢋRXWSXW  
0
9
;
9
2/  
W
W
7+/  
7/+  
DDDꢀꢁꢁꢂꢃꢄꢆ  
(1) Measurement points are given in Table 8.  
OL and VOH are typical voltage output levels that occur with the output load.  
V
Fig 6. Waveforms showing the input (1In, 2In) to output (1Y, 2Y) propagation delays and output transition times  
Table 8.  
Type  
Measurement points  
Input  
VM  
Output  
VM  
VX  
VY  
74HC153  
0.5VCC  
1.3 V  
0.5VCC  
1.3 V  
0.1VCC  
0.1VCC  
0.9VCC  
0.9VCC  
74HCT153  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
8 of 17  
 
 
 
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
9
,
9
9
0
6QꢊꢋQ(ꢋLQSXW  
*1'  
0
W
W
3/+  
3+/  
9
2+  
9
<
9
9
0
Q<ꢋRXWSXW  
0
9
;
9
2/  
W
W
7+/  
7/+  
DDDꢀꢁꢁꢂꢃꢄꢄ  
(1) Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 7. Waveforms showing the input (Sn, nE) to output (nY) propagation delays  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
GND  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
GND  
t
W
V
CC  
V
V
O
I
G
DUT  
R
T
C
L
001aah768  
Test data is given in Table 9.  
Definitions test circuit:  
RT = termination resistance should be equal to output impedance Zo of the pulse generator.  
CL = load capacitance including jig and probe capacitance.  
Fig 8. Test circuit for measuring switching times  
Table 9.  
Type  
Test data  
Input  
VI  
Load  
Test  
tr, tf  
CL  
74HC153  
VCC  
3.0 V  
6.0 ns  
6.0 ns  
15 pF, 50 pF  
15 pF, 50 pF  
tPLH, tPHL  
tPLH, tPHL  
74HCT153  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
9 of 17  
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
11. Package outline  
DIP14: plastic dual in-line package; 14 leads (300 mil)  
SOT27-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
M
H
14  
8
pin 1 index  
E
1
7
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
2
(1)  
(1)  
Z
1
UNIT  
mm  
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.  
min.  
max.  
max.  
1.73  
1.13  
0.53  
0.38  
0.36  
0.23  
19.50  
18.55  
6.48  
6.20  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
2.2  
0.068  
0.044  
0.021  
0.015  
0.014  
0.009  
0.77  
0.73  
0.26  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.087  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT27-1  
050G04  
MO-001  
SC-501-14  
Fig 9. Package outline SOT27-1 (DIP14)  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
10 of 17  
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
v
c
y
H
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT108-1  
076E06  
MS-012  
Fig 10. Package outline SOT108-1 (SO14)  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
11 of 17  
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm  
SOT337-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
7
1
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.4  
0.9  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT337-1  
MO-150  
Fig 11. Package outline SOT337-1 (SSOP14)  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
12 of 17  
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
7
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.72  
0.38  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT402-1  
MO-153  
Fig 12. Package outline SOT402-1 (TSSOP14)  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
13 of 17  
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
12. Abbreviations  
Table 10. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal-Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
HBM  
Human Body Model  
LSTTL  
MM  
Low-power Schottky Transistor-Transistor Logic  
Machine Model  
TTL  
Transistor-Transistor Logic  
13. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20131128  
Data sheet status  
Change notice  
Supersedes  
74HC_HCT153 v.4  
Modifications:  
Product data sheet  
-
74HC_HCT153 v.3  
Figure 4 removed from the data sheet.  
74HC_HCT153 v.3  
74HC_HCT153_CNV v.2  
20130722  
Product data sheet  
-
-
74HC_HCT153_CNV v.2  
-
19970827  
Product specification  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
14 of 17  
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
14. Legal information  
14.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
14.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
14.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
15 of 17  
 
 
 
 
 
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
14.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
15. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74HC_HCT153  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 4 — 28 November 2013  
16 of 17  
 
 
74HC153; 74HCT153  
NXP Semiconductors  
Dual 4-input multiplexer  
16. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
6
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14  
7
8
9
10  
11  
12  
13  
14  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
14.1  
14.2  
14.3  
14.4  
15  
16  
Contact information. . . . . . . . . . . . . . . . . . . . . 16  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2013.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 28 November 2013  
Document identifier: 74HC_HCT153  
 

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