74HCT1G04GV,125 [NXP]
74HC(T)1G04 - Inverter TSOP 5-Pin;型号: | 74HCT1G04GV,125 |
厂家: | NXP |
描述: | 74HC(T)1G04 - Inverter TSOP 5-Pin PC 光电二极管 逻辑集成电路 |
文件: | 总12页 (文件大小:92K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74HC1G04; 74HCT1G04
Inverter
Rev. 5 — 25 September 2013
Product data sheet
1. General description
The 74HC1G04; 74HCT1G04 is a single inverter. Inputs include clamp diodes that enable
the use of current limiting resistors to interface inputs to voltages in excess of VCC
.
2. Features and benefits
Wide supply voltage range from 2.0 V to 6.0 V
Input levels:
For 74HC1G04: CMOS level
For 74HCT1G04: TTL level
Symmetrical output impedance
High noise immunity
Low power dissipation
Balanced propagation delays
ESD protection:
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from 40 C to +85 C and 40 C to +125 C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC1G04GW
74HCT1G04GW
74HC1G04GV
74HCT1G04GV
40 C to +125 C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
40 C to +125 C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
4. Marking
Table 2.
Marking codes
Type number
74HC1G04GW
74HCT1G04GW
74HC1G04GV
74HCT1G04GV
Marking[1]
HC
TC
H04
T04
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
A
Y
4
1
2
2
4
Y
A
mna108
mna109
mna110
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram
6. Pinning information
6.1 Pinning
74HC1G04
74HCT1G04
1
2
3
5
4
n.c.
A
V
CC
GND
Y
001aaf089
Fig 4. Pin configuration
6.2 Pin description
Table 3.
Symbol
n.c.
Pin description
Pin
Description
not connected
data input
1
2
3
4
5
A
GND
Y
ground (0 V)
data output
VCC
supply voltage
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
2 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
7. Functional description
Table 4.
Function table
H = HIGH voltage level; L = LOW voltage level
Input
Output
A
L
Y
H
L
H
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). [1]
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7.0
20
20
12.5
25
Unit
V
supply voltage
0.5
input clamping current
output clamping current
output current
VI < 0.5 V or VI > VCC + 0.5 V
VO < 0.5 V or VO > VCC + 0.5 V
0.5 V < VO < VCC + 0.5 V
-
mA
mA
mA
mA
mA
C
IOK
-
IO
-
ICC
supply current
-
IGND
Tstg
Ptot
ground current
25
65
-
-
storage temperature
total power dissipation
+150
200
[2]
Tamb = 40 C to +125 C
mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] Above 55 C, the value of Ptot derates linearly with 2.5 mW/K.
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74HC1G04
74HCT1G04
Unit
Min
Typ
Max
6.0
Min
Typ
Max
5.5
VCC
VI
supply voltage
input voltage
2.0
5.0
4.5
5.0
V
V
V
0
-
VCC
VCC
+125
625
139
83
0
-
VCC
VCC
VO
output voltage
ambient temperature
0
-
0
-
Tamb
t/V
40
+25
40
+25
+125 C
input transition rise
and fall rate
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
-
-
-
-
-
-
-
-
-
-
-
-
-
139
-
ns/V
ns/V
ns/V
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
3 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C.
Symbol
Parameter
Conditions
40 C to +85 C
40 C to +125 C Unit
Min
Typ
Max
Min
Max
For type 74HC1G04
VIH HIGH-level input
VCC = 2.0 V
1.5
1.2
2.4
3.2
0.8
2.1
2.8
-
-
1.5
-
-
V
V
V
V
V
V
voltage
VCC = 4.5 V
3.15
3.15
VCC = 6.0 V
4.2
-
4.2
-
VIL
LOW-level input
voltage
VCC = 2.0 V
-
-
-
0.5
1.35
1.8
-
-
-
0.5
1.35
1.8
VCC = 4.5 V
VCC = 6.0 V
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 2.0 mA; VCC = 4.5 V
IO = 2.6 mA; VCC = 6.0 V
VI = VIH or VIL
1.9
4.4
2.0
4.5
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
6.0
4.13
5.63
4.32
5.81
VOL
LOW-level output
voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 2.0 mA; VCC = 4.5 V
IO = 2.6 mA; VCC = 6.0 V
-
-
-
-
-
-
-
0
0.1
0.1
-
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
1.0
20
V
0
V
0
0.15
0.16
-
0.1
V
0.33
0.33
1.0
V
V
II
input leakage current VI = VCC or GND; VCC = 6.0 V
A
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
10
CI
input capacitance
-
1.5
-
-
-
pF
For type 74HCT1G04
VIH
HIGH-level input
voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2.0
-
1.6
1.2
-
2.0
-
-
V
V
VIL
LOW-level input
voltage
0.8
0.8
VOH
HIGH-level output
voltage
VI = VIH or VIL
IO = 20 A; VCC = 4.5 V
IO = 2.0 mA; VCC = 4.5 V
VI = VIH or VIL
4.4
4.5
-
-
4.4
3.7
-
-
V
V
4.13
4.32
VOL
LOW-level output
voltage
IO = 20 A; VCC = 4.5 V
IO = 2.0 mA; VCC = 4.5 V
-
-
-
0
0.15
-
0.1
0.33
1.0
-
-
-
0.1
0.4
1.0
V
V
II
input leakage current VI = VCC or GND; VCC = 5.5 V
A
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
4 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
Table 7.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 C.
Symbol
Parameter
Conditions
40 C to +85 C
40 C to +125 C Unit
Min
Typ
Max
Min
Max
ICC
ICC
CI
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
-
-
10
500
-
-
20
A
A
pF
additional supply
current
per input; VCC = 4.5 V to 5.5 V;
VI = VCC 2.1 V; IO = 0 A
-
-
-
850
-
input capacitance
1.5
11. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; tr = tf 6.0 ns; All typical values are measured at Tamb = 25 C. For test circuit, see Figure 6
Symbol Parameter
Conditions
40 C to +85 C
40 C to +125 C Unit
Min
Typ
Max
Min
Max
For type 74HC1G04
[1]
tpd
propagation delay
A to Y; see Figure 5
VCC = 2.0 V; CL = 50 pF
VCC = 4.5 V; CL = 50 pF
VCC = 5.0 V; CL = 15 pF
VCC = 6.0 V; CL = 50 pF
VI = GND to VCC
-
-
-
-
-
25
9
105
21
-
-
-
-
-
-
135
27
-
ns
ns
ns
ns
pF
7
8
18
-
23
-
[2]
[1]
CPD
power dissipation
capacitance
16
For type 74HCT1G04
tpd
propagation delay A to Y; see Figure 5
VCC = 4.5 V; CL = 50 pF
-
-
-
10
8
24
-
-
-
-
27
-
ns
ns
pF
VCC = 5.0 V; CL = 15 pF
[2]
CPD
power dissipation
capacitance
VI = GND to VCC 1.5 V
18
-
-
[1] tpd is the same as tPLH and tPHL
.
[2] CPD is used to determine the dynamic power dissipation PD (W).
PD = CPD VCC2 fi + (CL VCC2 fo) where:
fi = input frequency in MHz
fo = output frequency in MHz
CL = output load capacitance in pF
VCC = supply voltage in Volts
(CL VCC2 fo) = sum of outputs
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
5 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
12. Waveforms
V
A input
M
t
t
PHL
PLH
Y output
V
M
mna111
Measurement points are given in Table 9.
Fig 5. The input (A) to output (Y) propagation delays
Table 9.
Type
Measurement points
VI
VM
74HC1G04
GND to VCC
GND to 03 V
0.5 VCC
1.3 V
74HCT1G04
V
CC
V
V
O
I
PULSE
GENERATOR
DUT
C
L
R
T
mna101
Test data is given in Table 8. Definitions for test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
Fig 6. Load circuitry for switching times
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
6 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
4
A
2
A
(A )
3
A
1
θ
L
L
p
1
3
e
w M
b
p
detail X
e
1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
e
1
H
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.1
0
1.0
0.8
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
2.25
2.0
0.46
0.21
0.60
0.15
7°
0°
mm
1.1
0.65
1.3
0.15
0.425
0.3
0.1
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
00-09-01
03-02-19
SOT353-1
MO-203
SC-88A
Fig 7. Package outline SOT353-1 (TSSOP5)
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
7 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
Plastic surface-mounted package; 5 leads
SOT753
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
1
2
3
p
detail X
e
b
p
w
M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.100
0.013
0.40
0.25
1.1
0.9
0.26
0.10
3.1
2.7
1.7
1.3
3.0
2.5
0.6
0.2
0.33
0.23
mm
0.95
0.2
0.2
0.1
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
02-04-16
06-03-16
SOT753
SC-74A
Fig 8. Package outline SOT753 (SC-74A)
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
8 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
14. Abbreviations
Table 10. Abbreviations
Acronym
DUT
Description
Device Under Test
TTL
Transistor-Transistor Logic
15. Revision history
Table 11. Revision history
Document ID
Release date
20130925
Data sheet status
Change notice
Supersedes
74HC_HCT1G04 v.5
Modifications:
Product data sheet
-
74HC_HCT1G04 v.4
• Section 1 “General description” updated.
20070716 Product data sheet
74HC_HCT1G04 v.4
Modifications:
-
74HC_HCT1G04 v.3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Package SOT353 changed to SOT353-1 in Table 1 and Figure 7.
• Quick Reference Data and Soldering sections removed.
• Section 2 “Features and benefits” updated.
74HC_HCT1G04 v.3
74HC_HCT1G04 v.2
74HC_HCT1G04 v.1
20020517
20010302
19980831
Product specification
Product specification
Preliminary specification
-
-
-
74HC_HCT1G04 v.2
74HC_HCT1G04 v.1
-
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
9 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
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Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
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the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
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products are sold subject to the general terms and conditions of commercial
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agreed in a valid written individual agreement. In case an individual
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applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
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Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
74HC_HCT1G04
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
10 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT1G04
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 5 — 25 September 2013
11 of 12
NXP Semiconductors
74HC1G04; 74HCT1G04
Inverter
18. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 3
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 September 2013
Document identifier: 74HC_HCT1G04
相关型号:
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