74HCT258DB [NXP]
IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer;
| 型号： | 74HCT258DB |
| 厂家： | 
NXP |
| 描述： | IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDSO16, Multiplexer/Demultiplexer 复用器 |
| 文件： | 总16页 (文件大小：87K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
74HC/HCT258
Quad 2-input multiplexer; 3-state;
inverting
Product specification
1999 Sep 02
File under Integrated Circuits, IC06
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
FEATURES
Data appears at the outputs (1Y to 4Y) in inverted form
from the select inputs.
• Inverting data path
The ‘258’ is the logic implementation of a 4-pole, 2-position
switch, where the position of the switch is determined by
the logic levels applied to S. The outputs are forced to a
high impedance OFF-state when OE is HIGH.
• 3-state outputs interface directly with system bus
• Output capability: bus driver
• ICC category: MSI.
The logic equations for the outputs are:
GENERAL DESCRIPTION
1Y = OE × (1I1 × S + 1I0 × S)
The 74HC/HCT258 are high-speed Si-gate CMOS devices
and are pin compatible with Low power Schottky TTL
(LSTTL). They are specified in compliance with JEDEC
standard no. 7A.
2Y = OE × (2I1 × S + 2I0 × S)
3Y = OE × (3I1 × S + 3I0 × S)
The 74HC/HCT258 have four identical 2-input multiplexers
with 3-state outputs, which select 4 bits of data from two
sources and are controlled by a common data select
input (S).
4Y = OE × (4I1 × S + 4I0 × S)
The ‘258’ is identical to the ‘257’ but has inverting outputs.
The data inputs from source 0 (1I0 to 4I0) are selected
when input S is LOW and the data inputs from source 1
(1I1 to 4I1) are selected when S is HIGH.
QUICK REFERENCE DATA
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns.
TYPICAL
SYMBOL
PARAMETER
CONDITIONS
CL = 15 pF;
UNIT
HC
HCT
tPHL/tPLH propagation delay
nI0, nI1 to nY
VCC = 5 V
9
13
16
ns
S to nY
14
3.5
55
ns
pF
pF
CI
input capacitance
3.5
38
CPD
power dissipation capacitance per multiplexer
notes 1 and 2
Notes
1. CPD is used to determine the dynamic power dissipation (PD in µW):
PD = CPD × VCC2 × fi + ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
∑ (CL × VCC2 × fo) = sum of outputs;
CL = output load capacitance in pF;
VCC = supply voltage in Volts.
2. For HC the condition is VI = GND to VCC
;
For HCT the condition is VI = GND to VCC − 1.5 V.
1999 Sep 02
2
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
74HC258N;
74HCT258N
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
74HC258D;
74HCT258D
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
74HC258DB
SSOP16
plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
PIN DESCRIPTION
PIN NO.
SYMBOL
NAME AND FUNCTION
common data select input
1
S
2, 5, 11 and 14
1I0 to 4I0
1I1 to 4I1
1Y to 4Y
GND
data inputs from source 0
3, 6, 10 and 13
data inputs from source 1
4, 7, 9 and 12
3-state multiplexer outputs
ground (0 V)
8
15
16
OE
3-state output enable input (active LOW)
positive supply voltage
VCC
page
1
G1
1
page
page
S
1
2
3
4
5
6
7
8
16
15
14
V
CC
15
EN
S
1I
1I
2
3
0
1
1I
OE
0
1
1Y
2Y
3Y
4Y
4
2
3
MUX
1I
3I
0
1
1
4
2I
2I
5
6
0
1
7
1Y
13 3I
1
258
5
6
3I
3I
2I
0
4Y
12
11
10
9
14
13
0
1
7
9
9
2I
1
4I
4I
0
1
4I
4I
11
10
11
10
0
1
12
2Y
GND
3Y
15
OE
14
13
12
MGA830
MGA832
MGA831
Fig.1 Pin configuration.
Fig.2 Logic symbol.
Fig.3 IEC logic symbol.
1999 Sep 02
3
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
2
3
5
6
14
3I
13
3I
11
4I
10
4I
1I
1I
2I
2I
0
1
0
1
0
1
0
1
1
S
SELECTOR
15 OE
3-STATE MULTIPLEXER OUTPUTS
1Y
4
2Y
7
3Y
12
4Y
9
MBL095
Fig.4 Functional diagram.
FUNCTION TABLE
See note 1
INPUTS
nI0
OUTPUT
1I
0
OE
S
nI1
nY
1Y
2Y
3Y
H
L
L
L
L
X
H
H
L
X
X
X
L
X
L
Z
H
L
1I
1
H
X
X
2I
0
H
L
L
H
2I
1
Note
1. H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
3I
0
3I
1
Z = high impedance OFF-state.
4I
0
4Y
4I
1
OE
S
MBL096
Fig.5 Logic diagram.
1999 Sep 02
4
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
DC CHARACTERISTICS FOR 74HC
For the DC characteristics see chapter “HCMOS family characteristics”, section “Family specifications”.
Output capability: bus driver.
ICC category: MSI.
AC CHARACTERISTICS FOR 74HC
GND = 0 V; tr = tf = 6 ns; CL = 50 pF.
Tamb (°C)
−40 to +85
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
TEST CONDITIONS
SYMBOL
PARAMETER
25
−40 to +125 UNIT
VCC
(V)
WAVEFORMS
tPHL/tPLH propagation delay;
nI0 to nY; nI1 to nY
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
30
11
9
95
19
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
120
24
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
145
29
ns
ns
ns
ns
ns
2.0 see Fig.6
4.5
16
20
25
6.0
propagation delay;
S to nY
47
17
14
39
14
11
55
20
16
14
5
140
28
175
35
210
42
2.0 see Fig.6
4.5
24
30
36
6.0
t
t
t
PZH/tPZL 3-state output
140
28
175
35
210
42
2.0 see Fig.7
enable time
OE to nY
4.5
24
30
36
6.0
PHZ/tPLZ 3-state output
disable time
150
30
190
38
225
45
2.0 see Fig.7
4.5
OE to nY
26
33
38
6.0
THL/tTLH output transition
time
60
75
90
2.0 see Fig.6
12
15
18
4.5
6.0
4
10
13
15
1999 Sep 02
5
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
DC CHARACTERISTICS FOR 74HCT
For the DC characteristics see chapter “HCMOS family characteristics”, section “Family specifications”.
Output capability: bus driver.
ICC category: MSI.
Note to HCT types
The value of additional quiescent supply current (∆ICC) for a unit load of 1 is given in the family specifications.
To determine ∆ICC per input, multiply this value by the unit load coefficient shown in Table 1.
Table 1
INPUT
UNIT LOAD COEFFICIENT
nI0
nI1
OE
S
0.50
0.50
1.50
1.50
AC CHARACTERISTICS FOR 74HCT
GND = 0 V; tr = tf = 6 ns; CL = 50 pF.
Tamb (°C)
TEST CONDITIONS
SYMBOL
PARAMETER
25
−40 to +85 −40 to +125 UNIT
VCC
WAVEFORMS
(V)
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
t
PHL/tPLH propagation delay;
−
−
−
−
−
16
19
18
17
5
27
34
30
30
12
−
−
−
−
−
34
43
38
38
15
−
−
−
−
−
41
51
45
45
18
ns
ns
ns
ns
ns
4.5
4.5
4.5
4.5
4.5
see Fig.6
see Fig.6
see Fig.7
see Fig.7
see Fig.6
nI0 to nY; nI1 to nY
propagation delay;
S to nY
t
t
t
PZH/tPZL 3-state output enable
time; OE to nY
PHZ/tPLZ 3-state output disable
time; OE to nY
THL/tTLH output transition time
1999 Sep 02
6
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
AC WAVEFORMS
(1)
V
S, nl , nl INPUT
M
t
0
1
t
PHL
PLH
(1)
nY OUTPUT
V
M
t
t
THL
MBL097
TLH
(1) HC: VM = 50%; VI = GND to VCC
.
HCT: VM = 1.3 V; VI = GND to 3 V.
Fig.6 Waveforms showing input (nI0, nI1 and S) to output (nY) propagation delays and output transition times.
t
t
f
r
(1)
t
V
OE INPUT
M
t
PLZ
PZL
OUTPUT
LOW-to-OFF
OFF-to-LOW
(1)
V
M
10%
t
t
PHZ
PZH
90%
OUTPUT
(1)
V
HIGH-to-OFF
OFF-to-HIGH
M
outputs
enabled
outputs
enabled
outputs
disabled
MBL098
(1) HC: VM = 50%; VI = GND to VCC
.
HCT: VM = 1.3 V; VI = GND to 3 V.
Fig.7 Waveforms showing the 3-state enable and disable times.
7
1999 Sep 02
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
PACKAGE OUTLINES
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
16
9
M
H
pin 1 index
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
w
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
1
1
E
max.
max.
min.
max.
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
8.25
7.80
9.5
8.3
4.7
0.51
3.7
2.54
0.10
7.62
0.30
0.254
0.01
2.2
0.021
0.015
0.013
0.009
0.86
0.84
0.32
0.31
0.055
0.045
0.26
0.24
0.15
0.13
0.37
0.33
inches
0.19
0.020
0.15
0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-10-02
95-01-19
SOT38-1
050G09
MO-001AE
1999 Sep 02
8
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-01-23
97-05-22
SOT109-1
076E07S
MS-012AC
1999 Sep 02
9
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2.0
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
94-01-14
95-02-04
SOT338-1
MO-150AC
1999 Sep 02
10
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
SOLDERING
Introduction
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Through-hole mount packages
SOLDERING BY DIPPING OR BY SOLDER WAVE
• For packages with leads on two sides and a pitch (e):
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
MANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
300 and 400 °C, contact may be up to 5 seconds.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Surface mount packages
REFLOW SOLDERING
MANUAL SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 02
11
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
Suitability of IC packages for wave, reflow and dipping soldering methods
SOLDERING METHOD
WAVE
REFLOW(1) DIPPING
suitable(2)
MOUNTING
PACKAGE
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
−
suitable
Surface mount
BGA, SQFP
not suitable
not suitable(3)
suitable
suitable
−
−
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP,
SMS
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
−
−
−
not recommended(4)(5) suitable
not recommended(6)
suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 02
12
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
NOTES
1999 Sep 02
13
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
NOTES
1999 Sep 02
14
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state; inverting
74HC/HCT258
NOTES
1999 Sep 02
15
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Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America
Czech Republic: see Austria
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
67
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245002/02/pp16
Date of release: 1999 Sep 02
Document order number: 9397 750 06308
相关型号：
74HCT258NB
IC HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16, Multiplexer/Demultiplexer
NXP
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