74HCT2G125DP-G [NXP]
暂无描述;
NXP 
74HC2G125; 74HCT2G125
Dual buffer/line driver; 3-state
Rev. 04 — 4 July 2008
Product data sheet
1. General description
The 74HC2G125; 74HCT2G125 is a high-speed, Si-gate CMOS device.
The 74HC2G125; 74HCT2G125 provides two non-inverting buffer/line drivers with 3-state
output. The 3-state output is controlled by the output enable input (pin nOE). A HIGH level
at pin nOE causes the output to assume a high-impedance OFF-state.
The bus driver output currents are equal compared to the 74HC125 and 74HCT125.
2. Features
I Wide supply voltage range from 2.0 V to 6.0 V
I Symmetrical output impedance
I High noise immunity
I Low power consumption
I Balanced propagation delays
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
I Multiple package options
I Specified from −40 °C to +85 °C and −40 °C to +125 °C
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74HC2G125DP
74HCT2G125DP
74HC2G125DC
74HCT2G125DC
74HC2G125GD
74HCT2G125GD
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
VSSOP8
plastic very thin shrink small outline package; 8 leads; SOT765-1
body width 2.3 mm
XSON8U plastic extremely thin small outline package; no leads; SOT996-2
8 terminals; UTLP based; body 3 × 2 × 0.5 mm
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
4. Marking
Table 2.
Marking
Type number
Marking code
74HC2G125DP
74HCT2G125DP
74HC2G125DC
74HCT2G125DC
74HC2G125GD
74HCT2G125GD
H25
T25
H25
T25
H25
T25
5. Functional diagram
1A
1Y
6
3
2
1
5
7
2
1
6
1OE
2A
1
EN1
EN2
2Y
Y
A
5
7
3
2
2OE
OE
mce186
mce185
mna120
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Fig 3. Logic diagram (one driver)
6. Pinning information
6.1 Pinning
74HC2G125
74HCT2G125
1OE
1A
1
2
3
4
8
7
6
5
V
CC
74HC2G125
74HCT2G125
2OE
1Y
1
2
3
4
8
7
6
5
1OE
1A
V
CC
2Y
2OE
1Y
GND
2A
2Y
GND
2A
001aai333
001aae074
Transparent top view
Fig 4. Pin configuration SOT505-2 (TSSOP8) and
SOT765-1 (VSSOP8)
Fig 5. Pin configuration SOT996-2 (XSON8U)
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
2 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
6.2 Pin description
Table 3.
Symbol
1OE, 2OE
1A, 2A
GND
Pin description
Pin
1, 7
2, 5
4
Description
output enable input (active LOW)
data input
ground (0 V)
1Y, 2Y
VCC
6, 3
8
data output
supply voltage
7. Functional description
Table 4.
Function table[1]
Control
Input
nA
L
Output
nOE
L
nY
L
L
H
H
Z
H
X
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7.0
±20
±20
35
Unit
V
supply voltage
−0.5
[1]
[1]
[1]
input clamping current
output clamping current
output current
VI < −0.5 V or VI > VCC + 0.5 V
VO < −0.5 V or VO > VCC + 0.5 V
VO = −0.5 V to (VCC + 0.5 V)
-
mA
mA
mA
mA
mA
°C
IOK
-
IO
-
ICC
supply current
-
70
IGND
Tstg
Ptot
ground current
−70
−65
-
-
storage temperature
total power dissipation
+150
300
[2]
Tamb = −40 °C to +125 °C
mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K.
For VSSOP8 package: above 110 °C the value of Ptot derates linearly with 8 mW/K.
For XSON8U package: above 45 °C the value of Ptot derates linearly with 2.4 mW/K.
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
3 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions
74HC2G125
74HCT2G125
Unit
Min
Typ
Max
6.0
Min
Typ
Max
5.5
VCC
VI
supply voltage
2.0
5.0
4.5
5.0
V
V
V
input voltage
0
-
VCC
VCC
+125
625
139
83
0
-
VCC
VCC
VO
output voltage
0
-
+25
-
0
-
+25
-
Tamb
∆t/∆V
ambient temperature
input transition rise and fall rate VCC = 2.0 V
VCC = 4.5 V
−40
−40
+125 °C
-
-
-
-
-
-
-
139
-
ns/V
1.67
-
1.67
-
ns/V
ns/V
VCC = 6.0 V
10. Static characteristics
Table 7.
Static characteristics
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C.
Symbol Parameter Conditions Tamb = −40 °C to +85 °C Tamb = −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
74HC2G125
VIH
HIGH-level input VCC = 2.0 V
1.5
1.2
2.4
3.2
0.8
2.1
2.8
-
-
1.5
-
-
V
V
V
V
V
V
voltage
VCC = 4.5 V
3.15
3.15
VCC = 6.0 V
4.2
-
4.2
-
VIL
LOW-level input
voltage
VCC = 2.0 V
-
-
-
0.5
1.35
1.8
-
-
-
0.5
1.35
1.8
VCC = 4.5 V
VCC = 6.0 V
VOH
HIGH-level
VI = VIH or VIL
output voltage
IO = −20 µA; VCC = 2.0 V
IO = −20 µA; VCC = 4.5 V
IO = −20 µA; VCC = 6.0 V
IO = −6.0 mA; VCC = 4.5 V
IO = −7.8 mA; VCC = 6.0 V
1.9
4.4
2.0
4.5
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
6.0
3.84
5.34
4.32
5.81
VOL
LOW-level output VI = VIH or VIL
voltage
IO = 20 µA; VCC = 2.0 V
-
-
-
-
-
-
0
0
0.1
0.1
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
±1.0
V
IO = 20 µA; VCC = 4.5 V
IO = 20 µA; VCC = 6.0 V
IO = 6.0 mA; VCC = 4.5 V
IO = 7.8 mA; VCC = 6.0 V
VI = VCC or GND; VCC = 6.0 V
V
0
0.1
V
0.15
0.16
-
0.33
0.33
±1.0
V
V
II
input leakage
current
µA
IOZ
OFF-state output VI = VIH or VIL;
current VO = VCC or GND; VCC = 6.0 V
-
-
±5.0
-
±10
µA
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
4 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
Table 7.
Static characteristics …continued
Voltages are referenced to GND (ground = 0 V). All typical values are measured at Tamb = 25 °C.
Symbol
Parameter
Conditions
Tamb = −40 °C to +85 °C Tamb = −40 °C to +125 °C Unit
Min
Typ
Max
Min
Max
ICC
supply current
VI = VCC or GND; IO = 0 A;
-
-
10
-
20
µA
V
CC = 6.0 V
CI
input capacitance
-
-
1.0
1.5
-
-
-
-
-
-
pF
pF
CO
output
capacitance
74HCT2G125
VIH
HIGH-level input VCC = 4.5 V to 5.5 V
voltage
2.0
-
1.6
1.2
-
2.0
-
-
V
V
VIL
LOW-level input
voltage
VCC = 4.5 V to 5.5 V
0.8
0.8
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = −20 µA
4.4
4.5
-
-
4.4
3.7
-
-
V
V
IO = −6.0 mA
3.84
4.32
VOL
LOW-level output VI = VIH or VIL; VCC = 4.5 V
voltage
IO = 20 µA
-
-
-
0
0.16
-
0.1
-
-
-
0.1
0.4
V
IO = 6.0 mA
0.33
±1.0
V
II
input leakage
current
VI = VCC or GND; VCC = 5.5 V
±1.0
µA
IOZ
ICC
∆ICC
OFF-state output VI = VIH or VIL; VO =
-
-
-
-
-
-
±5.0
10
-
-
-
±10
20
current
V
CC or GND; VCC = 5.5 V
VI = VCC or GND; IO = 0 A;
CC = 5.5 V
additional supply per input; VCC = 4.5 V to 5.5 V;
supply current
µA
µA
V
375
410
current
VI = VCC − 2.1 V; IO = 0 A
CI
input capacitance
-
-
1.0
1.5
-
-
-
-
-
-
pF
pF
CO
output
capacitance
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions
74HC2G125
Tamb = −40 °C to +85 °C Tamb = −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
[2]
tpd
propagation nA to nY; see Figure 6
delay
VCC = 2.0 V
-
-
-
-
35
11
10
8
115
23
-
-
-
-
-
135
27
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5.0 V; CL = 15 pF
VCC = 6.0 V
20
23
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
5 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
Table 8.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 8.
Symbol Parameter Conditions Tamb = −40 °C to +85 °C Tamb = −40 °C to +125 °C Unit
Min
Typ[1]
Max
Min
Max
[2]
[2]
[2]
[3]
[2]
ten
tdis
tt
enable time nOE to nY; see Figure 7
VCC = 2.0 V
VCC = 4.5 V
-
-
-
40
11
8
115
23
-
-
-
135
27
ns
ns
ns
VCC = 6.0 V
20
23
disable time nOE to nY; see Figure 7
VCC = 2.0 V
-
-
-
24
12
10
125
25
-
-
-
150
30
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
21
26
transition
time
see Figure 6
VCC = 2.0 V
-
-
-
18
6
75
15
13
-
-
-
90
18
15
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
5
CPD
power
dissipation
capacitance
per buffer; VI = GND to VCC
output enabled
output disabled
-
-
11
1
-
-
-
-
-
-
pF
pF
74HCT2G125
tpd
propagation nA to nY; see Figure 6
delay
VCC = 4.5 V
-
-
-
15
12
15
31
-
-
-
-
38
-
ns
ns
ns
VCC = 5.0 V; CL = 15 pF
[2]
[2]
[2]
[3]
ten
tdis
tt
enable time nOE to nY; see Figure 7;
35
42
V
CC = 4.5 V
disable time nOE to nY; see Figure 7;
CC = 4.5 V
-
-
15
6
31
15
-
-
38
18
ns
ns
V
transition
time
see Figure 6; VCC = 4.5 V
CPD
power
per buffer;
dissipation
capacitance
VI = GND to VCC − 1.5 V
output enabled
output disabled
-
-
11
1
-
-
-
-
-
-
pF
pF
[1] All typical values are measured at Tamb = 25 °C.
[2] tpd is the same as tPLH and tPHL
ten is the same as tPZL and tPZH
tdis is the same as tPLZ and tPHZ
tt is the same as tTHL and tTLH
.
.
.
.
[3] CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
Σ(CL × VCC2 × fo) = sum of outputs.
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
6 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
12. Waveforms
V
I
input
nA
V
V
M
M
GND
t
t
PHL
PLH
V
OH
90 %
output
nY
V
V
M
M
10 %
V
OL
t
t
TLH
THL
001aad982
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6. Propagation delays data input (nA) to output (nY)
V
I
nOE input
GND
V
M
t
t
PZL
PLZ
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna362
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. Enable and disable times
Table 9.
Type
Measurement points
Input
Output
VM
VM
VX
VY
74HC2G125
0.5VCC
1.3 V
0.5VCC
1.3 V
VOL + 0.3 V
VOL + 0.3 V
V
OH − 0.3 V
74HCT2G125
VOH − 0.3 V
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
7 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
V
CC
CC
V
V
O
I
R
L
S1
G
open
DUT
R
T
C
L
001aad983
Test data is given in Table 10.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 8. Load circuitry for measuring switching times
Table 10. Test data
Type
Input
VI
Load
S1 position
tPHL, tPLH
open
tr, tf
CL
RL
tPZH, tPHZ
GND
tPZL, tPLZ
VCC
74HC2G125
VCC
3 V
≤ 6 ns
≤ 6 ns
15 pF, 50 pF
15 pF, 50 pF
1 kΩ
1 kΩ
74HCT2G125
open
GND
VCC
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
8 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
13. Package outline
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.00
0.95
0.75
0.38
0.22
0.18
0.08
3.1
2.9
3.1
2.9
4.1
3.9
0.47
0.33
0.70
0.35
8°
0°
mm
1.1
0.65
0.25
0.5
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-01-16
SOT505-2
- - -
Fig 9. Package outline SOT505-2 (TSSOP8)
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
9 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )
3
pin 1 index
θ
L
p
L
detail X
1
4
e
w
M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT
v
w
y
Z
θ
1
2
3
p
E
max.
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
3.2
3.0
0.40
0.15
0.21
0.19
0.4
0.1
8°
0°
mm
1
0.5
0.12
0.4
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-06-07
SOT765-1
MO-187
Fig 10. Package outline SOT765-1 (VSSOP8)
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
10 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
XSON8U: plastic extremely thin small outline package; no leads;
8 terminals; UTLP based; body 3 x 2 x 0.5 mm
SOT996-2
D
B
A
E
A
A
1
detail X
terminal 1
index area
e
1
C
M
M
v
C A
C
B
b
e
L
1
y
y
w
C
1
1
4
L
2
L
8
5
X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
E
e
e
1
L
L
L
v
w
y
y
1
1
2
max
0.05 0.35
0.00 0.15
2.1
1.9
3.1
2.9
0.5
0.3
0.15
0.05
0.6
0.4
mm
0.5
0.5
1.5
0.1
0.05 0.05
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
07-12-18
07-12-21
SOT996-2
- - -
Fig 11. Package outline SOT996-2 (XSON8U)
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
11 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
14. Abbreviations
Table 11. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal Oxide Semiconductor
Device Under Test
ElectroStatic Discharge
Human Body Model
Machine Model
ESD
HBM
MM
15. Revision history
Table 12. Revision history
Document ID
Release date
20080704
Data sheet status
Change notice
Supersedes
74HC_HCT2G125_4
Modifications:
Product data sheet
-
74HC_HCT2G125_3
• The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 8: derating factor for TSSOP8, VSSOP8 and XSON8U package added
• Added type numbers 74HC2G125GD and 74HCT2G125GD (XSON8U package)
74HC_HCT2G125_3
74HC_HCT2G125_2
74HC_HCT2G125_1
20060102
20030303
20030131
Product data sheet
Product specification
Product specification
-
-
-
74HC_HCT2G125_2
74HC_HCT2G125_1
-
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
12 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
16.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
16.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT2G125_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 4 July 2008
13 of 14
74HC2G125; 74HCT2G125
NXP Semiconductors
Dual buffer/line driver; 3-state
18. Contents
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 July 2008
Document identifier: 74HC_HCT2G125_4
相关型号：
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