74HCT393N,652 [NXP]
74HCT393N;
| 型号： | 74HCT393N,652 |
| 厂家： | 
NXP |
| 描述： | 74HCT393N 光电二极管 逻辑集成电路 触发器 |
| 文件： | 总21页 (文件大小：178K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74HC393; 74HCT393
Dual 4-bit binary ripple counter
Rev. 5 — 1 April 2014
Product data sheet
1. General description
The 74HC393; 7474HCT393 is a dual 4-stage binary ripple counter. Each counter
features a clock input (nCP), an overriding asynchronous master reset input (nMR) and 4
buffered parallel outputs (nQ0 to nQ3). The counter advances on the HIGH-to-LOW
transition of nCP. A HIGH on nMR clears the counter stages and forces the outputs LOW,
independent of the state of nCP. Inputs include clamp diodes. This enables the use of
current limiting resistors to interface inputs to voltages in excess of VCC
.
2. Features and benefits
Input levels:
For 74HC393: CMOS level
For 74HCT393: TTL level
Complies with JEDEC standard no. 7A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V.
Two 4-bit binary counters with individual clocks
Divide by any binary module up to 28 in one package
Two master resets to clear each 4-bit counter individually
3. Ordering information
Table 1.
Type number Package
Temperature range Name
Ordering information
Description
Version
74HC393N
40 C to +125 C
DIP14
plastic dual in-line package; 14 leads (300 mil)
SOT27-1
74HCT393N
74HC393D
40 C to +125 C
40 C to +125 C
SO14
plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
74HCT393D
74HC393DB
74HCT393DB
SSOP14
TSSOP14
plastic shrink small outline package; 14 leads; body width SOT337-1
5.3 mm
74HC393PW 40 C to +125 C
plastic thin shrink small outline package; 14 leads; body
width 4.4 mm
SOT402-1
74HCT393PW
74HC393BQ
40 C to +125 C
DHVQFN14 plastic dual in-line compatible thermal enhanced very thin SOT762-1
quad flat package; no leads; 14 terminals;
74HCT393BQ
body 2.5 3 0.85 mm
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
4. Functional diagram
CTR4
CT = 0
1Q0
3
4
5
6
0
3
4
5
6
1
2
1CP
2
1
1Q1
1Q2
1Q3
1
CT
+
1MR
3
0
CTR4
2Q0
2Q1
2Q2
2Q3
11
10
9
11
10
9
13
12
2CP
12
13
CT = 0
2
CT
+
2MR
8
3
8
001aad532
001aad533
Fig 1. Logic symbol
Fig 2. IEC logic symbol
1Q0
1Q1
3
4
5
6
1CP
1
4-BIT
BINARY
RIPPLE
1Q2
1Q3
1MR
2
COUNTER
0
1
2
3
4
5
6
7
8
15
14
13
12
2Q0
2Q1
2Q2
2Q3
11
10
9
2CP
13
4-BIT
BINARY
RIPPLE
2MR
12
COUNTER
8
11
10
9
001aad534
001aad535
Fig 3. Functional diagram
Fig 4. State diagram
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
2 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
Q
Q
Q
Q
FF
1
FF
2
FF
3
FF
4
CP
T
T
T
T
RD
RD
RD
RD
MR
Q0
Q1
Q2
Q3
001aad536
Fig 5. Logic diagram (one counter)
5. Pinning information
5.1 Pinning
ꢀꢁ+&ꢂꢃꢂ
ꢀꢁ+&7ꢂꢃꢂ
ꢀ
ꢀꢄ
ꢀꢃ
ꢀꢁ
ꢀꢀ
ꢀꢂ
ꢉ
ꢀ&3
ꢀ05
ꢀ4ꢂ
ꢀ4ꢀ
ꢀ4ꢁ
ꢀ4ꢃ
*1'
9
&&
ꢁ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢁ&3
ꢁ05
ꢁ4ꢂ
ꢁ4ꢀ
ꢁ4ꢁ
ꢁ4ꢃ
ꢈ
DDDꢀꢁꢁꢂꢃꢄꢅ
Fig 6. Pin configuration DIP14 and SO14
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
3 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
ꢀꢁ+&ꢂꢃꢂ
ꢀꢁ+&7ꢂꢃꢂ
WHUPLQDOꢊꢀ
LQGH[ꢊDUHD
ꢀꢁ+&ꢂꢃꢂ
ꢀꢁ+&7ꢂꢃꢂ
ꢁ
ꢃ
ꢄ
ꢅ
ꢆ
ꢀꢃ
ꢀꢁ
ꢀꢀ
ꢀꢂ
ꢉ
ꢀ05
ꢀ4ꢂ
ꢀ4ꢀ
ꢀ4ꢁ
ꢀ4ꢃ
ꢁ&3
ꢁ05
ꢁ4ꢂ
ꢁ4ꢀ
ꢁ4ꢁ
ꢀ
ꢁ
ꢃ
ꢄ
ꢅ
ꢆ
ꢇ
ꢀꢄ
ꢀꢃ
ꢀꢁ
ꢀꢀ
ꢀꢂ
ꢉ
ꢀ&3
ꢀ05
ꢀ4ꢂ
ꢀ4ꢀ
ꢀ4ꢁ
ꢀ4ꢃ
*1'
9
&&
ꢁ&3
ꢁ05
ꢁ4ꢂ
ꢁ4ꢀ
ꢁ4ꢁ
ꢁ4ꢃ
ꢋꢀꢌ
&&
9
DDDꢀꢁꢁꢂꢃꢆꢄ
ꢈ
7UDQVSDUHQWꢊWRSꢊYLHZ
DDDꢀꢁꢁꢂꢃꢆꢇ
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to VCC
.
Fig 7. Pin configuration SSOP14 and TSSOP14
Fig 8. Pin configuration DHVQFN14
5.2 Pin description
Table 2.
Symbol
1CP
Pin description
Pin
1
Description
clock input (HIGH-to-LOW, edge-triggered)
asynchronous master reset input (active HIGH)
flip-flop output
1MR
1Q0
2
3
1Q1
4
flip-flop output
1Q2
5
flip-flop output
1Q3
6
flip-flop output
GND
2Q3
7
ground (0 V)
8
flip-flop output
2Q2
9
flip-flop output
2Q1
10
11
12
13
14
flip-flop output
2Q0
flip-flop output
2MR
2CP
asynchronous master reset input (active HIGH)
clock input (HIGH-to-LOW, edge-triggered)
supply voltage
VCC
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
4 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
6. Functional description
Table 3.
Count
Count sequence for one counter [1]
Output
nQ0
L
nQ1
L
nQ2
L
nQ3
L
0
1
H
L
L
L
L
2
H
H
L
L
L
3
H
L
L
L
4
H
H
H
H
L
L
5
H
L
L
L
6
H
H
L
L
7
H
L
L
8
H
H
H
H
H
H
H
H
9
H
L
L
L
10
11
12
13
14
15
H
H
L
L
H
L
L
H
H
H
H
H
L
L
H
H
H
[1] H = HIGH voltage level; L = LOW voltage level.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
Max
+7
Unit
V
supply voltage
0.5
input clamping current
output clamping current
output current
VI < 0.5 V or VI > VCC + 0.5 V
VO < 0.5 V or VO > VCC + 0.5 V
VO = 0.5 V to VCC + 0.5 V
-
20
20
25
±50
50
+150
750
500
mA
mA
mA
mA
mA
C
IOK
-
IO
-
ICC
supply current
-
IGND
Tstg
Ptot
ground current
-
storage temperature
total power dissipation
65
[1]
[2]
DIP14 package
-
-
mW
mW
SO14, SSOP14, TSSOP14 and
DHVQFN14 package
[1] For DIP14 package: Ptot derates linearly with 12 mW/K above 70 C.
[2] For SO14 package: Ptot derates linearly with 8 mW/K above 70 C.
For (T)SSOP14 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
For DHVQFN14 packages: Ptot derates linearly with 4.5 mW/K above 60 C.
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
5 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V)
Symbol Parameter Conditions
74HC393
74HCT393
Unit
Min
Typ
Max
6.0
Min
Typ
Max
5.5
VCC
VCC
+125
-
VCC
VI
supply voltage
2.0
5.0
4.5
5.0
V
input voltage
0
-
VCC
VCC
+125
625
139
83
0
-
V
VO
output voltage
0
-
0
-
V
Tamb
t/V
ambient temperature
input transition rise and fall rate VCC = 2.0 V
VCC = 4.5 V
40
+25
40
+25
C
-
-
-
-
-
-
-
-
ns/V
ns/V
ns/V
1.67
-
1.67
-
139
-
VCC = 6.0 V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 C
Min Typ
40 C to +85 C 40 C to +125 C Unit
Max
Min
Max
Min
Max
74HC393
VIH
HIGH-level
input voltage
VCC = 2.0 V
1.5
1.2
-
-
1.5
-
-
1.5
-
-
V
V
V
V
V
V
VCC = 4.5 V
3.15 2.4
3.15
3.15
VCC = 6.0 V
4.2
3.2
0.8
-
4.2
-
4.2
-
VIL
LOW-level
input voltage
VCC = 2.0 V
-
-
-
0.5
-
-
-
0.5
1.35
1.8
-
-
-
0.5
1.35
1.8
VCC = 4.5 V
2.1 1.35
VCC = 6.0 V
2.8
1.8
VOH
HIGH-level
VI = VIH or VIL
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
1.9
4.4
5.9
2.0
4.5
6.0
-
-
-
-
-
1.9
4.4
-
-
-
-
-
1.9
4.4
5.9
3.7
5.2
-
-
-
-
-
V
V
V
V
V
5.9
IO = 4.0 mA; VCC = 4.5 V 3.98 4.32
IO = 5.2 mA; VCC = 6.0 V 5.48 5.81
VI = VIH or VIL
3.84
5.34
VOL
LOW-level
output voltage
IO = 20 A; VCC = 2.0 V
IO = 20 A; VCC = 4.5 V
IO = 20 A; VCC = 6.0 V
IO = 4.0 mA; VCC = 4.5 V
IO = 5.2 mA; VCC = 6.0 V
-
-
-
-
-
-
0
0
0
0.1
0.1
0.1
-
-
-
-
-
-
0.1
0.1
-
-
-
-
-
-
0.1
0.1
0.1
0.4
0.4
0.1
V
V
0.1
V
0.15 0.26
0.16 0.26
0.33
0.33
0.1
V
V
II
input leakage
current
VI = VCC or GND;
VCC = 6.0 V
-
0.1
A
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
8.0
-
80
-
160
A
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
6 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
Table 6.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
25 C
Min Typ
40 C to +85 C 40 C to +125 C Unit
Max
Min
Max
Min
Max
CI
input
-
3.5
-
pF
capacitance
74HCT393
VIH
HIGH-level
input voltage
VCC = 4.5 V to 5.5 V
VCC = 4.5 V to 5.5 V
2.0
-
1.6
1.2
-
2.0
-
-
2.0
-
-
V
V
VIL
LOW-level
0.8
0.8
0.8
input voltage
VOH
HIGH-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
4.4
4.5
-
-
4.4
-
-
4.4
3.7
-
-
V
V
IO = 6 mA
3.98 4.32
3.84
VOL
LOW-level
output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
-
-
-
0
0.1
-
-
-
0.1
-
-
-
0.1
0.4
V
IO = 6.0 mA
0.15 0.26
0.33
1.0
V
II
input leakage
current
VI = VCC or GND;
VCC = 5.5 V
-
0.1
1.0
A
ICC
ICC
supply current VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
8.0
-
80
-
160
A
additional
VI = VCC 2.1 V;
supply current other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V; IO = 0 A
per input pin; nCP
per input pin; nMR
-
-
-
40
144
-
-
180
450
-
-
196
490
A
A
pF
100 360
3.5
CI
input
-
capacitance
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
7 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 11.
Symbol Parameter
Conditions
25 C
40 C to +85 C 40 C to +125 C Unit
Max Min Max
Min Typ Max Min
74HC393
[1]
tpd
propagation nCP to nQ0; see Figure 9
delay
VCC = 2.0 V
-
-
-
-
41
15
12
12
125
25
-
-
-
-
-
155
-
-
-
-
190
ns
ns
ns
ns
VCC = 4.5 V
31
-
38
-
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
21
26
32
[1]
nQx to nQ(x1);
see Figure 9
VCC = 2.0 V
-
-
-
-
14
5
45
9
-
-
-
-
55
11
-
-
-
-
-
70
14
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
5
-
4
8
9
12
tPHL
HIGH to
LOW
propagation
delay
nMR to nQx; see Figure 10
VCC = 2.0 V
-
-
-
-
39
14
11
11
140
28
-
-
-
-
-
175
35
-
-
-
-
-
210
42
-
ns
ns
ns
ns
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
24
30
36
[2]
tt
transition
time
Qn; see Figure 9
VCC = 2.0 V
-
-
-
19
7
75
15
13
-
-
-
95
19
16
-
-
-
110
22
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
6
19
tW
pulse width nCP HIGH or LOW;
see Figure 9
VCC = 2.0 V
VCC = 4.5 V
80
16
14
17
6
-
-
-
100
20
-
-
-
120
24
-
-
-
ns
ns
ns
VCC = 6.0 V
5
17
20
nMR HIGH; see Figure 10
VCC = 2.0 V
80
16
14
19
7
-
-
-
100
20
-
-
-
120
24
-
-
-
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
6
17
20
trec
recovery
time
nMR to nCP; see Figure 10
VCC = 2.0 V
5
5
5
3
1
1
-
-
-
5
5
5
-
-
-
5
5
5
-
-
-
ns
ns
ns
VCC = 4.5 V
VCC = 6.0 V
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
8 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 11.
Symbol Parameter
Conditions
25 C
40 C to +85 C 40 C to +125 C Unit
Min Typ Max Min
Max
Min
Max
fclk(max) maximum
clock
see Figure 9
VCC = 2.0 V
6
30
90
-
-
-
-
5
-
-
-
4
-
-
MHz
MHz
MHz
MHz
pF
frequency
VCC = 4.5 V
30
-
24
20
VCC = 5 V; CL = 15 pF
VCC = 6.0 V
99
-
-
-
-
-
-
35
107
23
28
24
-
[3]
CPD
power
CL = 50 pF; f = 1 MHz;
VI = GND to VCC
-
-
-
dissipation
capacitance
74HCT393
[1]
[1]
tpd
propagation nCP to nQ0; see Figure 9
delay
VCC = 4.5 V
-
-
15
20
25
-
-
31
-
38
ns
ns
VCC = 5 V; CL = 15 pF
-
-
-
-
nQx to nQ(x1);
see Figure 9
VCC = 4.5 V
-
-
6
6
10
-
-
-
13
40
-
-
15
48
ns
ns
VCC = 5 V; CL = 15 pF
-
-
-
-
-
-
-
-
tPHL
HIGH to
LOW
nMR to nQx; see Figure 10
VCC = 4.5 V
-
-
18
15
32
-
ns
ns
propagation
delay
VCC = 5 V; CL = 15 pF
[2]
tt
transition
time
Qn; see Figure 9
VCC = 4.5 V
-
7
15
-
19
-
22
ns
tW
pulse width nCP HIGH or LOW;
see Figure 9
VCC = 4.5 V
19
16
11
6
-
-
24
20
-
-
29
24
-
-
ns
ns
nMR HIGH; see Figure 10
VCC = 4.5 V
trec
recovery
time
nMR to nCP;
see Figure 10
VCC = 4.5 V
see Figure 9
5
0
-
5
-
-
5
-
-
ns
fclk(max) maximum
clock
VCC = 4.5 V
27
-
48
53
-
-
22
18
MHz
MHz
frequency
VCC = 5 V; CL = 15 pF
-
-
-
-
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
9 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 11.
Symbol Parameter
Conditions
25 C
40 C to +85 C 40 C to +125 C Unit
Min Typ Max Min
Max
Min
Max
[3]
CPD
power
CL = 50 pF; f = 1 MHz;
-
25
-
-
-
-
-
pF
dissipation
capacitance
VI = GND to VCC 1.5 V
[1] tpd is the same as tPLH and tPHL
[2] tt is the same as tTHL and tTLH
.
.
[3] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
10.1 Waveforms
1/f
max
V
I
input nCP
GND
V
M
t
t
PLH
PHL
V
OH
output nQx
V
M
V
OL
t
t
TLH
THL
001aad537
Measurement points are given in Table 8.
Fig 9. Propagation delays clock (nCP) to output (nQx), the output transition times and the maximum clock
frequency
Table 8.
Type
Measurement points
Input
VM
Output
VM
74HC393
0.5VCC
1.3 V
0.5VCC
1.3 V
74HCT393
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
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74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
V
I
input nMR
GND
V
M
t
W
t
rec
V
I
input nCP
GND
V
M
t
PHL
V
OH
output nQx
V
M
V
OL
001aad538
Measurement points are given in Table 8.
Fig 10. Propagation delays clock (nCP) to output (nQx), pulse width master reset (nMR), and recovery time
master reset (nMR) to clock (nCP)
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
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74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
t
W
V
I
90 %
90 %
negative
pulse
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
V
M
10 %
10 %
0 V
t
W
001aac221
Measurement points are given in Table 8.
a. Input pulse definition
V
CC
V
V
O
I
PULSE
GENERATOR
D.U.T.
C
L
R
T
mna101
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
b. Test circuit
Fig 11. Test circuit for measuring switching times
Table 9.
Type
Test data
Input
VI
Load
tr, tf
6 ns
6 ns
CL
74HC393
VCC
3 V
15 pF, 50 pF
15 pF, 50 pF
74HCT393
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
12 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
11. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
v
c
y
H
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.05
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT108-1
076E06
MS-012
Fig 12. Package outline SOT108-1 (SO14)
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
13 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
DIP14: plastic dual in-line package; 14 leads (300 mil)
SOT27-1
D
M
E
A
2
A
A
1
L
c
e
w M
Z
b
1
(e )
1
b
M
H
14
8
pin 1 index
E
1
7
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A
A
A
2
(1)
(1)
Z
1
UNIT
mm
b
b
c
D
E
e
e
L
M
M
H
w
1
1
E
max.
min.
max.
max.
1.73
1.13
0.53
0.38
0.36
0.23
19.50
18.55
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.1
7.62
0.3
0.254
0.01
2.2
0.068
0.044
0.021
0.015
0.014
0.009
0.77
0.73
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.02
0.13
0.087
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-13
SOT27-1
050G04
MO-001
SC-501-14
Fig 13. Package outline SOT27-1 (DIP14)
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
14 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
7
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT337-1
MO-150
Fig 14. Package outline SOT337-1 (SSOP14)
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
15 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
7
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.72
0.38
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT402-1
MO-153
Fig 15. Package outline SOT402-1 (TSSOP14)
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
16 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
SOT762-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14
13
9
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.
0.05 0.30
0.00 0.18
3.1
2.9
1.65
1.35
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
2
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT762-1
- - -
MO-241
- - -
Fig 16. Package outline SOT762-1 (DHVQFN14)
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
17 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
12. Abbreviations
Table 10. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal-Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
13. Revision history
Table 11. Revision history
Document ID
Release date
20140401
Data sheet status
Change notice
Supersedes
74HC_HCT393 v.5
Modifications:
Product data sheet
-
74HC_HCT393 v.4
• The conditions for CPD have been corrected (errata).
20130516 Product data sheet
74HC_HCT393 v.4
Modifications:
-
74HC_HCT393 v.3
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
74HC_HCT393 v.3
20050906
Product data sheet
-
74HC_HCT393_CNV v.2
74HC_HCT393_CNV v.2
19901201
Product specification
-
-
74HC_HCT393
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Product data sheet
Rev. 5 — 1 April 2014
18 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
14.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
14.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
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Product data sheet
Rev. 5 — 1 April 2014
19 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74HC_HCT393
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 5 — 1 April 2014
20 of 21
74HC393; 74HCT393
NXP Semiconductors
Dual 4-bit binary ripple counter
16. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18
7
8
9
10
10.1
11
12
13
14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
14.1
14.2
14.3
14.4
15
16
Contact information. . . . . . . . . . . . . . . . . . . . . 20
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2014.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 April 2014
Document identifier: 74HC_HCT393
相关型号：
74HCT393PW-Q100
HCT SERIES, ASYN NEGATIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
NXP
74HCT393PW-T
IC HCT SERIES, ASYN NEGATIVE EDGE TRIGGERED 4-BIT UP BINARY COUNTER, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14, Counter
NXP
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