74HCT670D,653 [NXP]

4X4 STANDARD SRAM, 60ns, PDSO16;
74HCT670D,653
型号: 74HCT670D,653
厂家: NXP    NXP
描述:

4X4 STANDARD SRAM, 60ns, PDSO16

静态存储器 光电二极管 内存集成电路
文件: 总9页 (文件大小:79K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
For a complete data sheet, please also download:  
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications  
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information  
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines  
74HC/HCT670  
4 x 4 register file; 3-state  
December 1990  
Product specification  
File under Integrated Circuits, IC06  
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
the location of the stored word. When the WE input is  
LOW, the data is entered into the addressed location. The  
addressed location remains transparent to the data while  
the WE input is LOW. Data supplied at the inputs will be  
read out in true (non-inverting) form from the 3-state  
outputs (Q0 to Q3). Dn and Wn inputs are inhibited when  
WE is HIGH.  
FEATURES  
Simultaneous and independent read and write  
operations  
Expandable to almost any word size and bit length  
Output capability: bus driver  
ICC category: MSI  
Direct acquisition of data stored in any of the four registers  
is made possible by individual read address inputs  
(RA and RB). The addressed word appears at the four  
outputs when the RE is LOW. Data outputs are in the high  
impedance OFF-state when RE is HIGH. This permits  
outputs to be tied together to increase the word capacity to  
very large numbers.  
GENERAL DESCRIPTION  
The 74HC/HCT670 are high-speed Si-gate CMOS devices  
and are pin compatible with low power Schottky TTL  
(LSTTL). They are specified in compliance with JEDEC  
standard no. 7A.  
The 74HC/HCT670 are 16-bit 3-state register files  
Design of the read enable signals for the stacked devices  
must ensure that there is no overlap in the LOW levels  
which would cause more than one output to be active at  
the same time. Parallel expansion to generate n-bit words  
is accomplished by driving the enable and address inputs  
of each device in parallel.  
organized as 4 words of 4 bits each. Separated read and  
write address inputs (RA, RB and WA, WB) and enable  
inputs (RE and WE) are available, permitting simultaneous  
writing into one word location and reading from another  
location. The 4-bit word to be stored is presented to four  
data inputs (D0 to D3). The WA and WB inputs determine  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf = 6 ns  
TYPICAL  
SYMBOL PARAMETER  
CONDITIONS  
UNIT  
ns  
HC  
HCT  
23  
tPHL/ tPLH propagation delay Dn to Qn  
CL = 15 pF; VCC = 5 V  
23  
CI  
input capacitance  
3.5  
3.5  
pF  
pF  
CPD  
power dissipation capacitance per package  
notes 1 and 2  
122  
124  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW):  
2
PD = CPD × VCC2 × fi + ∑ (CL × VCC × fo)  
where:  
fi = input frequency in MHz  
fo = output frequency in MHz  
2
(CL × VCC × fo) = sum of outputs  
CL = output load capacitance in pF  
VCC = supply voltage in V  
2. For HC the condition is VI = GND to VCC  
;
for HCT the condition is VI = GND to VCC 1.5 V  
ORDERING INFORMATION  
See “74HC/HCT/HCU/HCMOS Logic Package Information”.  
December 1990  
2
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
PIN DESCRIPTION  
PIN NO.  
SYMBOL  
NAME AND FUNCTION  
5, 4  
RA, RB  
GND  
read address inputs  
8
ground (0 V)  
10, 9, 7, 6  
11  
Q0 to Q3  
RE  
data outputs  
3-state output read enable input (active LOW)  
write enable input (active LOW)  
write address inputs  
data inputs  
12  
WE  
14, 13  
15, 1, 2, 3  
16  
WA, WB  
D0 to D3  
VCC  
positive supply voltage  
Fig.1 Pin configuration.  
Fig.2 Logic symbol.  
Fig.3 IEC logic symbol.  
Fig.4 Functional diagram.  
WRITE MODE SELECT TABLE  
INPUTS  
READ MODE SELECT TABLE  
OPERATING  
INPUTS  
OUTPUT  
Qn  
OPERATING  
MODE  
INTERNAL  
LATCHES(1)  
MODE  
WE Dn  
RE  
INTERNAL LATCHES(1)  
L
L
L
H
L
H
L
L
L
H
L
H
write data  
read  
data latched  
H
X
no change  
disabled  
H
X
Z
Note  
Notes  
1. The write address (WA and WB) to the  
“internal latches” must be stable while WE is  
LOW for conventional operation.  
1. The selection of the “internal latches” by read address  
(RA and RB) are not constrained by WE or RE operation.  
H = HIGH voltage level  
L = LOW voltage level  
X = don’t care  
Z = high impedance OFF-state  
December 1990  
3
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
Fig.5 Logic diagram.  
December 1990  
4
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
DC CHARACTERISTICS FOR 74HC  
74HC/HCT670  
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.  
Output capability: bus driver  
I
CC category: MSI  
AC CHARACTERISTICS FOR 74HC  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF  
Tamb (°C)  
TEST CONDITIONS  
74HC  
SYMBOL  
PARAMETER  
UNIT  
VCC  
(V)  
+25  
40 to +85 40 to+125  
WAVEFORMS  
min. typ. max. min. max. min. max.  
t
PHL/ tPLH propagation delay  
58  
21  
17  
195  
39  
33  
245  
49  
42  
295  
59  
50  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
2.0 Fig.6  
4.5  
6.0  
RA, RB to Qn  
tPHL/ tPLH propagation delay  
WE to Qn  
77  
28  
22  
250  
50  
43  
315  
63  
54  
375  
75  
64  
2.0 Fig.7  
4.5  
6.0  
t
PHL/ tPLH propagation delay  
Dn to Qn  
74  
27  
22  
250  
50  
43  
315  
63  
54  
375  
75  
64  
2.0 Fig.7  
4.5  
6.0  
tPZH/ tPZL 3-state output enable time  
RE to Qn  
39  
14  
11  
150  
30  
26  
190  
38  
33  
225  
45  
38  
2.0 Fig.9  
4.5  
6.0  
t
t
PHZ/ tPLZ 3-state output disable time  
RE to Qn  
47  
17  
14  
150  
30  
26  
190  
38  
33  
225  
45  
38  
2.0 Fig.9  
4.5  
6.0  
THL/ tTLH output transition time  
14  
5
4
60  
12  
10  
75  
15  
13  
90  
18  
15  
2.0 Fig.6  
4.5  
6.0  
tW  
tsu  
tsu  
th  
write enable pulse width  
LOW  
80  
16  
14  
14  
5
4
100  
20  
17  
120  
24  
20  
2.0 Fig.8  
4.5  
6.0  
set-up time  
Dn to WE  
60  
12  
10  
3
1
1
75  
15  
13  
90  
18  
15  
2.0 Fig.8  
4.5  
6.0  
set-up time  
WA, WB to WE  
60  
12  
10  
6
2
2
75  
15  
13  
90  
18  
15  
2.0 Fig.8  
4.5  
6.0  
hold time  
Dn to WE  
5
5
5
0
0
0
5
5
5
5
5
5
2.0 Fig.8  
4.5  
6.0  
th  
hold time  
WA, WB to WE  
5
5
5
0
0
0
5
5
5
5
5
5
2.0 Fig.8  
4.5  
6.0  
tlatch  
latch time  
WE to RA, RB  
100 28  
125  
25  
21  
150  
30  
26  
2.0 Fig.8  
4.5  
6.0  
20  
17  
10  
8
December 1990  
5
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
DC CHARACTERISTICS FOR 74HCT  
For the DC characteristics see “74HC/HCT/HCU/HCMOS Logic Family Specifications”.  
Output capability: bus driver  
ICC category: MSI  
Note to HCT types  
The value of additional quiescent supply current (ICC) for a unit load of 1 is given in the family specifications.  
To determine ICC per input, multiply this value by the unit load coefficient shown in the table below.  
INPUT  
UNIT LOAD COEFFICIENT  
Dn  
WE, WA  
WB  
0.25  
0.40  
0.60  
RA  
RB  
RE  
0.70  
1.10  
1.35  
December 1990  
6
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
AC CHARACTERISTICS FOR 74HCT  
GND = 0 V; tr = tf = 6 ns; CL = 50 pF  
Tamb (°C)  
TEST CONDITIONS  
74HCT  
SYMBOL  
PARAMETER  
UNIT  
VCC  
(V)  
+25  
40 to +85 40 to +125  
WAVEFORMS  
min. typ. max. min. max. min. max.  
tPHL/ tPLH propagation delay  
RA, RB to Qn  
21  
28  
27  
18  
19  
5
40  
50  
50  
35  
35  
12  
50  
63  
63  
44  
44  
15  
60  
75  
75  
53  
53  
18  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
4.5 Fig.6  
4.5 Fig.7  
4.5 Fig.7  
4.5 Fig.9  
4.5 Fig.9  
4.5 Fig.6  
4.5 Fig.8  
4.5 Fig.8  
4.5 Fig.8  
4.5 Fig.8  
4.5 Fig.8  
4.5 Fig.8  
t
PHL/ tPLH propagation delay  
WE to Qn  
t
PHL/ tPLH propagation delay  
Dn to Qn  
tPZH/ tPZL 3-state output enable time  
RE to Qn  
t
PHZ/ tPLZ 3-state output disable time  
RE to Qn  
t
THL/ tTLH output transition time  
tW  
tsu  
tsu  
th  
write enable pulse width  
LOW  
18  
12  
12  
5
9
23  
15  
15  
5
27  
18  
18  
5
set-up time  
Dn to WE  
4
set-up time  
WA, WB to WE  
2  
1  
0
hold time  
Dn to WE  
th  
hold time  
5
5
5
WA, WB to WE  
tlatch  
latch time  
25  
11  
31  
38  
WE to RA, RB  
December 1990  
7
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
AC WAVEFORMS  
(1) HC : VM = 50%; VI = GND to VCC  
.
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT : VM = 1.3 V; VI = GND to 3 V.  
HCT : VM = 1.3 V; VI = GND to 3 V.  
Fig.7 Waveforms showing the write enable input  
(WE) and data input (Dn) to output (Qn)  
propagation delays, and the write enable  
pulse width.  
Fig.6 Waveforms showing the read address input  
(RA, RB) to output (Qn) propagation delays  
and output transition times.  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT : VM = 1.3 V; VI = GND to 3 V.  
The shaded areas indicate when the input is permitted  
to change for predictable output performance.  
The time allowed for the internal output of the latch to  
assume the state of the new data (tlatch) is important  
only when attempting to read from a location  
immediately after that location has received new data.  
This parameter is measured from the falling edge of  
WE to the rising edge of RA or RB, RE must be LOW.  
Fig.8 Waveforms showing the write address input (WA, WB) and data input (Dn) to write enable (WE) set-up,  
hold and latch times.  
December 1990  
8
Philips Semiconductors  
Product specification  
4 x 4 register file; 3-state  
74HC/HCT670  
(1) HC : VM = 50%; VI = GND to VCC  
.
HCT : VM = 1.3 V; VI = GND to 3 V.  
Fig.9 Waveforms showing the read enable (RE) to output (Qn) enable and disable times, and the read enable  
pulse width.  
PACKAGE OUTLINES  
See “74HC/HCT/HCU/HCMOS Logic Package Outlines”.  
December 1990  
9

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