74HCT7540N,112 [NXP]

74HC(T)7540 - Octal Schmitt trigger buffer/line driver; 3-state; inverting DIP 20-Pin;
74HCT7540N,112
型号: 74HCT7540N,112
厂家: NXP    NXP
描述:

74HC(T)7540 - Octal Schmitt trigger buffer/line driver; 3-state; inverting DIP 20-Pin

驱动 光电二极管 输出元件 逻辑集成电路
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74HC7540; 74HCT7540  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
Rev. 4 — 31 December 2012  
Product data sheet  
1. General description  
The 74HC7540; 74HCT7540 is a high-speed Si-gate CMOS device and is pin compatible  
with Low-power Schottky TTL (LSTTL). It is specified in compliance with JEDEC standard  
No. 7A.  
The 74HC7540; 74HCT7540 provides eight inverting buffer/line drivers with 3-state  
outputs and Schmitt-trigger action. The 3-state outputs are controlled by the output enable  
inputs OE1 and OE2. A HIGH on OEn causes the outputs to assume a high-impedance  
OFF-state. Schmitt trigger action on the data inputs transforms slowly changing input  
signals into sharply defined, jitter-free output signals.  
The 74HC7540; 74HCT7540 is identical to the 74HC540; 74HCT540 but has hysteresis  
on the data inputs.  
2. Features and benefits  
Inverting outputs  
Low-power dissipation  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
Multiple package options  
Specified from 40 C to +85 C and from 40 C to +125 C  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74HC7540N  
74HCT7540N  
74HC7540D  
74HCT7540D  
74HC7540DB  
40 C to +125 C  
40 C to +125 C  
40 C to +125 C  
DIP20  
plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
SO20  
plastic small outline package; 20 leads;  
body width 7.5 mm  
SOT163-1  
SOT339-1  
SSOP20  
plastic shrink small outline package; 20 leads;  
body width 5.3 mm  
 
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
4. Functional diagram  
ꢂꢃ  
ꢊꢃ  
ꢊꢀ  
ꢊꢄ  
ꢊꢅ  
ꢊꢆ  
ꢊꢇ  
ꢊꢈ  
ꢊꢉ  
ꢀꢁ  
ꢀꢉ  
ꢀꢈ  
ꢀꢇ  
ꢀꢆ  
ꢀꢅ  
ꢀꢄ  
ꢀꢀ  
ꢂꢀ  
ꢂꢄ  
ꢂꢅ  
ꢂꢆ  
ꢂꢇ  
ꢂꢈ  
ꢂꢉ  
ꢌꢏ  
ꢀꢍ  
ꢀꢁ  
ꢀꢉ  
ꢀꢈ  
ꢀꢇ  
ꢀꢆ  
ꢀꢅ  
ꢀꢄ  
ꢋꢌꢀ  
ꢋꢌꢄ  
ꢀꢍ  
ꢀꢀ  
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢆ  
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢇ  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
5. Pinning information  
5.1 Pinning  
ꢀꢁꢂꢃꢀꢄꢁꢅ  
ꢀꢁꢂꢃꢆꢀꢄꢁꢅ  
ꢀꢁꢂꢃꢀꢄꢁꢅ  
ꢀꢁꢂꢃꢆꢀꢄꢁꢅ  
ꢄꢃ  
ꢀꢍ  
ꢀꢁ  
ꢀꢉ  
ꢀꢈ  
ꢀꢇ  
ꢀꢆ  
ꢀꢅ  
ꢀꢄ  
ꢀꢀ  
ꢋꢌꢀ  
ꢊꢃ  
ꢓꢓ  
ꢄꢃ  
ꢀꢍ  
ꢀꢁ  
ꢀꢉ  
ꢀꢈ  
ꢀꢇ  
ꢀꢆ  
ꢀꢅ  
ꢀꢄ  
ꢀꢀ  
ꢋꢌꢀ  
ꢊꢃ  
ꢓꢓ  
ꢋꢌꢄ  
ꢂꢃ  
ꢂꢀ  
ꢂꢄ  
ꢂꢅ  
ꢂꢆ  
ꢂꢇ  
ꢂꢈ  
ꢂꢉ  
ꢋꢌꢄ  
ꢂꢃ  
ꢂꢀ  
ꢂꢄ  
ꢂꢅ  
ꢂꢆ  
ꢂꢇ  
ꢂꢈ  
ꢂꢉ  
ꢊꢀ  
ꢊꢀ  
ꢊꢄ  
ꢊꢄ  
ꢊꢅ  
ꢊꢅ  
ꢊꢆ  
ꢊꢆ  
ꢊꢇ  
ꢊꢇ  
ꢊꢈ  
ꢊꢈ  
ꢊꢉ  
ꢊꢉ  
ꢀꢃ  
ꢐꢏꢑ  
ꢀꢃ  
ꢐꢏꢑ  
ꢀꢀꢀꢁꢂꢂꢃꢄꢅꢅ  
ꢀꢀꢀꢁꢂꢂꢃꢈꢂꢂ  
Fig 3. Pin configuration DIP20, SO20  
Fig 4. Pin configuration SSOP20  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
2 of 16  
 
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
5.2 Pin description  
Table 2.  
Symbol  
OE1  
Pin description  
Pin  
Description  
1
output enable input (active LOW)  
data input  
A0 to A7  
GND  
2, 3, 4, 5, 6, 7, 8, 9  
10  
ground (0 V)  
Y0 to Y7  
OE2  
18, 17, 16, 15, 14, 13, 12, 11 data output  
19  
20  
output enable input (active LOW)  
supply voltage  
VCC  
6. Functional description  
Table 3.  
Functional table[1]  
Control  
Input  
An  
L
Output  
OE1  
L
OE2  
Yn  
H
L
L
L
L
H
X
H
X
X
Z
H
X
Z
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
Max  
+7  
Unit  
V
supply voltage  
0.5  
[1]  
[1]  
input clamping current  
output clamping current  
output current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
0.5 V < VO < VCC + 0.5 V  
-
20  
20  
35  
70  
mA  
mA  
mA  
mA  
mA  
C  
IOK  
-
IO  
-
ICC  
supply current  
-
IGND  
Tstg  
Ptot  
ground current  
70  
65  
-
storage temperature  
total power dissipation  
DIP20  
+150  
[2]  
-
-
750  
500  
mW  
mW  
SO20, SSOP20  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For DIP20 packages: above 70 C the value of Ptot derates linearly with 12 mW/K.  
For SO20 packages: above 70 C the value of Ptot derates linearly with 8 mW/K.  
For SSOP20 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K.  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
3 of 16  
 
 
 
 
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
8. Recommended operating conditions  
Table 5.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V)  
Symbol Parameter Conditions  
74HC7540  
74HCT7540  
Unit  
Min  
2.0  
0
Typ  
Max  
6.0  
Min  
4.5  
0
Typ  
5.0  
-
Max  
5.5  
VCC  
VI  
supply voltage  
input voltage  
5.0  
V
-
VCC  
VCC  
+125  
VCC  
VCC  
+125  
V
VO  
output voltage  
ambient temperature  
0
-
0
-
V
Tamb  
40  
+25  
40  
+25  
C  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Tamb = 40 C  
to +85 C  
Tamb = 40 C  
to +125 C  
Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
74HC7540  
VOH  
HIGH-level  
VI = VT+ or VT  
output voltage  
IO = 20 A; VCC = 2.0 V  
IO = 20 A; VCC = 4.5 V  
IO = 20 A; VCC = 6.0 V  
IO = 6.0 mA; VCC = 4.5 V  
IO = 7.8 mA; VCC = 6.0 V  
VI = VT+ or VT  
1.9  
4.4  
5.9  
2.0  
4.5  
6.0  
-
-
-
-
-
1.9  
4.4  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
V
V
V
V
V
5.9  
3.98 4.32  
5.48 5.81  
3.84  
5.34  
VOL  
LOW-level  
output voltage  
IO = 20 A; VCC = 2.0 V  
IO = 20 A; VCC = 4.5 V  
IO = 20 A; VCC = 6.0 V  
IO = 6.0 mA; VCC = 4.5 V  
IO = 7.8 mA; VCC = 6.0 V  
-
-
-
-
-
-
0
0
0
0.1  
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
-
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
1.0  
V
V
0.1  
V
0.15 0.26  
0.16 0.26  
0.33  
0.33  
1.0  
V
V
II  
input leakage VI = VCC or GND; VCC = 6.0 V  
current  
-
0.1  
A  
IOZ  
OFF-state  
output current VO = VCC or GND;  
other inputs at VCC or GND;  
per input pin; VI = VT+ or VT;  
-
-
0.5  
-
5.0  
-
10  
A  
VCC = 6.0 V; IO = 0 A  
ICC  
CI  
supply current VI = VCC or GND; IO = 0 A;  
VCC = 6.0 V  
-
-
-
8.0  
-
-
-
80  
-
-
-
160  
-
A  
input  
3.5  
pF  
capacitance  
74HCT7540  
VOH  
HIGH-level  
output voltage  
VI = VT+ or VT; VCC = 4.5 V  
IO = 20 A  
4.4  
4.5  
-
-
4.4  
-
-
4.4  
3.7  
-
-
V
V
IO = 6.0 mA  
3.98 4.32  
3.84  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
4 of 16  
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
Table 6.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Tamb = 40 C  
to +85 C  
Tamb = 40 C  
to +125 C  
Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
VOL  
LOW-level  
output voltage  
VI = VT+ or VT; VCC = 4.5 V  
IO = 20 A;  
-
-
-
0
0.1  
-
-
-
0.1  
-
-
-
0.1  
0.4  
V
IO = 6.0 mA;  
0.15 0.26  
0.33  
1.0  
V
II  
input leakage VI = VCC or GND; VCC = 5.5 V  
current  
-
-
0.1  
0.5  
1.0  
A  
IOZ  
OFF-state  
output current VO = VCC or GND;  
other inputs at VCC or GND;  
CC = 5.5 V; IO = 0 A  
per input pin; VI = VT+ or VT;  
-
-
5.0  
-
10  
A  
A  
V
ICC  
supply current VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
-
-
8.0  
-
80  
-
160  
ICC  
additional  
supply current VI = VCC 2.1 V;  
other inputs at VCC or GND;  
per input pin; IO = 0 A;  
VCC = 4.5 V to 5.5 V  
An input  
-
-
-
20  
72  
-
-
-
90  
585  
-
-
-
-
98  
637  
-
A  
A  
pF  
OEn input  
130 468  
3.5  
CI  
input  
-
capacitance  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
GND = 0 V; CL = 50 pF; for test circuit see Figure 7.  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Tamb = 40 C to +125 C Unit  
Min Typ Max Max (85 C) Max (125 C)  
74HC7540  
[1]  
tpd  
propagation delay An to Yn; see Figure 5  
VCC = 2.0 V  
-
-
-
-
39  
14  
11  
11  
120  
24  
-
150  
30  
-
180  
36  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 5.0 V; CL = 15 pF  
VCC = 6.0 V  
20  
26  
31  
[1]  
[1]  
ten  
enable time  
disable time  
OEn to Yn; see Figure 6  
VCC = 2.0 V  
-
-
-
41  
15  
12  
150  
30  
190  
38  
225  
45  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 6.0 V  
26  
33  
38  
tdis  
OEn to Yn; see Figure 6  
VCC = 2.0 V  
-
-
-
52  
19  
15  
150  
30  
190  
38  
225  
45  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 6.0 V  
26  
33  
38  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
5 of 16  
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
Table 7.  
Dynamic characteristics  
GND = 0 V; CL = 50 pF; for test circuit see Figure 7.  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Tamb = 40 C to +125 C Unit  
Min Typ Max Max (85 C) Max (125 C)  
[2]  
tt  
transition time  
see Figure 5  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
-
14  
5
60  
12  
10  
-
75  
15  
13  
-
90  
18  
15  
-
ns  
ns  
ns  
pF  
4
[3]  
[1]  
CPD  
power dissipation per package;  
capacitance VI = GND to VCC  
29  
74HCT7540  
tpd  
propagation delay An to Yn; see Figure 5  
VCC = 4.5 V  
-
-
19  
16  
32  
-
40  
-
48  
-
ns  
ns  
VCC = 5.0 V; CL = 15 pF  
[1]  
[1]  
ten  
enable time  
disable time  
transition time  
OEn to Yn; see Figure 6  
VCC = 4.5 V  
-
19  
32  
40  
48  
ns  
tdis  
OEn to Yn; see Figure 6  
VCC = 4.5 V  
-
-
-
20  
5
32  
12  
-
40  
15  
-
48  
18  
-
ns  
ns  
pF  
[2]  
[3]  
tt  
VCC = 4.5 V; see Figure 5  
CPD  
power dissipation per package;  
capacitance VI = GND to VCC 1.5 V  
31  
[1] tpd is the same as tPLH and tPHL  
ten is the same as tPZL and tPZH  
tdis is the same as tPLZ and tPHZ  
[2] tt is the same as tTHL and tTLH  
.
.
.
.
[3] CPD is used to determine the dynamic power dissipation (PD in W):  
PD = CPD VCC2 fi N + (CL VCC2 fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL VCC2 fo) = sum of outputs.  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
6 of 16  
 
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
11. Waveforms  
#
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ꢐꢏꢑ  
#
"ꢝ  
" ꢝ  
ꢋꢝ  
ꢍꢃꢔꢕ  
ꢂꢖꢔꢗꢘꢙꢚꢘꢙ  
#
#
ꢀꢃꢔꢕ  
 
!ꢝ  
! ꢝ  
ꢀꢀꢀꢁꢂꢂꢃꢈꢂꢉ  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 5. Input to output propagation delays  
ꢋꢌꢖꢔꢛꢖꢚꢘꢙ  
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ꢋ..-ꢙꢗ- ꢋ,  
#
+
 
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ꢋ..-ꢙꢗ-ꢝꢜꢐꢝ  
#
ꢐꢏꢑ  
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ꢀꢀꢀꢁꢂꢂꢃꢄꢂꢅ  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. 3-state enable and disable times  
Table 8.  
Type  
Measurement points  
Input  
VM  
Output  
VM  
VX  
VY  
74HC7540  
0.5VCC  
1.3 V  
0.5VCC  
1.3 V  
0.1VCC  
0.1VCC  
0.9VCC  
0.9VCC  
74HCT7540  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
7 of 16  
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
CC  
V
CC  
V
V
O
I
R
L
S1  
G
open  
DUT  
R
T
C
L
001aad983  
Test data is given in Table 9.  
Definitions test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator  
CL = Load capacitance including jig and probe capacitance  
RL = Load resistance  
S1 = Test selection switch  
Fig 7. Test circuit for measuring switching times  
Table 9.  
Type  
Test data  
Input  
Load  
S1 position  
tPHL, tPLH  
open  
VI  
tr, tf  
6 ns  
6 ns  
CL  
RL  
tPZH, tPHZ  
GND  
tPZL, tPLZ  
VCC  
74HC7540  
VCC  
3 V  
15 pF, 50 pF  
15 pF, 50 pF  
1 k  
1 k  
74HCT7540  
open  
GND  
VCC  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
8 of 16  
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
12. Transfer characteristics  
Table 10. Transfer characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); see Figure 8 and Figure 9.  
Symbol Parameter  
Conditions  
Tamb = 25 C  
Tamb = 40 C  
to +85 C  
Tamb = 40 C  
to +125 C  
Unit  
Min Typ Max  
Min  
Max  
Min  
Max  
74HC7540  
VT+  
VT  
VH  
positive-going  
threshold  
voltage  
V
CC = 2.0 V  
-
-
-
-
-
-
-
-
1.5  
-
1.5  
-
-
1.5  
V
V
V
V
V
V
V
V
V
VCC = 4.5 V  
VCC = 6.0 V  
3.15  
-
3.15  
3.15  
-
4.2  
-
4.2  
-
4.2  
negative-going VCC = 2.0 V  
threshold  
voltage  
0.3  
1.35  
1.8  
-
-
-
-
-
-
0.3  
1.35  
1.8  
0.1  
0.25  
0.3  
-
-
-
-
-
-
0.3  
1.35  
1.8  
0.1  
0.25  
0.3  
-
-
-
-
-
-
VCC = 4.5 V  
VCC = 6.0 V  
hysteresis  
voltage  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
0.1 0.20  
0.25 0.40  
0.3  
0.5  
74HCT7540  
VT+  
VT  
VH  
positive-going VCC = 4.5 V  
-
-
-
-
2.0  
2.1  
-
-
2.0  
2.1  
-
-
2.0  
2.1  
V
V
threshold  
voltage  
VCC = 5.5 V  
negative-going VCC = 4.5 V  
0.7  
0.8  
-
-
-
-
0.64  
0.74  
-
-
0.6  
0.7  
-
-
V
V
threshold  
voltage  
VCC = 5.5 V  
hysteresis  
voltage  
VCC = 4.5 V  
VCC = 5.5 V  
0.17 0.23  
0.17 0.23  
-
-
-
-
-
-
-
-
-
-
V
V
13. Transfer characteristics waveforms  
V
O
V
T+  
V
I
V
H
V
T  
V
I
V
V
O
H
V
V
T+  
T−  
mna207  
mna208  
Fig 8. Transfer characteristics  
Fig 9. Transfer characteristics definitions  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
9 of 16  
 
 
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
14. Package outline  
DIP20: plastic dual in-line package; 20 leads (300 mil)  
SOT146-1  
D
M
E
A
2
A
A
1
L
c
e
w M  
Z
b
1
(e )  
1
b
M
H
20  
11  
pin 1 index  
E
1
10  
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
(1)  
A
A
A
(1)  
(1)  
Z
1
2
UNIT  
mm  
b
b
c
D
E
e
e
1
L
M
M
H
w
1
E
max.  
min.  
max.  
max.  
1.73  
1.30  
0.53  
0.38  
0.36  
0.23  
26.92  
26.54  
6.40  
6.22  
3.60  
3.05  
8.25  
7.80  
10.0  
8.3  
4.2  
0.51  
3.2  
2.54  
0.1  
7.62  
0.3  
0.254  
0.01  
2
0.068  
0.051  
0.021  
0.015  
0.014  
0.009  
1.060  
1.045  
0.25  
0.24  
0.14  
0.12  
0.32  
0.31  
0.39  
0.33  
inches  
0.17  
0.02  
0.13  
0.078  
Note  
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-13  
SOT146-1  
MS-001  
SC-603  
Fig 10. Package outline SOT146-1 (DIP20)  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
10 of 16  
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
mm  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3  
0.1  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
2.65  
0.1  
0.25  
0.01  
1.27  
0.05  
1.4  
0.25 0.25  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches  
0.055  
0.01 0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT163-1  
075E04  
MS-013  
Fig 11. Package outline SOT163-1 (SO20)  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
11 of 16  
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm  
SOT339-1  
D
E
A
X
v
c
H
M
A
y
E
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
7.4  
7.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
0.9  
0.5  
mm  
2
0.65  
0.25  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT339-1  
MO-150  
Fig 12. Package outline SOT339-1 (SSOP20)  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
12 of 16  
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
15. Abbreviations  
Table 11. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal-Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
HBM  
LSTTL  
MM  
Low-power Schottky Transistor-Transistor Logic  
Machine Model  
16. Revision history  
Table 12. Revision history  
Document ID  
Release date  
20121231  
Data sheet status  
Change notice  
Supersedes  
74HC_HCT7540 v.4  
Modifications:  
Product data sheet  
-
74HC_HCT7540 v.3  
IOZ added to static characteristics table.  
20120827 Product data sheet  
74HC_HCT7540 v.3  
Modifications:  
-
74HC_HCT7540_CNV v.2  
The format of this data sheet has been redesigned to comply with the new identity  
guidelines of NXP Semiconductors.  
Legal texts have been adapted to the new company name where appropriate.  
74HC_HCT7540_CNV v.2 19970917  
Product specification  
-
-
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
13 of 16  
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
17. Legal information  
17.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
17.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
17.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
14 of 16  
 
 
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
17.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
18. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74HC_HCT7540  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2012. All rights reserved.  
Product data sheet  
Rev. 4 — 31 December 2012  
15 of 16  
 
 
74HC7540; 74HCT7540  
NXP Semiconductors  
Octal Schmitt trigger buffer/line driver; 3-state; inverting  
19. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
6
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Transfer characteristics . . . . . . . . . . . . . . . . . . 9  
Transfer characteristics waveforms. . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13  
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
17.1  
17.2  
17.3  
17.4  
18  
19  
Contact information. . . . . . . . . . . . . . . . . . . . . 15  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2012.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 31 December 2012  
Document identifier: 74HC_HCT7540  
 

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