74HCU [NXP]
HCMOS family characteristics; HCMOS系列特点型号: | 74HCU |
厂家: | NXP |
描述: | HCMOS family characteristics |
文件: | 总19页 (文件大小:90K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
FAMILY SPECIFICATIONS
HCMOS family characteristics
March 1988
File under Integrated Circuits, IC06
Philips Semiconductors
FAMILY
SPECIFICATIONS
HCMOS family characteristics
A subset of the family, designated as XX74HCTXXXXX,
with the same features and functions as the “HC-types”,
will operate at standard TTL power supply voltage
(5 V ± 10%) and logic input levels (0.8 to 2.0 V) for use as
pin-to-pin compatible CMOS replacements to reduce
power consumption without loss of speed. These types are
also suitable for converted switching from TTL to CMOS.
GENERAL
These family specifications cover the common electrical
ratings and characteristics of the entire HCMOS
74HC/HCT/HCU family, unless otherwise specified in the
individual device data sheet.
INTRODUCTION
Another subset, the XX74HCUXXXXX, consists of
single-stage unbuffered CMOS compatible devices for
application in RC or crystal controlled oscillators and other
types of feedback circuits which operate in the linear
mode.
The 74HC/HCT/HCU high-speed Si-gate CMOS logic
family combines the low power advantages of the
HE4000B family with the high speed and drive capability of
the low power Schottky TTL (LSTTL).
The family will have the same pin-out as the 74 series and
provide the same circuit functions.
HANDLING MOS DEVICES
Inputs and outputs are protected against electrostatic
effects in a wide variety of device-handling situations.
However, to be totally safe, it is desirable to take handling
precautions into account
In these families are included several HE4000B family
circuits which do not have TTL counterparts, and some
special circuits.
The basic family of buffered devices, designated as
XX74HCXXXXX, will operate at CMOS input logic levels
for high noise immunity, negligible typical quiescent supply
and input current. It is operated from a power supply of
2 to 6 V.
(see also “HANDLING PRECAUTIONS”).
RECOMMENDED OPERATING CONDITIONS FOR 74HC/HCT
74HC
74HCT
SYMBOL PARAMETER
UNIT CONDITIONS
min. typ. max. min. typ. max.
VCC
VI
DC supply voltage
2.0 5.0 6.0
4.5
0
5.0 5.5
VCC
V
V
V
DC input voltage range
DC output voltage range
0
0
VCC
VCC
+85
VO
0
VCC
Tamb
Tamb
tr, tf
operating ambient temperature range −40
operating ambient temperature range −40
−40
+85
°C
see DC and AC
CHAR. per device
+125 −40
+125 °C
input rise and fall times except for
Schmitt-trigger inputs
1000
VCC = 2.0 V
6.0 500
400
6.0 500
ns
V
CC = 4.5 V
VCC = 6.0 V
Note
1. For analog switches, e.g. “4016”, “4051 series”, “4351 series”, “4066” and “4067”, the specified maximum operating
supply voltage is 10 V.
March 1988
2
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
RECOMMENDED OPERATING CONDITIONS FOR 74HCU
74HCU
SYMBOL
PARAMETER
UNIT CONDITIONS
min. typ. max.
2.0 5.0 6.0
VCC
VI
DC supply voltage
V
DC input voltage range
0
VCC
VCC
+85
V
VO
DC output voltage range
0
V
Tamb
Tamb
operating ambient temperature range
operating ambient temperature range
−40
−40
°C
see DC and AC
CHAR. per device
+125 °C
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Voltages are referenced to GND (ground = 0 V)
SYMBOL PARAMETER
MIN. MAX. UNIT CONDITIONS
VCC
±IIK
±IOK
±IO
DC supply voltage
−0.5 +7
V
DC input diode current
DC output diode current
20
20
mA
mA
for VI < −0.5 or VI > VCC + 0.5 V
for VO < −0.5 or VO > VCC + 0.5 V
for −0.5 V < VO < VCC + 0.5 V
DC output source or sink
current
standard outputs
bus driver outputs
25
35
mA
mA
±ICC
±IGND
;
DC VCC or GND current for
types with:
standard outputs
50
70
mA
mA
bus driver outputs
Tstg
Ptot
storage temperature range
power dissipation per package
−65 +150 °C
for temperature range: −40 to +125 °C
74HC/HCT/HCU
plastic DIL
750
500
mW above +70 °C: derate linearly with 12 mW/K
mW above +70 °C: derate linearly with 8 mW/K
plastic mini-pack (SO)
Note
1. For analog switches, e.g. “4016”, “4051 series”, “4351 series”, “4066” and “4067”, the specified maximum operating
supply voltage is 11 V.
March 1988
3
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
DC CHARACTERISTICS FOR 74HC
Voltages are referenced to GND (ground = 0 V)
Tamb (°C)
TEST CONDITIONS
74HC
SYMBOL PARAMETER
UNIT
VCC
+25
−40 to +85 −40 to +125
VI
OTHER
(V)
min. typ. max. min. max. min. max.
VIH
HIGH level input
voltage
1.5 1.2
3.15 2.4
4.2 3.2
1.5
1.5
V
V
V
2.0
4.5
6.0
2.0
4.5
6.0
3.15
4.2
3.15
4.2
VIL
LOW level input
voltage
0.8 0.5
0.5
0.5
2.1 1.35
2.8 1.8
1.35
1.8
1.35
1.8
VOH
HIGH level output
voltage
all outputs
1.9 2.0
1.9
1.9
4.4
5.9
3.7
5.2
2.0 VIH
−IO = 20 µA
−IO = 20 µA
−IO = 20 µA
−IO = 4.0 mA
−IO = 5.2 mA
or
VIL
4.4 4.5
5.9 6.0
3.98 4.32
5.48 5.81
4.4
4.5
5.9
6.0
VOH
VOH
VOL
HIGH level output
voltage
standard outputs
3.84
5.34
V
V
V
4.5 VIH
or
VIL
6.0
HIGH level output
voltage
bus driver outputs
3.98 4.32
5.48 5.81
3.84
5.34
3.7
5.2
4.5 VIH
−IO = 6.0 mA
−IO = 7.8 mA
or
VIL
6.0
LOW level output
voltage
all outputs
0
0
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.4
0.4
2.0 VIH
IO = 20 µA
IO = 20 µA
IO = 20 µA
IO = 4.0 mA
IO = 5.2 mA
or
VIL
0.1
4.5
0.1
6.0
VOL
VOL
±II
LOW level output
voltage
standard outputs
0.15 0.26
0.16 0.26
0.33
0.33
V
4.5 VIH
or
VIL
6.0
LOW level output
voltage
bus driver outputs
0.15 0.26
0.16 0.26
0.33
0.33
0.4
0.4
V
4.5 VIH
IO = 6.0 mA
IO = 7.8 mA
or
VIL
6.0
input leakage current
0.1
1.0
1.0
µA
µA
6.0 VCC
or
GND
±IOZ
3-state OFF-state
current
0.5
5.0
10.0
6.0 VIH
VO = VCC
or GND
or
VIL
ICC
quiescent supply
current
SSI
2.0
4.0
20.0
40.0
80.0
500
40.0
µA
6.0 VCC IO = 0
or
flip-flops
MSI
80.0
6.0
6.0
6.0
IO = 0
IO = 0
IO = 0
GND
8.0
160.0
1000
LSI
50.0
March 1988
4
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
DC CHARACTERISTICS FOR 74HCT
Voltages are referenced to GND (ground = 0 V)
Tamb (°C)
TEST CONDITIONS
74HCT
SYMBOL PARAMETER
UNIT
VCC
+25
−40 to +85 −40 to +125
VI
OTHER
(V)
min. typ. max. min. max. min. max.
VIH
HIGH level input
voltage
2.0 1.6
1.2
2.0
2.0
V
V
V
V
V
V
V
V
µA
4.5
to
5.5
VIL
LOW level input
voltage
0.8
0.8
0.8
4.5
to
5.5
VOH
VOH
VOH
VOL
VOL
VOL
±II
HIGH level output
voltage
all outputs
4.4 4.5
3.98 4.32
3.98 4.32
0
4.4
4.4
3.7
3.7
4.5 VIH
−IO = 20 µA
−IO = 4.0 mA
−IO = 6.0 mA
IO = 20 µA
or
VIL
HIGH level output
voltage
standard outputs
3.84
3.84
4.5 VIH
or
VIL
HIGH level output
voltage
bus driver outputs
4.5 VIH
or
VIL
LOW level output
voltage
all outputs
0.1
0.1
0.1
0.4
0.4
1.0
4.5 VIH
or
VIL
LOW level output
voltage
standard outputs
0.15 0.26
0.16 0.26
0.1
0.33
0.33
1.0
4.5 VIH
IO = 4.0 mA
IO = 6.0 mA
or
VIL
LOW level output
voltage
bus driver outputs
4.5 VIH
or
VIL
input leakage
current
5.5 VCC
or
GND
±IOZ
3-state OFF-state
current
0.5
5.0
10.0 µA
5.5 VIH
VO = VCC or
GND per input
pin;
or
VIL
other inputs at
VCC or GND;
IO = 0
ICC
quiescent supply
current
SSI
2.0
4.0
20.0
40.0
80.0
500
40.0 µA
80.0
5.5 VCC
IO = 0
IO = 0
IO = 0
IO = 0
or
GND
flip-flops
MSI
5.5
8.0
160.0
5.5
LSI
50.0
1000
5.5
March 1988
5
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
Tamb (°C)
TEST CONDITIONS
74HCT
SYMBOL PARAMETER
UNIT
VCC
+25
−40 to +85 −40 to +125
VI
OTHER
(V)
min. typ. max. min. max. min. max.
100 360 450 490
∆ICC
additional quiescent
supply current per
input pin for unit load
coefficient is 1
µA
4.5 VCC
other inputs at
to
−2.1 V VCC or GND;
O = 0
5.5
I
(note 1)
Note
1. The additional quiescent supply current per input is determined by the ∆ICC unit load, which has to be multiplied by
the unit load coefficient as given in the individual data sheets. For dual supply systems the theoretical worst-case
(VI = 2.4 V; VCC = 5.5 V) specification is: ∆ICC = 0.65 mA (typical) and 1.8 mA (maximum) across temperature.
March 1988
6
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
DC CHARACTERISTICS FOR 74HCU
Voltages are referenced to GND (ground = 0 V)
Tamb (°C)
TEST CONDITIONS
74HCU
SYMBOL PARAMETER
UNIT
VCC
+25
−40 to +85 −40 to +125
VI
OTHER
(V)
min. typ. max. min. max. min. max.
VIH
HIGH level input
voltage
1.7 1.4
3.6 2.6
4.8 3.4
1.7
3.6
4.8
1.7
3.6
4.8
V
V
V
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
4.5
6.0
VIL
LOW level input
voltage
0.6 0.3
0.3
0.9
1.2
0.3
0.9
1.2
1.9 0.9
2.6 1.2
VOH
HIGH level output
voltage
1.8 2.0
1.8
1.8
4.0
5.5
3.7
5.2
VIH
or
VIL
−IO = 20 µA
−IO = 20 µA
−IO = 20 µA
−IO = 4.0 mA
−IO = 5.2 mA
4.0 4.5
5.5 6.0
3.98 4.32
5.48 5.81
4.0
5.5
VOH
HIGH level output
voltage
3.84
5.34
V
V
VCC
or
GND
VOL
LOW level output
voltage
0
0
0
0.2
0.5
0.5
0.2
0.2
0.5
0.5
0.4
0.4
2.0
4.5
6.0
4.5
6.0
VIH
or
VIL
IO = 20 µA
IO = 20 µA
IO = 20 µA
IO = 4.0 mA
IO = 5.2 mA
0.5
0.5
VOL
LOW level output
voltage
0.15 0.26
0.16 0.26
0.33
0.33
V
VCC
or
GND
±II
input leakage current
0.1
1.0
1.0
µA
6.0
VCC
or
GND
ICC
quiescent supply
current SSI
2.0
20.0
40.0 µA
6.0
VCC
or
IO = 0
GND
March 1988
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Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
AC CHARACTERISTICS FOR 74HC
GND = 0 V; tr = tf = 6 ns; CL = 50 pF
Tamb (°C)
TEST CONDITIONS
74HC
SYMBOL PARAMETER
UNIT
ns
WAVEFORMS
Figs 3 and 4
Figs 3 and 4
VCC
(V)
+25
−40 to +85 −40 to +125
min. typ. max. min. max. min. max.
tTHL/ tTLH output transition time
standard outputs
19
7
75
15
13
60
12
10
95
19
16
75
15
13
110
22
19
90
18
15
2.0
4.5
6.0
2.0
4.5
6.0
6
t
THL/ tTLH output transition time
bus driver outputs
14
5
ns
4
AC CHARACTERISTICS FOR 74HCU
GND = 0 V; tr = tf = 6 ns; CL = 50 pF
T
amb (°C)
74HCU
−40 to +85 −40 to +125
min. typ. max. min. max. min. max.
TEST CONDITIONS
SYMBOL PARAMETER
UNIT
WAVEFORMS
VCC
(V)
+25
tTHL/ tTLH output transition time
19
7
75
15
13
95
19
16
110
22
ns
2.0
4.5
6.0
Fig.1
6
19
AC CHARACTERISTICS FOR 74HCT
GND = 0 V; tr = tf = 6 ns; CL = 50 pF
T
amb (°C)
74HCT
−40 to +85 −40 to +125
min. typ. max. min. max. min. max.
TEST CONDITIONS
SYMBOL PARAMETER
UNIT
WAVEFORMS
VCC
(V)
+25
tTHL/ tTLH output transition time
standard outputs
7
5
15
12
19
15
22
18
ns
ns
4.5
4.5
Figs 8 and 9
Figs 8 and 9
tTHL/ tTLH output transition time
bus driver outputs
March 1988
8
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
HCU TYPES
AC waveforms 74HCU
t
t
f
handbook, halfpage
r
V
CC
90%
50%
INPUT
10%
GND
t
t
PHL
90%
PLH
50%
10%
OUTPUT
t
t
THL
TLH
MGK564
Fig.1 Input rise and fall times, transition times and propagation delays for combinatorial logic ICs.
Test circuit for 74HCU
V
handbook, halfpage
CC
V
V
I
O
PULSE
GENERATOR
D.U.T
R
C
50 pF
T
L
MGK565
CL
RT
=
=
load capacitance including jig and probe capacitance
(see AC CHARACTERISTICS for values).
termination resistance should be equal to the output impedance Zo of
the pulse generator.
Fig.2 Test circuit.
March 1988
9
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
HC TYPES
AC waveforms 74HC
t
t
f
handbook, halfpage
r
V
CC
90%
50%
INPUT
10%
GND
t
t
PHL
90%
PLH
50%
10%
OUTPUT
t
t
THL
TLH
MGK564
Fig.3 Input rise and fall times, transition times and propagation delays for combinatorial logic ICs.
AC waveforms 74HC
1/f
max
t
t
r
f
V
CC
90%
50%
CLOCK
INPUT
10 %
GND
t
t
WL
WH
t
t
h
h
V
CC
DATA
INPUT
50%
GND
t
t
su
su
t
t
THL
TLH
90%
50%
OUTPUT
10%
t
t
PHL
PLH
t
rem
V
CC
SET,
RESET,
PRESET
INPUT
50%
GND
MGK569
(1) In Fig.4 the active transition of the clock is going from LOW-to-HIGH and the active level of the forcing signals (SET, RESET
and PRESET) is HIGH. The actual direction of the transition of the clock input and the actual active levels of the forcing signals
are specified in the individual device data sheet.
(2) For AC measurements: tr = tf = 6 ns; when measuring fmax, there is no constraint on tr, tf with 50% duty factor.
Fig.4 Set-up times, hold times, removal times, propagation delays and the maximum clock pulse frequency for
sequential logic ICs.
March 1988
10
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
Test circuit for 74HC
V
handbook, halfpage
CC
V
V
I
O
PULSE
GENERATOR
D.U.T
R
C
50 pF
T
L
MGK565
CL
RT
=
=
load capacitance including jig and probe capacitance
(see AC CHARACTERISTICS for values).
termination resistance should be equal to the output impedance Zo of
the pulse generator.
Fig.5 Test circuit.
AC waveforms 74HC (continued)
t
t
r
f
V
CC
90%
50%
OUTPUT
ENABLE
10%
t
GND
t
PLZ
PZL
OUTPUT
LOW-to-OFF
OFF-to-LOW
50%
10%
t
t
PHZ
PZH
90%
OUTPUT
50%
HIGH-to-OFF
OFF-to-HIGH
outputs
enabled
outputs
enabled
outputs
disabled
MGK562
Fig.6 Propagation delays of 3-state outputs.
March 1988
11
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
Test circuit for 74HC
V
V
CC
CC
V
V
R
= 1 kΩ
I
O
L
PULSE
GENERATOR
D.U.T
R
C
50 pF
T
L
MGK563
Switch position
TEST
SWITCH
tPZH
tPZL
tPHZ
tPLZ
GND
VCC
GND
VCC
Note
1. For open-drain N-channel outputs tPLZ and tPZL are applicable.
CL
RT
=
=
load capacitance including jig and probe capacitance
(see AC CHARACTERISTICS for values).
termination resistance should be equal to the output impedance Zo of
the pulse generator.
Fig.7 Test circuit for 3-state outputs.
HCT TYPES
AC waveforms 74HCT
t
t
f
handbook, halfpage
INPUT
r
3 V
90%
1.3 V
10%
GND
t
t
PHL
90%
PLH
1.3 V
10%
OUTPUT
t
t
THL
TLH
MGK567
Fig.8 Input rise and fall times, transition times and propagation delays for combinatorial logic ICs.
March 1988
12
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
AC waveforms 74HCT
1/f
max
t
t
r
f
3 V
90%
CLOCK
INPUT
1.3 V
10%
GND
t
t
WH
WL
t
t
h
h
3 V
DATA
INPUT
1.3 V
GND
t
t
su
su
t
t
TLH
THL
90%
1.3 V
OUTPUT
10%
t
t
PHL
PLH
t
rem
3 V
SET,
RESET,
PRESET
INPUT
1.3 V
GND
MGK568
(1) In Fig.9 the active transition of the clock is going from LOW-to-HIGH and the active level of the forcing signals
(SET, RESET and PRESET) is HIGH. The actual direction of the transition of the clock input and the actual
active levels of the forcing signals are specified in the individual device data sheet.
(2) For AC measurements: tr = tf = 6 ns; when measuring fmax, there is no constraint on tr, tf with 50% duty factor.
Fig.9 Set-up times, hold times, removal times, propagation delays and the maximum clock pulse frequency for
sequential logic ICs.
Test circuit for 74HCT
V
handbook, halfpage
CC
V
V
I
O
PULSE
GENERATOR
D.U.T
R
C
50 pF
T
L
MGK565
CL
RT
=
=
load capacitance including jig and probe capacitance (see AC
CHARACTERISTICS for values).
termination resistance should be equal to the output impedance Zo of
the pulse generator.
Fig.10 Test circuit.
13
March 1988
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
AC waveforms 74HCT (continued)
t
t
r
f
90%
OUTPUT
ENABLE
1.3 V
10%
t
t
PLZ
PZL
OUTPUT
LOW-to-OFF
OFF-to-LOW
1.3 V
10%
t
t
PHZ
PZH
90%
OUTPUT
1.3 V
HIGH-to-OFF
OFF-to-HIGH
outputs
enabled
outputs
enabled
outputs
disabled
MGK566
Fig.11 Propagation delays of 3-state outputs.
Test circuit for 74HCT
V
V
CC
CC
V
V
R
= 1 kΩ
I
O
L
PULSE
GENERATOR
D.U.T
R
C
50 pF
T
L
MGK563
Switch position
TEST
SWITCH
tPZH
tPZL
tPHZ
tPLZ
GND
VCC
GND
VCC
Note
1. For open-drain N-channel outputs tPLZ and tPZL are applicable.
CL
RT
=
=
load capacitance including jig and probe capacitance
(see AC CHARACTERISTICS for values).
termination resistance should be equal to the output impedance Zo of
the pulse generator.
Fig.12 Test circuit for 3-state outputs.
March 1988
14
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
conditions under which the limits in the “DC
DATA SHEET SPECIFICATION GUIDE
INTRODUCTION
CHARACTERISTICS” and “AC CHARACTERISTICS”
tables will be met. The table should not be seen as a set of
limits guaranteed by the manufacturer, but as the
conditions used to test the devices and guarantee that
they will then meet the limits in the DC and AC
CHARACTERISTICS tables.
The 74HCMOS data sheets have been designed for
ease-of-use. A minimum of cross-referencing for more
information is needed.
TYPICAL PROPAGATION DELAY AND FREQUENCY
DC CHARACTERISTICS
The typical propagation delays listed at the top of the data
sheets are the average of tPLH and tPHL for the longest data
path through the device with a 15 pF load.
The “DC CHARACTERISTICS” table reflects the DC limits
used during testing. The values published are guaranteed.
The threshold values of VIH and VIL can be tested by the
user. If VIH and VIL are applied to the inputs, the output
voltages will be those published in the “DC
CHARACTERISTICS” table. There is a tendency, by
some, to use the published VIH and VIL thresholds to test a
device for functionality in a “function-table exercizer”
mode. This frequently causes problems because of the
noise present at the test head of automated test
For clocked devices, the maximum frequency of operation
is also given. The typical operating frequency is the
maximum device operating frequency with a 50% duty
factor and no constraints on tr and tf.
LOGIC SYMBOLS
Two logic symbols are given for each device - the
conventional one (Logic Symbol) which explicitly shows
the internal logic (except for complex logic) and the IEC
Logic Symbol as developed by the IEC (International
Electrotechnical Commission).
equipment with cables up to 1 metre. Parametric tests,
such as those used for the output levels under the VIH and
VIL conditions are done fairly slowly, in the order of
milliseconds, so that there is no noise at the inputs when
the outputs are measured. But in functionality testing, the
outputs are measured much faster, so there can be noise
on the inputs, before the device has assumed its final and
correct output state. Thus, never use VIH and VIL to test the
functionality of any HCMOS device type; instead, use input
voltages of VCC (for the HIGH state) and 0 V (for the LOW
state). In no way does this imply that the devices are
noise-sensitive in the final system.
The IEC has been developing a very powerful symbolic
language that can show the relationship of each input of a
digital logic current to each output without explicitly
showing the internal logic.
Internationally, Working Group 2 of IEC Technical
Committee TC-3 has prepared a new document
(Publication 617-12) which supersedes
Publication 117-15, published in 1972.
In the data sheets, it may appear strange that the typical
VIL is higher than the maximum VIL. However, this is
because VILmax is the maximum VIL (guaranteed) for all
devices that will be recognized as a logic LOW. However,
typically a higher VIL will also be recognized as a logic
LOW. Conversely, the typical VIH is lower than its minimum
guaranteed level.
RATINGS
The “RATINGS” table (Limiting values in accordance with
the Absolute Maximum System - IEC134) lists the
maximum limits to which the device can be subjected
without damage. This doesn’t imply that the device will
function at these extreme conditions, only that, when these
conditions are removed and the device operated within the
Recommended Operating Conditions, it will still be
functional and its useful life won’t have been shortened.
For 74HCMOS, unlike TTL, no output HIGH short-circuit
current is specified. The use of this current, for example, to
calculate propagation delays with capacitive loads, is
covered by the HCMOS graphs showing the output drive
capability and those showing the dependence of
propagation delay on load capacitance.
The maximum rated supply voltage of 7 V is well below the
typical breakdown voltage of 18 V.
The quiescent supply current ICC is the leakage current of
all the reversed-biased diodes and the OFF-state MOS
transistors. It is measured with the inputs at VCC or GND
and is typically a few nA.
RECOMMENDED OPERATING CONDITIONS
The “RECOMMENDED OPERATING CONDITIONS”
table lists the operating ambient temperature and the
March 1988
15
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
AC CHARACTERISTICS
The “AC CHARACTERISTICS” table lists the guaranteed
limits when a device is tested under the conditions given in
the AC Test Circuits and Waveforms section.
TEST CIRCUITS
Good high-frequency wiring practices should be used in
test circuits. Capacitor leads should be as short as
possible to minimize ripples on the output waveform
transitions and undershoot. Generous ground metal
(preferably a ground-plane) should be used for the same
reasons. A VCC decoupling capacitor should be provided
at the test socket, also with short leads. Input signals
should have rise and fall times of 6 ns, a signal swing of
0 V to VCC for 74HC and 0 V to 3 V for 74HCT; a 1.0 MHz
square wave is recommended for most propagation delay
tests. The repetition rate must be increased for testing
fmax. Two pulse generators are usually required for testing
such parameters as set-up time, hold time and removal
time. fmax is also tested with 6 ns input rise and fall times,
with a 50% duty factor, but for typical fmax as high as
60 MHz, there are no constraints on rise and fall times.
March 1988
16
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
DEFINITIONS OF SYMBOLS AND TERMS USED IN
HCMOS DATA SHEETS
Currents
VIL
LOW level input voltage; the range of input
voltages that represents a logic LOW level in
the system.
Positive current is defined as conventional current flow
into a device.
Negative current is defined as conventional current flow
out of a device.
VOH
HIGH level output voltage; the range of
voltages at an output terminal with a specified
output loading and supply voltage. Device
inputs are conditioned to establish a HIGH level
at the output.
ICC
∆ICC
IGND
II
Quiescent power supply current; the current
flowing into the VCC supply terminal.
Additional quiescent supply current per input
pin at a specified input voltage and VCC
.
VOL
LOW level output voltage; the range of voltages
at an output terminal with a specified output
loading and supply voltage. Device inputs are
conditioned to establish a LOW level at the
output.
Quiescent power supply current; the current
flowing into the GND terminal.
Input leakage current; the current flowing into a
device at a specified input voltage and VCC
.
IIK
Input diode current; the current flowing into a
device at a specified input voltage.
VT+
Trigger threshold voltage; positive-going signal.
VT−
Trigger threshold voltage; negative-going
signal.
IO
Output source or sink current: the current
flowing into a device at a specified output
voltage.
Analog terms
RON ON-resistance; the effective ON-state
IOK
IOZ
Output diode current; the current flowing into a
device at a specified output voltage.
resistance of an analog switch, at a specified
voltage across the switch and output load.
OFF-state output current; the leakage current
flowing into the output of a 3-state device in the
OFF-state, when the output is connected to
∆RON ∆ON-resistance; the difference in
ON-resistance between any two switches of an
analog device at a specified voltage across the
switch and output load.
V
CC or GND.
IS
Analog switch leakage current; the current
flowing into an analog switch at a specified
voltage across the switch and VCC
.
Capacitances
CI
Input capacitance; the capacitance measured
at a terminal connected to an input of a device.
Voltages
All voltages are referenced to GND (ground), which is
typically 0 V.
CI/O
Input/Output capacitance; the capacitance
measured at a terminal connected to an I/O-pin
(e.g. a transceiver).
GND
Supply voltage; for a device with a single
negative power supply, the most negative
power supply, used as the reference level for
other voltages; typically ground.
CL
Output load capacitance; the capacitance
connected to an output terminal including jig
and probe capacitance.
CPD
Power dissipation capacitance; the capacitance
used to determine the dynamic power
dissipation per logic function, when no extra
load is provided to the device.
VCC
VEE
VH
Supply voltage; the most positive potential on
the device.
Supply voltage; one of two (GND and VEE
)
negative power supplies.
CS
Switch capacitance; the capacitance of a
terminal to a switch of an analog device.
Hysteresis voltage; difference between the
trigger levels, when applying a positive and a
negative-going input signal.
VIH
HIGH level input voltage; the range of input
voltages that represents a logic HIGH level in
the system.
March 1988
17
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
AC switching parameters
tPLZ
tPZH
tPZL
3-state output disable time; the time between
the specified reference points, normally the
50% points for the 74HC devices and the 1.3 V
points for the 74HCT devices on the output
enable input voltage waveform and a point
representing 10% of the output swing on the
output voltage waveform of a 3-state
fi
Input frequency; for combinatorial logic devices
the maximum number of inputs and outputs
switching in accordance with the device
function table. For sequential logic devices the
clock frequency using alternate HIGH and LOW
for data input or using the toggle mode,
whichever is applicable.
device, with the output changing from a LOW
level (VOL) to a high impedance OFF-state (Z).
fo
Output frequency; each output.
fmax
Maximum clock frequency; clock input
waveforms should have a 50% duty factor and
be such as to cause the outputs to be switching
from 10%VCC to 90%VCC in accordance with
the device function table.
3-state output enable time; the time between
the specified reference points, normally the
50% points for the 74HC devices and 1.3 V
points for the 74HCT devices on the output
enable input voltage waveform and the 50%
point on the output voltage waveform of a
3-state device, with the output changing from a
high impedance OFF-state (Z) to a HIGH level
(VOH).
th
Hold time; the interval immediately following the
active transition of the timing pulse (usually the
clock pulse) or following the transition of the
control input to its latching level, during which
interval the data to be recognized must be
maintained at the input to ensure their
continued recognition. A negative hold time
indicates that the correct logic level may be
released prior to the timing pulse and still be
recognized.
3-state output enable time; the time between
the specified reference points, normally the
50% points for the 74HC devices and the 1.3 V
points for the 74HCT devices on the output
enable input voltage waveform and the 50%
point on the output voltage waveform of a
3-state device, with the output changing from a
high impedance OFF-state (Z) to a LOW level
(VOL).
tr,
tf
Clock input rise and fall times; 10% and 90%
values.
tPHL
tPLH
tPHZ
Propagation delay; the time between the
specified reference points, normally the 50%
points for 74HC and 74HCU devices on the
input and output waveforms and the 1.3 V
points for the 74HCT devices, with the output
changing from the defined HIGH level to the
defined LOW level.
trem
Removal time; the time between the end of an
overriding asynchronous input, typically a clear
or reset input, and the earliest permissible
beginning of a synchronous control input,
typically a clock input, normally measured at
the 50% points for 74HC devices and the 1.3 V
points for the 74HCT devices on both input
voltage waveforms.
Propagation delay; the time between the
specified reference points, normally the 50%
points for 74HC and 74HCU devices on the
input and output waveforms and the 1.3 V point
for the 74HCT devices, with the output
changing from the defined LOW level to the
defined HIGH level.
tsu
Set-up time; the interval immediately preceding
the active transition of the timing pulse (usually
the clock pulse) or preceding the transition of
the control input to its latching level, during
which interval the data to be recognized must
be maintained at the input to ensure their
recognition. A negative set-up time indicates
that the correct logic level may be initiated
sometime after the active transition of the
timing pulse and still be recognized.
3-state output disable time; the time between
the specified reference points, normally the
50% points for the 74HC and 74HCU devices
and the 1.3 V points for the 74HCT devices on
the output enable input voltage waveform and a
point representing 10% of the output swing on
the output voltage waveform of a 3-state
device, with the output changing from
a HIGH level (VOH) to a high impedance
OFF-state (Z).
March 1988
18
Philips Semiconductors
HCMOS family characteristics
FAMILY SPECIFICATIONS
tTHL
tTHL
tW
Output transition time; the time between two
specified reference points on a waveform,
normally 90% and 10% points, that is changing
from HIGH-to-LOW.
Output transition time; the time between two
specified reference points on a waveform,
normally 10% and 90% points, that is changing
from LOW-to-HIGH.
Pulse width; the time between the 50%
amplitude points on the leading and trailing
edges of a pulse for 74HC and 74HCU devices
and at the 1.3 V points for 74HCT devices.
March 1988
19
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