74LV132D,132 [NXP]

NAND Gate, LV/LV-A/LVX/H Series, 4-Func, 2-Input, CMOS, PDSO14;
74LV132D,132
型号: 74LV132D,132
厂家: NXP    NXP
描述:

NAND Gate, LV/LV-A/LVX/H Series, 4-Func, 2-Input, CMOS, PDSO14

栅 光电二极管 逻辑集成电路
文件: 总17页 (文件大小:199K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74LV132  
Quad 2-input NAND Schmitt trigger  
Rev. 6 — 9 December 2015  
Product data sheet  
1. General description  
The 74LV132 is a low-voltage Si-gate CMOS device that is pin and function compatible  
with 74HC132 and 74HCT132.  
The 74LV132 contains four 2-input NAND gates which accept standard input signals.  
They are capable of transforming slowly changing input signals into sharply defined,  
jitter-free output signals.  
The gate switches at different points for positive and negative-going signals. The  
difference between the positive voltage VT+ and the negative voltage VTis defined as the  
input hysteresis voltage VH.  
2. Features and benefits  
Wide operating voltage: 1.0 V to 5.5 V  
Optimized for low voltage applications: 1.0 V to 3.6 V  
Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V  
Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 C  
Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and  
Tamb = 25 C  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
Multiple package options  
Specified from 40 C to +85 C and from 40 C to +125 C  
3. Applications  
Wave and pulse shapers for highly noisy environments  
Astable multivibrators  
Monostable multivibrators  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
4. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LV132D  
40 C to +125 C  
40 C to +125 C  
40 C to +125 C  
40 C to +125 C  
SO14  
plastic small outline package; 14 leads;  
body width 3.9 mm  
SOT108-1  
SOT337-1  
SOT402-1  
SOT762-1  
74LV132DB  
74LV132PW  
74LV132BQ  
SSOP14  
TSSOP14  
plastic shrink small outline package; 14 leads;  
body width 5.3 mm  
plastic thin shrink small outline package; 14 leads;  
body width 4.4 mm  
DHVQFN14 plastic dual in-line compatible thermal enhanced very  
thin quad flat package; no leads; 14 terminals;  
body 2.5 3 0.85 mm  
5. Functional diagram  
ꢀ$  
ꢀ<  
ꢀ%  
ꢂ$  
ꢂ<  
ꢂ%  
ꢁ$  
ꢁ<  
ꢁ%  
ꢀꢈ  
ꢀꢈ  
ꢃ$  
ꢀꢂ  
$
%
ꢀꢂ  
ꢀꢁ  
ꢃ<  
ꢀꢀ  
ꢀꢀ  
<
ꢃ%  
ꢀꢁ  
PQDꢀꢁꢂ  
PQDꢀꢁꢃ  
PQDꢀꢁꢄ  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
Fig 3. Logic diagram (one gate)  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
2 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
6. Pinning information  
6.1 Pinning  
74LV132  
terminal 1  
index area  
ꢀꢃ  
ꢀꢁ  
ꢀꢂ  
ꢀꢀ  
ꢀꢈ  
ꢀ$  
ꢀ%  
9
&&  
ꢃ%  
ꢃ$  
ꢃ<  
ꢁ%  
ꢁ$  
ꢁ<  
2
3
4
5
6
13  
12  
11  
10  
9
1B  
4B  
4A  
4Y  
3B  
3A  
1Y  
2A  
2B  
2Y  
ꢀ<  
ꢂ$  
ꢀꢁꢂ  
(1)  
CC  
V
ꢂ%  
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Transparent top view  
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(1) This is not a supply pin. The substrate is attached to this  
pad using conductive die attach material. There is no  
electrical or mechanical requirement to solder this pad.  
However, if it is soldered, the solder land should remain  
floating or be connected to VCC  
.
Fig 4. Pin configuration SO14 and (T)SSOP14  
Fig 5. Pin configuration DHVQFN14  
6.2 Pin description  
Table 2.  
Symbol  
1A to 4A  
1B to 4B  
1Y to 4Y  
GND  
Pin description  
Pin  
Description  
data input  
1, 4, 9, 12  
2, 5, 10, 13  
3, 6, 8, 11  
7
data input  
data output  
ground (0 V)  
supply voltage  
VCC  
14  
7. Functional description  
Table 3.  
Function table  
H = HIGH voltage level; L = LOW voltage level.  
Input  
Output  
nA  
L
nB  
L
nY  
H
L
H
L
H
H
H
H
H
L
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
3 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
8. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
Max Unit  
supply voltage  
0.5  
+7.0  
20  
50  
25  
50  
V
[1]  
[1]  
input clamping current  
output clamping current  
output current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
VO = 0.5 V to (VCC + 0.5 V)  
-
mA  
mA  
mA  
mA  
mA  
IOK  
-
-
IO  
ICC  
supply current  
-
IGND  
Tstg  
Ptot  
ground current  
50  
65  
-
storage temperature  
total power dissipation  
+150 C  
Tamb = 40 C to +125 C  
SO14 package  
[2]  
[3]  
[4]  
-
-
-
500  
500  
500  
mW  
(T)SSOP14 package  
DHVQFN14 package  
mW  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] tot derates linearly with 8 mW/K above 70 C.  
P
[3] Ptot derates linearly with 5.5 mW/K above 60 C.  
[4] Ptot derates linearly with 4.5 mW/K above 60 C.  
9. Recommended operating conditions  
Table 5.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
VI  
Parameter  
supply voltage[1]  
Conditions  
Min  
1.0  
0
Typ  
3.3  
-
Max  
5.5  
Unit  
V
input voltage  
VCC  
VCC  
+125  
V
VO  
output voltage  
ambient temperature  
0
-
V
Tamb  
40  
+25  
C  
[1] The static characteristics are guaranteed from VCC = 1.2 V to VCC = 5.5 V, but LV devices are guaranteed to function down to  
VCC = 1.0 V (with input levels GND or VCC).  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
4 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
10. Static characteristics  
Table 6.  
Static characteristics  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
VOH  
HIGH-level output voltage VI = VT+ or VT  
lO = 100 A; VCC = 1.2 V  
lO = 100 A; VCC = 2.0 V  
lO = 100 A; VCC = 2.7 V  
lO = 100 A; VCC = 3.0 V  
lO = 100 A; VCC = 4.5 V  
lO = 6 mA; VCC = 3.0 V  
lO = 12 mA; VCC = 4.5 V  
VI = VT+ or VT  
-
1.2  
2.0  
2.7  
3.0  
4.5  
2.82  
4.2  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
1.8  
2.5  
2.8  
4.3  
2.4  
3.6  
1.8  
2.5  
2.8  
4.3  
2.2  
3.5  
VOL  
LOW-level output voltage  
IO = 100 A; VCC = 1.2 V  
IO = 100 A; VCC = 2.0 V  
IO = 100 A; VCC = 2.7 V  
IO = 100 A; VCC = 3.0 V  
IO = 100 A; VCC = 4.5 V  
IO = 6 mA; VCC = 3.0 V  
IO = 12 mA; VCC = 4.5 V  
-
-
-
-
-
-
-
-
0
0
-
-
-
-
-
-
-
-
-
-
V
0.2  
0.2  
0.2  
0.2  
0.40  
0.55  
1.0  
0.2  
0.2  
0.2  
0.2  
0.50  
0.65  
1.0  
V
0
V
0
V
0
V
0.25  
0.35  
-
V
V
II  
input leakage current  
supply current  
VI = VCC or GND;  
VCC = 5.5 V  
A  
ICC  
ICC  
CI  
VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
-
-
-
-
-
20.0  
500  
-
-
-
-
40  
850  
-
A  
A  
pF  
additional supply current  
input capacitance  
per input; VI = VCC 0.6 V;  
VCC = 2.7 V to 3.6 V  
3.5  
[1] Typical values are measured at Tamb = 25 C.  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
5 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
11. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
GND = 0 V; For test circuit see Figure 7.  
Symbol Parameter Conditions  
40 C to +85 C  
Min  
Typ[1] Max  
40 C to +125 C  
Unit  
Min  
Max  
[2]  
tpd  
propagation delay nA, nB to nY; see Figure 6  
VCC = 1.2 V  
-
-
-
-
-
-
-
65  
18  
15  
10  
12  
9.0  
24  
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
ns  
ns  
pF  
VCC = 2.0 V  
34  
24  
-
43  
30  
-
VCC = 2.7 V  
[3]  
[3]  
[3]  
[4]  
VCC = 3.0 V to 3.6 V; CL = 15 pF  
VCC = 3.0 V to 3.6 V  
20  
14  
-
25  
17  
-
VCC = 4.5 V to 5.5 V  
CPD  
power dissipation CL = 50 pF; fi = 1 MHz;  
capacitance  
VI = GND to VCC  
[1] All typical values are measured at Tamb = 25 C.  
[2] tpd is the same as tPLH and tPHL  
.
[3] Typical values are measured at nominal supply voltage (VCC = 3.3 V and VCC = 5.0 V).  
[4] CPD is used to determine the dynamic power dissipation (PD in W).  
PD = CPD VCC2 fi N + (CL VCC2 fo) where:  
fi = input frequency in MHz, fo = output frequency in MHz  
CL = output load capacitance in pF  
VCC = supply voltage in V  
N = number of inputs switching  
(CL VCC2 fo) = sum of the outputs.  
12. Waveforms  
9
,
9
Q$ꢋꢌQ%ꢌLQSXW  
0
*1'  
W
W
3+/  
3/+  
9
2+  
9
Q<ꢌRXWSXW  
0
9
2/  
ꢁꢁꢅDDDꢈꢈꢆ  
Measurement points are given in Table 8.  
VOL and VOH are typical voltage output levels that occur with the output load.  
Fig 6. The input (nA, nB) to output (nY) propagation delays  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
6 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
Table 8.  
Measurement points  
Supply voltage  
VCC  
Input  
VM  
Output  
VM  
< 2.7 V  
0.5VCC  
1.5 V  
0.5VCC  
0.5VCC  
1.5 V  
2.7 V to 3.6 V  
4.5 V  
0.5VCC  
9
&&  
9
9
2
,
38/6(ꢌ  
*(1(5$725  
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&
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5
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ꢀꢌNȍ  
5
7
ꢁꢁꢅDDDꢈꢈꢇ  
Test data is given in Table 9.  
Definitions test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
Fig 7. Test circuit for measuring switching times  
Table 9.  
Test data  
Supply voltage  
VCC  
Input  
VI  
tr, tf  
< 2.7 V  
VCC  
2.7 V  
VCC  
2.5 ns  
2.5 ns  
2.5 ns  
2.7 V to 3.6 V  
4.5 V  
13. Transfer characteristics  
Table 10. Transfer characteristics  
GND = 0 V; For test circuit see Figure 7.  
Symbol Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C  
Unit  
Min  
Typ[1] Max  
Min  
Max  
VT+  
positive-going  
threshold voltage  
see Figure 6  
VCC = 1.2 V  
VCC = 2.0 V  
VCC = 2.7 V  
VCC = 3.0 V  
VCC = 3.6 V  
VCC = 4.5 V  
VCC = 5.5 V  
-
0.70  
1.10  
1.45  
1.60  
1.95  
2.50  
3.00  
-
-
-
V
V
V
V
V
V
V
0.8  
1.0  
1.2  
1.5  
1.7  
2.1  
1.4  
2.0  
2.2  
2.4  
3.2  
3.9  
0.8  
1.0  
1.2  
1.5  
1.7  
2.1  
1.4  
2.0  
2.2  
2.4  
3.2  
3.9  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
7 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
Table 10. Transfer characteristics …continued  
GND = 0 V; For test circuit see Figure 7.  
Symbol Parameter  
Conditions  
40 C to +85 C  
Min  
Typ[1] Max  
40 C to +125 C  
Unit  
Min  
Max  
VT  
negative-going  
threshold voltage  
see Figure 6  
VCC = 1.2 V  
VCC = 2.0 V  
VCC = 2.7 V  
VCC = 3.0 V  
VCC = 3.6 V  
VCC = 4.5 V  
VCC = 5.5 V  
-
0.34  
0.65  
0.90  
1.05  
1.30  
1.60  
2.00  
-
-
-
V
V
V
V
V
V
V
0.3  
0.4  
0.6  
0.8  
0.9  
1.2  
0.9  
1.4  
1.5  
1.8  
2.0  
2.6  
0.3  
0.4  
0.6  
0.8  
0.9  
1.2  
0.9  
1.4  
1.5  
1.8  
2.0  
2.6  
VH  
hysteresis voltage (VT+ VT); see Figure 6  
VCC = 1.2 V  
VCC = 2.0 V  
VCC = 2.7 V  
VCC = 3.0 V  
VCC = 3.6 V  
VCC = 4.5 V  
VCC = 5.5 V  
-
0.3  
-
-
-
V
V
V
V
V
V
V
0.2  
0.3  
0.4  
0.4  
0.4  
0.6  
0.55  
0.60  
0.65  
0.70  
0.80  
1.00  
0.8  
1.1  
1.2  
1.2  
1.4  
1.5  
0.2  
0.3  
0.4  
0.4  
0.4  
0.6  
0.8  
1.1  
1.2  
1.2  
1.4  
1.5  
[1] All typical values are measured at Tamb = 25 C.  
14. Waveforms transfer characteristics  
9
2
9
7ꢍ  
9
,
9
+
9
7ꢎ  
9
,
9
9
2
+
9
9
7ꢍ  
7ꢎ  
PQDꢆꢁꢂ  
PQDꢆꢁꢃ  
VT+ and VTlimits at 70 % and 20 %.  
Fig 8. Transfer characteristic  
Fig 9. Definition of VT+, VTand VH  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
8 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
ꢁꢁꢅDDDꢈꢉꢄ  
ꢁꢁꢅDDDꢈꢈꢁ  
ꢀꢂ  
ꢀꢈꢈ  
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,
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ꢇꢈ  
ꢄꢈ  
ꢃꢈ  
ꢂꢈ  
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ꢈꢑꢄ  
ꢈꢑꢆ  
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ꢈꢑꢇ  
ꢀꢑꢂ  
ꢀꢑꢄ  
9 ꢌꢏ9ꢐ  
,
9 ꢏ9ꢐ  
,ꢌ  
VCC = 1.2 V.  
VCC = 2.0 V.  
Fig 10. Typical 74LV132 transfer characteristics  
Fig 11. Typical 74LV132 transfer characteristics  
ꢁꢁꢅDDDꢈꢈꢅ  
ꢁꢈꢈ  
,
&&  
ꢏ—$ꢐ  
ꢂꢈꢈ  
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ꢂꢑꢃ  
9 ꢏ9ꢐ  
,ꢌ  
VCC = 3.0 V.  
Fig 12. Typical 74LV132 transfer characteristics  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
9 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
15. Package outline  
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Fig 13. Package outline SOT108-1 (SO14)  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
10 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
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Fig 14. Package outline SOT337-1 (SSOP14)  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
11 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
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Fig 15. Package outline SOT402-1 (TSSOP14)  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
12 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
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Fig 16. Package outline SOT762-1 (DHVQFN14)  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
13 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
16. Abbreviations  
Table 11. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
HBM  
MM  
Machine Model  
TTL  
Transistor-Transistor Logic  
17. Revision history  
Table 12. Revision history  
Document ID  
74LV132 v.6  
Modifications:  
74LV132 v.5  
Modifications:  
Release date  
20151209  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
74LV132 v.5  
Type number 74LV132N (SOT27-1) removed.  
20090702 Product data sheet  
-
74LV132 v.4  
Table 6: the conditions for HIGH-level output voltage and LOW-level output voltage have been  
changed.  
74LV132 v.4  
74LV132 v.3  
74LV132 v.2  
74LV132 v.1  
20071112  
20040415  
19980428  
19970204  
Product data sheet  
Product specification  
Product specification  
Product specification  
-
-
-
-
74LV132 v.3  
74LV132 v.2  
74LV132 v.1  
-
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
14 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
18. Legal information  
18.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
18.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
18.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
15 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
18.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
19. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74LV132  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2015. All rights reserved.  
Product data sheet  
Rev. 6 — 9 December 2015  
16 of 17  
74LV132  
NXP Semiconductors  
Quad 2-input NAND Schmitt trigger  
20. Contents  
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Transfer characteristics . . . . . . . . . . . . . . . . . . 7  
Waveforms transfer characteristics. . . . . . . . . 8  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14  
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
18.1  
18.2  
18.3  
18.4  
19  
20  
Contact information. . . . . . . . . . . . . . . . . . . . . 16  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP Semiconductors N.V. 2015.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 9 December 2015  
Document identifier: 74LV132  

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