74LV368D [NXP]

Hex buffer/line driver; inverting 3-State; 六角缓冲器/线路驱动器;反相三态
74LV368D
型号: 74LV368D
厂家: NXP    NXP
描述:

Hex buffer/line driver; inverting 3-State
六角缓冲器/线路驱动器;反相三态

总线驱动器 总线收发器 逻辑集成电路 光电二极管
文件: 总12页 (文件大小:125K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
74LV368  
Hex buffer/line driver; inverting (3-State)  
Product specification  
1998 May 29  
Supersedes data of 1997 Apr 07  
IC24 Data Handbook  
Philips  
Semiconductors  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
FEATURES  
DESCRIPTION  
The 74LV368 a low–voltage Si–gate CMOS device and is pin and  
function compatible with 74HC/HCT368.  
Optimized for Low Voltage applications: 1.0 to 3.6V  
Accepts TTL input levels between V = 2.7V and V = 3.6V  
CC  
CC  
The 74LV368 is a hex inverting buffer/line driver with 3–state  
outputs. The 3–state outputs (nY) are controlled by the output  
enable inputs 1OE and 2OE. A HIGH on nOE causes the outputs to  
assume a high impedance OFF–state.  
Typical V  
(output ground bounce) t 0.8V @ V = 3.3V,  
OLP  
CC  
T
= 25°C  
amb  
Typical V  
(output V undershoot) u 2V @ V = 3.3V,  
OHV  
OH  
CC  
T
= 25°C  
amb  
Inverting outputs  
Output capability: bus driver  
I category: SSI  
CC  
QUICK REFERENCE DATA  
GND = 0V; T  
= 25°C; t =t v2.5 ns  
amb  
r f  
SYMBOL  
PARAMETER  
CONDITIONS  
TYPICAL  
UNIT  
Propagation delay  
nA to nY  
C = 15pF  
L
t
/t  
9.0  
ns  
PHL PLH  
V
CC  
= 3.3V  
C
C
Input capacitance  
3.5  
30  
pF  
pF  
I
Power dissipation capacitance per buffer  
Notes 1, 2  
PD  
NOTES:  
1
C
is used to determine the dynamic power dissipation (P in µW)  
PD  
D
2
2
P
D
= C   V  
x f )S (C   V  
  f ) where:  
CC o  
PD  
CC  
i
L
f = input frequency in MHz; C = output load capacitance in pF;  
i
L
f = output frequency in MHz; V = supply voltage in V;  
o
CC  
2
S (C   V  
  f ) = sum of the outputs.  
L
CC  
o
2
The condition is V = GND to V  
I
CC  
ORDERING INFORMATION  
PACKAGES  
TEMPERATURE RANGE OUTSIDE NORTH AMERICA  
NORTH AMERICA  
74LV368 N  
PKG. DWG. #  
SOT38-4  
16-Pin Plastic DIL  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
74LV368 N  
74LV368 D  
16-Pin Plastic SO  
74LV368 D  
SOT109-1  
SOT338-1  
SOT403-1  
16-Pin Plastic SSOP Type II  
16-Pin Plastic TSSOP Type I  
74LV368 DB  
74LV368 PW  
74LV368 DB  
74LV368PW DH  
2
1998 May 29  
853–1966 19466  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
PIN CONFIGURATION  
LOGIC SYMBOL (IEEE/IEC)  
1
EN  
3
16  
V
2
1OE  
1A  
1
2
3
4
5
6
7
8
CC  
15 2OE  
14 6A  
13 6Y  
12 5A  
5
7
9
4
1Y  
6
2A  
10  
2Y  
3A  
11  
5Y  
15  
EN  
3Y  
10 4A  
9
4Y  
GND  
11  
12  
14  
13  
SV00373  
SV00374  
LOGIC SYMBOL  
PIN DESCRIPTION  
PIN  
NUMBER  
SYMBOL  
FUNCTION  
2
4
6
1A  
2A  
3A  
1Y  
2Y  
3Y  
4Y  
3
1, 15  
1OE to 2OE Output enable inputs (active LOW)  
2, 4, 6, 10,  
12, 14  
1A to 6A  
Data inputs  
Bus outputs  
5
7
9
3, 5, 7,  
9, 11, 13  
1Y to 6Y  
GND  
8
Ground (0V)  
10 4A  
16  
V
CC  
Positive supply voltage  
1
1OE  
5A  
12  
5Y 11  
6Y 13  
6A  
14  
15 2OE  
SV00375  
3
1998 May 29  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
FUNCTIONAL DIAGRAM  
FUNCTION TABLE  
INPUTS  
OUTPUT  
nOE  
L
nA  
L
nY  
H
L
2
1A  
1Y  
2Y  
3Y  
4Y  
3
5
7
9
L
H
4
2A  
H
X
Z
NOTES:  
6
3A  
H = HIGH voltage level  
L = LOW voltage level  
X = Don’t care  
10  
1
4A  
Z = High impedance OFF-state  
1OE  
5A  
12  
14  
5Y  
6Y  
11  
13  
6A  
15  
2OE  
SV00376  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
1.0  
0
TYP.  
3.3  
MAX  
3.6  
UNIT  
1
V
CC  
DC supply voltage  
See Note  
V
V
V
V
I
Input voltage  
V
CC  
CC  
V
O
Output voltage  
0
V
Operating ambient temperature range  
in free air  
See DC and AC  
characteristics  
–40  
–40  
+85  
+125  
T
amb  
°C  
V
CC  
V
CC  
V
CC  
= 1.0V to 2.0V  
= 2.0V to 2.7V  
= 2.7V to 3.6V  
500  
200  
100  
t , t  
r
Input rise and fall times  
ns/V  
f
NOTES:  
1
The LV is guaranteed to function down to V = 1.0V (input levels GND or V ); DC characteristics are guaranteed from V = 1.2V to V = 3.6V.  
CC CC CC CC  
1, 2  
ABSOLUTE MAXIMUM RATINGS  
In accordance with the Absolute Maximum Rating System (IEC 134); Voltages are referenced to GND (ground = 0V)  
SYMBOL  
PARAMETER  
DC supply voltage  
CONDITIONS  
RATING  
–0.5 to +4.6  
20  
UNIT  
V
CC  
V
±I  
IK  
DC input diode current  
DC output diode current  
V < –0.5 or V > V + 0.5V  
mA  
mA  
I
I
CC  
±I  
OK  
V
O
< –0.5 or V > V + 0.5V  
50  
O
CC  
DC output source or sink current  
– bus driver outputs  
±I  
O
–0.5V < V < V + 0.5V  
35  
mA  
O
CC  
DC V or GND current for types with  
–bus driver outputs  
CC  
±I  
±I  
,
70  
mA  
GND  
CC  
T
stg  
Storage temperature range  
–65 to +150  
°C  
Power dissipation per package  
–plastic DIL  
–plastic mini-pack (SO)  
for temperature range: –40 to +125°C  
above +70°C derate linearly with 12mW/K  
above +70°C derate linearly with 8 mW/K  
above +60°C derate linearly with 5.5 mW/K  
750  
500  
400  
P
TOT  
mW  
–plastic shrink mini-pack (SSOP and TSSOP)  
NOTES:  
1
Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
4
1998 May 29  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
DC CHARACTERISTICS FOR THE LV FAMILY  
Over recommended operating conditions voltages are referenced to GND (ground = 0V)  
LIMITS  
MAX  
-40°C to +85°C  
-40°C to +125°C  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
= 1.2V  
UNIT  
V
1
MIN  
0.9  
1.4  
2.0  
TYP  
MIN  
0.9  
1.4  
2.0  
MAX  
V
V
V
V
V
V
V
V
V
V
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
CC  
HIGH level Input  
voltage  
= 2.0V  
V
IH  
= 2.7 to 3.6V  
= 1.2V  
0.3  
0.6  
0.8  
0.3  
0.6  
0.8  
LOW level Input  
voltage  
= 2.0V  
V
IL  
V
= 2.7 to 3.6V  
= 1.2V; V = V or V –I = 100µA  
1.2  
2.0  
2.7  
3.0  
I
IH  
IL;  
O
= 2.0V; V = V or V –I = 100µA  
1.8  
2.5  
2.8  
1.8  
2.5  
2.8  
I
IH  
IL;  
O
HIGH level output  
voltage; all outputs  
V
OH  
V
OH  
V
V
V
V
= 2.7V; V = V or V –I = 100µA  
I
IH  
IL;  
O
= 3.0V; V = V or V –I = 100µA  
I
IH  
IL;  
O
HIGH level output  
voltage; BUS driver  
outputs  
V
CC  
= 3.0V;V = V or V –I = 8mA  
2.40  
2.82  
2.20  
I
IH  
IL;  
O
V
CC  
V
CC  
V
CC  
V
CC  
= 1.2V; V = V or V I  
IL; O  
= 100µA  
= 100µA  
= 100µA  
0
0
0
0
I
IH  
= 2.0V; V = V or V I  
IL; O  
0.2  
0.2  
0.2  
0.2  
0.2  
0.2  
I
IH  
LOW level output  
voltage; all outputs  
V
OL  
OL  
= 2.7V; V = V or V I  
IL; O  
I
IH  
= 3.0V;V = V or V I = 100µA  
IL; O  
I
IH  
LOW level output  
voltage; BUS driver  
outputs  
V
V
CC  
= 3.0V;V = V or V I = 8mA  
IL; O  
0.20  
0.40  
0.50  
I
IH  
Input leakage  
current  
I
V
= 3.6V; V = V or GND  
1.0  
5
1.0  
10  
µA  
µA  
µA  
I
CC  
CC  
I
CC  
3-State output  
OFF-state current  
V
V
= 3.6V; V = V or V  
I IH IL;  
I
OZ  
CC  
= V or GND  
O
CC  
Quiescent supply  
current; MSI  
I
V
CC  
= 3.6V; V = V or GND; I = 0  
20.0  
160  
I
CC  
O
Additional  
quiescent supply  
current per input  
I  
CC  
V
CC  
= 2.7V to 3.6V; V = V –0.6V  
500  
850  
µA  
I
CC  
NOTE:  
All typical values are measured at T  
1
= 25°C.  
amb  
5
1998 May 29  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
AC CHARACTERISTICS  
GND = 0V; t = t = 2.5ns; C = 50pF; R = 1KΩ  
r
f
L
L
LIMITS  
–40 to +85 °C  
LIMITS  
–40 to +125 °C  
CONDITION  
(V)  
SYMBOL  
PARAMETER  
WAVEFORM  
UNIT  
1
V
CC  
MIN  
TYP  
MAX  
MIN  
MAX  
1.2  
2.0  
2.7  
55  
19  
14  
36  
26  
21  
44  
33  
26  
Propagation delay  
nA, to nY  
t
t
Figures, 1, 3  
Figures, 2, 3  
Figures, 2, 3  
ns  
PZL/ PLH  
2
3.0 to 3.6  
1.2  
10  
75  
26  
19  
3-State output  
enable time  
nOE to nY  
2.0  
49  
36  
29  
60  
44  
35  
t
t
ns  
ns  
PZH/ PZL  
2.7  
2
3.0 to 3.6  
1.2  
14  
90  
32  
24  
3-State output  
disable time  
nOE to nY  
2.0  
59  
44  
36  
70  
52  
42  
t
t
PHZ/ PLZ  
2.7  
2
3.0 to 3.6  
19  
NOTE:  
1
Unless otherwise stated, all typical values are at T  
= 25°C.  
amb  
2
Typical value measured at V = 3.3V.  
CC  
AC WAVEFORMS  
V
V
V
= 1.5V at V w 2.7V  
M
CC  
V
I
= 0.5V * V at V t 2.7V  
M
CC  
CC  
and V are the typical output voltage drop that occur with the  
OL  
OH  
V
M
OE INPUT  
GND  
output load.  
V
X
V
X
V
Y
V
Y
= V + 0.3V at V w 2.7V  
OL CC  
= V + 0.1 * V at V < 2.7V  
OL  
CC  
CC  
t
t
PLZ  
PZL  
= V – 0.3V at V w 2.7V  
V
OH  
CC  
CC  
OUTPUT  
LOW-to-OFF  
OFF-to-LOW  
= V – 0.1V at V < 2.7V  
OH  
CC  
CC  
V
M
V
V
I
X
V
OL  
t
PZH  
nA, nB INPUT  
GND  
V
M
t
PHZ  
V
OH  
V
Y
OUTPUT  
HIGH-to-OFF  
OFF-to-HIGH  
t
V
PHL  
t
PLH  
M
V
OH  
GND  
outputs  
enabled  
outputs  
disabled  
outputs  
enabled  
nY OUTPUT  
V
M
SV00344  
V
OL  
Figure 2. 3-State enable and disable times  
SV00377  
Figure 1.Input (nA) to output (nY) propagation delay  
6
1998 May 29  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
TEST CIRCUIT  
S
1
2 * V  
V
CC  
CC  
Open  
GND  
R
R
= 1k  
L
L
V
V
O
I
PULSE  
GENERATOR  
D.U.T.  
50pF  
R
= 1k  
T
C
L
Test Circuit for switching times  
DEFINITIONS  
R
L
C
L
R
T
= Load resistor  
= Load capacitance includes jig and probe capacitance  
= Termination resistance should be equal to Z of pulse generators.  
OUT  
SWITCH POSITION  
TEST  
S
V
V
I
1
CC  
t
t
Open  
< 2.7V  
V
CC  
PLH/ PHL  
t
t
t
2.7–3.6V  
2.7V  
PLZ/ PZL  
2 < V  
CC  
t
GND  
PHZ/ PZH  
SV00895  
Figure 3. Load circuitry for switching times  
7
1998 May 29  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
DIP16: plastic dual in-line package; 16 leads (300 mil)  
SOT38-4  
8
1997 Apr 02  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
SO16: plastic small outline package; 16 leads; body width 3.9 mm  
SOT109-1  
9
1997 Apr 02  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm  
SOT338-1  
10  
1997 Apr 02  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3-State)  
74LV368  
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm  
SOT403-1  
11  
1997 Apr 02  
Philips Semiconductors  
Product specification  
Hex buffer/line driver; inverting (3–State)  
74LV368  
DEFINITIONS  
Data Sheet Identification  
Product Status  
Definition  
This data sheet contains the design target or goal specifications for product development. Specifications  
may change in any manner without notice.  
Objective Specification  
Formative or in Design  
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to make changes at any time without notice in order to improve design  
and supply the best possible product.  
Preliminary Specification  
Product Specification  
Preproduction Product  
Full Production  
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes  
at any time without notice, in order to improve design and supply the best possible product.  
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,  
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips  
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,  
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask  
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes  
only. PhilipsSemiconductorsmakesnorepresentationorwarrantythatsuchapplicationswillbesuitableforthespecifiedusewithoutfurthertesting  
or modification.  
LIFE SUPPORT APPLICATIONS  
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,  
orsystemswheremalfunctionofaPhilipsSemiconductorsandPhilipsElectronicsNorthAmericaCorporationProductcanreasonablybeexpected  
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips  
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully  
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Copyright Philips Electronics North America Corporation 1998  
All rights reserved. Printed in U.S.A.  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
print code  
Date of release: 05-96  
9397-750-04446  
Document order number:  
Philips  
Semiconductors  

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