74LVC109DB,118 [NXP]
74LVC109 - Dual JK(not) flip-flop with set and reset; positive-edge trigger SSOP1 16-Pin;型号: | 74LVC109DB,118 |
厂家: | NXP |
描述: | 74LVC109 - Dual JK(not) flip-flop with set and reset; positive-edge trigger SSOP1 16-Pin 光电二极管 逻辑集成电路 触发器 |
文件: | 总17页 (文件大小:139K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
74LVC109
Dual JK flip-flop with set and reset; positive-edge trigger
Rev. 5 — 29 November 2012
Product data sheet
1. General description
The 74LVC109A is a dual positive edge triggered JK flip-flop featuring:
• individual J and K inputs
• clock (CP) inputs
• set (SD) and reset (RD) inputs
• complementary Q and Q outputs
The set and reset are asynchronous active LOW inputs and operate independently of the
clock input.
The J and K inputs control the state changes of the flip-flops as described in the mode
select function table. The J and K inputs must be stable one set-up time before the
LOW-to-HIGH clock transition for predictable operation. The JK design allows operation
as a D-type flip-flop by tying the J and K inputs together.
Schmitt trigger action in the clock input makes the circuit highly tolerant of slower clock
rise and fall times.
2. Features and benefits
5 V tolerant inputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
Direct interface with TTL levels
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-B exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Specified from 40 C to +85 C and 40 C to +125 C
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
3. Ordering information
Table 1.
Ordering information
All types are specified from 40 C to +125 C.
Type number
Package
Name
Description
Version
74LVC109D
74LVC109DB
74LVC109PW
SO16
plastic small outline package; 16 leads; body width 3.9 mm
plastic shrink small outline package; 16 leads; body width 5.3 mm
plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT109-1
SOT338-1
SOT403-1
SSOP16
TSSOP16
4. Functional diagram
5
11
1SD 2SD
SD
5
2
11
14
S
S
1Q
2Q
6
2
14
4
1J
2J
1CP
2CP
J
Q
10
1J
1J
6
7
10
9
CP
4
3
1
12
13
15
12
C1
C1
FF
1Q
2Q
7
9
3
13
1K
2K
Q
K
1K
R
1K
R
RD
1RD 2RD
1 15
(a)
(b)
mna858
mna856
Fig 1. Logic symbol
Fig 2. IEC logic symbol
Q
Q
C
C
C
C
C
C
C
C
K
J
S
R
mna859
C
C
CP
Fig 3. Logic diagram for one flip-flop
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
2 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
5. Pinning information
5.1 Pinning
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1RD
1J
V
CC
2RD
2J
1K
1CP
1SD
1Q
2K
109
2CP
2SD
2Q
1Q
GND
2Q
001aad064
Fig 4. Pin configuration SO16 and (T)SSOP16
5.2 Pin description
Table 2.
Symbol
1RD
1J
Pin description
Pin
1
Description
asynchronous reset input (active LOW)
synchronous input
2
1K
3
synchronous input
1CP
1SD
1Q
4
clock input (LOW-to-HIGH; edge-triggered)
asynchronous set input (active LOW)
true flip-flop output
5
6
1Q
7
complement flip-flop output
ground (0 V)
GND
2Q
8
9
complement flip-flop output
true flip-flop output
2Q
10
11
12
13
14
15
16
2SD
2CP
2K
asynchronous set input (active LOW)
clock input (LOW-to-HIGH; edge-triggered)
synchronous input
2J
synchronous input
2RD
VCC
asynchronous reset input (active LOW)
supply voltage
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
3 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
6. Functional description
Table 3.
Function selection[1]
Operating modes
Input
nSD
L
Output
nRD
H
nCP
X
nJ
X
X
X
h
l
nK
X
X
X
l
nQ
H
L
nQ
L
Asynchronous set
Asynchronous reset
Undetermined
Toggle
H
L
X
H
H
q
L
L
X
H
q
H
H
Load 0 (reset)
Load 1 (set)
H
H
l
L
H
L
H
H
h
l
h
H
q
Hold no change
H
H
h
q
[1] H = HIGH voltage level
h = HIGH voltage level one set-up time before the LOW-to-HIGH CP transition
L = LOW voltage level
l = LOW voltage level one set-up time before the LOW-to-HIGH CP transition
q = lower case letters indicate the state of the referenced output one set-up time before the LOW-to-HIGH CP transition
X = don’t care
= LOW-to-HIGH CP transition
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
IIK
Parameter
Conditions
Min
0.5
50
0.5
-
Max
+6.5
-
Unit
V
supply voltage
input clamping current
input voltage
VI < 0 V
mA
V
[1]
[2]
VI
+6.5
50
VCC + 0.5
50
100
-
IOK
output clamping current
output voltage
VO > VCC or VO < 0 V
VO = 0 V to VCC
mA
V
VO
0.5
-
IO
output current
mA
mA
mA
mW
C
ICC
supply current
-
IGND
Ptot
Tstg
ground current
100
-
[3]
total power dissipation
storage temperature
Tamb = 40 C to +125 C
500
+150
65
[1] The minimum input voltage ratings may be exceeded if the input current ratings are observed.
[2] The output voltage ratings may be exceeded if the output current ratings are observed.
[3] For SO16 packages: above 70 C the value of Ptot derates linearly with 8 mW/K.
For (T)SSOP16 packages: above 60 C the value of Ptot derates linearly with 5.5 mW/K.
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
4 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
8. Recommended operating conditions
Table 5.
Symbol
VCC
Recommended operating conditions
Parameter
Conditions
Min
1.65
1.2
0
Typ
Max
3.6
-
Unit
V
supply voltage
-
-
-
-
-
-
-
functional
V
VI
input voltage
5.5
VCC
+125
20
V
VO
output voltage
0
V
Tamb
t/V
ambient temperature
input transition rise and fall rate
in free air
40
0
C
ns/V
ns/V
VCC = 1.65 V to 2.7 V
VCC = 2.7 V to 3.6 V
0
10
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
40 C to +85 C
Min Max
Typ[1]
1.08
40 C to +125 C
Min Max
1.08
Unit
VIH
HIGH-level
VCC = 1.2 V
-
-
-
-
-
-
V
V
V
V
V
V
V
V
input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.65 VCC
-
-
-
-
-
-
-
-
0.65 VCC
1.7
-
1.7
VCC = 2.7 V to 3.6 V
2.0
-
2.0
VIL
LOW-level
VCC = 1.2 V
-
-
-
-
0.12
-
-
-
-
0.12
input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VI = VIH or VIL
0.35 VCC
0.7
0.35 VCC
0.7
0.8
0.8
VOH
HIGH-level
output
IO = 100 A;
VCC = 1.65 V to 3.6 V
VCC 0.2
-
-
VCC 0.3
-
V
voltage
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 18 mA; VCC = 3.0 V
IO = 24 mA; VCC = 3.0 V
VI = VIH or VIL
1.2
1.8
2.2
2.4
2.2
-
-
-
-
-
-
-
-
-
-
1.05
1.65
2.05
2.25
2.0
-
-
-
-
-
V
V
V
V
V
VOL
LOW-level
output
voltage
IO = 100 A;
-
-
0.2
-
0.3
V
VCC = 1.65 V to 3.6 V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
-
-
-
-
-
-
0.45
0.6
-
-
-
-
-
0.65
0.8
V
-
V
-
0.4
0.6
V
-
0.55
5
0.8
V
II
input leakage VCC = 3.6 V; VI = 5.5 V or GND
current
0.1
20
A
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
5 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
Table 6.
Static characteristics …continued
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
40 C to +85 C
40 C to +125 C
Min Max
Unit
Min
Typ[1]
Max
ICC
supply
current
VCC = 3.6 V; VI = VCC or GND;
IO = 0 A
-
-
0.1
10
-
-
40
A
A
ICC
additional
supply
current
per input pin;
5
500
5000
-
VCC = 2.7 V to 3.6 V;
VI = VCC 0.6 V; IO = 0 A
CI
input
VCC = 0 V to 3.6 V;
-
5.0
-
-
pF
capacitance VI = GND to VCC
[1] All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 C.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.
Symbol Parameter Conditions 40 C to +85 C
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
[2]
tpd
propagation nCP to nQ, nQ; see Figure 5
delay
VCC = 1.2 V
-
15
6.8
3.9
3.9
3.5
-
-
-
ns
ns
ns
ns
ns
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.7
2.7
1.5
1.0
15.0
8.1
7.3
6.8
1.7
2.7
1.5
1.0
17.4
9.4
9.5
8.5
VCC = 3.0 V to 3.6 V
nSD, nRD to nQ, nQ; see Figure 6
VCC = 1.2 V
tPLH
LOW to
HIGH
propagation
delay
-
16
6.2
3.6
4.5
3.3
-
-
-
ns
ns
ns
ns
ns
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.0
1.5
1.5
1.0
15.6
8.3
8.2
7.0
1.0
1.5
1.5
1.0
18.0
9.7
10.5
9.0
VCC = 3.0 V to 3.6 V
nSD, nRD to nQ, nQ; see Figure 6
VCC = 1.2 V
tPHL
HIGH to
LOW
propagation
delay
-
13
6.7
3.8
4.1
3.5
-
-
-
ns
ns
ns
ns
ns
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.5
2.0
1.5
1.0
14.4
7.7
7.1
6.5
1.5
2.0
1.5
1.0
16.7
9.0
9.0
8.5
VCC = 3.0 V to 3.6 V
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
6 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 7.
Symbol Parameter Conditions 40 C to +85 C
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
tW
pulse width clock HIGH or LOW; see Figure 5
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
5.0
4.0
3.3
3.3
-
-
-
-
-
-
5.0
4.0
3.3
3.3
-
-
-
-
ns
ns
ns
ns
-
VCC = 3.0 V to 3.6 V
set or reset HIGH or LOW; see Figure 6
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
2.0
5.0
4.0
3.0
3.0
-
-
-
-
-
-
-
-
5.0
4.0
3.0
3.0
-
-
-
-
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
nSD, nRD to nCP; see Figure 6
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
trec
recovery
time
5.5
4.0
3.2
3.0
-
-
-
-
-
-
-
-
5.5
4.0
3.2
3.0
-
-
-
-
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
tsu
set-up time nJ and nK to CP; see Figure 5
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
5.0
3.5
2.7
2.5
-
-
-
-
-
-
-
-
5.0
3.5
2.7
2.5
-
-
-
-
ns
ns
ns
ns
VCC = 2.7 V
VCC = 3.0 V to 3.6 V
th
hold time
nJ and nK to nCP; see Figure 5
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
3.0
2.5
2.2
2.0
-
-
-
-
-
-
-
-
3.0
2.5
2.2
2.0
-
-
-
-
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
see Figure 5
fmax
maximum
frequency
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
100
125
150
150
-
-
-
80
100
120
120
-
-
MHz
MHz
MHz
MHz
ns
-
-
-
-
-
-
330
-
VCC = 3.0 V to 3.6 V
-
-
[3]
[4]
tsk(o)
CPD
output skew VCC = 3.0 V to 3.6 V
time
1.0
1.5
power
VI = GND to VCC
dissipation
capacitance
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
-
-
-
11.4
17.6
23.1
-
-
-
-
-
-
-
-
-
pF
pF
pF
[1] Typical values are measured at Tamb = 25 C and VCC = 1.2 V, 1.8 V, 2.5 V, 2.7 V and 3.3 V respectively.
[2] pd is the same as tPLH and tPHL
[3] Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
t
.
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
7 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
[4] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz; fo = output frequency in MHz
CL = output load capacitance in pF
VCC = supply voltage in Volts
N = number of inputs switching
(CL VCC2 fo) = sum of the outputs
11. AC waveforms
V
I
V
nJ, nK input
GND
M
t
t
h
h
t
t
su
su
1/f
max
V
I
V
nCP input
M
GND
t
W
t
t
PLH
PHL
V
OH
V
nQ output
nQ output
M
V
OL
V
OH
V
M
V
OL
t
t
PHL
PLH
mna860
Measurement points are given in Table 8.
VOL and VOH are typical output voltage levels that occur with the output load.
The shaded areas indicate when the input is permitted to change for predictable output performance.
Fig 5. Clock propagation delays, pulse width, set-up, hold times, and maximum frequency
74LVC109
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
8 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
V
I
V
M
nCP input
GND
t
rem
V
I
V
M
nSD input
nRD input
GND
t
t
W
W
V
I
V
M
GND
t
t
PHL
PLH
V
OH
nQ output
nQ output
V
V
M
V
OL
V
OH
M
V
OL
t
t
PLH
PHL
mna861
Measurement points are given in Table 8.
OL and VOH are typical output voltage levels that occur with the output load.
V
Fig 6. Set and reset propagation delays, pulse widths and recovery times
Table 8. Measurement points
Supply voltage
VCC
Input
VI
Output
VM
VM
1.2 V
VCC
VCC
VCC
2.7 V
2.7 V
0.5 VCC
0.5 VCC
0.5 VCC
1.5 V
0.5 VCC
0.5 VCC
0.5 VCC
1.5 V
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
3.0 V to 3.6 V
1.5 V
1.5 V
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
9 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
CC
V
V
O
I
PULSE
GENERATOR
DUT
R
T
C
L
R
L
001aaf615
Test data is given in Table 9.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
Fig 7. Load circuitry for switching times
Table 9.
Test data
Supply voltage
Input
VI
Load
CL
tr, tf
RL
1.2 V
VCC
VCC
VCC
2.7 V
2.7 V
2 ns
2 ns
2 ns
2.5 ns
2.5 ns
30 pF
30 pF
30 pF
50 pF
50 pF
1 k
1 k
500
500
500
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
3.0 V to 3.6 V
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
10 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
12. Package outline
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
v
c
y
H
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.39
0.014 0.0075 0.38
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT109-1
076E07
MS-012
Fig 8. Package outline SOT109-1 (SO16)
74LVC109
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
11 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
8
1
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
mm
2
0.25
0.65
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT338-1
MO-150
Fig 9. Package outline SOT338-1 (SSOP16)
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
12 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
D
E
A
X
c
y
H
v
M
A
E
Z
9
16
Q
(A )
3
A
2
A
A
1
pin 1 index
θ
L
p
L
1
8
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.40
0.06
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT403-1
MO-153
Fig 10. Package outline SOT403-1 (TSSOP16)
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
13 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
13. Abbreviations
Table 10. Abbreviations
Acronym
CDM
DUT
Description
Charged Device Model
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
Machine Model
HBM
MM
TTL
Transistor-Transistor Logic
14. Revision history
Table 11. Revision history
Document ID
Release date
20121129
Data sheet status
Change notice
Supersedes
74LVC109 v.5
Product data sheet
-
74LVC109 v.4
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity guidelines
of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Table 4, Table 5, Table 6, Table 7 and Table 8: values added for lower voltage ranges.
74LVC109 v.4
74LVC109 v.3
74LVC109 v.2
74LVC109 v.1
20040318
19980428
19970318
-
Product specification
Product specification
Product specification
-
-
-
-
-
74LVC109 v.3
74LVC109 v.2
74LVC109 v.1
-
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
14 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
15.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
15 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC109
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 29 November 2012
16 of 17
74LVC109
NXP Semiconductors
Dual JK flip-flop with set and reset; positive-edge trigger
17. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 5
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
7
8
9
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 29 November 2012
Document identifier: 74LVC109
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