74LVC10APW [NXP]

Triple 3-input NAND gate; 三路3输入与非门
74LVC10APW
型号: 74LVC10APW
厂家: NXP    NXP
描述:

Triple 3-input NAND gate
三路3输入与非门

栅极 逻辑集成电路 光电二极管
文件: 总8页 (文件大小:88K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
74LVC10A  
Triple 3-input NAND gate  
Product specification  
1998 Apr 28  
Philips  
Semiconductors  
Philips Semiconductors  
Product specification  
Triple 3-input NAND gate  
74LVC10A  
FEATURES  
DESCRIPTION  
The 74LVC10A is a high performance, low power, low voltage, Si  
gate CMOS device and superior to most advanced CMOS  
compatible TTL families.  
Wide supply voltage range of 1.2 V to 3.6 V  
In accordance with JEDEC standard no. 8-1A.  
Inputs accept voltages up to 5.5 V  
CMOS low power consumption  
Direct interface with TTL levels  
Output capability: standard  
The 74LVC10A provides the 3-input NAND function.  
I category: SSI  
CC  
QUICK REFERENCE DATA  
GND = 0 V; T  
= 25°C; t = t v2.5 ns  
amb  
r f  
SYMBOL  
/t  
PARAMETER  
CONDITIONS  
TYPICAL  
UNIT  
Propagation delay  
nA, nB, nC to nY  
C = 50 pF;  
L
CC  
t
3.9  
ns  
PHL PLH  
V
= 3.3 V  
C
Input capacitance  
5.0  
26  
pF  
pF  
I
1
C
Power dissipation capacitance per gate  
V = GND to V  
I CC  
PD  
NOTE:  
1. C is used to determine the dynamic power dissipation (P in µW)  
PD  
D
2
2
P
= C × V  
× f  (C × V  
  f ) where:  
D
PD  
CC  
i
L
CC o  
f = input frequency in MHz; C = output load capacity in pF;  
i
L
f = output frequency in MHz; V = supply voltage in V;  
o
CC  
2
ȍ (C × V  
× f ) = sum of the outputs.  
L
CC  
o
ORDERING INFORMATION  
PACKAGES  
TEMPERATURE RANGE OUTSIDE NORTH AMERICA  
NORTH AMERICA  
74LVC10A D  
DWG NUMBER  
SOT108-1  
14-Pin Plastic SO  
–40°C to +85°C  
–40°C to +85°C  
–40°C to +85°C  
74LVC10A D  
74LVC10A DB  
74LVC10A PW  
14-Pin Plastic SSOP Type II  
14-Pin Plastic TSSOP Type I  
74LVC10A DB  
SOT337-1  
74LVC10APW DH  
SOT402-1  
PIN CONFIGURATION  
LOGIC SYMBOL  
V
1A  
1B  
1
2
3
4
5
6
7
14  
1
2
1A  
1B  
CC  
1Y 12  
13 1C  
13 1C  
2A  
12 1Y  
11 3C  
10 3B  
3
4
5
2A  
2B  
2C  
2B  
2Y  
3Y  
6
8
2C  
2Y  
9
8
3A  
3Y  
9
3A  
10 3B  
11 3C  
GND  
SV00416  
SV00417  
PIN DESCRIPTION  
PIN  
SYMBOL  
NUMBER  
NAME AND FUNCTION  
1, 3, 9  
2, 4, 10  
7
1A – 3A  
1B – 3B  
GND  
Data inputs  
Data inputs  
Ground (0 V)  
Data outputs  
12, 6, 8  
13, 5, 11  
14  
1Y – 3Y  
1C – 3C  
Data inputs  
V
CC  
Positive supply voltage  
2
1998 Apr 28  
853-1973 19308  
Philips Semiconductors  
Product specification  
Triple 3-input NAND gate  
74LVC10A  
LOGIC SYMBOL (IEEE/IEC)  
FUNCTION TABLE  
INPUTS  
OUTPUTS  
nY  
1
2
13  
&
12  
nA  
nB  
nC  
3
4
5
L
L
L
L
L
L
H
H
L
H
L
H
H
H
H
&
6
9
10  
11  
&
8
H
H
H
H
H
L
L
H
H
L
H
L
H
H
H
L
SV00418  
H
LOGIC DIAGRAM (ONE GATE)  
NOTES:  
H = HIGH voltage level  
L = LOW voltage level  
A
B
C
Y
SV00419  
RECOMMENDED OPERATING CONDITIONS  
LIMITS  
SYMBOL  
PARAMETER  
CONDITIONS  
UNIT  
MIN  
2.7  
1.2  
0
MAX  
3.6  
V
V
DC supply voltage (for max. speed performance)  
DC supply voltage (for low-voltage applications)  
DC input voltage range  
V
V
CC  
3.6  
5.5  
CC  
V
I
V
T
amb  
Operating free-air temperature range  
–40  
+85  
°C  
V
CC  
V
CC  
= 1.2 to 2.7V  
= 2.7 to 3.6V  
0
0
20  
10  
t , t  
r
Input rise and fall times  
ns/V  
f
1
ABSOLUTE MAXIMUM RATINGS  
In accordance with the Absolute Maximum Rating System (IEC 134).  
Voltages are referenced to GND (ground = 0V).  
SYMBOL  
PARAMETER  
DC supply voltage  
CONDITIONS  
RATING  
–0.5 to +6.5  
–50  
UNIT  
V
V
CC  
I
IK  
DC input diode current  
V t 0  
mA  
V
I
V
I
DC input voltage  
Note 2  
–0.5 to +6.5  
"50  
I
DC output diode current  
DC output voltage; output HIGH or LOW  
V
O
uV or V t 0  
mA  
OK  
CC  
O
Note 2  
Note 2  
–0.5 to V +0.5  
CC  
V
I/O  
V
DC input voltage; output 3-State  
DC output source or sink current  
–0.5 to 6.5  
I
O
V
O
= 0 to V  
"50  
"100  
mA  
mA  
°C  
CC  
I
, I  
DC V or GND current  
GND CC  
CC  
T
stg  
Storage temperature range  
–65 to +150  
Power dissipation per package  
– plastic mini-pack (SO)  
– plastic shrink mini-pack (SSOP and TSSOP)  
P
TOT  
above +70°C derate linearly with 8 mW/K  
above +60°C derate linearly with 5.5 mW/K  
500  
500  
mW  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
3
1998 Apr 28  
Philips Semiconductors  
Product specification  
Triple 3-input NAND gate  
74LVC10A  
DC ELECTRICAL CHARACTERISTICS  
Over recommended operating conditions. Voltages are referenced to GND (ground = 0V).  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
Temp = -40°C to +85°C  
UNIT  
1
MIN  
TYP  
MAX  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 1.2V  
V
CC  
V
HIGH level Input voltage  
LOW level Input voltage  
V
V
IH  
= 2.7 to 3.6V  
= 1.2V  
2.0  
GND  
0.8  
V
IL  
= 2.7 to 3.6V  
= 2.7V; V = V or V ; I = –12mA  
V
V
V
V
*0.5  
I
IH  
IL  
O
CC  
CC  
CC  
CC  
= 3.0V; V = V or V ; I = –100µA  
*0.2  
*0.6  
*1.0  
V
CC  
I
IH  
IL  
O
V
OH  
HIGH level output voltage  
LOW level output voltage  
V
= 3.0V; V = V or V I  
= –12mA  
I = –24mA  
I
IH  
IL; O  
= 3.0V; V = V or V  
IL; O  
I
IH  
= 2.7V; V = V or V ; I = 12mA  
0.40  
0.20  
0.55  
"5  
10  
I
IH  
IL  
O
= 3.0V; V = V or V ; I = 100µA  
V
OL  
V
I
IH  
IL  
O
= 3.0V; V = V or V  
I = 24mA  
IL; O  
I
IH  
I
Input leakage current  
= 3.6V; V = 5.5V or GND  
"0.1  
µA  
µA  
I
I
I
Quiescent supply current  
= 3.6V; V = V or GND; I = 0  
0.1  
CC  
I
CC  
O
Additional quiescent supply current per  
input pin  
I  
CC  
V
CC  
= 2.7V to 3.6V; V = V –0.6V; I = 0  
5
500  
µA  
I
CC  
O
NOTE:  
1. All typical values are at V = 3.3V and T  
= 25°C.  
CC  
amb  
AC CHARACTERISTICS  
GND = 0 V; t = t v 2.5 ns; C = 50 pF  
r
f
L
LIMITS  
V
CC  
= 3.3V ±0.3V  
V
CC  
= 2.7V  
SYMBOL  
PARAMETER  
WAVEFORM  
UNIT  
1
MIN  
1.5  
TYP  
MAX  
MIN  
MAX  
t
t
/
Propagation delay  
nA, nB, nC to nY  
PHL  
Figures 1, 2  
3.9  
5.7  
1.5  
6.7  
ns  
PLH  
NOTE:  
1. These typical values are at V = 3.3V and T  
= 25°C.  
amb  
CC  
AC WAVEFORMS  
TEST CIRCUIT  
V
V
V
= 1.5 V at V w 2.7 V  
M
CC  
S
1
= 0.5 S V at V < 2.7 V  
M
CC  
CC  
2 * V  
V
CC  
CC  
and V are the typical output voltage drop that occur with the  
OL  
OH  
Open  
GND  
output load.  
500  
V
V
O
I
V
I
PULSE  
GENERATOR  
D.U.T.  
nA, nB, nC  
INPUT  
GND  
V
M
50pF  
500Ω  
R
T
C
L
t
t
PLH  
PHL  
V
OH  
nY OUTPUT  
V
V
M
SWITCH POSITION  
TEST  
S
V
V
I
OL  
1
CC  
SV00420  
t
t
Open  
< 2.7V  
V
CC  
PLH/ PHL  
Figure 1. Input (nA, nB, nC) to output (nY)  
propagation delays.  
2.7–3.6V  
2.7V  
SV00903  
Figure 2. Load circuitry for switching times.  
4
1998 Apr 28  
Philips Semiconductors  
Product specification  
Triple 3-input NAND gate  
74LVC10A  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
5
1998 Apr 28  
Philips Semiconductors  
Product specification  
Triple 3-input NAND gate  
74LVC10A  
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm  
SOT337-1  
6
1998 Apr 28  
Philips Semiconductors  
Product specification  
Triple 3-input NAND gate  
74LVC10A  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
7
1998 Apr 28  
Philips Semiconductors  
Product specification  
Triple 3-input NAND gate  
74LVC10A  
Data sheet status  
[1]  
Data sheet  
status  
Product  
status  
Definition  
Objective  
specification  
Development  
This data sheet contains the design target or goal specifications for product development.  
Specification may change in any manner without notice.  
Preliminary  
specification  
Qualification  
This data sheet contains preliminary data, and supplementary data will be published at a later date.  
Philips Semiconductors reserves the right to make chages at any time without notice in order to  
improve design and supply the best possible product.  
Product  
specification  
Production  
This data sheet contains final specifications. Philips Semiconductors reserves the right to make  
changes at any time without notice in order to improve design and supply the best possible product.  
[1] Please consult the most recently issued datasheet before initiating or completing a design.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or  
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended  
periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips  
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or  
modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.  
RighttomakechangesPhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard  
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Copyright Philips Electronics North America Corporation 1998  
All rights reserved. Printed in U.S.A.  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
print code  
Date of release: 07-98  
9397-750-04482  
Document order number:  
Philips  
Semiconductors  

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