74LVC16244ABQ [NXP]

16-bit buffer/line driver; 5 V input/output tolerant; 3-state; 16位缓冲器/线路驱动器; 5 V输入/输出宽容;三态
74LVC16244ABQ
型号: 74LVC16244ABQ
厂家: NXP    NXP
描述:

16-bit buffer/line driver; 5 V input/output tolerant; 3-state
16位缓冲器/线路驱动器; 5 V输入/输出宽容;三态

总线驱动器 总线收发器 逻辑集成电路
文件: 总19页 (文件大小:176K)
中文:  中文翻译
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74LVC16244A; 74LVCH16244A  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
Rev. 09 — 18 March 2010  
Product data sheet  
1. General description  
The 74LVC16244A; 74LVCH16244A are 16-bit non-inverting buffer/line drivers with  
3-state bus compatible outputs. The device can be used as four 4-bit buffers, two 8-bit  
buffers or one 16-bit buffer. It features four output enable inputs, (1OE to 4OE) each  
controlling four of the 3-state outputs. A HIGH on nOE causes the outputs to assume a  
high-impedance OFF-state.  
Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be  
applied to the outputs. These features allow the use of these devices in mixed  
3.3 V and 5 V applications.  
The 74LVCH16244A bus hold on data inputs eliminates the need for external pull-up  
resistors to hold unused inputs.  
2. Features and benefits  
„ 5 V tolerant inputs/outputs for interfacing with 5 V logic  
„ Wide supply voltage range from 1.2 V to 3.6 V  
„ CMOS low power consumption  
„ Multibyte flow-through standard pin-out architecture  
„ Low inductance multiple power and ground pins for minimum noise and ground  
bounce  
„ Direct interface with TTL levels  
„ High-impedance when VCC = 0 V  
„ All data inputs have bus hold. (74LVCH16244A only)  
„ Complies with JEDEC standard JESD8-B / JESD36  
„ ESD protection:  
‹ HBM JESD22-A114F exceeds 2000 V  
‹ MM JESD22-A115-A exceeds 200 V  
„ Specified from 40 °C to +85 °C and 40 °C to +125 °C  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Temperature range Package  
Name  
Description  
Version  
74LVC16244ADL  
74LVCH16244ADL  
74LVC16244ADGG  
74LVCH16244ADGG  
74LVC16244AEV  
74LVCH16244AEV  
74LVC16244ABQ  
74LVCH16244ABQ  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
SSOP48  
plastic shrink small outline package; 48 leads;  
body width 7.5 mm  
SOT370-1  
TSSOP48  
VFBGA56  
plastic thin shrink small outline package;  
48 leads; body width 6.1 mm  
SOT362-1  
plastic very thin fine-pitch ball grid array package; SOT702-1  
56 balls; body 4.5 × 7 × 0.65 mm  
HXQFN60U plastic thermal enhanced extremely thin quad flat SOT1134-1  
package; no leads; 60 terminals; UTLP based;  
body 4 x 6 x 0.5 mm  
4. Functional diagram  
1
1A0  
1A1  
1A2  
1A3  
1OE  
2A0  
2A1  
2A2  
2A3  
2OE  
1Y0  
1Y1  
1Y2  
1Y3  
3A0  
3A1  
3A2  
3A3  
3OE  
4A0  
4A1  
4A2  
4A3  
4OE  
3Y0  
1OE  
2OE  
3OE  
4OE  
EN1  
EN2  
EN3  
EN4  
47  
46  
44  
43  
1
2
3
5
6
36  
35  
33  
32  
25  
30  
29  
27  
26  
24  
13  
14  
16  
17  
48  
25  
24  
3Y1  
3Y2  
3Y3  
47  
46  
44  
43  
41  
40  
38  
37  
36  
35  
33  
32  
30  
29  
27  
26  
2
3
1A0  
1A1  
1A2  
1A3  
2A0  
2A1  
2A2  
2A3  
3A0  
3A1  
3A2  
3A3  
4A0  
4A1  
4A2  
4A3  
1
1
1
1
1
2
3
4
1Y0  
1Y1  
1Y2  
1Y3  
2Y0  
2Y1  
2Y2  
2Y3  
3Y0  
3Y1  
3Y2  
3Y3  
4Y0  
4Y1  
4Y2  
4Y3  
5
6
8
9
11  
12  
13  
14  
16  
17  
19  
20  
22  
23  
2Y0  
2Y1  
2Y2  
2Y3  
4Y0  
4Y1  
4Y2  
4Y3  
41  
40  
38  
37  
48  
8
9
19  
20  
22  
23  
11  
12  
001aae506  
001aae231  
Pin numbers are shown for SSOP48 and TSSOP48  
packages only.  
Pin numbers are shown for SSOP48 and TSSOP48  
packages only.  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
2 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
V
CC  
data input  
to internal circuit  
mna705  
Fig 3. Bus hold circuit  
5. Pinning information  
5.1 Pinning  
1
2
48  
1OE  
1Y0  
1Y1  
GND  
1Y2  
1Y3  
2OE  
1A0  
1A1  
GND  
1A2  
1A3  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
3
4
5
6
7
V
CC  
V
CC  
8
2Y0  
2Y1  
GND  
2Y2  
2Y3  
3Y0  
3Y1  
GND  
3Y2  
3Y3  
2A0  
2A1  
GND  
2A2  
2A3  
3A0  
3A1  
GND  
3A2  
3A3  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
74LVC16244A  
74LVCH16244A  
74LVC16244A  
74LVCH16244A  
ball A1  
index area  
1
2 3 4 5 6  
A
B
C
D
E
F
G
H
J
V
CC  
V
CC  
4Y0  
4Y1  
4A0  
4A1  
GND  
4A2  
4A3  
3OE  
GND  
4Y2  
4Y3  
K
4OE  
001aaj053  
Transparent top view  
001aaj052  
Fig 4. Pin configuration SOT370-1 (SSOP48) and  
SOT362-1 (TSSOP48)  
Fig 5. Pin configuration SOT702-1 (VFBGA56)  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
3 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
terminal 1  
index area  
D1  
A32  
D5  
A31  
A30  
A29  
A28  
A27  
D8  
D4  
B20  
B19  
B18  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
A10  
A26  
A25  
A24  
A23  
A22  
A21  
A20  
A19  
A18  
A17  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B17  
B16  
B15  
B14  
B13  
B12  
B11  
74LVC16244A  
74LVCH16244A  
(1)  
GND  
D6  
B8  
B9  
B10  
D7  
D2  
A11  
A12  
A13  
A14  
A15  
A16  
D3  
001aaj054  
Transparent top view  
(1) The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.  
Fig 6. Pin configuration SOT1134-1 (HXQFN60U)  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
4 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
5.2 Pin description  
Table 2.  
Symbol  
Pin description  
Pin  
Description  
SOT1134-1  
SOT370-1 and  
SOT362-1  
SOT702-1  
1OE, 2OE, 1, 48, 25, 24  
3OE, 4OE  
A1, A6, K6, K1  
A30, A29, A14, A13  
output enable input (active LOW)  
1Y0 to 1Y3 2, 3, 5, 6  
B2, B1, C2, C1  
D2, D1, E2, E1  
F1, F2, G1, G2  
H1, H2, J1, J2  
B20, A31, D5, D1  
A2, B2, B3, A5  
A6, B5, B6, A9  
D2, D6, A12, B8  
data output  
data output  
data output  
data output  
ground (0 V)  
2Y0 to 2Y3 8, 9, 11, 12  
3Y0 to 3Y3 13, 14, 16, 17  
4Y0 to 4Y3 19, 20, 22, 23  
GND  
4, 10, 15, 21, 28,  
34, 39, 45  
B3, B4, D3, D4, G3, G4, A32, A3, A8, A11, A16,  
J3, J4  
A19, A24, A27  
VCC  
7, 18, 31, 42  
C3, C4, H3, H4  
B5, B6, C5, C6  
D5, D6, E5, E6  
F6, F5, G6, G5  
H6, H5, J6, J5  
A1, A10, A17, A26  
B18, A28, D8, D4  
A25, B16, B15, A22  
A21, B13, B12, A18  
D3, D7, A15, B10  
supply voltage  
data input  
1A0 to 1A3 47, 46, 44, 43  
2A0 to 2A3 41, 40, 38, 37  
3A0 to 3A3 36, 35, 33, 32  
4A0 to 4A3 30, 29, 27, 26  
data input  
data input  
data input  
n.c.  
-
A2, A3, A4, A5, K2, K3, A4, A7, A20, A23, B1,  
not connected  
K4, K5  
B4, B7, B9, B11, B14,  
B17, B19  
6. Functional description  
Table 3.  
Function table[1]  
Control  
Input  
nAn  
L
Output  
nOE  
L
nYn  
L
L
H
H
H
X
Z
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
5 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
7. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
0.5  
50  
0.5  
-
Max  
+6.5  
-
Unit  
V
supply voltage  
input clamping current  
input voltage  
VI < 0 V  
mA  
V
[1]  
VI  
+6.5  
±50  
VCC + 0.5  
+6.5  
±50  
100  
-
IOK  
output clamping current  
output voltage  
VO > VCC or VO < 0 V  
output HIGH or LOW  
output 3-state  
mA  
V
[2]  
[2]  
VO  
0.5  
0.5  
-
V
IO  
output current  
VO = 0 V to VCC  
mA  
mA  
mA  
°C  
ICC  
IGND  
Tstg  
Ptot  
supply current  
-
ground current  
100  
65  
storage temperature  
total power dissipation  
+150  
Tamb = 40 °C to +125 °C;  
(T)SSOP48 package  
VFBGA56 package  
[3]  
[4]  
[4]  
-
-
-
500  
mW  
mW  
mW  
1000  
1000  
HXQFN60U package  
[1] The minimum input voltage ratings may be exceeded if the input current ratings are observed.  
[2] The output voltage ratings may be exceeded if the output current ratings are observed.  
[3] Above 60 °C the value of Ptot derates linearly with 5.5 mW/K.  
[4] Above 70 °C the value of Ptot derates linearly with 1.8 mW/K.  
8. Recommended operating conditions  
Table 5.  
Symbol  
VCC  
Recommended operating conditions  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
supply voltage  
maximum speed  
performance  
2.7  
-
3.6  
V
functional  
1.2  
0
-
-
-
-
-
-
-
3.6  
5.5  
VCC  
5.5  
+125  
20  
V
VI  
input voltage  
V
VO  
output voltage  
output HIGH or LOW  
output 3-state  
0
V
0
V
Tamb  
ambient temperature  
in free air  
40  
0
°C  
ns/V  
ns/V  
Δt/ΔV  
input transition rise and fall rate  
VCC = 1.2 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
0
10  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
6 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
9. Static characteristics  
Table 6.  
Static characteristics  
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter Conditions 40 °C to +85 °C  
Min  
Typ[1] Max  
40 °C to +125 °C Unit  
Min  
VCC  
2.0  
-
Max  
VIH  
HIGH-level input VCC = 1.2 V  
voltage  
VCC  
-
-
-
-
-
-
-
-
V
V
V
V
VCC = 2.7 V to 3.6 V  
2.0  
VIL  
LOW-level input  
voltage  
VCC = 1.2 V  
VCC = 2.7 V to 3.6 V  
-
-
0
0
0.8  
-
0.8  
VOH  
HIGH-leveloutput VI = VIH or VIL  
voltage  
IO = 100 μA;  
VCC 0.2 VCC  
-
VCC 0.3  
-
V
VCC = 2.7 V to 3.6 V  
IO = 12 mA; VCC = 2.7 V  
IO = 18 mA; VCC = 3.0 V  
IO = 24 mA; VCC = 3.0 V  
2.2  
2.4  
2.2  
-
-
-
-
-
-
2.05  
2.25  
2.0  
-
-
-
V
V
V
VOL  
LOW-level output VI = VIH or VIL  
voltage  
IO = 100 μA;  
-
0
0.20  
-
0.3  
V
VCC = 2.7 V to 3.6 V  
IO = 12 mA; VCC = 2.7 V  
IO = 24 mA; VCC = 3.0 V  
-
-
-
-
-
0.40  
0.55  
±5  
-
-
-
0.6  
0.8  
V
V
[2]  
II  
input leakage  
current  
VI = 5.5 V or GND; VCC = 3.6 V  
±0.1  
±20 μA  
[2][3]  
IOZ  
OFF-state output VI = VIH or VIL;  
current VO = 5.5 V or GND;  
VCC = 3.6 V  
-
±0.1  
±5  
-
±20 μA  
IOFF  
ICC  
power-off leakage VI or VO = 5.5 V; VCC = 0.0 V  
current  
-
-
±0.1  
±10  
-
-
±20 μA  
supply current  
VI = VCC or GND; IO = 0 A;  
VCC = 3.6 V  
0.1  
20  
80  
μA  
ΔICC  
CI  
additional supply per input pin; VI = VCC 0.6 V;  
current IO = 0 A; VCC = 2.7 V to 3.6 V  
-
5
5.0  
-
500  
-
5000 μA  
input capacitance VCC = 0 V to 3.6 V;  
VI = GND to VCC  
-
-
-
-
-
-
-
-
-
-
pF  
μA  
μA  
μA  
[4][5]  
[4][5]  
[4][6]  
IBHL  
IBHH  
IBHLO  
bus hold LOW  
current  
VCC = 3.0 V; VI = 0.8 V  
VCC = 3.0 V; VI = 2.0 V  
VCC = 3.6 V  
75  
75  
500  
60  
60  
500  
bus hold HIGH  
current  
-
bus hold LOW  
-
overdrive current  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
7 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
Table 6.  
Static characteristics …continued  
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
40 °C to +85 °C  
Min  
Typ[1] Max  
500  
40 °C to +125 °C Unit  
Min  
Max  
[4][6]  
IBHHO  
bus hold HIGH  
overdrive current  
VCC = 3.6 V  
-
-
500  
-
μA  
[1] All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 °C.  
[2] The bus hold circuit is switched off when VI > VCC allowing 5.5 V on the input terminal.  
[3] For I/O ports the parameter IOZ includes the input leakage current.  
[4] Valid for data inputs of bus hold parts only (74LVCH16244A). Note that control inputs do not have a bus hold circuit.  
[5] The specified sustaining current at the data input holds the input below the specified VI level.  
[6] The specified overdrive current at the data input forces the data input to the opposite input state.  
10. Dynamic characteristics  
Table 7.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9.  
Symbol Parameter  
Conditions  
40 °C to +85 °C  
40 °C to +125 °C Unit  
Min  
Typ  
Max  
Min  
Max  
[1]  
tpd  
ten  
tdis  
propagation  
delay  
nAn to nYn; see Figure 7  
VCC = 1.2 V  
-
11.0  
-
-
-
-
ns  
ns  
ns  
VCC = 2.7 V  
1.0  
1.1  
4.7  
4.1  
1.0  
1.1  
6.0  
5.5  
[2]  
[1]  
VCC = 3.0 V to 3.6 V  
3.0  
enable time  
disable time  
nOE to nYn; see Figure 8  
VCC = 1.2 V  
-
15.0  
-
-
-
-
ns  
ns  
ns  
VCC = 2.7 V  
1.0  
1.0  
5.8  
4.6  
1.0  
1.0  
7.5  
6.0  
[2]  
[1]  
VCC = 3.0 V to 3.6 V  
nOE to nYn; see Figure 8  
VCC = 1.2 V  
3.5  
-
10.0  
-
-
-
-
ns  
ns  
ns  
VCC = 2.7 V  
1.0  
1.8  
6.2  
5.2  
1.0  
1.8  
8.0  
6.5  
[2]  
VCC = 3.0 V to 3.6 V  
3.7  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
8 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
Table 7.  
Dynamic characteristics …continued  
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 9.  
Symbol Parameter  
Conditions  
40 °C to +85 °C  
40 °C to +125 °C Unit  
Min  
Typ  
Max  
Min  
Max  
[3]  
CPD  
power  
dissipation  
capacitance  
per buffer; VI = GND to VCC; VCC = 3.3 V  
outputs enabled  
-
-
12  
-
-
-
-
-
-
pF  
pF  
outputs disabled  
4.0  
[1] tpd is the same as tPLH and tPHL  
ten is the same as tPZL and tPZH  
tdis is the same as tPLZ and tPHZ  
.
.
.
[2] Typical values are measured at Tamb = 25 °C and VCC = 3.3 V.  
[3] CPD is used to determine the dynamic power dissipation (PD in μW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz; fo = output frequency in MHz  
CL = output load capacitance in pF  
VCC = supply voltage in Volts  
N = number of inputs switching  
Σ(CL × VCC2 × fo) = sum of the outputs.  
11. Waveforms  
V
I
nAn input  
GND  
V
V
M
M
t
t
PLH  
PHL  
V
OH  
V
V
M
nYn output  
M
V
OL  
mna171  
Measurement points are given in Table 8.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 7. The input (nAn) to output (nYn) propagation delays  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
9 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
V
I
nOE input  
GND  
V
M
t
t
PZL  
PLZ  
V
CC  
output  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
X
V
OL  
t
t
PHZ  
PZH  
V
OH  
V
Y
output  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
outputs  
enabled  
outputs  
enabled  
outputs  
disabled  
mna362  
Measurement points are given in Table 8.  
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 8. 3-state enable and disable times.  
Table 8.  
Measurement points  
Supply voltage  
VCC  
Input  
VI  
Output  
VM  
VM  
VX  
VY  
1.2 V  
VCC  
0.5 × VCC  
1.5 V  
1.5 V  
0.5 × VCC  
1.5 V  
VOL + 0.1 V  
VOL + 0.3 V  
VOL + 0.3 V  
VOH 0.1 V  
VOH 0.3 V  
VOH 0.3 V  
2.7 V  
2.7 V  
2.7 V  
3.0 V to 3.6 V  
1.5 V  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
10 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
t
W
V
I
90 %  
negative  
pulse  
V
M
V
M
10 %  
0 V  
t
f
t
r
t
r
t
f
V
I
90 %  
positive  
pulse  
V
M
V
M
10 %  
0 V  
t
W
V
EXT  
R
V
CC  
L
V
V
O
I
G
DUT  
R
C
R
L
T
L
001aae331  
Test data is given in Table 9.  
Definitions for test circuit:  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
VEXT = External voltage for measuring switching times.  
Fig 9. Load circuit for measuring switching times  
Table 9.  
Test data  
Supply voltage  
Input  
VI  
Load  
CL  
VEXT  
tr, tf  
RL  
tPLH, tPHL  
open  
tPLZ, tPZL  
2 × VCC  
2 × VCC  
2 × VCC  
tPHZ, tPZH  
GND  
1.2 V  
VCC  
2.5 ns  
2.5 ns  
2.5 ns  
50 pF  
50 pF  
50 pF  
500 Ω[1]  
500 Ω  
500 Ω  
2.7 V  
2.7 V  
2.7 V  
open  
GND  
3.0 V to 3.6 V  
open  
GND  
[1] The circuit performs better when RL = 1 kΩ.  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
11 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
12. Package outline  
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm  
SOT370-1  
D
E
A
X
c
y
H
v
M
A
E
Z
25  
48  
Q
p
A
2
A
A
(A )  
3
1
θ
pin 1 index  
L
L
24  
1
detail X  
w
M
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
E
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
max.  
8o  
0o  
0.4  
0.2  
2.35  
2.20  
0.3  
0.2  
0.22 16.00  
0.13 15.75  
7.6  
7.4  
10.4  
10.1  
1.0  
0.6  
1.2  
1.0  
0.85  
0.40  
mm  
2.8  
0.25  
0.635  
1.4  
0.25  
0.18  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT370-1  
MO-118  
Fig 10. Package outline SOT370-1 (SSOP48)  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
12 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm  
SOT362-1  
E
D
A
X
c
H
v
M
A
y
E
Z
48  
25  
Q
A
2
(A )  
3
A
A
1
pin 1 index  
θ
L
p
L
detail X  
1
24  
w
M
b
e
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions).  
A
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
8o  
0o  
0.15  
0.05  
1.05  
0.85  
0.28  
0.17  
0.2  
0.1  
12.6  
12.4  
6.2  
6.0  
8.3  
7.9  
0.8  
0.4  
0.50  
0.35  
0.8  
0.4  
mm  
1.2  
0.5  
1
0.25  
0.25  
0.08  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT362-1  
MO-153  
Fig 11. Package outline SOT362-1 (TSSOP48)  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
13 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm  
SOT702-1  
B
A
D
ball A1  
index area  
A
2
A
E
A
1
detail X  
e
1
C
v M  
w M  
C
C
A B  
b
e
y
y
C
1
1/2 e  
K
J
H
G
F
e
e
2
E
D
C
B
A
1/2 e  
X
ball A1  
index area  
1
2
3
4
5
6
DIMENSIONS (mm are the original dimensions)  
A
A
A
b
e
y
UNIT  
D
E
e
e
v
w
y
1
1
2
0
2.5  
5 mm  
1
2
max.  
0.3  
0.2  
0.7  
0.6  
0.45  
0.35  
4.6  
4.4  
7.1  
6.9  
scale  
mm  
1
3.25 5.85  
0.08  
0.1  
0.65  
0.15 0.08  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
02-08-08  
03-07-01  
SOT702-1  
MO-225  
Fig 12. Package outline SOT702-1 (VFBGA56)  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
14 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads;  
60 terminals; UTLP based; body 4 x 6 x 0.5 mm  
SOT1134-1  
D
B
A
terminal 1  
index area  
E
A
A
1
detail X  
e
2
e
1
1/2 e  
b
C
e
v
w
C A  
C
B
v
w
C A  
C
B
y
1
y
C
L
1
D2  
D6  
A11  
A16  
D3  
B8 B10  
D7  
A10  
B7  
A17  
e
L
e
R
B11  
E
h
e
3
e
4
1/2 e  
B1  
A1  
B17  
A26  
terminal 1  
index area  
D5  
D1  
B20 B18  
D8  
X
A32  
A27  
D4  
D
h
k
0
2.5  
scale  
5 mm  
eR  
Dimensions  
Unit  
A
A
1
b
D
D
h
E
E
h
e
e
1
e
2
e
3
e
4
k
L
L
1
v
w
y
y
1
max 0.50 0.05 0.35 4.1 1.90 6.1 3.90  
0.25 0.35 0.125  
mm nom 0.48 0.02 0.30 4.0 1.85 6.0 3.85 0.5  
min 0.46 0.00 0.25 3.9 1.80 5.9 3.80  
1
2.5  
3
4.5 0.5 0.20 0.30 0.075 0.07 0.05 0.08 0.1  
0.15 0.25 0.025  
sot1134-1_po  
References  
Outline  
version  
European  
projection  
Issue date  
IEC  
- - -  
JEDEC  
- - -  
JEITA  
- - -  
08-12-17  
09-01-22  
SOT1134-1  
Fig 13. Package outline SOT1134-1 (HXQFN60U)  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
15 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
13. Abbreviations  
Table 10. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
Machine Model  
HBM  
MM  
TTL  
Transistor-Transistor Logic  
14. Revision history  
Table 11. Revision history  
Document ID  
Release date  
20100318  
Data sheet status  
Change notice  
Supersedes  
74LVC_LVCH16244A_9  
Modifications:  
Product data sheet  
-
74LVC_LVCH16244A_8  
74LVC16244ABQ and 74LVCH16244ABQ changed from HUQFN60U (SOT1025-1) to  
HXQFN60U (SOT1134-1) package.  
74LVC_LVCH16244A_8  
74LVC_LVCH16244A_7  
74LVC_LVCH16244A_6  
74LVC_LVCH16244A_5  
74LVC_H16244A_4  
20081117  
20031208  
20030130  
20021030  
19971028  
Product data sheet  
Product specification  
Product specification  
Product specification  
Product specification  
-
-
-
-
-
74LVC_LVCH16244A_7  
74LVC_LVCH16244A_6  
74LVC_LVCH16244A_5  
74LVC_H16244A_4  
74LVC16244A_  
74LVCH16244A_3  
74LVC16244A_  
19971028  
Product specification  
-
74LVC16244A_2  
74LVCH16244A_3  
74LVC16244A_2  
74LVC16244A_1  
19970630  
-
Product specification  
-
-
-
74LVC16244A_1  
-
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
16 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
15. Legal information  
15.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
suitable for use in medical, military, aircraft, space or life support equipment,  
15.2 Definitions  
nor in applications where failure or malfunction of an NXP Semiconductors  
product can reasonably be expected to result in personal injury, death or  
severe property or environmental damage. NXP Semiconductors accepts no  
liability for inclusion and/or use of NXP Semiconductors products in such  
equipment or applications and therefore such inclusion and/or use is at the  
customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on a weakness or default in the  
customer application/use or the application/use of customer’s third party  
customer(s) (hereinafter both referred to as “Application”). It is customer’s  
sole responsibility to check whether the NXP Semiconductors product is  
suitable and fit for the Application planned. Customer has to do all necessary  
testing for the Application in order to avoid a default of the Application and the  
product. NXP Semiconductors does not accept any liability in this respect.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
15.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
15.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use in automotive applications — This NXP  
Semiconductors product has been qualified for use in automotive  
applications. The product is not designed, authorized or warranted to be  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
17 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
16. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74LVC_LVCH16244A_9  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2010. All rights reserved.  
Product data sheet  
Rev. 09 — 18 March 2010  
18 of 19  
74LVC16244A; 74LVCH16244A  
NXP Semiconductors  
16-bit buffer/line driver; 5 V input/output tolerant; 3-state  
17. Contents  
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
5
5.1  
5.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5  
6
Functional description . . . . . . . . . . . . . . . . . . . 5  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Recommended operating conditions. . . . . . . . 6  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 16  
7
8
9
10  
11  
12  
13  
14  
15  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 17  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
15.1  
15.2  
15.3  
15.4  
16  
17  
Contact information. . . . . . . . . . . . . . . . . . . . . 18  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2010.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 18 March 2010  
Document identifier: 74LVC_LVCH16244A_9  

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TI

74LVC16244ADGV

16-bit buffer/line driver; 5 V input/output tolerant; 3-stateProduction
NEXPERIA

74LVC16244ADGV-Q100

16-bit buffer/line driver; 5 V input/output tolerant; 3-state
NEXPERIA

74LVC16244ADGVRE4

16-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS
TI