74LVC1G157GV [NXP]

Single 2-input multiplexer; 单路2输入多路复用器
74LVC1G157GV
型号: 74LVC1G157GV
厂家: NXP    NXP
描述:

Single 2-input multiplexer
单路2输入多路复用器

解复用器 逻辑集成电路 光电二极管 PC
文件: 总15页 (文件大小:80K)
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74LVC1G157  
Single 2-input multiplexer  
Rev. 03 — 12 July 2007  
Product data sheet  
1. General description  
The 74LVC1G157 is a single 2-input multiplexer which select data from two data inputs (I0  
and I1) under control of a common data select input (S). The state of the common data  
select input determines the particular register from which the data comes. The output (Y)  
presents the selected data in the true (non-inverted) form.  
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these  
devices as translators in mixed 3.3 V and 5 V applications.  
This device is fully specified for partial power-down applications using IOFF  
.
The IOFF circuitry disables the output, preventing the damaging backflow current through  
the device when it is powered down.  
Schmitt-trigger action at all inputs makes the circuit highly tolerant to slower input rise and  
fall times.  
2. Features  
Wide supply voltage range from 1.65 V to 5.5 V  
High noise immunity  
Complies with JEDEC standard:  
JESD8-7 (1.65 V to 1.95 V)  
JESD8-5 (2.3 V to 2.7 V)  
JESD8B/JESD36 (2.7 V to 3.6 V)  
±24 mA output drive (VCC = 3.0 V)  
CMOS low power consumption  
Latch-up performance exceeds 250 mA  
Direct interface with TTL levels  
Inputs accept voltages up to 5 V  
ESD protection:  
HBM JESD22-A114E exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
Multiple package options  
Specified from 40 °C to +85 °C and 40 °C to +125 °C  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature  
range  
Name  
Description  
Version  
74LVC1G157GW 40 °C to +125 °C SC-88  
74LVC1G157GV 40 °C to +125 °C SC-74  
74LVC1G157GM 40 °C to +125 °C XSON6  
plastic surface-mounted package; 6 leads  
SOT363  
SOT457  
plastic surface-mounted package (TSOP6); 6 leads  
plastic extremely thin small outline package; no leads; SOT886  
6 terminals; body 1 × 1.45 × 0.5 mm  
74LVC1G157GF  
40 °C to +125 °C XSON6  
plastic extremely thin small outline package; no leads; SOT891  
6 terminals; body 1 × 1 × 0.5 mm  
4. Marking  
Table 2.  
Marking  
Type number  
Marking code  
74LVC1G157GW  
74LVC1G157GV  
74LVC1G157GM  
74LVC1G157GF  
YP  
YP  
YP  
YP  
5. Functional diagram  
1
3
6
G1  
I1 I0  
6
S
3
1
1
1
MUX  
Y
4
4
001aac653  
001aac652  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
1
3
I1  
I0  
4
MULTIPLEXER  
Y
SELECTOR  
OUTPUT S  
6
001aac655  
S
Fig 3. Functional diagram  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
2 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
S
I1  
I0  
Y
001aac654  
Fig 4. Logic diagram  
6. Pinning information  
6.1 Pinning  
74LVC1G157  
74LVC1G157  
I1  
GND  
I0  
1
2
3
6
5
4
S
V
Y
74LVC1G157  
1
2
3
6
5
4
I1  
GND  
I0  
S
V
Y
I1  
GND  
I0  
1
2
3
6
5
4
S
V
Y
CC  
CC  
CC  
001aac657  
001aaf545  
001aac656  
Transparent top view  
Transparent top view  
Fig 5. Pin configuration SOT363  
(SC-88) and SOT457 (SC-74)  
Fig 6. Pin configuration SOT886  
(XSON6)  
Fig 7. Pin configuration SOT891  
(XSON6)  
6.2 Pin description  
Table 3.  
Pin description  
Pin  
Symbol  
Description  
I1  
1
2
3
4
5
6
data input from source 1  
ground (0 V)  
GND  
I0  
data input from source 0  
multiplexer output  
supply voltage  
Y
VCC  
S
common data select input  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
3 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
7. Functional description  
Table 4.  
Function table[1]  
Inputs  
Output  
S
L
I1  
X
X
L
I0  
L
Y
L
L
H
X
X
H
L
H
H
H
H
[1] H = HIGH voltage level;  
L = LOW voltage level;  
X = don’t care.  
8. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
0.5  
50  
0.5  
-
Max  
+6.5  
-
Unit  
V
supply voltage  
input clamping current  
input voltage  
VI < 0 V  
mA  
V
[1]  
VI  
+6.5  
±50  
VCC + 0.5  
+6.5  
±50  
100  
-
IOK  
output clamping current  
output voltage  
VO > VCC or VO < 0 V  
Active mode  
mA  
V
[1][2]  
[1][2]  
VO  
0.5  
0.5  
-
Power-down mode  
VO = 0 V to VCC  
V
IO  
output current  
mA  
mA  
mA  
mW  
°C  
ICC  
IGND  
Ptot  
Tstg  
supply current  
-
ground current  
100  
-
[3]  
total power dissipation  
storage temperature  
Tamb = 40 °C to +125 °C  
250  
+150  
65  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.  
[3] For SC-88 and SC-74 packages: above 87.5 °C the value of Ptot derates linearly with 4.0 mW/K.  
For XSON6 packages: above 45 °C the value of Ptot derates linearly with 2.4 mW/K.  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
4 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
9. Recommended operating conditions  
Table 6.  
Recommended operating conditions  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
5.5  
Unit  
V
VCC  
VI  
supply voltage  
input voltage  
output voltage  
1.65  
-
-
-
-
-
-
-
0
5.5  
V
VO  
Active mode  
-
VCC  
5.5  
V
VCC = 0 V; Power-down mode  
-
V
Tamb  
ambient temperature  
40  
+125  
20  
°C  
ns/V  
ns/V  
t/V  
input transition rise and fall rate VCC = 1.65 V to 2.7 V  
VCC = 2.7 V to 5.5 V  
-
-
10  
10. Static characteristics  
Table 7.  
Static characteristics  
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
40 °C to +85 °C  
40 °C to +125 °C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
VIH  
HIGH-level  
input voltage  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
VI = VIH or VIL  
0.65VCC  
-
-
-
-
-
-
-
-
-
0.65VCC  
-
V
V
V
V
V
V
V
V
1.7  
-
1.7  
-
2.0  
-
-
2.0  
-
-
0.7VCC  
0.7VCC  
VIL  
LOW-level  
input voltage  
-
-
-
-
0.35VCC  
0.7  
-
-
-
-
0.35VCC  
0.7  
0.8  
0.8  
0.3VCC  
0.3VCC  
VOH  
HIGH-level  
output voltage  
IO = 100 µA;  
VCC 0.1  
-
-
V
CC 0.1  
-
V
VCC = 1.65 V to 5.5 V  
IO = 4 mA; VCC = 1.65 V  
IO = 8 mA; VCC = 2.3 V  
IO = 12 mA; VCC = 2.7 V  
IO = 24 mA; VCC = 3.0 V  
IO = 32 mA; VCC = 4.5 V  
VI = VIH or VIL  
1.2  
1.9  
2.2  
2.3  
3.8  
1.54  
2.15  
2.50  
2.62  
4.11  
-
-
-
-
-
0.95  
1.7  
1.9  
2.0  
3.4  
-
-
-
-
-
V
V
V
V
V
VOL  
LOW-level  
output voltage  
IO = 100 µA;  
-
-
0.10  
-
0.10  
V
VCC = 1.65 V to 5.5 V  
IO = 4 mA; VCC = 1.65 V  
IO = 8 mA; VCC = 2.3 V  
IO = 12 mA; VCC = 2.7 V  
IO = 24 mA; VCC = 3.0 V  
IO = 32 mA; VCC = 4.5 V  
-
-
-
-
-
-
0.07  
0.12  
0.17  
0.33  
0.39  
±0.1  
0.45  
0.30  
0.40  
0.55  
0.55  
±5  
-
-
-
-
-
-
0.70  
0.45  
0.60  
0.80  
0.80  
±20  
V
V
V
V
V
II  
input leakage VI = 5.5 V or GND;  
current CC = 0 V to 5.5 V  
µA  
V
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
5 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
Table 7.  
Static characteristics …continued  
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
40 °C to +85 °C  
40 °C to +125 °C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
IOFF  
power-off  
leakage  
current  
VCC = 0 V; VI or VO = 5.5 V  
-
±0.1  
±10  
-
±20  
µA  
ICC  
ICC  
CI  
supply current VI = 5.5 V or GND; IO = 0 A;  
CC = 1.65 V to 5.5 V  
-
-
-
0.1  
5
10  
500  
-
-
-
-
40  
5000  
-
µA  
µA  
pF  
V
additional  
per pin; VCC = 2.3 V to 5.5 V;  
supply current VI = VCC 0.6 V; IO = 0 A  
input  
VCC = 3.3 V; VI = GND to VCC  
2.5  
capacitance  
[1] All typical values are measured at Tamb = 25 °C.  
11. Dynamic characteristics  
Table 8.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); for load circuit see Figure 9.  
Symbol Parameter Conditions 40 °C to +85 °C  
Min  
Typ[1] Max  
40 °C to +125 °C  
Unit  
Min  
Max  
[2]  
[2]  
[3]  
tpd  
propagation delay I0, I1 to Y; see Figure 8  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
1.5  
1.0  
1.0  
1.0  
0.5  
4.3  
2.9  
3.1  
2.7  
2.2  
11.0  
6.1  
5.6  
5.0  
4.0  
1.5  
1.0  
1.0  
1.0  
0.5  
13.0  
7.6  
7.0  
6.3  
5.0  
ns  
ns  
ns  
ns  
ns  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
S to Y; see Figure 8  
VCC = 1.65 V to 1.95 V  
VCC = 2.3 V to 2.7 V  
VCC = 2.7 V  
1.5  
1.0  
1.0  
1.0  
0.5  
-
4.3  
2.9  
3.3  
2.9  
2.3  
18  
11.0  
6.9  
5.9  
5.0  
4.0  
-
1.5  
1.0  
1.0  
1.0  
0.5  
-
13.0  
8.6  
7.4  
6.3  
5.0  
-
ns  
ns  
ns  
ns  
ns  
pF  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
CPD  
power dissipation VI = GND to VCC; VCC = 3.3 V  
capacitance  
[1] Typical values are measured at Tamb = 25 °C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.  
[2] tpd is the same as tPLH and tPHL  
.
[3] CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = number of inputs switching;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
6 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
12. Waveforms  
V
I
V
I0, I1, S input  
M
GND  
t
t
PLH  
PHL  
V
OH  
Y output  
V
M
V
OL  
001aac658  
Measurement points are given in Table 9.  
VOL and VOH are typical output voltage levels that occur with the output load.  
Fig 8. Data inputs (I0, I1) and common data select input (S) to output (Y) propagation delays  
Table 9. Measurement points  
Supply voltage  
VCC  
Input  
VM  
Output  
VM  
1.65 V to 1.95 V  
2.3 V to 2.7 V  
2.7 V  
0.5VCC  
0.5VCC  
1.5 V  
1.5 V  
0.5VCC  
0.5VCC  
0.5VCC  
1.5 V  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
1.5 V  
0.5VCC  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
7 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
V
EXT  
V
CC  
R
L
V
V
O
I
PULSE  
GENERATOR  
DUT  
R
T
C
L
R
L
mna616  
Test data is given in Table 10.  
Definitions for test circuit:  
RL = Load resistance.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance; should be equal to the output impedance Zo of the pulse generator.  
VEXT = External voltage for measuring switching times.  
Fig 9. Load circuit for switching times  
Table 10. Test data  
Supply voltage  
VCC  
Input  
VI  
Load  
CL  
VEXT  
tr = tf  
RL  
tPLH, tPHL  
open  
1.65 V to 1.95 V  
2.3 V to 2.7 V  
2.7 V  
VCC  
VCC  
2.7 V  
2.7 V  
VCC  
2.0 ns  
2.0 ns  
2.5 ns  
2.5 ns  
2.5 ns  
30 pF  
30 pF  
50 pF  
50 pF  
50 pF  
1 kΩ  
500 Ω  
500 Ω  
500 Ω  
500 Ω  
open  
open  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
open  
open  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
8 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
13. Package outline  
Plastic surface-mounted package; 6 leads  
SOT363  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B  
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
04-11-08  
06-03-16  
SOT363  
SC-88  
Fig 10. Package outline SOT363 (SC-88)  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
9 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
Plastic surface-mounted package (TSOP6); 6 leads  
SOT457  
D
B
E
A
X
y
H
v
M
A
E
6
5
4
Q
pin 1  
index  
A
A
1
c
1
2
3
L
p
e
b
p
w
M B  
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
b
c
D
E
e
H
L
Q
v
w
y
p
1
p
E
0.1  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
05-11-07  
06-03-16  
SOT457  
SC-74  
Fig 11. Package outline SOT457 (SC-74)  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
10 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm  
SOT886  
b
1
2
3
4×  
(2)  
L
L
1
e
6
5
4
e
1
e
1
6×  
(2)  
A
A
1
D
E
terminal 1  
index area  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
A
1
UNIT  
b
D
E
e
e
L
L
1
1
max max  
0.25  
0.17  
1.5  
1.4  
1.05  
0.95  
0.35 0.40  
0.27 0.32  
mm  
0.5 0.04  
0.6  
0.5  
Notes  
1. Including plating thickness.  
2. Can be visible in some manufacturing processes.  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
04-07-15  
04-07-22  
SOT886  
MO-252  
Fig 12. Package outline SOT886 (XSON6)  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
11 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm  
SOT891  
b
1
2
3
4×  
(1)  
L
L
1
e
6
5
4
e
1
e
1
6×  
(1)  
A
A
1
D
E
terminal 1  
index area  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
A
1
UNIT  
b
D
E
e
e
L
L
1
1
max max  
0.20 1.05 1.05  
0.12 0.95 0.95  
0.35 0.40  
0.27 0.32  
mm  
0.5 0.04  
0.55 0.35  
Note  
1. Can be visible in some manufacturing processes.  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
05-04-06  
07-05-15  
SOT891  
Fig 13. Package outline SOT891 (XSON6)  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
12 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
14. Abbreviations  
Table 11. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
HBM  
MM  
Machine Model  
TTL  
Transistor-Transistor Logic  
15. Revision history  
Table 12. Revision history  
Document ID  
74LVC1G157_3  
Modifications:  
Release date  
20070712  
Data sheet status  
Change notice  
Supersedes  
Product data sheet  
-
74LVC1G157_2  
Section 10 “Static characteristics”:  
Changed: Conditions for input leakage current and supply current.  
New package outline drawing for XSON6/SOT891.  
74LVC1G157_2  
74LVC1G157_1  
20061011  
Product data sheet  
-
74LVC1G157_1  
-
20050425  
Product data sheet  
-
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
13 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of a NXP Semiconductors product can reasonably be expected to  
16.2 Definitions  
result in personal injury, death or severe property or environmental damage.  
NXP Semiconductors accepts no liability for inclusion and/or use of NXP  
Semiconductors products in such equipment or applications and therefore  
such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
16.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
17. Contact information  
For additional information, please visit: http://www.nxp.com  
For sales office addresses, send an email to: salesaddresses@nxp.com  
74LVC1G157_3  
© NXP B.V. 2007. All rights reserved.  
Product data sheet  
Rev. 03 — 12 July 2007  
14 of 15  
74LVC1G157  
NXP Semiconductors  
Single 2-input multiplexer  
18. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
Functional description . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13  
8
9
10  
11  
12  
13  
14  
15  
16  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
16.1  
16.2  
16.3  
16.4  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2007.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 12 July 2007  
Document identifier: 74LVC1G157_3  

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