74LVC1G79 [NXP]

Single D-type flip-flop; positive-edge trigger; 单一的D- FL型IP- FL操作;正边沿触发
74LVC1G79
型号: 74LVC1G79
厂家: NXP    NXP
描述:

Single D-type flip-flop; positive-edge trigger
单一的D- FL型IP- FL操作;正边沿触发

文件: 总18页 (文件大小:95K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
74LVC1G79  
Single D-type flip-flop;  
positive-edge trigger  
Product specification  
2004 Sep 10  
Supersedes data of 2004 Mar 17  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
FEATURES  
DESCRIPTION  
Wide supply voltage range from 1.65 V to 5.5 V  
High noise immunity  
The 74LVC1G79 is a high-performance, low-power,  
low-voltage, Si-gate CMOS device, superior to most  
advanced CMOS compatible TTL families.  
Complies with JEDEC standard:  
– JESD8-7 (1.65 V to 1.95 V)  
Inputs can be driven from either 3.3 V or 5 V devices.  
This feature allows the use of this device in a mixed  
3.3 V and 5 V environment.  
– JESD8-5 (2.3 V to 2.7 V)  
– JESD8B/JESD36 (2.7 V to 3.6 V).  
• ±24 mA output drive (VCC = 3.0 V)  
ESD protection:  
This device is fully specified for partial Power-down  
applications using Ioff. The Ioff circuitry disables the output,  
preventing the damaging backflow current through the  
device when it is powered down.  
– HBM EIA/JESD22-A114-B exceeds 2000 V  
– MM EIA/JESD22-A115-A exceeds 200 V.  
CMOS low power consumption  
Latch-up performance exceeds 250 mA  
Direct interface with TTL levels  
Inputs accept voltages up to 5 V  
Multiple package options  
The 74LVC1G79 provides a single positive-edge triggered  
D-type flip-flop.  
Information on the data input is transferred to the Q output  
on the LOW-to-HIGH transition of the clock pulse.  
The D input must be stable one set-up time prior to the  
LOW-to-HIGH clock transition for predictable operation.  
Specified from 40 °C to +85 °C and  
40 °C to +125 °C.  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf 2.5 ns.  
SYMBOL  
PHL/tPLH  
PARAMETER  
CONDITIONS  
TYPICAL  
UNIT  
t
propagation delay CP to Q  
VCC = 1.8 V; CL = 30 pF; RL = 1 kΩ  
VCC = 2.5 V; CL = 30 pF; RL = 500 Ω  
VCC = 2.7 V; CL = 50 pF; RL = 500 Ω  
3.6  
2.3  
2.6  
2.2  
1.7  
450  
5
ns  
ns  
ns  
ns  
ns  
V
CC = 3.3 V; CL = 50 pF; RL = 500 Ω  
VCC = 5.0 V; CL = 50 pF; RL = 500 Ω  
VCC = 3.3 V; CL = 50 pF; RL = 500 Ω  
fmax  
CI  
maximum frequency  
input capacitance  
MHz  
pF  
CPD  
power dissipation capacitance  
per buffer  
VCC = 3.3 V; notes 1 and 2  
17  
pF  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = total load switching outputs;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
2. The condition is VI = GND to VCC.  
2004 Sep 10  
2
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
FUNCTION TABLE  
See note 1.  
INPUT  
OUTPUT  
CP  
D
Q
L
L
H
X
L
H
q
Note  
1. H = HIGH voltage level;  
L = LOW voltage level;  
= LOW-to-HIGH CP transition;  
X = don’t care;  
q = lower case letter indicates the state of referenced input, one set-up time prior to the LOW-to-HIGH CP transition.  
ORDERING INFORMATION  
PACKAGE  
PACKAGE MATERIAL  
TYPE NUMBER  
TEMPERATURE  
PINS  
CODE  
MARKING  
RANGE  
74LVC1G79GW  
74LVC1G79GV  
74LVC1G79GM  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
5
5
6
SC-88A  
SC-74A  
XSON6  
plastic  
plastic  
plastic  
SOT353  
SOT753  
SOT886  
VP  
V79  
VP  
PINNING  
PIN SC-88A; SC-74A  
PIN XSON6  
SYMBOL  
DESCRIPTION  
1
2
3
4
-
1
2
3
4
5
6
D
data input D  
CP  
clock pulse input CP  
ground (0 V)  
GND  
Q
data output Q  
not connected  
supply voltage  
n.c.  
VCC  
5
2004 Sep 10  
3
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
79  
D
CP  
1
2
3
6
5
4
V
CC  
1
2
3
5
4
D
CP  
V
CC  
79  
n.c.  
Q
GND  
Q
GND  
001aab660  
001aab661  
Transparent top view  
Fig.1 Pin configuration TSSOP5 and VSSOP5.  
Fig.2 Pin configuration XSON6.  
handbook, halfpage  
1
2
4
1
2
D
Q
4
D
CP  
mna441  
CP  
MNA440  
Fig.3 Logic symbol.  
Fig.4 IEE/IEC logic symbol.  
2004 Sep 10  
4
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
CP  
C
C
C
C
D
TG  
C
TG  
C
Q
C
C
TG  
C
TG  
C
MNA442  
Fig.5 Logic diagram.  
2004 Sep 10  
5
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
1.65  
MAX.  
5.5  
UNIT  
VCC  
VI  
V
input voltage  
0
5.5  
VCC  
5.5  
+125  
20  
V
VO  
output voltage  
active mode  
0
V
VCC = 0 V; Power-down mode  
0
V
Tamb  
tr, tf  
operating ambient temperature  
input rise and fall times  
40  
0
°C  
VCC = 1.65 V to 2.7 V  
VCC = 2.7 V to 5.5 V  
ns/V  
ns/V  
0
10  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V).  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
0.5  
MAX.  
+6.5  
UNIT  
VCC  
IIK  
V
input diode current  
input voltage  
VI < 0 V  
note 1  
50  
mA  
V
VI  
0.5  
+6.5  
±50  
IOK  
VO  
output diode current  
output voltage  
VO > VCC or VO < 0 V  
active mode; note 1  
Power-down mode; note 1  
VO = 0 V to VCC  
mA  
V
0.5  
0.5  
VCC + 0.5  
+6.5  
±50  
V
IO  
output source or sink current  
VCC or GND current  
storage temperature  
power dissipation  
mA  
mA  
°C  
mW  
ICC, IGND  
Tstg  
±100  
+150  
250  
65  
Ptot  
Tamb = 40 °C to +125 °C  
Note  
1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2004 Sep 10  
6
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
DC CHARACTERISTICS  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 40 °C to +85 °C; note 1  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
1.65 to 1.95 0.65 × VCC  
V
V
V
V
V
V
V
V
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.7  
2.0  
0.7 × VCC  
VIL  
0.35 × VCC  
0.7  
0.8  
0.3 × VCC  
VOL  
LOW-level output  
voltage  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
1.65 to 5.5  
1.65  
2.3  
0.1  
V
V
V
V
V
V
0.45  
0.3  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
2.7  
0.4  
3.0  
0.55  
0.55  
4.5  
VOH  
HIGH-level output  
voltage  
1.65 to 5.5  
1.65  
2.3  
V
CC 0.1  
V
1.2  
1.9  
2.2  
2.3  
3.8  
V
V
2.7  
V
3.0  
V
4.5  
V
ILI  
input leakage current  
VI = 5.5 V or GND 5.5  
VI or VO = 5.5 V  
±0.1  
±0.1  
±5  
±10  
µA  
µA  
Ioff  
power OFF leakage  
current  
0
ICC  
quiescent supply current VI = VCC or GND; 5.5  
IO = 0 A  
0.1  
5
10  
µA  
µA  
ICC  
additional quiescent  
VI = VCC 0.6 V;  
2.3 to 5.5  
500  
supply current per input IO = 0 A  
pin  
2004 Sep 10  
7
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 40 °C to +125 °C  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
1.65 to 1.95 0.65 × VCC  
V
V
V
V
V
V
V
V
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.7  
2.0  
0.7 × VCC  
VIL  
0.35 × VCC  
0.7  
0.8  
0.3 × VCC  
VOL  
LOW-level output  
voltage  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
1.65 to 5.5  
1.65  
2.3  
0.1  
V
V
V
V
V
V
0.70  
0.45  
0.60  
0.80  
0.80  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
VI = VIH or VIL  
IO = 100 µA  
IO = 4 mA  
IO = 8 mA  
IO = 12 mA  
IO = 24 mA  
IO = 32 mA  
2.7  
3.0  
4.5  
VOH  
HIGH-level output  
voltage  
1.65 to 5.5  
1.65  
2.3  
V
CC 0.1  
V
0.95  
1.7  
1.9  
2.0  
3.4  
V
V
2.7  
V
3.0  
V
4.5  
V
ILI  
input leakage current  
VI = 5.5 V or GND 5.5  
VI or VO = 5.5 V  
±100  
±200  
µA  
µA  
Ioff  
power OFF leakage  
current  
0
ICC  
quiescent supply current VI = VCC or GND; 5.5  
IO = 0 A  
200  
µA  
µA  
ICC  
additional quiescent  
VI = VCC 0.6 V;  
2.3 to 5.5  
5000  
supply current per input IO = 0 A  
pin  
Note  
1. All typical values are measured at VCC = 3.3 V and Tamb = 25 °C.  
2004 Sep 10  
8
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
AC CHARACTERISTICS  
GND = 0 V.  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
WAVEFORMS  
VCC (V)  
Tamb = 40 °C to +85 °C; note 1  
tPHL/tPLH propagation delay  
CP to Q  
see Figs 6 and 8 1.65 to 1.95 1.0  
3.6  
2.3  
2.6  
2.2  
1.7  
1.4  
0.9  
0.9  
0.6  
0.6  
9.9  
ns  
2.3 to 2.7  
2.7  
0.5  
0.5  
0.5  
0.5  
7.0  
6.0  
5.0  
3.8  
ns  
ns  
3.0 to 3.6  
4.5 to 5.5  
ns  
ns  
tsu  
set-up time D to CP  
hold time D to CP  
see Figs 7 and 8 1.65 to 1.95 2.5  
ns  
2.3 to 2.7  
1.7  
1.7  
1.3  
1.2  
0
ns  
2.7  
ns  
3.0 to 3.6  
ns  
4.5 to 5.5  
ns  
th  
see Figs 7 and 8 1.65 to 1.95  
0.7  
0.4  
0.3  
0.3  
0.2  
1.1  
ns  
2.3 to 2.7  
2.7  
0
ns  
+0.5  
+0.5  
+0.5  
ns  
3.0 to 3.6  
4.5 to 5.5  
ns  
ns  
tW  
clock pulse width HIGH  
or LOW  
see Figs 7 and 8 1.65 to 1.95 3.0  
ns  
2.3 to 2.7  
2.7  
2.5  
2.5  
2.5  
2.0  
0.7  
ns  
0.6  
ns  
3.0 to 3.6  
4.5 to 5.5  
0.6  
ns  
0.5  
ns  
fmax  
maximum clock pulse  
frequency  
see Figs 7 and 8 1.65 to 1.95 160  
250  
300  
350  
450  
500  
MHz  
MHz  
MHz  
MHz  
MHz  
2.3 to 2.7  
2.7  
160  
160  
160  
200  
3.0 to 3.6  
4.5 to 5.5  
2004 Sep 10  
9
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
WAVEFORMS  
VCC (V)  
Tamb = 40 °C to +125 °C  
tPHL/tPLH propagation delay  
CP to Q  
see Figs 6 and 8 1.65 to 1.95 1.0  
12.5  
ns  
2.3 to 2.7  
2.7  
0.5  
0.5  
0.5  
0.5  
9.0  
8.0  
6.5  
5.0  
ns  
ns  
3.0 to 3.6  
4.5 to 5.5  
ns  
ns  
tsu  
set-up time D to CP  
hold time D to CP  
see Figs 7 and 8 1.65 to 1.95 2.5  
ns  
2.3 to 2.7  
1.7  
1.7  
1.2  
1.2  
0
ns  
2.7  
ns  
3.0 to 3.6  
ns  
4.5 to 5.5  
ns  
th  
see Figs 7 and 8 1.65 to 1.95  
ns  
2.3 to 2.7  
2.7  
0
ns  
0.5  
0.5  
0.5  
ns  
3.0 to 3.6  
4.5 to 5.5  
ns  
ns  
tW  
clock pulse width  
HIGH or LOW  
see Figs 7 and 8 1.65 to 1.95 3.0  
ns  
2.3 to 2.7  
2.7  
2.5  
2.5  
2.5  
2.0  
ns  
ns  
3.0 to 3.6  
4.5 to 5.5  
ns  
ns  
fmax  
maximum clock pulse  
frequency  
see Figs 7 and 8 1.65 to 1.95 160  
MHz  
MHz  
MHz  
MHz  
MHz  
2.3 to 2.7  
2.7  
160  
160  
160  
200  
3.0 to 3.6  
4.5 to 5.5  
Note  
1. All typical values are measured at Tamb = 25 °C.  
2004 Sep 10  
10  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
AC WAVEFORMS  
V
I
D input  
GND  
V
I
CP input  
V
V
M
M
GND  
t
t
PLH  
PHL  
V
OH  
V
V
M
Q output  
M
V
MNA443  
OL  
INPUT  
VCC  
VM  
VI  
tr = tf  
2.0 ns  
1.65 V to 1.95 V 0.5 × VCC  
VCC  
2.3 V to 2.7 V  
2.7 V  
0.5 × VCC  
1.5 V  
VCC  
2.0 ns  
2.5 ns  
2.5 ns  
2.5 ns  
2.7 V  
2.7 V  
VCC  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
1.5 V  
0.5 × VCC  
VOL and VOH are typical output voltage drop that occur with the output load.  
Fig.6 Clock (CP) to output (Q) propagation delay times.  
2004 Sep 10  
11  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
V
I
V
D input  
M
GND  
t
t
h
h
t
t
su  
su  
1/f  
max  
V
I
CP input  
V
M
GND  
t
W
t
t
PLH  
PHL  
V
OH  
V
Q output  
M
V
MNA647  
OL  
INPUT  
VCC  
VM  
VI  
tr = tf  
2.0 ns  
1.65 V to 1.95 V 0.5 × VCC  
VCC  
2.3 V to 2.7 V  
2.7 V  
0.5 × VCC  
1.5 V  
VCC  
2.0 ns  
2.5 ns  
2.5 ns  
2.5 ns  
2.7 V  
2.7 V  
VCC  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
1.5 V  
0.5 × VCC  
The shaded areas indicate when the input is permitted to change for predictable output performance.  
VOL and VOH are typical output voltage drop that occur with the output load.  
Fig.7 Clock (CP) to output (Q) propagation delays, clock pulse width, D to CP set-up times, the CP to D hold  
times and maximum clock pulse frequency.  
2004 Sep 10  
12  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
V
EXT  
V
CC  
R
L
V
I
V
O
PULSE  
GENERATOR  
D.U.T.  
C
L
R
L
R
T
mna616  
VEXT  
VCC  
VI  
CL  
RL  
tPLH/tPHL  
tPZH/tPHZ  
tPZL/tPLZ  
1.65 V to 1.95 V VCC  
30 pF  
30 pF  
50 pF  
50 pF  
50 pF  
1 kΩ  
open  
open  
open  
open  
open  
GND  
GND  
GND  
GND  
GND  
2 × VCC  
2 × VCC  
6 V  
2.3 V to 2.7 V  
2.7 V  
VCC  
500 Ω  
500 Ω  
500 Ω  
500 Ω  
2.7 V  
2.7 V  
VCC  
3.0 V to 3.6 V  
4.5 V to 5.5 V  
6 V  
2 × VCC  
Definitions for test circuit:  
RL = Load resistor.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig.8 Load circuitry for switching times.  
2004 Sep 10  
13  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
PACKAGE OUTLINES  
Plastic surface mounted package; 5 leads  
SOT353  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
1
2
3
c
e
1
b
p
L
p
w
M B  
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
(2)  
UNIT  
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max  
0.30  
0.20  
1.1  
0.8  
0.25  
0.10  
2.2  
1.8  
1.35  
1.15  
2.2  
2.0  
0.45  
0.15  
0.25  
0.15  
mm  
0.1  
1.3  
0.65  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
SC-88A  
97-02-28  
SOT353  
2004 Sep 10  
14  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
Plastic surface mounted package; 5 leads  
SOT753  
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
c
L
p
1
2
3
detail X  
e
b
p
w
M B  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
UNIT  
A
A
1
b
c
D
E
e
H
L
Q
v
w
y
p
p
E
0.100  
0.013  
0.40  
0.25  
1.1  
0.9  
0.26  
0.10  
3.1  
2.7  
1.7  
1.3  
3.0  
2.5  
0.6  
0.2  
0.33  
0.23  
mm  
0.95  
0.2  
0.2  
0.1  
REFERENCES  
JEDEC JEITA  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
SOT753  
SC-74A  
02-04-16  
2004 Sep 10  
15  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm  
SOT886  
b
1
2
3
4×  
(2)  
L
L
1
e
6
5
4
e
1
e
1
6×  
(2)  
A
A
1
D
E
terminal 1  
index area  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
A
1
UNIT  
b
D
E
e
e
L
L
1
1
max max  
0.25  
0.17  
1.5  
1.4  
1.05  
0.95  
0.35 0.40  
0.27 0.32  
mm  
0.5 0.04  
0.6  
0.5  
Notes  
1. Including plating thickness.  
2. Can be visible in some manufacturing processes.  
REFERENCES  
JEDEC JEITA  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
04-07-15  
04-07-22  
SOT886  
MO-252  
2004 Sep 10  
16  
Philips Semiconductors  
Product specification  
Single D-type flip-flop; positive-edge trigger  
74LVC1G79  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2004 Sep 10  
17  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2004  
SCA76  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
R20/05/pp18  
Date of release: 2004 Sep 10  
Document order number: 9397 750 13766  

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