74LVC244ABQ-Q100X [NXP]
74LVC(H)244A-Q100 - Octal buffer/line driver; 3-state QFN 20-Pin;
| 型号： | 74LVC244ABQ-Q100X |
| 厂家： | 
NXP |
| 描述： | 74LVC(H)244A-Q100 - Octal buffer/line driver; 3-state QFN 20-Pin 驱动 逻辑集成电路 |
| 文件： | 总18页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74LVC244A-Q100;
74LVCH244A-Q100
Quad buffer/line driver; 3-state
Rev. 2 — 13 August 2013
Product data sheet
1. General description
The 74LVC244A-Q100; 74LVCH244A-Q100 is an octal non-inverting buffer/line driver
with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE
and 2OE. A HIGH on nOE causes the outputs to assume a high-impedance OFF-state.
Schmitt-trigger action at all inputs makes the circuit highly tolerant for slower input rise
and fall times.
Inputs can be driven from either 3.3 V or 5.0 V devices. In 3-state operation, outputs can
handle 5 V. These features allow the use of these devices as translators in a mixed
3.3 V and 5 V environment.
The 74LVCH244A-Q100 bus hold on data inputs eliminates the need for external pull-up
resistors to hold unused inputs.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
5 V tolerant inputs/outputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low-power consumption
Direct interface with TTL levels
Inputs accept voltages up to 5.5 V
High-impedance when VCC = 0 V
Bus hold on all data inputs (74LVCH244A-Q100 only)
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
Multiple package options
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC244AD-Q100
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74LVCH244AD-Q100
74LVC244ADB-Q100
74LVCH244ADB-Q100
74LVC244APW-Q100
74LVCH244APW-Q100
74LVC244ABQ-Q100
74LVCH244ABQ-Q100
SSOP20
TSSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
SOT360-1
plastic thin shrink small outline package; 20
leads; body width 4.4 mm
DHVQFN20 plastic dual in-line compatible thermal enhanced SOT764-1
very thin quad flat package; no leads;
20 terminals; body 2.5 4.5 0.85 mm
4. Functional diagram
2
4
6
17
15
13
18
16
14
12
3
5
7
9
1A0
1A1
1A2
1Y0
1Y1
1Y2
1Y3
2A0
2A1
2A2
2Y0
2Y1
2Y2
2Y3
8
1
11
19
1A3
2A3
1OE
2OE
mna874
Fig 1. Logic symbol
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
2 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
1Y0
1Y1
1Y2
1Y3
1A0
1A1
1A2
2
4
6
18
16
14
12
1A3
1
8
1
EN
1OE
18
2
16
14
12
4
6
8
2Y0
2Y1
2Y2
2Y3
2A0
2A1
2A2
17
15
13
3
5
7
9
19
EN
9
11
2A3
7
5
3
11
19
13
15
17
2OE
mna873
mna875
Fig 2. IEC logic diagram
Fig 3. Functional diagram
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
3 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
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(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4. Pin configuration for SO20 and (T)SSOP20
Fig 5. Pin configuration for DHVQFN20
5.2 Pin description
Table 2.
Symbol
1OE, 2OE
Pin description
Pin
Description
1, 19
output enable input (active low)
data input
1A0, 1A1, 1A2, 1A3
2Y0, 2Y1, 2Y2, 2Y3
GND
2, 4, 6, 8
3, 5, 7, 9
10
data output
ground (0 V)
2A0, 2A1, 2A2, 2A3
17, 15, 13, 11 data input
1Y0, 1Y1, 1Y2, 1Y3, 18, 16, 14, 12 data output
VCC
20
supply voltage
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
4 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
6. Functional description
Table 3.
Function table [1]
Control
Input
Output
nOE
L
nAn
L
nYn
L
L
H
H
H
X
Z
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
0.5
50
0.5
-
Max
+6.5
-
Unit
V
supply voltage
input clamping current
input voltage
VI < 0 V
mA
V
[1]
VI
+6.5
50
VCC + 0.5
+6.5
50
100
-
IOK
output clamping current
output voltage
VO > VCC or VO < 0 V
output HIGH or LOW
output 3-state
mA
V
[2]
[2]
VO
0.5
0.5
-
V
IO
output current
VO = 0 V to VCC
mA
mA
mA
C
ICC
IGND
Tstg
Ptot
supply current
-
ground current
100
65
-
storage temperature
total power dissipation
+150
500
[3]
Tamb = 40 C to +125 C
mW
[1] The minimum input voltage ratings may be exceeded if the input current ratings are observed.
[2] The output voltage ratings may be exceeded if the output current ratings are observed.
[3] For SO20 packages: above 70 C derate linearly with 8 mW/K.
For (T)SSOP20 packages: above 60 C derate linearly with 5.5 mW/K.
For DHVQFN20 packages: above 60 C derate linearly with 4.5 mW/K.
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
5 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
8. Recommended operating conditions
Table 5.
Symbol
VCC
Recommended operating conditions
Parameter
Conditions
Min
1.65
1.2
0
Typ
Max
3.6
Unit
V
supply voltage
-
-
-
-
-
-
-
-
functional
3.6
5.5
V
VI
input voltage
V
VO
output voltage
output HIGH or LOW
output 3-state
0
VCC
5.5
+125
20
V
0
V
Tamb
ambient temperature
in free air
40
0
C
ns/V
ns/V
t/V
input transition rise and fall rate
VCC = 1.2 V to 2.7 V
VCC = 2.7 V to 3.6 V
0
10
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 40 C to +85 C
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
VIH
HIGH-level VCC = 1.2 V
input voltage
1.08
-
-
-
-
1.08
-
-
V
V
VCC = 1.65 V to 1.95 V
0.65 VCC
0.65
VCC
V
CC = 2.3 V to 2.7 V
1.7
-
-
-
-
-
-
-
1.7
-
V
V
V
V
V
V
VCC = 2.7 V to 3.6 V
VCC = 1.2 V
2.0
-
0.12
2.0
-
0.12
VIL
LOW-level
-
-
-
-
-
-
-
-
input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
0.35 VCC
0.7
0.35 VCC
0.7
0.8
0.8
VOH
HIGH-level VI = VIH or VIL
output
voltage
IO = 100 A;
VCC 0.2
-
-
VCC 0.3
-
V
VCC = 1.65 V to 3.6 V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 18 mA; VCC = 3.0 V
IO = 24 mA; VCC = 3.0 V
VI = VIH or VIL
1.2
1.8
2.2
2.4
2.2
-
-
-
-
-
-
-
-
-
-
1.05
1.65
2.05
2.25
2.0
-
-
-
-
-
V
V
V
V
V
VOL
LOW-level
output
voltage
IO = 100 A;
VCC = 1.65 V to 3.6 V
-
-
0.2
-
0.3
V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
-
-
-
-
-
-
-
-
0.45
0.6
-
-
-
-
0.65
0.8
V
V
V
V
0.4
0.6
0.55
0.8
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
6 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 40 C to +85 C
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
[2]
II
input
leakage
current
VI = 5.5 V or GND;
VCC = 3.6 V
-
-
-
0.1
5
-
20
A
[2]
IOZ
OFF-state
output
current
VI = VIH or VIL;
VO = 5.5 V or GND;
VCC = 3.6 V
0.1
0.1
5
-
-
20
20
A
A
IOFF
power-off
leakage
current
VI or VO = 5.5 V; VCC = 0.0 V
10
ICC
supply
current
VI = VCC or GND; IO = 0 A;
VCC = 3.6 V
-
-
0.1
5
10
-
-
40
A
A
ICC
additional
supply
current
per input pin;
VI = VCC 0.6 V; IO = 0 A;
VCC = 2.7 V to 3.6 V
500
5000
CI
input
-
4.0
-
-
-
pF
capacitance
[3][4]
[3][4]
[3][5]
IBHL
bus hold
LOW current
VCC = 1.65 V; VI = 0.58 V
VCC = 2.3 V; VI = 0.7 V
VCC = 3.0 V; VI = 0.8 V
VCC = 1.65 V; VI = 1.07 V
VCC = 2.3 V; VI = 1.7 V
VCC = 3.0 V; VI = 2.0 V
VCC = 1.95 V
10
30
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
10
25
-
-
-
-
-
-
-
-
-
A
A
A
A
A
A
A
A
A
75
60
IBHH
bus hold
HIGH
current
10
30
75
200
300
500
10
25
60
200
300
500
IBHLO
bus hold
LOW
overdrive
current
VCC = 2.7 V
VCC = 3.6 V
[3][5]
IBHHO
bus hold
HIGH
overdrive
current
VCC = 1.95 V
VCC = 2.7 V
VCC = 3.6 V
200
300
500
-
-
-
-
-
-
200
300
500
-
-
-
A
A
A
[1] All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 C.
[2] The bus hold circuit is switched off when VI > VCC allowing 5.5 V on the input terminal.
[3] Valid for data inputs of bus hold parts only (74LVCH244A-Q100). Note that control inputs do not have a bus hold circuit.
[4] The specified sustaining current at the data input holds the input below the specified VI level.
[5] The specified overdrive current at the data input forces the data input to the opposite input state.
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
7 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8.
Symbol Parameter
Conditions
40 C to +85 C
Min
Typ[1] Max
40 C to +125 C Unit
Min
Max
[2]
[2]
[2]
tpd
ten
tdis
propagation
delay
nAn to nYn; see Figure 6
VCC = 1.2 V
-
17.0
6.4
3.4
3.4
2.9
-
-
-
ns
ns
ns
ns
ns
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.5
1.0
1.5
1.5
13.7
7.1
6.9
5.9
1.5
1.0
1.5
1.5
15.8
8.2
9.0
7.5
VCC = 3.0 V to 3.6 V
nOE to nYn; see Figure 7
VCC = 1.2 V
enable time
-
24.0
7.0
3.9
4.1
3.2
-
-
-
ns
ns
ns
ns
ns
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.5
1.5
1.5
1.0
17.3
9.5
8.6
7.6
1.5
1.5
1.5
1.0
20.0
11.0
11.0
9.5
VCC = 3.0 V to 3.6 V
nOE to nYn; see Figure 7
VCC = 1.2 V
disable time
-
9.0
4.5
3.6
3.3
3.1
-
-
-
-
ns
ns
ns
ns
ns
ns
VCC = 1.65 V to 1.95 V
2.2
0.5
1.5
1.5
-
9.8
5.5
6.8
5.8
1.0
2.2
0.5
1.5
1.5
-
11.3
6.4
8.5
7.5
1.5
V
CC = 2.3 V to 2.7 V
VCC = 2.7 V
VCC = 3.0 V to 3.6 V
[3]
[4]
tsk(o)
CPD
output skew
time
power
dissipation
capacitance
per input; VI = GND to VCC
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
-
-
-
6.4
9.6
-
-
-
-
-
-
-
-
-
pF
pF
pF
VCC = 3.0 V to 3.6 V
12.5
[1] Typical values are measured at Tamb = 25 C and VCC = 1.2 V, 1.8 V, 2.5 V, 2.7 V, and 3.3 V respectively.
[2] tpd is the same as tPLH and tPHL
ten is the same as tPZL and tPZH
tdis is the same as tPLZ and tPHZ
[3] Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
[4] PD is used to determine the dynamic power dissipation (PD in W).
.
.
.
C
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz; fo = output frequency in MHz
CL = output load capacitance in pF
VCC = supply voltage in Volts
N = number of inputs switching
(CL VCC2 fo) = sum of the outputs.
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
8 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
11. AC waveforms
V
I
nAn input
GND
V
V
M
M
t
t
PLH
PHL
V
OH
V
V
M
nYn output
M
V
OL
mna171
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 6. The input (nAn) to output (nYn) propagation delays
V
I
nOE input
GND
V
M
t
t
PZL
PLZ
V
CC
output
LOW-to-OFF
OFF-to-LOW
V
M
V
X
V
OL
t
t
PHZ
PZH
V
OH
V
Y
output
HIGH-to-OFF
OFF-to-HIGH
V
M
GND
outputs
enabled
outputs
enabled
outputs
disabled
mna362
Measurement points are given in Table 8.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 7. 3-state enable and disable times.
Table 8.
Measurement points
Supply voltage
VCC
Input
VI
Output
VM
VM
VX
VY
1.2 V
VCC
VCC
VCC
2.7 V
2.7 V
0.5 VCC
0.5 VCC
0.5 VCC
1.5 V
0.5 VCC
0.5 VCC
0.5 VCC
1.5 V
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOH 0.15 V
VOH 0.15 V
VOH 0.15 V
VOH 0.3 V
VOH 0.3 V
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
3.0 V to 3.6 V
1.5 V
1.5 V
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
9 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
t
W
V
I
90 %
negative
pulse
V
V
V
M
M
10 %
0 V
t
t
r
f
t
t
f
r
V
I
90 %
positive
pulse
V
M
M
10 %
0 V
t
W
V
EXT
R
V
CC
L
V
V
O
I
G
DUT
R
T
C
L
R
L
001aae331
Test data is given in Table 9.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 8. Test circuit for measuring switching times
Table 9.
Test data
Supply voltage
Input
VI
Load
CL
VEXT
tr, tf
RL
tPLH, tPHL
open
tPLZ, tPZL
2 VCC
2 VCC
2 VCC
2 VCC
2 VCC
tPHZ, tPZH
GND
1.2 V
VCC
VCC
VCC
2.7 V
2.7 V
2 ns
2 ns
2 ns
2.5 ns
2.5 ns
30 pF
30 pF
30 pF
50 pF
50 pF
1 k
1 k
500
500
500
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
open
GND
open
GND
open
GND
3.0 V to 3.6 V
open
GND
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
10 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
12. Package outline
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
D
E
A
X
c
y
H
E
v
M
A
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
w
detail X
e
M
b
p
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
max.
(1)
(1)
(1)
UNIT
mm
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
10.65
10.00
1.1
0.4
1.1
1.0
0.9
0.4
2.65
0.1
0.25
0.01
1.27
0.05
1.4
0.25 0.25
0.1
8o
0o
0.012 0.096
0.004 0.089
0.019 0.013 0.51
0.014 0.009 0.49
0.30
0.29
0.419
0.394
0.043 0.043
0.016 0.039
0.035
0.016
inches
0.055
0.01 0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT163-1
075E04
MS-013
Fig 9. Package outline SOT163-1 (SO20)
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
11 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
E
A
X
v
c
H
M
A
y
E
Z
20
11
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
7.9
7.6
1.03
0.63
0.9
0.7
0.9
0.5
mm
2
0.65
0.25
1.25
0.2
0.13
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT339-1
MO-150
Fig 10. Package outline SOT339-1 (SSOP20)
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
12 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c
H
v
M
A
y
E
Z
11
20
Q
A
2
(A )
3
A
A
1
pin 1 index
θ
L
p
L
1
10
detail X
w
M
b
p
e
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.
8o
0o
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
6.6
6.2
0.75
0.50
0.4
0.3
0.5
0.2
mm
1.1
0.65
0.25
1
0.2
0.13
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-19
SOT360-1
MO-153
Fig 11. Package outline SOT360-1 (TSSOP20)
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
13 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
SOT764-1
B
A
D
A
A
1
E
c
detail X
terminal 1
index area
C
terminal 1
index area
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
9
L
1
10
E
h
e
20
11
19
12
D
h
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
1
h
h
max.
0.05 0.30
0.00 0.18
4.6
4.4
3.15
2.85
2.6
2.4
1.15
0.85
0.5
0.3
mm
0.05
0.1
1
0.2
0.5
3.5
0.1
0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
02-10-17
03-01-27
SOT764-1
- - -
MO-241
- - -
Fig 12. Package outline SOT764-1 (DHVQFN20)
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
14 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
13. Abbreviations
Table 10. Abbreviations
Acronym
CDM
CMOS
DUT
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MM
Machine Model
TTL
Transistor-Transistor Logic
Military
MIL
14. Revision history
Table 11. Revision history
Document ID
Release date Data sheet status
Product data sheet
• 74LVC244ADB-Q100 and 74LVCH244DB-Q100 added.
Change notice Supersedes
74LVC_LVCH244A_Q100 v.2 20130813
Modifications:
- 74LVC_LVCH244A_Q100 v.1
74LVC_LVCH244A_Q100 v.1 20120823
Product data sheet
-
-
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
15 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
15.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
16 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC_LVCH244A_Q100
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 2 — 13 August 2013
17 of 18
NXP Semiconductors
74LVC244A-Q100; 74LVCH244A-Q100
Quad buffer/line driver; 3-state
17. Contents
1
2
3
4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5
5.1
5.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
6
Functional description . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Recommended operating conditions. . . . . . . . 6
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
7
8
9
10
11
12
13
14
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
15.1
15.2
15.3
15.4
16
17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 August 2013
Document identifier: 74LVC_LVCH244A_Q100
相关型号：
74LVC244ADB-T
IC LVC/LCX/Z SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, PDSO20, 5.30 MM, PLASTIC, MO-150, SOT339-1, SSOP-20, Bus Driver/Transceiver
NXP
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