74LVC2G126DP-Q100 [NXP]
LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8;
| 型号： | 74LVC2G126DP-Q100 |
| 厂家： | 
NXP |
| 描述： | LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8 驱动 光电二极管 输出元件 |
| 文件： | 总14页 (文件大小：148K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74LVC2G126-Q100
Bus buffer/line driver; 3-state
Rev. 1 — 13 May 2015
Product data sheet
1. General description
The 74LVC2G126-Q100 is a dual non-inverting buffer/line driver with 3-state outputs. An
output enable input (pin nOE) controls each 3-state output. A LOW-level at pin nOE
causes the output to assume a high-impedance OFF-state. Schmitt trigger action at all
inputs makes the circuit highly tolerant of slower input rise and fall times.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the
74LVC2G126-Q100 as a translator in a mixed 3.3 V and 5 V environment.
It is fully specified for partial power-down applications using IOFF. The IOFF circuitry
disables the output, preventing a damaging backflow current through the device when it is
powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from 40 C to +85 C and from 40 C to +125 C
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
24 mA output drive (VCC = 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range Name
Description
Version
74LVC2G126DP-Q100 40 C to +125 C
TSSOP8 plastic thin shrink small outline package; 8 leads;
body width 3 mm; lead length 0.5 mm
SOT505-2
74LVC2G126DC-Q100 40 C to +125 C
VSSOP8 plastic very thin shrink small outline package;
8 leads; body width 2.3 mm
SOT765-1
4. Marking
Table 2.
Marking codes
Type number
Marking code[1]
74LVC2G126DP-Q100
74LVC2G126DC-Q100
V26
V26
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
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Fig 1. Logic symbol
Fig 2. Logic diagram (one gate)
6. Pinning information
6.1 Pinning
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Fig 3. Pin configuration SOT505-2 and SOT765-1
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
2 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
6.2 Pin description
Table 3.
Symbol
1OE, 2OE
1A, 2A
1Y, 2Y
GND
Pin description
Pin
1, 7
2, 5
6, 3
4
Description
output enable input (active HIGH)
data input
data output
ground (0 V)
VCC
8
supply voltage
7. Functional description
Table 4.
Function table[1]
Input
nOE
H
Output
nA
L
nY
L
H
H
H
Z
L
X
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
VCC
IIK
Parameter
Conditions
Min
0.5
50
0.5
-
Max
+6.5
-
Unit
V
supply voltage
input clamping current
input voltage
VI < 0 V
mA
V
[1]
VI
+6.5
50
IOK
output clamping current
output voltage
VO > VCC or VO < 0 V
Active mode
mA
V
[1]
VO
0.5
0.5
-
VCC + 0.5
+6.5
50
[1][2]
Power-down mode
VO = 0 V to VCC
V
IO
output current
mA
mA
mA
mW
C
ICC
IGND
Ptot
Tstg
supply current
-
+100
-
ground current
100
-
[3]
total power dissipation
storage temperature
Tamb = 40 C to +125 C
300
65
+150
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3] For TSSOP8 packages: above 55 C, the value of Ptot derates linearly at 2.5 mW/K.
For VSSOP8 packages: above 110 C, the value of Ptot derates linearly at 8.0 mW/K.
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
3 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
9. Recommended operating conditions
Table 6. Operating conditions
Symbol
VCC
VI
Parameter
Conditions
Min
Max
5.5
Unit
V
supply voltage
input voltage
output voltage
1.65
0
0
5.5
V
VO
Active mode
VCC
5.5
V
VCC = 0 V; Power-down mode
0
V
Tamb
ambient temperature
40
-
+125 C
t/V
input transition rise and fall rate
VCC = 1.65 V to 2.7 V
VCC = 2.7 V to 5.5 V
20
10
ns/V
ns/V
-
10. Static characteristics
Table 7. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ[1]
Max
Unit
Tamb = 40 C to +85 C
VIH
HIGH-level input voltage VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
0.65 VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
VCC = 2.7 V to 3.6 V
2.0
-
V
CC = 4.5 V to 5.5 V
0.7 VCC
-
VIL
LOW-level input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
-
-
-
-
0.35 VCC
0.7
0.8
0.3 VCC
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.1
0.45
0.3
V
V
V
V
V
V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
0.4
0.55
0.55
VOH
HIGH-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
VCC 0.1
-
-
V
1.2
1.9
2.2
2.3
3.8
-
-
-
V
IO = 8 mA; VCC = 2.3 V
-
-
-
V
IO = 12 mA; VCC = 2.7 V
-
-
V
IO = 24 mA; VCC = 3.0 V
-
V
IO = 32 mA; VCC = 4.5 V
-
-
V
II
input leakage current
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
0.1
0.1
5
10
A
A
IOZ
OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND;
VCC = 3.6 V
-
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
4 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
IOFF power-off leakage current VI or VO = 5.5 V; VCC = 0 V
ICC
Conditions
Min
Typ[1]
0.1
0.1
Max
10
10
Unit
A
-
-
supply current
VI = 5.5 V or GND;
A
VCC = 1.65 V to 5.5 V; IO = 0 A
ICC
additional supply current
per pin; VI = VCC 0.6 V; IO = 0 A;
-
-
5
2
500
-
A
VCC = 2.3 V to 5.5 V
CI
input capacitance
pF
Tamb = 40 C to +125 C
VIH HIGH-level input voltage
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 4.5 V to 5.5 V
0.65 VCC
-
-
-
-
-
-
-
-
-
V
V
V
V
V
V
V
V
1.7
-
2.0
-
0.7 VCC
-
VIL
LOW-level input voltage
-
-
-
-
0.35 VCC
0.7
0.8
0.3 VCC
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
-
-
-
-
-
-
-
-
-
-
0.1
V
V
V
V
V
V
IO = 4 mA; VCC = 1.65 V
IO = 8 mA; VCC = 2.3 V
IO = 12 mA; VCC = 2.7 V
IO = 24 mA; VCC = 3.0 V
IO = 32 mA; VCC = 4.5 V
0.70
0.45
0.60
0.80
0.80
VOH
HIGH-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
IO = 4 mA; VCC = 1.65 V
VCC 0.1
-
-
-
-
-
-
-
-
-
V
0.95
1.7
1.9
2.0
3.4
-
-
V
IO = 8 mA; VCC = 2.3 V
-
V
IO = 12 mA; VCC = 2.7 V
-
-
V
IO = 24 mA; VCC = 3.0 V
V
IO = 32 mA; VCC = 4.5 V
-
V
II
input leakage current
VI = 5.5 V or GND; VCC = 0 V to 5.5 V
20
20
A
A
IOZ
OFF-state output current VI = VIH or VIL; VO = 5.5 V or GND;
VCC = 3.6 V
-
IOFF
ICC
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
-
-
-
-
20
A
A
supply current
VI = 5.5 V or GND;
CC = 1.65 V to 5.5 V; IO = 0 A
40
V
ICC
additional supply current
per pin; VI = VCC 0.6 V; IO = 0 A;
-
-
5
mA
VCC = 2.3 V to 5.5 V
[1] Typical values are measured at VCC = 3.3 V and Tamb = 25 C.
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
5 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 6.
Symbol Parameter Conditions 40 C to +85 C
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
[2]
[3]
[4]
[5]
tpd
propagation delay nA to nY; see Figure 4
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
1.0
0.5
1.0
0.5
0.5
3.9
2.6
2.8
2.4
1.9
9.8
4.9
4.7
4.3
3.2
1.0
0.5
1.0
0.5
0.5
12.3
6.3
5.9
5.4
4.0
ns
ns
ns
ns
ns
VCC = 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
ten
enable time
nOE to nY; see Figure 5
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V
1.0
1.0
1.0
1.0
0.5
4.1
2.6
2.8
2.4
1.8
10.0
5.0
4.7
4.1
3.1
1.0
1.0
1.0
1.0
0.5
12.5
6.3
5.9
5.1
3.9
ns
ns
ns
ns
ns
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
nOE to nY; see Figure 5
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
tdis
disable time
1.0
0.5
1.5
1.0
0.5
3.3
1.9
3.0
2.5
1.8
12.6
5.7
4.8
4.4
3.3
1.0
0.5
1.5
1.0
0.5
15.4
7.5
6.2
5.7
4.4
ns
ns
ns
ns
ns
V
CC = 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
CPD
power dissipation per buffer; VI = GND to VCC
capacitance
output enabled
-
-
17
5
-
-
-
-
-
-
pF
pF
output disabled
[1] Typical values are measured at Tamb = 25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2] pd is the same as tPLH and tPHL
t
[3] ten is the same as tPZH and tPZL
[4] tdis is the same as tPLZ and tPHZ
[5] CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL VCC2 fo) = sum of outputs.
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
6 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
12. Waveforms
9
,
9
Q$ꢈLQSXW
0
*1'
W
W
3+/
3/+
9
2+
9
Q<ꢈRXWSXW
0
9
2/
PQDꢄꢅꢀ
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4. The data input (nA) to output (nY) propagation delays
9
,
Q2(ꢈLQSXW
9
0
W
*1'
W
3/=
3=/
9
&&
RXWSXWꢈ
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9
0
9
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9
2/
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W
3=+
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9
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9
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9
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*1'
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Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 5. 3-state enable and disable times
Table 9.
Measurement points
Supply voltage
VCC
Input
Output
VM
VM
VX
VY
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
0.5 VCC
0.5 VCC
1.5 V
0.5 VCC
0.5 VCC
1.5 V
VOL + 0.15 V
VOL + 0.15 V
VOL + 0.3 V
VOL + 0.3 V
VOL + 0.3 V
VOH 0.15 V
VOH 0.15 V
VOH 0.3 V
VOH 0.3 V
VOH 0.3 V
3.0 V to 3.6 V
4.5 V to 5.5 V
1.5 V
1.5 V
0.5 VCC
0.5 VCC
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
7 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
9
(;7
9
&&
5
/
/
9
9
2
,
*
'87
5
7
&
/
5
PQDꢉꢁꢉ
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 6. Test circuit for measuring switching times
Table 10. Test data
Supply voltage
VCC
Input
VI
Load
CL
VEXT
tr, tf
RL
tPLH, tPHL
open
tPZH, tPHZ
GND
tPZL, tPLZ
2 VCC
2 VCC
6 V
1.65 V to 1.95 V
2.3 V to 2.7 V
2.7 V
VCC
VCC
2.7 V
2.7 V
VCC
2.0 ns
2.0 ns
2.5 ns
2.5 ns
2.5 ns
30 pF
30 pF
50 pF
50 pF
50 pF
1 k
500
500
500
500
open
GND
open
GND
3.0 V to 3.6 V
4.5 V to 5.5 V
open
GND
6 V
open
GND
2 VCC
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
8 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
13. Package outline
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74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
9 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
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74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
10 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
14. Abbreviations
Table 11. Abbreviations
Acronym
CMOS
DUT
Description
Complementary Metal Oxide Semiconductor
Device Under Test
ESD
ElectroStatic Discharge
Human Body Model
HBM
MIL
Military
MM
Machine Model
TTL
Transistor-Transistor Logic
15. Revision history
Table 12. Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC2G126_Q100 v.1 20150512
Product data sheet
-
-
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
11 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use in automotive applications — This NXP
16.2 Definitions
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
12 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC2G126_Q100
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Product data sheet
Rev. 1 — 13 May 2015
13 of 14
74LVC2G126-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
18. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 11
8
9
10
11
12
13
14
15
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2015.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 13 May 2015
Document identifier: 74LVC2G126_Q100
相关型号：
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