74LVC4066PW [NXP]

Quad bilateral switches; 四双边开关
74LVC4066PW
型号: 74LVC4066PW
厂家: NXP    NXP
描述:

Quad bilateral switches
四双边开关

复用器 开关 复用器或开关 信号电路 光电二极管
文件: 总23页 (文件大小:131K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
INTEGRATED CIRCUITS  
DATA SHEET  
74LVC4066  
Quad bilateral switches  
Product specification  
2003 Aug 12  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
FEATURES  
DESCRIPTION  
Very low ON resistance:  
The 74LVC4066 is a high-speed Si-gate CMOS device.  
– 7.5 (typical) at VCC = 2.7 V  
– 6.5 (typical) at VCC = 3.3 V  
– 6 (typical) at VCC = 5 V.  
The 74LVC4066 has four independent analog switches.  
Each switch has two input/output terminals (nY and nZ)  
and an active HIGH enable input (nE). When nE is LOW,  
the analog switch is turned off.  
ESD protection:  
– HBM EIA/JESD22-A114-A Exceeds 2000 V  
– MM EIA/JESD22-A115-A Exceeds 200 V.  
High noise immunity  
CMOS low power consumption  
Latch up performance exceeds 250 mA  
Complies with JEDEC standard no. 8-1A  
Direct interface TTL-levels.  
QUICK REFERENCE DATA  
GND = 0 V; Tamb = 25 °C; tr = tf 2.5 ns.  
SYMBOL  
PARAMETER  
turn-on time E to Vos  
CONDITIONS  
TYPICAL  
UNIT  
t
PZH/tPZL  
CL = 50 pF; RL = 500 ; VCC = 3 V 2.5  
CL = 50 pF; RL = 500 ; VCC = 5 V 1.9  
CL = 50 pF; RL = 500 ; VCC = 3 V 3.4  
CL = 50 pF; RL = 500 ; VCC = 5 V 2.5  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
pF  
t
PHZ/tPLZ  
turn-off time E to Vos  
CI  
input capacitance  
VCC = 3 V  
3.5  
CPD  
CS  
power dissipation capacitance  
switch capacitance  
VCC = 3.3 V; notes 1 and 2  
OFF-state  
12.5  
8.0  
ON-state  
14.0  
Notes  
1. CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + ((CL + CS) × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = total load switching outputs;  
CS = switch capacitance.  
2. The condition is VI = GND to VCC  
.
2003 Aug 12  
2
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
FUNCTION TABLE  
See note 1.  
INPUT nE  
SWITCH  
L
OFF  
ON  
H
Note  
1. H = HIGH voltage level;  
L = LOW voltage level.  
ORDERING INFORMATION  
PACKAGE  
PACKAGE  
TYPE NUMBER  
TEMPERATURE  
PINS  
MATERIAL  
CODE  
RANGE  
74LVC4066D  
74LVC4066PW  
74LVC4066BQ  
40 to +125 °C  
40 to +125 °C  
40 to +125 °C  
14  
14  
14  
SO14  
plastic  
plastic  
plastic  
SOT108-2  
SOT402-1  
SOT762-1  
TSSOP14  
DHVQFN14  
PINNING  
PIN  
SYMBOL  
DESCRIPTION  
1
2
1Y  
1Z  
independent input/output  
independent output/input  
independent output/input  
independent input/output  
enable input (active HIGH)  
enable input (active HIGH)  
ground (0 V)  
handbook, halfpage  
1Y  
1Z  
1
2
3
4
5
6
7
V
14  
CC  
3
2Z  
13  
12  
11  
10  
9
1E  
4
2Y  
2E  
3E  
GND  
3Y  
3Z  
2Z  
4E  
4Y  
4Z  
3Z  
3Y  
5
2Y  
4066  
6
2E  
7
3E  
8
independent input/output  
independent output/input  
independent output/input  
independent input/output  
enable input (active HIGH)  
enable input (active HIGH)  
supply voltage  
8
GND  
9
MNB109  
10  
11  
12  
13  
14  
4Z  
4Y  
4E  
1E  
VCC  
Fig.1 Pin configuration SO14 and TSSOP14.  
2003 Aug 12  
3
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
V
1Y  
1
handbook, halfpage  
handbook, halfpage  
CC  
1
1Y  
1Z  
2
14  
13 1E  
1Z  
2
3
13 1E  
12 4E  
4
5
8
6
2Y  
2E  
3Y  
3E  
2Z  
3Z  
3
9
2Z  
(1)  
2Y  
2E  
3E  
4
5
6
11 4Y  
10 4Z  
GND  
9
3Z  
11 4Y  
12 4E  
4Z 10  
7
8
GND 3Y  
Top view  
MNB110  
MNB111  
(1) The die substrate is attached to this pad using conductive die  
attach material. It can not be used as a supply pin or input.  
Fig.2 Pin configuration DHVQFN14.  
Fig.3 Logic symbol.  
1
2
3
1
1
1
1
1
13  
#
#
#
#
X1  
1
2
3
handbook, halfpage  
13  
#
#
#
#
4
5
Z
1
4
5
X1  
8
6
9
1
8
6
9
Y
E
X1  
11  
12  
10  
11  
12  
10  
1
X1  
V
MNA658  
CC  
(a)  
(b)  
MNB112  
Fig.4 logic symbol (IEEE/IEC).  
Fig.5 Logic diagram (one switch).  
2003 Aug 12  
4
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
RECOMMENDED OPERATING CONDITIONS  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN. MAX. UNIT  
VCC  
VI  
1.65  
0
5.5  
5.5  
VCC  
V
V
V
input voltage  
VS  
switch voltage  
0
Tamb  
tr, tf  
operating ambient temperature  
input rise and fall times  
40  
0
+125 °C  
VCC = 1.65 to 2.7 V  
CC = 2.7 to 5.5 V  
20  
10  
ns/V  
ns/V  
V
0
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V);  
see note 1.  
SYMBOL  
PARAMETER  
supply voltage  
CONDITIONS  
MIN. MAX. UNIT  
VCC  
VI  
0.5  
0.5  
+6.5  
+6.5  
50  
±50  
+6.5  
±50  
V
input voltage  
note 2  
V
IIK  
input diode current  
switch diode current  
switch voltage  
VI < 0.5 V or VI > VCC + 0.5 V  
VI < 0.5 V or VI > VCC + 0.5 V  
enable and disable mode  
0.5 < VS < VCC + 0.5 V  
mA  
mA  
V
ISK  
VS  
IS  
0.5  
switch source or sink current  
mA  
ICC, IGND VCC or GND current  
±100 mA  
+150 °C  
Tstg  
Ptot  
storage temperature  
power dissipation  
65  
Tamb = 40 to +125 °C; note 3  
500  
mW  
Notes  
1. To avoid drawing VCC current out of terminal Z, when switch current flows in terminal Y, the voltage drop across the  
bidirectional switch must not exceed 0.4 V. If the switch current flows into terminal Z, no VCC current will flow out of  
terminal Y. In this case there is no limit for the voltage drop across the switch, but the voltage at Y and Z may not  
exceed VCC or GND.  
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
3. For SO14 packages: above 70 °C derate linearly with 8 mW/K.  
For TSSOP14 packages: above 60 °C derate linearly with 5.5 mW/K.  
For DHVQFN14 packages: above 60 °C derate linearly with 4.5 mW/K.  
2003 Aug 12  
5
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
DC CHARACTERISTICS  
At recommended operating conditions; voltage are referenced to GND (ground = 0 V).  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
OTHER  
VCC (V)  
Tamb = 40 to +85 °C; note 1  
VIH  
HIGH-level input  
voltage  
1.65 to 1.95 0.65VCC  
V
V
V
V
V
V
V
V
µA  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
5.5  
1.7  
2.0  
0.7VCC  
VIL  
LOW-level input  
voltage  
0.35VCC  
0.7  
0.8  
0.30VCC  
±5  
ILI  
input leakage current VI = 5.5 V or GND  
(control pin)  
±0.1  
IS(OFF)  
IS(ON)  
ICC  
analog switch  
OFF-state current  
VI = VIH or VIL;  
|VS| = VCC GND; see Fig.7  
5.5  
5.5  
5.5  
5.5  
±0.1  
±0.1  
0.1  
5
±5  
µA  
µA  
µA  
µA  
analog switch  
ON-state current  
VI = VIH or VIL;  
|VS| = VCC GND; see Fig.8  
±5  
quiescent supply  
current  
VI = VCC or GND;  
VS = GND or VCC; IO = 0 A  
10  
ICC  
additional quiescent  
supply current per  
control pin  
VI = VCC 0.6 V;  
VS = GND or VCC; IO = 0 A  
500  
2003 Aug 12  
6
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
TEST CONDITIONS  
OTHER  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
VCC (V)  
Tamb = 40 to +125 °C  
VIH  
HIGH-level input  
voltage  
1.65 to 1.95 0.65VCC  
V
V
V
V
V
V
V
V
µA  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7 to 3.6  
4.5 to 5.5  
5.5  
1.7  
2.0  
0.7VCC  
VIL  
LOW-level input  
voltage  
0.35VCC  
0.7  
0.8  
0.30VCC  
±20  
ILI  
input leakage current VI = 5.5 V or GND  
(control pin)  
IS(OFF)  
IS(ON)  
ICC  
analog switch  
OFF-state current  
VI = VIH or VIL;  
|VS| = VCC GND; see Fig.7  
5.5  
5.5  
5.5  
5.5  
±20  
±20  
40  
µA  
µA  
µA  
µA  
analog switch  
ON-state current  
VI = VIH or VIL;  
|VS| = VCC GND; see Fig.8  
quiescent supply  
current  
VI = VCC or GND;  
VS = GND or VCC; IO = 0 A  
ICC  
additional quiescent  
supply current per  
control pin  
VI = VCC 0.6 V;  
VS = GND or VCC; IO = 0 A  
5000  
Note  
1. All typical values are measured at Tamb = 25 °C.  
2003 Aug 12  
7
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
Resistance RON  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP. MAX. UNIT  
OTHER  
IS (mA)  
VCC (V)  
Tamb = 40 to +85 °C; note 1; see Fig.6  
RON(peak)  
ON-resistance  
(peak)  
VS = GND to VCC  
VI = VIH  
;
4
1.65 to 1.95  
2.3 to 2.7  
2.7  
35  
14  
11.5  
8.5  
6.5  
10  
8.5  
7.5  
6.5  
6
100  
30  
25  
20  
15  
30  
20  
18  
15  
10  
30  
20  
18  
15  
10  
8
12  
24  
32  
4
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
RON(rail)  
ON-resistance (rail) VS = GND; VI = VIH  
8
12  
24  
32  
4
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
VS = VCC; VI = VIH  
12  
8.5  
7.5  
6.5  
6
8
12  
24  
32  
4
3.0 to 3.6  
4.5 to 5.5  
1.8  
RON(flatness) ON-resistance  
(flatness)  
VS = GND to VCC  
;
100  
17  
10  
5
VI = VIH;  
see Figs.10 to 13  
8
2.5  
12  
24  
32  
2.7  
3.3  
5.0  
3
2003 Aug 12  
8
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP. MAX. UNIT  
OTHER  
IS (mA)  
VCC (V)  
Tamb = 40 to +125 °C; see Fig.6  
RON(peak)  
ON-resistance  
(peak)  
VS = GND to VCC  
VI = VIH  
;
4
1.65 to 1.95  
2.3 to 2.7  
2.7  
150  
45  
38  
30  
23  
45  
30  
27  
23  
15  
45  
30  
27  
23  
15  
8
12  
24  
32  
4
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
RON(rail)  
ON-resistance (rail) VS = GND; VI = VIH  
8
12  
24  
32  
4
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
VS = VCC; VI = VIH  
8
12  
24  
32  
3.0 to 3.6  
4.5 to 5.5  
Note  
1. Typical value Ron(flatness) is measured at Tamb = 40 to +85 °C, all other typical values are measured at Tamb = 25 °C.  
2003 Aug 12  
9
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
E
V
IL  
E
V
IH  
V
Y
Z
Y
Z
A
A
V
= GND to V  
I
S
S
CC  
V = V  
or GND  
CC  
V
= GND or V  
I
O
CC  
GND  
GND  
MNA659  
GND  
MNA660  
Fig.6 Test circuit for measuring ON-state  
resistance (RON).  
Fig.7 Test circuit for measuring OFF-state current.  
MNA673  
2
10  
handbook, halfpage  
R
ON  
V
= 1.8 V  
2.5 V  
()  
CC  
E
V
IH  
Y
Z
2.7 V  
10  
3.3 V  
5.0 V  
A
A
V = V  
or GND  
V
(open circuit)  
GND  
I
CC  
O
MNA661  
1
0
1
2
3
4
5
V (V)  
I
Fig.9 Typical ON-resistance (RON) as a function  
of input voltage (VS) for VS = GND to VCC  
Fig.8 Test circuit for measuring ON-state current.  
.
2003 Aug 12  
10  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
MNA663  
MNA664  
15  
15  
handbook, halfpage  
handbook, halfpage  
R
R
ON  
ON  
°
C
°
C
°
C
T
= +85  
+25  
amb  
()  
()  
°
C
°
C
°
C
T
= +85  
+25  
amb  
40  
10  
10  
40  
5
0
5
0
0
0
1
2
3
1
2
3
V (V)  
V (V)  
l
l
Fig.10 RON for VCC = 2.5 V.  
Fig.11 RON for VCC = 2.7 V.  
MNA666  
MNA665  
10  
8
handbook, halfpage  
handbook, halfpage  
R
ON  
R
ON  
()  
()  
T
=
amb  
7
8
°
+85  
C
6
5
4
3
°
= +85 C  
T
amb  
°
°
6
4
2
+25  
40  
C
C
°
+25  
C
°
40  
C
2
0
0
0
1
2
3
4
5
1
2
3
4
V (V)  
l
V (V)  
I
Fig.12 RON for VCC = 3.3 V.  
Fig.13 RON for VCC = 5.0 V.  
2003 Aug 12  
11  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
AC CHARACTERISTICS  
GND = 0 V.  
TEST CONDITIONS  
SYMBOL  
PARAMETER  
MIN.  
TYP.  
MAX.  
UNIT  
WAVEFORMS  
V
CC (V)  
Tamb = 40 to +85 °C; note 1  
tPHL/tPLH propagation delay nY to nZ see Figs 14 and 16;  
1.65 to 1.95  
2.3 to 2.7  
2.7  
0.8  
2.0  
ns  
or nZ to nY  
note 2  
0.4  
0.4  
0.3  
0.2  
5.3  
3.0  
2.6  
2.5  
1.9  
4.2  
2.4  
3.6  
3.4  
2.5  
1.2  
1.0  
0.8  
0.6  
10  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
t
PZH/tPZL  
turn-ON time E to VOS  
see Figs 15 and 16  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
5.6  
5.0  
4.4  
3.9  
9.0  
5.5  
6.5  
6.0  
5.0  
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
tPHZ/tPLZ  
turn-OFF time E to VOS  
see Figs 15 and 16  
3.0 to 3.6  
4.5 to 5.5  
Tamb = 40 to +125 °C  
tPHL/tPLH propagation delay nY to nZ see Figs 14 and 16;  
1.65 to 1.95  
2.3 to 2.7  
2.7  
3.0  
2.0  
1.5  
1.5  
1.0  
12.5  
7.0  
6.5  
5.5  
5.0  
11.5  
7.0  
8.5  
7.5  
6.5  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
or nZ to nY  
note 2  
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
t
PZH/tPZL  
turn-ON time E to VOS  
see Figs 15 and 16  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
3.0 to 3.6  
4.5 to 5.5  
1.65 to 1.95  
2.3 to 2.7  
2.7  
tPHZ/tPLZ  
turn-OFF time E to VOS  
see Figs 15 and 16  
3.0 to 3.6  
4.5 to 5.5  
Notes  
1. All typical values are measured at Tamb = 25 °C.  
2. tPHL/tPLH propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and  
the specified capacitance when driven by an ideal voltage source (zero output impedance).  
2003 Aug 12  
12  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
AC WAVEFORMS  
V
handbook, halfpage  
I
V
Y or Z  
M
GND  
t
t
PHL  
PLH  
V
OH  
V
Z or Y  
M
V
OL  
MNA667  
INPUT  
VCC  
VM  
VI  
tr = tf  
1.65 to 1.95 V  
2.3 to 2.7 V  
0.5VCC  
0.5VCC  
VCC  
VCC  
2.7 V  
VCC  
2.0 ns  
2.0 ns  
2.5 ns  
2.5 ns  
2.7 and 3.0 to 3.6 V 1.5 V  
4.5 to 5.5 V 0.5VCC  
VOL and VOH are typical output voltage drop that occur with the output load.  
Fig.14 The input (VS) to output (VO) propagation delays.  
2003 Aug 12  
13  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
V
I
E
V
M
t
GND  
t
PLZ  
PZL  
V
CC  
output  
Y or Z  
LOW-to-OFF  
OFF-to-LOW  
V
M
V
X
V
OL  
t
t
PZH  
PHZ  
V
OH  
V
output  
Y
Y or Z  
HIGH-to-OFF  
OFF-to-HIGH  
V
M
GND  
switch  
enabled  
switch  
enabled  
switch  
disabled  
MNA668  
INPUT  
VCC  
VM  
VI  
tr = tf  
1.65 to 1.95 V  
2.3 to 2.7 V  
0.5VCC  
0.5VCC  
VCC  
VCC  
2.0 ns  
2.0 ns  
2.5 ns  
2.5 ns  
2.7 and 3.0 to 3.6 V 1.5 V  
4.5 to 5.5 V 0.5VCC  
2.7 V  
VCC  
V
X = VOL + 0.3 V at VCC 2.7 V;  
VX = VOL + 0.1 × VCC at VCC < 2.7 V;  
VY = VOH 0.3 V at VCC 2.7 V;  
VY = VOH 0.1 × VCC at VCC < 2.7 V.  
VOL and VOH are typical output voltage drop that occur with the output load.  
Fig.15 Turn-on and turn-off times.  
2003 Aug 12  
14  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
V
EXT  
V
CC  
R
L
V
V
O
I
PULSE  
GENERATOR  
D.U.T.  
C
R
R
L
L
T
MNA616  
VEXT  
tPLH/tPHL tPZH/tPHZ tPZL/tPLZ  
VCC  
VI  
CL  
RL  
1 kΩ  
1.65 to 1.95 V  
2.3 to 2.7 V  
VCC  
VCC  
30 pF  
30 pF  
50 pF  
50 pF  
open  
GND  
GND  
GND  
GND  
2VCC  
2VCC  
6 V  
500 open  
500 open  
500 open  
2.7 and 3.0 to 3.6 V 2.7 V  
4.5 to 5.5 V  
VCC  
2VCC  
Definitions for test circuits:  
RL = Load resistor.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.  
Fig.16 Load circuitry for switching times.  
ADDITIONAL AC CHARACTERISTICS  
Recommended conditions and typical values at Tamb = 25 °C.  
SYMBOL  
dsin  
PARAMETER  
TEST CONDITIONS  
VCC (V) TYPICAL UNIT  
sine-wave distortion  
RL = 10 k; CL = 50 pF; fin = 1 kHz; 1.65  
see Fig.18  
0.032  
0.008  
0.006  
0.005  
0.068  
0.009  
0.008  
0.006  
170  
%
2.3  
%
3
%
4.5  
%
RL = 10 k; CL = 50 pF;  
fin = 10 kHz; see Fig.18  
1.65  
2.3  
3
%
%
%
4.5  
1.65  
2.3  
3
%
fON  
switch ON signal frequency  
response  
RL = 600 ; CL = 50 pF; see  
Fig.17; note 1  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
MHz  
210  
212  
4.5  
1.65  
2.3  
3
215  
RL = 50 ; CL = 5 pF; see Fig.17;  
> 500  
> 500  
> 500  
> 500  
note 1  
4.5  
2003 Aug 12  
15  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
VCC (V) TYPICAL UNIT  
αOFF(feedthru) switch OFF signal feed-through RL = 600 ; CL = 50 pF;  
1.65  
2.3  
3
46  
46  
46  
46  
42  
42  
42  
42  
69  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
mV  
mV  
mV  
mV  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
dB  
pF  
pF  
pF  
pC  
pC  
attenuation  
fin = 1 MHz; see Fig.19; note 2  
4.5  
1.65  
2.3  
3
RL = 50 ; CL = 5 pF; fin = 1 MHz;  
see Fig.19; note 2  
4.5  
1.65  
2.3  
3
αct(E-Y/Z)  
crosstalk between control input RL = 600 ; CL = 50 pF;  
to signal output  
fin = 1 MHz; tr = tf = 2 ns; see  
Fig.20  
87  
156  
302  
58  
58  
58  
58  
58  
58  
58  
58  
11.0  
12.5  
15.6  
0.8  
4.5  
1.65  
2.3  
3
αct(S)  
crosstalk between switches)  
RL = 600 ; CL = 50 pF;  
fin = 1 MHz; see Fig.21  
4.5  
1.65  
2.3  
3
RL = 50 ; CL = 5 pF; fin = 1 MHz;  
see Fig.21  
4.5  
2.5  
3.3  
5.0  
CPD  
power dissipation capacitance  
charge injection  
fin = 10 MHz  
Q
CL = 0.1 nF; Vgen = 0 V; Rgen = 0 ; 3.3  
f = 1 MHz; RL = 1 M; see Fig.22;  
note 3  
5.5  
1.2  
Notes  
1. Adjust fin voltage to obtain 0 dBm level at output. Increase fin frequency until dB meter reads 3 dB.  
2. Adjust fin voltage to obtain 0 dBm level at input.  
3. Guaranteed by design.  
E
V
IH  
0.1 µF  
Y/Z  
Z/Y  
V
O
f
R
50 Ω  
C
dB  
in  
L
L
channel  
ON  
1/2V  
CC  
MNA669  
Fig.17 Test circuit for measuring the frequency response when switch is ON.  
2003 Aug 12  
16  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
E
V
IH  
10 µF  
Y/Z  
Z/Y  
V
O
DISTORTION  
METER  
f
600 Ω  
R
C
L
in  
L
channel  
ON  
1/2V  
CC  
MNA670  
VCC  
1.65 V  
VIH  
1.4 V (p-p)  
2 V (p-p)  
2.3 V  
3 V  
2.5 V (p-p)  
4 V (p-p)  
4. V  
Fig.18 Test circuit for measuring sine-wave distortion.  
E
V
IL  
0.1 µF  
Y/Z  
Z/Y  
V
O
f
R
R
L
50 Ω  
1/2V  
C
dB  
in  
L
L
channel  
OFF  
1/2V  
CC  
CC  
MNB113  
Fig.19 Test circuit for measuring feed-through when switch is OFF.  
E
Y/Z  
in  
Z/Y  
V
O
R
R
600 Ω  
C
L
L
50 Ω  
600 Ω  
50 pF  
1/2V  
1/2V  
CC  
CC  
MNA672  
Fig.20 Crosstalk between control input to signal output.  
17  
2003 Aug 12  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
E1  
V
IH  
0.1 µF  
50 Ω  
R
in  
1Y or 1Z  
1Z or 1Y  
V
O1  
600 Ω  
C
R
L
f
L
in  
50 pF  
600 Ω  
channel ON  
1/2V  
CC  
E2  
V
IL  
2Y or 2Z  
2Z or 2Y  
V
O2  
C
R
L
600 Ω  
L
R
in  
600 Ω  
50 pF  
channel OFF  
1/2V  
CC  
MNB114  
Fig.21 Crosstalk between switches.  
E
R
gen  
Y/Z  
Z/Y  
R
V
O
logic  
input  
1
MΩ  
0.1  
nF  
V
C
gen  
L
L
MNA674  
logic  
input (E)  
off  
on  
off  
V
V  
out  
O
MNA675  
Q = Vout × CL  
Fig.22 Charge injection test.  
18  
2003 Aug 12  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
PACKAGE OUTLINES  
SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm  
SOT108-2  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.55  
1.40  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.061  
0.004 0.055  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039  
0.016  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
01-05-29  
03-02-19  
SOT108-2  
MS-012  
2003 Aug 12  
19  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
7
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.72  
0.38  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT402-1  
MO-153  
2003 Aug 12  
20  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;  
14 terminals; body 2.5 x 3 x 0.85 mm  
SOT762-1  
B
A
D
A
A
1
E
c
detail X  
terminal 1  
index area  
C
terminal 1  
index area  
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14  
13  
9
D
h
X
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
b
c
E
e
e
1
y
D
D
E
L
v
w
y
1
h
h
1
max.  
0.05 0.30  
0.00 0.18  
3.1  
2.9  
1.65  
1.35  
2.6  
2.4  
1.15  
0.85  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
2
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-10-17  
03-01-27  
SOT762-1  
- - -  
MO-241  
- - -  
2003 Aug 12  
21  
Philips Semiconductors  
Product specification  
Quad bilateral switches  
74LVC4066  
DATA SHEET STATUS  
DATA SHEET  
STATUS(1)  
PRODUCT  
STATUS(2)(3)  
LEVEL  
DEFINITION  
I
Objective data  
Development This data sheet contains data from the objective specification for product  
development. Philips Semiconductors reserves the right to change the  
specification in any manner without notice.  
II  
Preliminary data Qualification  
This data sheet contains data from the preliminary specification.  
Supplementary data will be published at a later date. Philips  
Semiconductors reserves the right to change the specification without  
notice, in order to improve the design and supply the best possible  
product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips  
Semiconductors reserves the right to make changes at any time in order  
to improve the design, manufacturing and supply. Relevant changes will  
be communicated via a Customer Product/Process Change Notification  
(CPCN).  
Notes  
1. Please consult the most recently issued data sheet before initiating or completing a design.  
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was  
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.  
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
DEFINITIONS  
DISCLAIMERS  
Short-form specification  
The data in a short-form  
Life support applications  
These products are not  
specification is extracted from a full data sheet with the  
same type number and title. For detailed information see  
the relevant data sheet or data handbook.  
designed for use in life support appliances, devices, or  
systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips  
Semiconductors customers using or selling these products  
for use in such applications do so at their own risk and  
agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in  
accordance with the Absolute Maximum Rating System  
(IEC 60134). Stress above one or more of the limiting  
values may cause permanent damage to the device.  
These are stress ratings only and operation of the device  
at these or at any other conditions above those given in the  
Characteristics sections of the specification is not implied.  
Exposure to limiting values for extended periods may  
affect device reliability.  
Right to make changes  
Philips Semiconductors  
reserves the right to make changes in the products -  
including circuits, standard cells, and/or software -  
described or contained herein in order to improve design  
and/or performance. When the product is in full production  
(status ‘Production’), relevant changes will be  
Application information  
Applications that are  
communicated via a Customer Product/Process Change  
Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these  
products, conveys no licence or title under any patent,  
copyright, or mask work right to these products, and  
makes no representations or warranties that these  
products are free from patent, copyright, or mask work  
right infringement, unless otherwise specified.  
described herein for any of these products are for  
illustrative purposes only. Philips Semiconductors make  
no representation or warranty that such applications will be  
suitable for the specified use without further testing or  
modification.  
2003 Aug 12  
22  
Philips Semiconductors – a worldwide company  
Contact information  
For additional information please visit http://www.semiconductors.philips.com.  
Fax: +31 40 27 24825  
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.  
© Koninklijke Philips Electronics N.V. 2003  
SCA75  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
613508/01/pp23  
Date of release: 2003 Aug 12  
Document order number: 9397 750 11652  

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