74LVTH125PW,118 [NXP]

74LVT(H)125 - 3.3 V quad buffer; 3-state TSSOP 14-Pin;
74LVTH125PW,118
型号: 74LVTH125PW,118
厂家: NXP    NXP
描述:

74LVT(H)125 - 3.3 V quad buffer; 3-state TSSOP 14-Pin

驱动 信息通信管理 光电二极管 逻辑集成电路
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74LVT125; 74LVTH125  
3.3 V quad buffer; 3-state  
Rev. 06 — 6 March 2006  
Product data sheet  
1. General description  
The 74LVT125; 74LVTH125 is a high-performance BiCMOS product designed for VCC  
operation at 3.3 V.  
This device combines low static and dynamic power dissipation with high speed and high  
output drive. The 74LVT125; 74LVTH125 device is a quad buffer that is ideal for driving  
bus lines. The device features four output enable inputs (1OE, 2OE, 3OE and 4OE), each  
controlling one of the 3-state outputs.  
2. Features  
I Quad bus interface  
I 3-state buffers  
I Output capability: +64 mA and 32 mA  
I TTL input and output switching levels  
I Input and output interface capability to systems at 5 V supply  
I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs  
I Live insertion and extraction permitted  
I No bus current loading when output is tied to 5 V bus  
I Power-up 3-state  
I Latch-up protection:  
N JESD78: exceeds 500 mA  
I ESD protection:  
N MIL STD 883 method 3015: exceeds 2000 V  
N Machine model: exceeds 200 V  
3. Quick reference data  
Table 1.  
Quick reference data  
GND = 0 V; Tamb = 25 °C.  
Symbol Parameter  
Conditions  
Min  
Typ  
Max Unit  
tPLH  
LOW-to-HIGH propagation CL = 50 pF; VCC = 3.3 V  
delay nA to nY  
-
2.7  
-
ns  
tPHL  
HIGH-to-LOW propagation CL = 50 pF; VCC = 3.3 V  
delay nA to nY  
-
2.9  
-
ns  
 
 
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
Table 1.  
Quick reference data …continued  
GND = 0 V; Tamb = 25 °C.  
Symbol Parameter  
Conditions  
Min  
Typ  
4
Max Unit  
Ci  
input capacitance  
VI = 0 V or 3.0 V  
-
-
-
-
pF  
pF  
Co  
output capacitance  
outputs disabled;  
VO = 0 V or 3.0 V  
8
ICC  
quiescent supply current  
outputs disabled;  
-
0.13  
-
mA  
VCC = 3.6 V  
4. Ordering information  
Table 2.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVT125D  
40 °C to +85 °C  
40 °C to +85 °C  
40 °C to +85 °C  
40 °C to +85 °C  
SO14  
plastic small outline package; 14 leads;  
body width 3.9 mm  
SOT108-1  
74LVT125DB  
74LVT125PW  
74LVT125BQ  
SSOP14  
TSSOP14  
plastic shrink small outline package; 14 leads;  
body width 5.3 mm  
SOT337-1  
SOT402-1  
plastic thin shrink small outline package; 14 leads;  
body width 4.4 mm  
DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1  
thin quad flat package; no leads; 14 terminals;  
body 2.5 × 3 × 0.85 mm  
74LVTH125D  
40 °C to +85 °C  
40 °C to +85 °C  
SO14  
plastic small outline package; 14 leads;  
body width 3.9 mm  
SOT108-1  
SOT337-1  
SOT402-1  
74LVTH125DB  
SSOP14  
TSSOP14  
plastic shrink small outline package; 14 leads;  
body width 5.3 mm  
74LVTH125PW 40 °C to +85 °C  
plastic thin shrink small outline package; 14 leads;  
body width 4.4 mm  
74LVTH125BQ  
40 °C to +85 °C  
DHVQFN14 plastic dual in-line compatible thermal enhanced very SOT762-1  
thin quad flat package; no leads; 14 terminals;  
body 2.5 × 3 × 0.85 mm  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
2 of 16  
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
5. Functional diagram  
1A  
1Y  
2Y  
3Y  
4Y  
3
6
2
2
1
3
1
1OE  
2A  
1
5
EN1  
5
6
4
2OE  
3A  
4
9
9
8
8
10  
3OE  
4A  
10  
12  
12  
11  
13  
11  
4OE  
13  
mna229  
mna228  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
nY  
nA  
nOE  
mna227  
Fig 3. Logic diagram  
6. Pinning information  
6.1 Pinning  
terminal 1  
index area  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1OE  
V
CC  
1A  
1Y  
4OE  
4A  
2
3
4
5
6
13  
12  
11  
10  
9
1A  
1Y  
4OE  
4A  
2OE  
2A  
125  
4Y  
2OE  
2A  
125  
4Y  
3OE  
3A  
(1)  
GND  
3OE  
3A  
2Y  
2Y  
8
GND  
3Y  
001aac477  
001aac476  
Transparent top view  
(1) The die substrate is attached to the  
exposed die pad using conductive die  
attach material. It can not be used as  
a supply pin or input.  
Fig 4. Pin configuration SO14, SSOP14  
and TSSOP14  
Fig 5. Pin configuration DHVQFN14  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
3 of 16  
 
 
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
6.2 Pin description  
Table 3.  
Symbol  
1OE  
1A  
Pin description  
Pin  
1
Description  
1 output enable input (active LOW)  
2
1 data input  
1Y  
3
1 data output  
2OE  
2A  
4
2 output enable input (active LOW)  
2 data input  
5
2Y  
6
2 data output  
GND  
3Y  
7
ground (0 V)  
8
3 data output  
3A  
9
3 data input  
3OE  
4Y  
10  
11  
12  
13  
14  
3 output enable input (active LOW)  
4 data output  
4A  
4 data input  
4OE  
VCC  
4 output enable input (active LOW)  
supply voltage  
7. Functional description  
7.1 Function table  
Table 4.  
Control  
nOE  
Function table[1]  
Input  
nA  
L
Output  
nY  
L
L
H
H
Z
H
X
[1] H = HIGH voltage level;  
L = LOW voltage level;  
X = don’t care;  
Z = high-impedance OFF-state.  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
4 of 16  
 
 
 
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
8. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to  
GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Min  
0.5  
0.5  
0.5  
Max  
+4.6  
+7.0  
+7.0  
Unit  
V
VCC  
VI  
supply voltage  
input voltage  
output voltage  
[1]  
[1]  
V
VO  
output in OFF-state or  
HIGH-state  
V
IIK  
IOK  
IO  
input clamping current  
VI < 0 V  
-
50  
50  
128  
64  
+150  
150  
mA  
mA  
mA  
mA  
°C  
output clamping current VO < 0 V  
-
output current  
output in LOW-state  
output in HIGH-state  
-
-
Tstg  
Tj  
storage temperature  
junction temperature  
65  
[2]  
-
°C  
[1] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings  
are observed.  
[2] The performance capability of a high-performance integrated circuit in conjunction with its thermal  
environment can create junction temperatures which are detrimental to reliability.  
9. Recommended operating conditions  
Table 6.  
Recommended operating conditions  
Conditions  
Symbol Parameter  
Min  
Typ  
Max  
3.6  
5.5  
-
Unit  
V
VCC  
VI  
supply voltage  
2.7  
-
-
-
-
-
-
-
input voltage  
0
V
VIH  
VIL  
IOH  
IOL  
HIGH-state input voltage  
LOW-state input voltage  
HIGH-state output current  
2.0  
V
-
-
-
-
0.8  
32  
32  
V
mA  
mA  
mA  
LOW-state output current none  
current duty cycle 50 %;  
f 1 kHz  
64  
t/V  
input transition rise and  
fall rate  
0
-
-
10  
ns/V  
Tamb  
ambient temperature  
in free air  
40  
+85  
°C  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
5 of 16  
 
 
 
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
10. Static characteristics  
Table 7.  
Static characteristics  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tamb = 40 °C to +85 °C[1]  
VIK  
input clamping voltage  
IIK = 18 mA; VCC = 2.7 V  
IOH = 100 µA;  
-
0.9  
1.2  
V
V
VOH  
HIGH-state output voltage  
VCC 0.2 VCC 0.1 -  
VCC = 2.7 V to 3.6 V  
IOH = 8 mA; VCC = 2.7 V  
IOH = 32 mA; VCC = 3.0 V  
VCC = 2.7 V  
2.4  
2.0  
2.5  
2.2  
-
-
V
V
VOL  
LOW-state output voltage  
IOL = 100 µA  
-
-
0.1  
0.3  
0.2  
0.5  
V
V
IOL = 24 mA  
VCC = 3.0 V  
IOL = 16 mA  
-
-
-
0.25  
0.3  
0.4  
V
V
V
IOL = 32 mA  
0.5  
IOL = 64 mA  
0.4  
0.55  
ILI  
input leakage current  
all input pins  
control pins  
VCC = 0 V or 3.6 V; VI = 5.5 V  
VCC = 3.6 V; VI = VCC or GND  
VCC = 3.6 V  
-
-
1
10  
µA  
µA  
±0.1  
±1  
[2]  
[3]  
data pins  
VI = VCC  
-
-
-
0.1  
1  
1
1
µA  
µA  
µA  
VI = 0 V  
5  
IOFF  
power-off leakage current  
bus hold current data input  
VCC = 0 V; VI or VO = 0 V to 4.5 V  
VCC = 3 V  
±100  
IHOLD  
VI = 0.8 V  
75  
150  
-
-
µA  
µA  
VI = 2.0 V  
75  
150  
VCC = 0 V to 3.6 V  
VI = 3.6 V  
±500  
-
-
µA  
µA  
IEX  
external current into output  
output in HIGH-state when  
VO > VCC; VO = 5.5 V and  
-
60  
125  
VCC = 3.0 V  
[4]  
IO(pu/pd) power-up/power-down output  
current  
V
CC 1.2 V; VO = 0.5 V to VCC  
;
-
±1  
±100  
µA  
VI = GND or VCC  
;
nOE = don’t care  
IOZ  
OFF-state output current  
VCC = 3.6 V; VI = VIH or VIL  
output HIGH: VO = 3.0 V  
output LOW: VO = 0.5 V  
-
-
1
5
µA  
µA  
1  
5  
ICC  
quiescent supply current  
VCC = 3.6 V; VI = GND or VCC  
IO = 0 A  
;
outputs HIGH  
outputs LOW  
outputs disabled  
-
-
-
0.13  
2
0.19  
7
mA  
mA  
mA  
[5]  
0.13  
0.19  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
6 of 16  
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
Table 7.  
Static characteristics …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
[6]  
ICC  
additional quiescent supply  
current  
per input pin; VCC = 3 V to 3.6 V;  
one input at VCC 0.6 V and  
other inputs at VCC or GND  
-
0.1  
0.2  
mA  
Ci  
input capacitance  
output capacitance  
VI = 0 V or 3.0 V  
-
-
4
8
-
-
pF  
pF  
Co  
outputs disabled;  
VO = 0 V or 3.0 V  
[1] Typical values are measured at VCC = 3.3 V and Tamb = 25 °C.  
[2] Unused pins at VCC or GND.  
[3] This is the bus hold overdrive current required to force the input to the opposite logic state.  
[4] This parameter is valid for any VCC between 0 V and 1.2 V with a transition time of up to 10 ms. From VCC = 1.2 V to VCC = 3.0 V to  
3.6 V a transition time of 100 µs is permitted. This parameter is valid for Tamb = 25 °C only.  
[5] ICC is measured with outputs pulled to VCC or GND.  
[6] This is the increase in supply current for each input at the specified voltage level other than VCC or GND.  
11. Dynamic characteristics  
Table 8.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8.  
Symbol Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tamb = 40 °C to +85 °C[1]  
tPLH  
tPHL  
tPZH  
tPZL  
tPHZ  
tPLZ  
LOW-to-HIGH propagation delay nAn to nY see Figure 6  
VCC = 2.7 V  
-
-
4.5  
4.0  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.0  
2.7  
HIGH-to-LOW propagation delay nAn to nY see Figure 6  
VCC = 2.7 V  
-
-
4.9  
3.9  
ns  
ns  
VCC = 3.0 V to 3.6 V  
see Figure 7  
1.0  
2.9  
output enable time nOE to nY  
output enable time nOE to nY  
output disable time nOE to nY  
output disable time nOE to nY  
VCC = 2.7 V  
VCC = 3.0 V to 3.6 V  
see Figure 7  
-
-
6.0  
4.7  
ns  
ns  
1.0  
3.4  
VCC = 2.7 V  
-
-
6.5  
4.7  
ns  
ns  
VCC = 3.0 V to 3.6 V  
see Figure 7  
1.1  
3.4  
VCC = 2.7 V  
-
-
5.7  
5.1  
ns  
ns  
VCC = 3.0 V to 3.6 V  
see Figure 7  
1.8  
3.7  
VCC = 2.7 V  
-
-
4.0  
4.5  
ns  
ns  
VCC = 3.0 V to 3.6 V  
1.3  
2.6  
[1] Typical values are at VCC = 3.3 V and Tamb = 25 °C.  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
7 of 16  
 
 
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
12. Waveforms  
V
I
nA input  
V
M
V
M
GND  
t
t
PLH  
PHL  
V
OH  
V
V
M
nY output  
M
V
OL  
mnb072  
VM = 1.5 V.  
VOL and VOH are typical voltage output drop that occur with the output load.  
Fig 6. Propagation delay input (nA) to output (nY)  
V
I
nOE input  
nY output  
nY output  
V
M
t
GND  
t
PZL  
PLZ  
V
CC  
V
V
M
M
V
+ 0.3 V  
OL  
V
OL  
t
t
PHZ  
PZH  
V
OH  
V
0.3 V  
OH  
0 V  
001aac475  
VM = 1.5 V.  
VOL and VOH are typical voltage output drop that occur with the output load.  
Fig 7. Enable and disable times of 3-state outputs  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
8 of 16  
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
EXT  
V
CC  
R
L
V
V
O
I
PULSE  
GENERATOR  
DUT  
R
T
C
L
R
L
001aae235  
Test data is given in Table 9.  
Definitions test circuit:  
RL = Load resistor.  
CL = Load capacitance including jig and probe capacitance.  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
VEXT = Test voltage for switching times.  
Fig 8. Load circuitry for switching times  
Table 9.  
Input  
VI  
Test data  
Load  
CL  
VEXT  
fi  
tW  
tr, tf  
RL  
tPHZ, tPZH tPLZ, tPZL tPLH, tPHL  
2.7 V  
10 MHz 500 ns  
2.5 ns 50 pF  
500 Ω  
GND  
6 V  
open  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
9 of 16  
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
13. Package outline  
SO14: plastic small outline package; 14 leads; body width 3.9 mm  
SOT108-1  
D
E
A
X
v
c
y
H
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
7
e
detail X  
w
M
b
p
0
2.5  
scale  
5 mm  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
8.75  
8.55  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.75  
1.27  
0.05  
1.05  
0.25  
0.01  
0.25  
0.1  
0.25  
0.01  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.35  
0.014 0.0075 0.34  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches  
0.041  
0.01 0.004  
0.069  
Note  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT108-1  
076E06  
MS-012  
Fig 9. Package outline SOT108-1 (SO14)  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
10 of 16  
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm  
SOT337-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
7
1
detail X  
w M  
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
p
p
1
2
3
E
max.  
8o  
0o  
0.21  
0.05  
1.80  
1.65  
0.38  
0.25  
0.20  
0.09  
6.4  
6.0  
5.4  
5.2  
7.9  
7.6  
1.03  
0.63  
0.9  
0.7  
1.4  
0.9  
mm  
2
0.25  
0.65  
1.25  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-19  
SOT337-1  
MO-150  
Fig 10. Package outline SOT337-1 (SSOP14)  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
11 of 16  
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm  
SOT402-1  
D
E
A
X
c
y
H
v
M
A
E
Z
8
14  
Q
(A )  
3
A
2
A
A
1
pin 1 index  
θ
L
p
L
1
7
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
Z
θ
1
2
3
p
E
p
max.  
8o  
0o  
0.15  
0.05  
0.95  
0.80  
0.30  
0.19  
0.2  
0.1  
5.1  
4.9  
4.5  
4.3  
6.6  
6.2  
0.75  
0.50  
0.4  
0.3  
0.72  
0.38  
mm  
1.1  
0.65  
0.25  
1
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT402-1  
MO-153  
Fig 11. Package outline SOT402-1 (TSSOP14)  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
12 of 16  
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;  
14 terminals; body 2.5 x 3 x 0.85 mm  
SOT762-1  
B
A
D
A
A
1
E
c
detail X  
terminal 1  
index area  
C
terminal 1  
index area  
e
1
y
y
e
b
v
M
C
C
A
B
C
1
w
M
2
6
L
1
7
8
E
h
e
14  
13  
9
D
h
X
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
(1)  
(1)  
UNIT  
A
1
b
c
E
e
e
1
y
D
D
E
L
v
w
y
h
h
1
max.  
0.05 0.30  
0.00 0.18  
3.1  
2.9  
1.65  
1.35  
2.6  
2.4  
1.15  
0.85  
0.5  
0.3  
mm  
0.05  
0.1  
1
0.2  
0.5  
2
0.1  
0.05  
Note  
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-10-17  
03-01-27  
SOT762-1  
- - -  
MO-241  
- - -  
Fig 12. Package outline SOT762-1 (DHVQFN14)  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
13 of 16  
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
14. Abbreviations  
Table 10. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
Transistor-Transistor Logic  
TTL  
15. Revision history  
Table 11. Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
74LVT_LVTH125_6 20060306  
Product data sheet  
-
74LVT125_5 (9397 750 14703)  
Modifications:  
Section 4: Added type numbers 74LVTH125D, 74LVTH125DB, 74LVTH125PW and  
74LVTH125BQ.  
74LVT125_5  
74LVT125_4  
74LVT125_3  
74LVT125_2  
74LVT125_1  
20050210  
20050207  
20040624  
19980219  
-
Product data sheet  
Product data sheet  
Product data sheet  
Product specification  
-
-
-
-
-
-
74LVT125_4 (9397 750 14552)  
74LVT125_3 (9397 750 13535)  
74LVT125_2 (9397 750 03514)  
74LVT125_1  
-
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
14 of 16  
 
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.semiconductors.philips.com.  
malfunction of a Philips Semiconductors product can reasonably be expected  
16.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. Philips Semiconductors accepts no liability for inclusion and/or use  
of Philips Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is for the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. Philips Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. Philips Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local Philips Semiconductors  
sales office. In case of any inconsistency or conflict with the short data sheet,  
the full data sheet shall prevail.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Terms and conditions of sale — Philips Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.semiconductors.philips.com/profile/terms, including those  
pertaining to warranty, intellectual property rights infringement and limitation  
of liability, unless explicitly otherwise agreed to in writing by Philips  
16.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, Philips Semiconductors does not give any representations  
or warranties, expressed or implied, as to the accuracy or completeness of  
such information and shall have no liability for the consequences of use of  
such information.  
Semiconductors. In case of any inconsistency or conflict between information  
in this document and such terms and conditions, the latter will prevail.  
No offer to sell or license — Nothing in this document may be interpreted  
or construed as an offer to sell products that is open for acceptance or the  
grant, conveyance or implication of any license under any copyrights, patents  
or other industrial or intellectual property rights.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Suitability for use — Philips Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
17. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
74LVT_LVTH125_6  
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.  
Product data sheet  
Rev. 06 — 6 March 2006  
15 of 16  
 
 
 
 
 
 
74LVT125; 74LVTH125  
Philips Semiconductors  
3.3 V quad buffer; 3-state  
18. Contents  
1
2
3
4
5
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
7
7.1  
8
Functional description . . . . . . . . . . . . . . . . . . . 4  
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 6  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 14  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14  
9
10  
11  
12  
13  
14  
15  
16  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
16.1  
16.2  
16.3  
16.4  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 15  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© Koninklijke Philips Electronics N.V. 2006.  
All rights reserved.  
For more information, please visit: http://www.semiconductors.philips.com.  
For sales office addresses, email to: sales.addresses@www.semiconductors.philips.com.  
Date of release: 6 March 2006  
Document identifier: 74LVT_LVTH125_6  
 

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