933812320115 [NXP]
DIODE 0.6 A, 1000 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, 100H03, 2 PIN, Signal Diode;型号: | 933812320115 |
厂家: | NXP |
描述: | DIODE 0.6 A, 1000 V, SILICON, SIGNAL DIODE, HERMETIC SEALED, GLASS, 100H03, 2 PIN, Signal Diode |
文件: | 总14页 (文件大小:102K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BYD37 series
Fast soft-recovery
controlled avalanche rectifiers
Product specification
1999 Nov 16
Supersedes data of 1996 Jun 05
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
FEATURES
DESCRIPTION
and fatigue free as coefficients of
expansion of all used parts are
matched.
• Glass passivated
Cavity free cylindrical glass package
through Implotec (1) technology.
This package is hermetically sealed
• High maximum operating
temperature
(1) Implotec is a trademark of Philips.
• Low leakage current
• Excellent stability
k
a
handbook, 4 columns
• Guaranteed avalanche energy
absorption capability
MAM061
• Smallest surface mount rectifier
outline
Fig.1 Simplified outline (SOD87) and symbol.
• Shipped in 8 mm embossed tape.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
repetitive peak reverse voltage
BYD37D
−
−
−
−
−
200
400
V
V
V
V
V
BYD37G
BYD37J
600
BYD37K
800
BYD37M
1000
VR
continuous reverse voltage
BYD37D
−
−
−
−
−
−
200
400
600
800
1000
1.5
V
V
V
V
V
A
BYD37G
BYD37J
BYD37K
BYD37M
IF(AV)
average forward current
Ttp = 105 °C; see Fig.2;
averaged over any 20 ms period;
see also Fig.6
IF(AV)
average forward current
Tamb = 60 °C; PCB mounting (see
Fig.11); see Fig.3;
−
0.6
A
averaged over any 20 ms period;
see also Fig.6
IFRM
repetitive peak forward current
Ttp = 105 °C; see Fig.4
−
−
−
13
5.5
20
A
A
A
Tamb = 60 °C; see Fig.5
IFSM
non-repetitive peak forward current
t = 10 ms half sine wave; Tj = Tj max
prior to surge; VR = VRRMmax
1999 Nov 16
2
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
ERSM
non-repetitive peak reverse
avalanche energy
L = 120 mH; Tj = Tj max prior to
surge; inductive load switched off
BYD37D to J
−
10 mJ
mJ
BYD37K and M
−
7
Tstg
Tj
storage temperature
junction temperature
−65
−65
+175 °C
+175 °C
see Fig.7
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
forward voltage
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VF
IF = 1 A; Tj = Tj max
see Fig.8
;
−
−
1.1
V
V
IF = 1 A;
−
−
1.3
see Fig.8
V(BR)R
reverse avalanche breakdown
voltage
IR = 0.1 mA
BYD37D
BYD37G
300
500
700
900
1100
−
−
−
−
−
−
−
−
−
−
V
V
BYD37J
−
V
BYD37K
−
V
BYD37M
−
V
IR
reverse current
VR = VRRMmax; see Fig.9
VR = VRRMmax
1
µA
µA
;
−
100
Tj = 165 °C; see Fig.9
trr
reverse recovery time
BYD37D to J
when switched from
IF = 0.5 A to IR = 1 A;
measured at IR = 0.25A;
see Fig.12
−
−
−
−
250
300
ns
ns
BYD37K and M
Cd
diode capacitance
f = 1 MHz; VR = 0;
see Fig.10
−
20
−
pF
maximum slope of reverse recovery when switched from
dIR
--------
dt
current
BYD37D to J
BYD37K and M
IF = 1 A to VR ≥ 30 V and
dIF/dt = −1 A/µs;
see Fig.13
−
−
−
−
6
5
A/µs
A/µs
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
30
K/W
K/W
note 1
150
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.11.
For more information please refer to the “General Part of associated Handbook”.
1999 Nov 16
3
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
GRAPHICAL DATA
MGA854
MGA855
0.8
3
handbook, halfpage
handbook, halfpage
I
F(AV)
(A)
I
F(AV)
(A)
0.6
2
0.4
0.2
1
0
0
0
0
100
200
100
200
o
o
T
tp
( C)
T
( C)
amb
a = 1.42; VR = VRRMmax; δ = 0.5.
a = 1.42; VR = VRRMmax; δ = 0.5.
Device mounted as shown in Fig.11.
Switched mode application.
Switched mode application.
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
Fig.3 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
MLB268
16
I
FRM
(A)
δ
= 0.05
12
0.1
0.2
8
4
0
0.5
1
2
1
2
3
4
10
10
1
10
10
10
10
t
(ms)
p
Ttp = 105 °C; Rth j-tp = 30 K/W.
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1000 V.
Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
1999 Nov 16
4
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
MLB267
6
I
δ
= 0.05
FRM
(A)
4
0.1
0.2
2
0.5
1
0
10
2
1
2
3
4
10
1
10
10
10
10
t
(ms)
p
Tamb = 60 °C; Rth j-a = 150 K/W.
VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 1000 V.
Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.
MGA861
MGA869
2.4
200
handbook, halfpage
handbook, halfpage
a = 3 2.5
2
1.57
1.42
P
(W)
T
j
o
( C)
1.6
0.8
100
D
G
J
K
M
V
0
0
0
0
400
800
1200
0.8
1.6
(V)
R
I
(A)
F(AV)
a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5.
Solid line = VR.
Dotted line = VRRM; δ = 0.5.
Fig.6 Maximum steady state power dissipation
(forward plus leakage current losses,
excluding switching losses) as a function
of average forward current.
Fig.7 Maximum permissible junction temperature
as a function of reverse voltage.
1999 Nov 16
5
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
MGA853
MGA850
3
6
10
handbook, halfpage
handbook, halfpage
I
I
R
F
(µA)
(A)
2
10
4
10
2
0
1
0
0
1
2
3
100
200
o
( C)
V
(V)
T
j
F
Dotted line: Tj = 175 °C.
Solid line: Tj = 25 °C.
VR = VRRMmax
.
Fig.9 Reverse current as a function of junction
temperature; maximum values.
Fig.8 Forward current as a function of forward
voltage; maximum values.
MGA862
2
10
handbook, halfpage
50
C
d
(pF)
4.5
10
50
D, G, J
K, M
2.5
1
1.25
MSB213
2
3
1
10
10
10
V
(V)
R
f = 1 MHz; Tj = 25 °C.
Dimensions in mm.
Fig.10 Diode capacitance as a function of reverse
voltage; typical values.
Fig.11 Printed-circuit board for surface mounting.
1999 Nov 16
6
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
I
F
DUT
(A)
+
0.5
t
rr
25 V
10 Ω
1 Ω
50 Ω
0
0.25
0.5
t
I
R
(A)
MAM057
1.0
Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns.
Source impedance: 50 Ω; tr ≤ 15 ns.
Fig.12 Test circuit and reverse recovery time waveform and definition.
I
ndbook, halfpage
F
dI
F
dt
t
rr
t
10%
dI
R
dt
100%
I
R
MGC499
Fig.13 Reverse recovery definitions.
1999 Nov 16
7
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
PACKAGE OUTLINE
Hermetically sealed glass surface mounted package;
ImplotecTM(1) technology; 2 connectors
SOD87
k
a
(2)
D
D
1
L
L
H
DIMENSIONS (mm are the original dimensions)
D1
L
D
H
UNIT
0
1
2 mm
scale
2.1
2.0
2.0
1.8
3.7
3.3
mm
0.3
Notes
1. Implotec is a trademark of Philips.
2. The marking indicates the cathode.
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
99-03-31
99-06-04
SOD87
100H03
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Preliminary specification
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Nov 16
8
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
NOTES
1999 Nov 16
9
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
NOTES
1999 Nov 16
10
Philips Semiconductors
Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
NOTES
1999 Nov 16
11
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5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
135002/03/pp12
Date of release: 1999 Nov 16
Document order number: 9397 750 06274
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Cavity free cylindrical glass package through ImplotecÔ (1) technology. This package is hermetically sealed and fatigue free as coefficients
of expansion of all used parts are matched.
Communications
PC/PC-peripherals
(1) Implotec is a trademark of Philips.
Cross reference
Models
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Features
Application notes
Selection guides
Other technical documentation
End of Life information
Datahandbook system
l Glass passivated
l High maximum operating temperature
l Low leakage current
l Excellent stability
l Guaranteed avalanche energy absorption capability
l Smallest surface mount rectifier outline
l Shipped in 8 mm embossed tape.
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BYD37 series Fast soft-recovery controlled
avalanche rectifiers
16-Nov-99
Product
Specification
12
65
Products, packages, availability and ordering
North American
Partnumber
Order code
(12nc)
Partnumber
BYD37D
marking/packing
package device status buy online
BYD37D T/R
BYD37D /T3
BYD37G T/R
BYD37G /T3
BYD37J T/R
BYD37J /T3
BYD37K T/R
9338 122 80115 Standard Marking * Reel Pack, SMD SOD87 Full production
Standard Marking * Reel Pack, SMD,
9338 122 80135
SOD87 Full production
Large
BYD37G
BYD37J
BYD37K
BYD37M
9338 122 90115 Standard Marking * Reel Pack, SMD SOD87 Full production
Standard Marking * Reel Pack, SMD,
Large
9338 122 90135
SOD87 Full production
9338 123 00115 Standard Marking * Reel Pack, SMD SOD87 Full production
Standard Marking * Reel Pack, SMD,
Large
9338 123 00135
SOD87 Full production
9338 123 10115 Standard Marking * Reel Pack, SMD SOD87 Full production
-
Standard Marking * Reel Pack, SMD,
Large
9338 123 10135
SOD87 Full production
BYD37M T/R
BYD37M /T3
9338 123 20115 Standard Marking * Reel Pack, SMD SOD87 Full production
Standard Marking * Reel Pack, SMD,
Large
9338 123 20135
SOD87 Full production
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Copyright © 2000
Royal Philips Electronics
All rights reserved.
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