934055815127 [NXP]

TRANSISTOR 100 A, 55 V, 0.005 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247, PLASTIC PACKAGE-3, FET General Purpose Power;
934055815127
型号: 934055815127
厂家: NXP    NXP
描述:

TRANSISTOR 100 A, 55 V, 0.005 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-247, PLASTIC PACKAGE-3, FET General Purpose Power

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Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
FEATURES  
SYMBOL  
QUICK REFERENCE DATA  
d
’Trench’ technology  
• Very low on-state resistance  
• Fast switching  
VDSS = 55 V  
ID = 100 A  
• Low thermal resistance  
• Logic level compatible  
RDS(ON) 4.2 m(VGS = 10 V)  
g
RDS(ON) 4.5 m(VGS = 5 V)  
s
RDS(ON) 5 m(VGS = 4.5 V)  
GENERAL DESCRIPTION  
PINNING  
SOT429 (TO247)  
SiliconMAXproductsusethelatest  
Philips Trench technology to  
achieve the lowest possible  
on-state resistance in each  
package at each voltage rating.  
PIN  
DESCRIPTION  
1
2
gate  
drain  
Applications:-  
• d.c. to d.c. converters  
• switched mode power supplies  
3
source  
drain  
tab  
2
1
3
The PSMN004-55W is supplied in  
the SOT429 (TO247) conventional  
leaded package.  
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VDSS  
VDGR  
VGS  
Drain-source voltage  
Tj = 25 ˚C to 175˚C  
Tj = 25 ˚C to 175˚C; RGS = 20 k  
-
-
-
55  
55  
± 15  
V
V
V
Drain-gate voltage  
Continuous gate-source  
voltage  
VGSM  
ID  
Peak pulsed gate-source  
voltage  
Continuous drain current  
Tj 150 ˚C  
-
± 20  
V
Tmb = 25 ˚C; VGS = 5 V  
Tmb = 100 ˚C; VGS = 5 V  
Tmb = 25 ˚C  
-
-
-
-
1001  
1001  
300  
300  
175  
A
A
A
W
˚C  
IDM  
PD  
Tj, Tstg  
Pulsed drain current  
Total power dissipation  
Operating junction and  
storage temperature  
Tmb = 25 ˚C  
- 55  
1 Maximum continuous current limited by package.  
October 1999  
1
Rev 1.100  
Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
AVALANCHE ENERGY LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
EAS Non-repetitive avalanche  
CONDITIONS  
MIN.  
MAX.  
UNIT  
Unclamped inductive load, IAS = 100 A;  
tp = 100 µs; Tj prior to avalanche = 25˚C;  
-
357  
mJ  
energy  
VDD 25 V; RGS = 50 ; VGS = 5 V; refer to  
fig:15  
IAS  
Non-repetitive avalanche  
current  
-
100  
A
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
Rth j-mb  
Thermal resistance junction  
to mounting base  
-
-
0.5  
K/W  
Rth j-a  
Thermal resistance junction in free air  
to ambient  
-
45  
-
K/W  
ELECTRICAL CHARACTERISTICS  
Tj= 25˚C unless otherwise specified  
SYMBOL PARAMETER  
V(BR)DSS Drain-source breakdown  
CONDITIONS  
MIN. TYP. MAX. UNIT  
VGS = 0 V; ID = 0.25 mA;  
55  
-
-
-
-
V
V
voltage  
Tj = -55˚C  
42  
VGS(TO)  
Gate threshold voltage  
VDS = VGS; ID = 1 mA  
1
0.5  
1.5  
-
-
3.2  
3.6  
3.8  
6.2  
0.02 100  
0.05  
-
2
-
2.3  
4.2  
4.5  
5
V
V
V
mΩ  
mΩ  
mΩ  
mΩ  
nA  
µA  
µA  
Tj = 175˚C  
Tj = -55˚C  
-
-
-
-
-
-
-
-
RDS(ON)  
Drain-source on-state  
resistance  
VGS = 10 V; ID = 25 A  
VGS = 5 V; ID = 25 A  
VGS = 4.5 V; ID = 25 A  
VGS = 5 V; ID = 25 A; Tj = 175˚C  
9.5  
IGSS  
IDSS  
Gate-source leakage current VGS = ±10 V; VDS = 0 V;  
Zero gate voltage drain  
current  
VDS = 55 V; VGS = 0 V;  
10  
500  
Tj = 175˚C  
Qg(tot)  
Qgs  
Qgd  
Total gate charge  
Gate-source charge  
Gate-drain (Miller) charge  
ID = 100 A; VDD = 44 V; VGS = 5 V  
-
-
-
226  
36  
106  
-
-
-
nC  
nC  
nC  
td on  
tr  
td off  
tf  
Turn-on delay time  
Turn-on rise time  
Turn-off delay time  
Turn-off fall time  
VDD = 30 V; RD = 1.2 ;  
VGS = 10 V; RG = 5.6 Ω  
Resistive load  
-
-
-
-
26  
-
-
-
-
ns  
ns  
ns  
ns  
118  
848  
336  
Ld  
Ld  
Ls  
Internal drain inductance  
Internal drain inductance  
Internal source inductance  
Measured tab to centre of die  
Measured from drain lead to centre of die  
Measured from source lead to source  
bond pad  
-
-
-
3.5  
4.5  
7.5  
-
-
-
nH  
nH  
nH  
Ciss  
Coss  
Crss  
Input capacitance  
Output capacitance  
Feedback capacitance  
VGS = 0 V; VDS = 25 V; f = 1 MHz  
-
-
-
13  
1900  
1250  
-
-
-
nF  
pF  
pF  
October 1999  
2
Rev 1.100  
Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS  
Tj = 25˚C unless otherwise specified  
SYMBOL PARAMETER  
CONDITIONS  
MIN. TYP. MAX. UNIT  
IS  
Continuous source current  
(body diode)  
Pulsed source current (body  
diode)  
Diode forward voltage  
-
-
100  
A
A
V
ISM  
VSD  
-
-
300  
IF = 25 A; VGS = 0 V  
IF = 75 A; VGS = 0 V  
-
-
0.78  
0.92  
1.2  
-
trr  
Qrr  
Reverse recovery time  
Reverse recovery charge  
IF = 20 A; -dIF/dt = 100 A/µs;  
VGS = -10 V; VR = 20 V  
-
-
150  
0.7  
-
-
ns  
µC  
October 1999  
3
Rev 1.100  
Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
Transient thermal impedance, Zth j-mb (K/W)  
Normalised Power Derating, PD (%)  
100  
1
0.1  
D = 0.5  
0.2  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0.1  
0.05  
0.02  
P
D = tp/T  
D
tp  
0.01  
single pulse  
T
0.001  
0
1E-06  
1E-05  
1E-04  
1E-03  
1E-02  
1E-01  
1E+00  
0
25  
50  
75  
100  
125  
150  
175  
Pulse width, tp (s)  
Mounting Base temperature, Tmb (C)  
Fig.1. Normalised power dissipation.  
PD% = 100 PD/PD 25 ˚C = f(Tmb)  
Fig.4. Transient thermal impedance.  
Zth j-mb = f(t); parameter D = tp/T  
Drain Current, ID (A)  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Normalised Current Derating, ID (%)  
10 V  
VGS = 10V  
Tj = 25 C  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
2.5 V  
2.4 V  
2.3 V  
2.2 V  
2.1 V  
2 V  
0
25  
50  
75  
100  
125  
150  
175  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
1.8  
2
Mounting Base temperature, Tmb (C)  
Drain-Source Voltage, VDS (V)  
Fig.2. Normalised continuous drain current.  
ID% = 100 ID/ID 25 ˚C = f(Tmb); conditions: VGS 5 V  
Fig.5. Typical output characteristics, Tj = 25 ˚C.  
ID = f(VDS)  
Peak Pulsed Drain Current, IDM (A)  
1000  
Drain-Source On Resistance, RDS(on) (Ohms)  
0.02  
RDS(on) = VDS/ ID  
tp = 10 us  
2.5 V  
2.2 V 2.3 V  
2.4 V  
2 V  
Tj = 25 C  
0.018  
0.016  
0.014  
0.012  
0.01  
2.1 V  
100 us  
100  
1 ms  
10 ms  
D.C.  
0.008  
0.006  
0.004  
0.002  
0
10  
1
100 ms  
5 V  
VGS = 10V  
1
10  
Drain-Source Voltage, VDS (V)  
100  
0
10  
20  
30  
40  
50  
60  
70  
80  
90 100  
Drain Current, ID (A)  
Fig.3. Safe operating area. Tmb = 25 ˚C  
ID & IDM = f(VDS); IDM single pulse; parameter tp  
Fig.6. Typical on-state resistance, Tj = 25 ˚C.  
RDS(ON) = f(ID)  
October 1999  
4
Rev 1.100  
Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
Threshold Voltage, VGS(TO) (V)  
Drain current, ID (A)  
2.25  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VDS > ID X RDS(ON)  
2
1.75  
1.5  
1.25  
1
maximum  
typical  
minimum  
0.75  
0.5  
0.25  
0
175 C  
Tj = 25 C  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
2.2 2.4 2.6 2.8  
3
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
Junction Temperature, Tj (C)  
Gate-source voltage, VGS (V)  
Fig.7. Typical transfer characteristics.  
ID = f(VGS)  
Fig.10. Gate threshold voltage.  
VGS(TO) = f(Tj); conditions: ID = 1 mA; VDS = VGS  
Transconductance, gfs (S)  
VDS > ID X RDS(ON)  
Drain current, ID (A)  
220  
200  
180  
160  
140  
120  
100  
80  
1.0E-01  
Tj = 25 C  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
1.0E-06  
175 C  
minimum  
typical  
maximum  
60  
40  
20  
0
0
0.5  
1
1.5  
2
2.5  
3
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Gate-source voltage, VGS (V)  
Drain current, ID (A)  
Fig.8. Typical transconductance, Tj = 25 ˚C.  
gfs = f(ID)  
Fig.11. Sub-threshold drain current.  
ID = f(VGS); conditions: Tj = 25 ˚C; VDS = VGS  
Normalised On-state Resistance  
2.4  
2.2  
2
Capacitances, Ciss, Coss, Crss (pF)  
100000  
1.8  
1.6  
1.4  
1.2  
1
Ciss  
10000  
1000  
100  
Coss  
Crss  
0.8  
0.6  
0.4  
0.2  
0
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
0.1  
1
10  
100  
Junction temperature, Tj (C)  
Drain-Source Voltage, VDS (V)  
Fig.9. Normalised drain-source on-state resistance.  
RDS(ON)/RDS(ON)25 ˚C = f(Tj)  
Fig.12. Typical capacitances, Ciss, Coss, Crss.  
C = f(VDS); conditions: VGS = 0 V; f = 1 MHz  
October 1999  
5
Rev 1.100  
Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
Gate-source voltage, VGS (V)  
15  
Maximum Avalanche Current, IAS (A)  
1000  
ID = 100 A  
14  
13  
12  
11  
10  
9
Tj = 25 C  
25 C  
100  
10  
1
VDD = 11 V  
8
7
6
5
4
3
2
1
0
VDD = 44 V  
Tj prior to avalanche = 150 C  
0
40  
80 120 160 200 240 280 320 360 400 440  
Gate charge, QG (nC)  
0.001  
0.01  
0.1  
Avalanche time, tAV (ms)  
1
10  
Fig.13. Typical turn-on gate-charge characteristics.  
VGS = f(QG)  
Fig.15. Maximum permissible non-repetitive  
avalanche current (IAS) versus avalanche time (tAV);  
unclamped inductive load  
Source-Drain Diode Current, IF (A)  
100  
VGS = 0 V  
90  
80  
70  
60  
50  
40  
175 C  
30  
Tj = 25 C  
20  
10  
0
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9  
Source-Drain Voltage, VSDS (V)  
1
1.1 1.2  
Fig.14. Typical reverse diode current.  
IF = f(VSDS); conditions: VGS = 0 V; parameter Tj  
October 1999  
6
Rev 1.100  
Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
MECHANICAL DATA  
Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3-lead TO-247  
SOT429  
α
E
P
A
A
1
β
q
S
R
D
Y
(1)  
L
1
Q
b
2
L
1
2
3
c
b
1
w
M
b
e
e
0
10  
20 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
β
A
A
b
b
b
2
c
D
E
e
L
L
1
P
Q
q
R
S
w
Y
α
UNIT  
mm  
1
1
1.9  
1.7  
1.2  
0.9  
3.7  
3.3  
2.6  
2.4  
7.5  
7.1  
15.7  
15.3  
6°  
4°  
17°  
13°  
5.3  
4.7  
2.2  
1.8  
3.2  
2.8  
0.9  
0.6  
21  
20  
16  
15  
16  
15  
4.0  
3.6  
3.5  
3.3  
5.45  
5.3  
0.4  
Note  
1. Tinning of terminals are uncontrolled within zone L  
.
1
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
98-04-07  
99-08-04  
SOT429  
TO-247  
Fig.16. SOT429; pin 2 connected to mounting base  
Notes  
1. Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent  
damage to MOS gate oxide.  
2. Refer to mounting instructions for SOT429 envelope.  
3. Epoxy meets UL94 V0 at 1/8".  
October 1999  
7
Rev 1.100  
Philips Semiconductors  
Product specification  
N-channel logic level TrenchMOS transistor  
PSMN004-55W  
DEFINITIONS  
Data sheet status  
Objective specification  
This data sheet contains target or goal specifications for product development.  
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.  
Product specification  
This data sheet contains final product specifications.  
Limiting values  
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and  
operation of the device at these or at any other conditions above those given in the Characteristics sections of  
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
Philips Electronics N.V. 1999  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the  
copyright owner.  
The information presented in this document does not form part of any quotation or contract, it is believed to be  
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under patent or other  
industrial or intellectual property rights.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices or systems where malfunction of these  
products can be reasonably expected to result in personal injury. Philips customers using or selling these products  
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting  
from such improper use or sale.  
October 1999  
8
Rev 1.100  
it Q  
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PSMN004-55W; N-  
channel logic level  
TrenchMOS(tm)  
transistor  
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SiliconMAX products use the latest Philips Trench technology to achieve the lowest possible on-state  
resistance in each package at each voltage rating.  
Cross-reference  
Packages  
End of Life  
information  
Distributors Go  
Here!  
The PSMN004-55W is supplied in the SOT429 (TO247) conventional leaded package.  
to
Features  
Models  
SoC solutions  
’Trench’ technology  
Very low on-state resistance  
Fast switching  
Low thermal resistance  
Logic level compatible  
to
Applications  
d.c. to d.c. converters  
switched mode power supplies  
 
to
Datasheet  
Type number Title  
Publication  
release date  
Datasheet status Page  
File Datasheet  
count size  
(kB)  
PSMN004-  
55W  
N-channel logic level 10/1/1999  
TrenchMOS(tm)  
Product  
specification  
8
97  
Download  
Down  
transistor  
to
Parametrics  
Type number Package  
V
(V) Configuration  
I DC(A) R  
(mOhm) Q  
DS  
D
DS(on) gd  
(typ)(nC)  
4.2@10V  
4.5@5V  
5@4.5V  
SOT429 (TO-247)  
PSMN004-55W  
55  
Single N-channel 100  
106  
to
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North  
Ordering code Marking/Packing Package Device status Buy online  
Discretes  
number  
American (12NC)  
type  
Down  
packing info  
number  
Standard Marking  
9340 558 15127 * Horizontal, Rail  
Pack  
SOT429  
PSMN004- PSMN004-  
55W 55W  
Full production  
(TO-247)  
-
order this  
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