935213280112 [NXP]

IC COLOR SIGNAL DECODER, PDSO20, SOT-163, Color Signal Converter;


型号：	935213280112
厂家：	NXP
描述：	IC COLOR SIGNAL DECODER, PDSO20, SOT-163, Color Signal Converter 光电二极管商用集成电路
文件：	总12页 (文件大小：93K)
中文：	中文翻译
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INTEGRATED CIRCUITS

DATA SHEET

TDA8395

SECAM decoder

October 1991

Preliminary speciﬁcation

File under Integrated Circuits, IC02

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

FEATURES

• Fully integrated filters

• Alignment free

• For use with baseband delay

GENERAL DESCRIPTION

The TDA8395 is a self-calibrating, fully integrated SECAM decoder. The IC should preferably be used in conjunction with

the PAL/NTSC decoder TDA8362 or TDA8366 and with the switched capacitor baseband delay circuit TDA4660. The IC

incorporates HF and LF filters, a demodulator and an identification circuit (luminance is not processed in this IC). The IC

needs no adjustments and very few external components are required. A highly stable reference frequency is required

for calibration and a two-level sandcastle pulse for blanking and burst gating.

QUICK REFERENCE DATA

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

8.8

UNIT

V_P

positive supply voltage; pin 3

total power dissipation

7.2

−

P_tot

−

220

1.5

V_16(p-p)

V_O(p-p)

composite video input voltage

(peak-to-peak value); pin 16

−

1.0

−(R−Y) output voltage amplitude

(peak-to-peak value); pin 9

−

1.05

1.33

−

−(B−Y) output voltage amplitude

(peak-to-peak value); pin 10

ORDERING INFORMATION

PACKAGE

MATERIAL

plastic

EXTENDED TYPE NUMBER

PINS

PIN POSITION

CODE

TDA8395

DIL

SOT38GE1⁽¹⁾

Note

1. SOT38-1; 1996 December 3.

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

Fig.1 Block diagram.

PINNING

SYMBOL

DESCRIPTION

f_ref/IDENT

reference frequency

input/identiﬁcation input

TEST

V_P

test output

positive supply voltage

not connected

n.c.

not connected

GND

CLOCHE_ref

PLL_ref

−(R−Y)

−(B−Y)

n.c.

ground

Cloche reference ﬁlter

PLL reference

−(R−Y) output

−(B−Y) output

not connected

n.c.

not connected

n.c.

not connected

n.c.

not connected

SAND

CVBS

sandcastle pulse input

video (chrominance) input

Fig.2 Pin configuration

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

colour-on is transmitted to pin 1 (current is sunk). If the

signal request is granted (i.e. pin 1 is HIGH therefore no

PAL) the colour difference outputs (−(B−Y) and −(R−Y))

from the TDA8362 are high impedance and the output

signals from the TDA8395 are switched ON.

FUNCTIONAL DESCRIPTION

The TDA8395 is a self-calibrating SECAM decoder

designed for use with a baseband delay circuit.

During frame retrace a 4.433619 MHz reference frequency

is used to calibrate the filters and the demodulator. The

reference frequency should be very stable during this

period.

If no SECAM signal is decoded during a two-frame period

the demodulator will be initialized before another attempt

is made also during a two-frame period. The CD outputs

will be blanked or high-impedance depending on the logic

level at pin 1.

The Cloche filter is a gyrator-capacitor type filter the

resonance frequency of which is controlled during the

calibration period and offset during scan; this ensures the

correct frequency during calibration.

A two-level sandcastle pulse generates the required

blanking periods and, also, clocks the digital identification

pulse on the falling edge of the burst gate pulse. To enable

the calibration period to be defined the vertical retrace is

discriminated from the horizontal retrace, this is achieved

by measuring the width of the blanking period.

The demodulator is a Phase-Locked Loop (PLL) type

demodulator which uses the frequency reference and the

bandgap reference to force the PLL to the required

demodulation characteristic.

The low frequency de-emphasis is matched to the PLL and

is controlled by the tuning voltage of the PLL.

A digital identification circuit scans the incoming signal for

SECAM (only line-identification is implemented). The

identification circuit needs to communicate with the

TDA8362 to guarantee that the output signal from the

decoder is only available when no PAL signal has been

identified. If a SECAM signal is decoded a request for

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)

SYMBOL

PARAMETER

positive supply voltage

MIN.

MAX.

UNIT

V_P

−

8.8

T_stg

storage temperature range

−25

+150

+70

°C

T_amb

operating ambient temperature range

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

CHARACTERISTICS

V_P= 8.0 V; T_amb= 25 °C; unless otherwise speciﬁed

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply (pin 3)

V_P

I_P

positive supply voltage

supply current

7.2

8.0

8.8

−

P_tot

total power dissipation

144

220

CVBS input (pin 16)

V_16(p-p)composite video input voltage

−

1.0

−

1.5

300

−

(peak-to-peak value)

V_16(p-p)

chrominance input voltage

(peak-to-peak value)

note 1

−

kΩ

Z_I

input impedance

note 2

CLOCHE (pin 7)

V_tc

f₀

tuning voltage

resonance frequency

bandwidth

2.5

3.5

4.5

note 3

4.266

241

4.286

268

4.306

295

MHz

kHz

Demodulator

V_td

tuning voltage; pin 8

3.5

−

4.8

V_O(p-p)

output voltage amplitude

(peak-to-peak value); pin 9

100/75 colour bar

0.97

1.05

1.13

V_O(p-p)

NLE

output voltage amplitude

(peak-to-peak value); pin 10

1.23

1.33

1.43

non-linearity error

100/75 colour bar;

note 4

−

−(B−Y)/−(R−Y) ratio of −(B−Y) and −(R−Y)

1.23

1.27

−

1.32

f_be−(R−Y)

f_be−(B−Y)

V_O

black-level error −(R−Y)

black-level error −(B−Y)

note 5

−

kHz

−

output voltage level during

blanking

2.8

B_O

S/N

f_p

output bandwidth

−

1.3

−

MHz

signal-to-noise ratio

note 6

−

pole-frequency LF

de-emphasis

kHz

f_p/f₀

ratio of pole and zero

frequency

−

V_rh(p-p)

Z_O(e)

Z_O(d)

residual harmonic voltage

(peak-to-peak value)

600

−

Ω

output impedance SECAM

enabled

pin 1 HIGH

pin 1 LOW

output impedance SECAM

disabled

MΩ

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Sandcastle pulse

V_bl

V_bg

t_f

blanking detection level

1.0

1.25

1.5

burst gate detection level

3.5

8.5

3.85

9.0

4.2

9.5

falling edge of burst gate to

start sync

µs

Reference/communication

f_ref

reference frequency

note 7

−

4.4336

−

MHz

V_ref(p-p)

reference voltage amplitude

(peak-to-peak value)

0.20

−

0.50

V_ed

V_dd

I_s

SECAM enable detection

level; pin 1

−

2.8

2.0

150

3.3

−

SECAM disabled detection

level; pin 1

note 8

note 9

1.5

−

sink current at SECAM

identiﬁcation; pin 1

−

µA

Identiﬁcation

t_i

identiﬁcation time

−

frames

colour on/off hysteresis

−

Notes to the characteristics

1. If measured in the burst-period of a blue line.

2. The video input is AC-coupled.

3. During scan.

4. Measured as 100% x (IV_uI - IV_II) / (IV_uI + IV_lI); see Fig.3.

5. Converted to input frequency error.

6. Defined as the ratio between the peak-to-peak value of the B−Y component of the demodulated 100/75 colour bar

and the peak-to-peak value of the noise.

7. The reference should be stable during frame blanking.

8. The SECAM enable and disable timing should preferably be at the end of the frame blanking.

9. The externally supplied voltage should exceed 0.5 V.

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

Fig.3 Non-linearity definition.

TIMING

Fig.4 Timing waveforms.

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

APPLICATION INFORMATION

The leakage current at pin 8 should be well below 20 nA to meet the specification of the black levels (C8 = 220 nF).

The leakage current at pin 7 should be well below 60 nA to meet the specification of the Cloche resonance frequency

(C7 = 100 nF).

The capacitors C7 and C8 should be connected to the ground pin as close as possible to the package. If not, this can

result in a black level error for both channels.

TEST INFORMATION

The performance of the Cloche filter can be measured at pin 2. The use of a FET-probe is advised for low capacitive

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

SOT38-1

w M

(e )

pin 1 index

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

UNIT

max.

min.

max.

1.40

1.14

0.53

0.38

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

8.25

7.80

9.5

8.3

4.7

0.51

3.7

2.54

0.10

7.62

0.30

0.254

0.01

2.2

0.021

0.015

0.013

0.009

0.86

0.84

0.32

0.31

0.055

0.045

0.26

0.24

0.15

0.13

0.37

0.33

inches

0.19

0.020

0.15

0.087

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

92-10-02

95-01-19

SOT38-1

050G09

MO-001AE

October 1991

Philips Semiconductors

Preliminary speciﬁcation

SECAM decoder

TDA8395

SOLDERING

Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and

surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for

surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often

used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook” (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the

joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the printed-circuit board has been pre-heated, forced cooling may

be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more

than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

October 1991

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The TDA8395 is a self-calibrating, fully integrated SECAM decoder. The IC should preferably be used in conjunction with the PAL/NTSC

decoder TDA8362 or TDA8366 and with the switched capacitor baseband delay circuit TDA4660. The IC incorporates HF and LF filters, a

demodulator and an identification circuit (luminance is not processed in this IC). The IC needs no adjustments and very few external

components are required. A highly stable reference frequency is required for calibration and a two-level sandcastle pulse for blanking and

burst gating.

PC/PC-peripherals

Cross reference

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Packages

Features

Application notes

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