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935227450551 [NXP]

IC TRIPLE, PARALLEL, WORD INPUT LOADING, 0.01 us SETTLING TIME, 10-BIT DAC, PQFP48, PLASTIC, LQFP-48, Digital to Analog Converter;
935227450551
型号： 935227450551
厂家： NXP    NXP
描述：

IC TRIPLE, PARALLEL, WORD INPUT LOADING, 0.01 us SETTLING TIME, 10-BIT DAC, PQFP48, PLASTIC, LQFP-48, Digital to Analog Converter

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INTEGRATED CIRCUITS  
DATA SHEET  
TDA8775  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
1996 Aug 14  
Preliminary specification  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
FEATURES  
APPLICATIONS  
• 10-bit resolution  
• General purpose high-speed digital-to-analog  
conversion  
• Sampling rate up to:  
• Digital TV  
– 50 MHz for normal mode; RL = 37.5 Ω  
– 35 MHz for LOW power mode; RL = 150 Ω  
• Internal current reference  
• Graphic display  
• Desktop video processing.  
• Current reference selector for:  
– normal mode, RL = 37.5 Ω (typ.)  
– low-power mode, RL = 150 Ω (typ.)  
• No deglitching circuit required  
• SYNC and BLANK control inputs  
• 0.66 V output voltage range on red and blue channels  
GENERAL DESCRIPTION  
The TDA8775 consists of three 10-bit video  
Digital-to-Analog Converters (DACs). They convert the  
digital input signals into current outputs at a maximum  
conversion rate of 50 MHz.  
The DACs are based on current source architecture with  
selectable current reference.  
• 1 V output voltage range on green channel  
(including sync)  
The devices are fabricated in a 5 V CMOS process that  
ensures high functionality with low power dissipation.  
• BLANK control input on the 3 channels  
• + 5 V power supply.  
QUICK REFERENCE DATA  
SYMBOL  
VDDA  
PARAMETER  
CONDITIONS  
MIN.  
4.5  
TYP.  
5.0  
MAX.  
5.5  
UNIT  
analog supply voltage  
digital supply voltage  
analog supply current  
V
V
VDDD  
4.5  
−
5.0  
67  
16  
15  
10  
±1  
±0.7  
−
5.5  
tbf  
tbf  
tbf  
tbf  
±2  
±1.0  
−
IDDA  
SLT = 1; RL = 37.5 Ω  
SLT = 0; RL = 150 Ω  
SLT = 1; RL = 37.5 Ω  
SLT = 0; RL = 150 Ω  
mA  
−
mA  
IDDD  
digital supply current  
−
mA  
−
mA  
INL  
DC integral non-linearity  
DC differential non-linearity  
maximum clock frequency  
−
LSB  
LSB  
MHz  
MHz  
mW  
DNL  
−
fclk(max)  
SLT = 1; RL = 37.5 Ω  
SLT = 0; RL = 150 Ω  
50  
35  
−
−
−
Ptot  
total power dissipation  
SLT = 1; RL = 37.5 Ω;  
410  
tbf  
fclk = 50 MHz  
SLT = 0; RL = 150 Ω;  
−
130  
tbf  
mW  
fclk = 35 MHz  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TDA8775G  
LQFP48  
plastic low profile quad flat package; 48 leads; body 7 × 7 × 1.4 mm  
SOT313-2  
1996 Aug 14  
2
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
BLOCK DIAGRAM  
V
V
V
V
V
DDA1  
38  
DDA2  
41  
DDA3  
45  
DDD1  
DDD2  
37  
11  
4
red  
10-7  
digital inputs  
(bits R0 to R3)  
25  
46  
LSB  
DECODER  
CLK  
TDA8775  
red  
6
6-1  
MSB  
DECODER  
CURRENT  
SOURCE  
digital inputs  
(bits R4 to R9)  
OUTR  
green  
digital inputs  
(bits G0 to G3)  
24-21  
4
LSB  
DECODER  
green  
digital inputs  
(bits G4 to G9)  
6
20-15  
35-32  
MSB  
DECODER  
CURRENT  
SOURCE  
44  
OUTG  
47  
43  
40  
blue  
digital inputs  
(bits B0 to B3)  
VSSA3  
VSSA2  
VSSA1  
4
LSB  
DECODER  
blue  
digital inputs  
(bits B4 to B9)  
6
31-26  
MSB  
DECODER  
42  
CURRENT  
SOURCE  
OUTB  
BLANK  
control input  
14  
13  
CONTROL  
REGISTER  
CURRENT  
REFERENCE  
SYNC  
control input  
48  
39  
12  
36  
MGE965  
SLT reference current  
decoupling input  
V
V
SSD2  
SSD1  
(I  
)
ref  
Fig.1 Block diagram.  
3
1996 Aug 14  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
PINNING  
SYMBOL  
PIN  
DESCRIPTION  
R9  
R8  
R7  
R6  
R5  
R4  
R3  
R2  
R1  
R0  
1
red digital input data; bit 9 (MSB)  
red digital input data; bit 8  
red digital input data; bit 7  
red digital input data; bit 6  
red digital input data; bit 5  
red digital input data; bit 4  
red digital input data; bit 3  
red digital input data; bit 2  
red digital input data; bit 1  
red digital input data; bit 0 (LSB)  
digital supply voltage 1  
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
VDDD1  
VSSD1  
SYNC  
BLANK  
G9  
digital supply ground 1  
composite sync control input; for green channel only (active LOW)  
composite blank control input (active LOW)  
green digital input data; bit 9 (MSB)  
green digital input data; bit 8  
green digital input data; bit 7  
green digital input data; bit 6  
green digital input data; bit 5  
green digital input data; bit 4  
green digital input data; bit 3  
green digital input data; bit 2  
green digital input data; bit 1  
green digital input data; bit 0 (LSB)  
clock input  
G8  
G7  
G6  
G5  
G4  
G3  
G2  
G1  
G0  
CLK  
B9  
blue digital input data; bit 9 (MSB)  
blue digital input data; bit 8  
blue digital input data; bit 7  
blue digital input data; bit 6  
blue digital input data; bit 5  
blue digital input data; bit 4  
blue digital input data; bit 3  
blue digital input data; bit 2  
blue digital input data; bit 1  
blue digital input data; bit 0 (LSB)  
digital supply ground 2  
B8  
B7  
B6  
B5  
B4  
B3  
B2  
B1  
B0  
VSSD2  
VDDD2  
VDDA1  
Iref  
digital supply voltage 2  
analog supply voltage 1  
decoupling pin for reference current  
analog supply ground 1  
VSSA1  
1996 Aug 14  
4
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
SYMBOL  
VDDA2  
PIN  
DESCRIPTION  
41  
42  
43  
44  
45  
46  
47  
48  
analog supply voltage 2  
blue analog output  
OUTB  
VSSA2  
OUTG  
VDDA3  
OUTR  
VSSA3  
SLT  
analog supply ground 2  
green analog output  
analog supply voltage 3  
red analog output  
analog supply ground 3  
mode selection; normal mode, RL = 37.5 Ω (active HIGH); low power mode,  
RL = 150 Ω (active LOW)  
V
1
2
36  
35  
R9  
R8  
R7  
R6  
R5  
R4  
R3  
R2  
R1  
R0  
SSD2  
B0  
3
34 B1  
33  
4
B2  
5
32 B3  
31 B4  
6
TDA8775  
7
B5  
30  
29 B6  
B7  
8
9
28  
27 B8  
26  
10  
11  
12  
V
B9  
DDD1  
V
25 CLK  
SSD1  
MGE964  
Fig.2 Pin configuration.  
5
1996 Aug 14  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
PARAMETER  
analog supply voltage  
MIN.  
−0.5  
MAX.  
+6.5  
UNIT  
VDDA  
VDDD  
∆VDD  
Tstg  
V
digital supply voltage  
−0.5  
−1.0  
−55  
0
+6.5  
+1.0  
+150  
70  
V
supply voltage difference between VDDA and VDDD  
storage temperature  
V
°C  
°C  
°C  
Tamb  
Tj  
operating ambient temperature  
junction temperature  
−
125  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE (TYP.)  
72  
UNIT  
Rth j-a  
thermal resistance from junction to ambient in free air  
K/W  
HANDLING  
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is  
desirable to take normal precautions appropriate to handling integrated circuits.  
CHARACTERISTICS  
TDA8775 operating at 50 MHz; SLT = 1 and RL = 37.5 Ω.  
VDDA = VDDD = 4.5 to 5.5 V; VSSA and VSSD shorted together; VDDA − VDDD = −0.5 to +0.5 V; Tamb = 0 to +70 °C; typical  
values measured at VDDA = VDDD = 5 V and Tamb = 25 °C; unless otherwise specified.  
SYMBOL  
Supplies  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
VDDA  
VDDD  
IDDA  
analog supply voltage  
digital supply voltage  
analog supply current  
4.5  
4.5  
−
5.0  
5.5  
V
5.0  
67  
16  
15  
10  
5.5  
tbf  
tbf  
tbf  
tbf  
V
SLT = 1; RL = 37.5 Ω  
SLT = 0; RL = 150 Ω  
SLT = 1; RL = 37.5 Ω  
SLT = 0; RL = 150 Ω  
mA  
mA  
mA  
mA  
−
IDDD  
digital supply current  
−
−
Inputs  
CLOCK INPUT (PIN 25)  
VIL  
VIH  
LOW level input voltage  
HIGH level input voltage  
V
SSD − 0.5  
−
−
0.8  
V
2.0  
VDDD + 0.5 V  
BLANK AND SYNC INPUTS (PINS 13 AND 14; ACTIVE LOW)  
VIL  
VIH  
LOW level input voltage  
HIGH level input voltage  
V
SSD − 0.5  
−
−
0.8  
V
2.0  
VDDD + 0.5 V  
R, G AND B DIGITAL INPUTS (PINS 1 TO 10, 15 TO 24 AND 26 TO 35)  
VIL  
VIH  
LOW level input voltage  
HIGH level input voltage  
V
SSD − 0.5  
−
−
0.8  
V
2.0  
VDDD + 0.5 V  
1996 Aug 14  
6
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Timing (CL = 25 pF); see Fig.4  
fclk(max)  
maximum clock frequency  
SLT = 1; RL = 37.5 Ω  
SLT = 0; RL = 150 Ω  
50  
35  
6
−
−
−
−
−
4
4
−
−
MHz  
−
−
−
−
−
−
−
MHz  
ns  
tCPH  
tCPL  
tr  
clock pulse width HIGH  
clock pulse width LOW  
clock rise time  
6
ns  
−
ns  
tf  
clock fall time  
−
ns  
tSU;DAT  
tHD;DAT  
input data set-up time  
input data hold time  
4
ns  
2.5  
ns  
Outputs  
OUTB, OUTR AND OUTG ANALOG OUTPUTS (PINS 42, 46 AND 44, REFERENCED TO VSSA) FOR 37.5 Ω LOAD  
VOUTmax maximum output voltage  
BLANK and SYNC active  
R and B channels  
G channel  
−
−
−
0.714  
1.0  
−
−
−
V
V
THD  
ZL  
total harmonic distortion  
output load impedance  
fi = 4.43 MHz; SLT = 1;  
−52  
dB  
fclk = 50 MHz; RL = 37.5 Ω  
fi = 4.43 MHz; SLT = 0;  
fclk = 35 MHz; RL = 150 Ω  
−
−50  
−
dB  
SLT = 1  
SLT = 0  
tbf  
tbf  
37.5  
150  
tbf  
tbf  
Ω
Ω
Transfer function  
INL  
DNL  
αct  
DC integral non-linearity  
−
±1  
±2  
±1.0  
−
LSB  
LSB  
dB  
DC differential non-linearity  
crosstalk DAC to DAC  
DAC to DAC matching  
−
±0.7  
−
tbf  
−
1.0  
tbf  
%
Switching characteristics; see Fig.5  
td  
input to 50% output delay  
time  
full-scale change;  
SLT = 1; RL = 37.5 Ω  
−
−
−
−
−
−
tbf  
tbf  
4
−
−
−
−
−
−
ns  
ns  
ns  
ns  
ns  
ns  
full-scale change;  
SLT = 0; RL = 150 Ω  
ts1  
settling time  
settling time  
10 to 90% full-scale change;  
SLT = 1; RL = 37.5 Ω  
10 to 90% full-scale change;  
SLT = 0; RL = 150 Ω  
10  
tbf  
tbf  
ts2  
to ±1 LSB; SLT = 1;  
RL = 37.5 Ω  
to ±1 LSB; SLT = 0;  
RL = 150 Ω  
Output transients (glitches)  
Vg  
area for 1 LSB change  
−
tbf  
−
LSB.ns  
1996 Aug 14  
7
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
Table 1 Input coding and DAC output currents (typical values)  
DAC OUTPUT CURRENT DAC OUTPUT CURRENT  
(mA)  
(mA)  
BINARY INPUT  
SLT = 1; RL = 37.5 Ω  
SLT = 0; RL = 150 Ω  
R, B  
R, B  
SYNC  
BLANK  
DATA  
CODE  
G Channel  
Channels  
G Channel  
Channels  
0
1
0
0
0
1
XXH  
XXH  
00H  
−
−
0
0
0
0
0
0
−
0
7.62  
1.44  
−
1.90  
0.36  
−
1.44  
−
0.36  
−
−
3FFH  
00H  
−
1023  
0
19.05  
1.44  
−
19.05  
9.05  
−
4.76  
0.36  
−
4.76  
2.26  
−
1
1
−
3FFH  
1023  
19.05  
26.67  
4.76  
6.67  
SYNC  
PERIOD  
VIDEO PICTURE DATA  
REFERENCE  
WHITE  
GREY  
SCALE  
100 IRE  
UNITS  
660 mV 1 V  
SET-UP  
LEVEL  
REFERENCE  
BLACK  
BLANKING LEVEL  
330 mV  
40 IRE UNITS  
(1)  
SYNC LEVEL  
BLANK  
(1)  
SYNC  
MGD630  
(1) Sync only on green channel.  
Fig.3 Video signal diagram.  
8
1996 Aug 14  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
TIMING  
t
t
HD; DAT  
SU; DAT  
n
V
IH  
50 %  
data input  
clock input  
stable  
V
IL  
50 %  
V
IL  
MBB656 - 1  
t
t
CPH  
CPL  
Fig.4 Input timing.  
clock input  
50 %  
code 1023  
input code  
(example of a  
full-scale input  
data transition)  
code 0  
1 LSB  
714 mV  
(code 1023)  
10 %  
t
50 %  
90 %  
d
(1)  
V
o
54 mV  
(code 0)  
1 LSB  
t
s1  
MBB662 - 3  
t
s2  
(1) Output level conditions, SYNC = 0; BLANK = 1.  
Fig.5 Switching timing.  
9
1996 Aug 14  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
INTERNAL PIN CIRCUITRY  
V
DDA  
V
DDA  
V
DDD  
bit  
bit  
n
n
GND  
V
V
V
SSD  
SSA  
SSA  
MGE967  
(a)  
(b)  
(c)  
(a) Digital inputs; pins 1 to 10, 13 to 25 and 26 to 35.  
(b) Iref; pin 39.  
(c) OUTR, OUTG and OUTB; pins 46, 44 and 42.  
Fig.6 Internal circuitry.  
1996 Aug 14  
10  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
APPLICATION INFORMATION  
+5 V  
+5 V  
R = 37.5 Ω or 150 Ω  
100 nF  
+5 V  
+5 V  
22  
nF  
22  
nF  
100 nF  
(1)  
R
R
R
(2)  
48 47 46 45 44 43 42 41 40 39 38 37  
1
36  
2
35  
34  
33  
32  
31  
3
4
5
red  
input  
6
blue  
input  
TDA8775  
7
30  
29  
8
9
28  
27  
26  
25  
10  
11  
12  
+5 V  
100 nF  
CLK  
13 14 15 16 17 18 19 20 21 22 23 24  
MGE966  
green input  
Analog and digital supplies should be separated and decoupled.  
Supplies are not connected internally.  
All ground pins must be connected. One ground plane is preferred although it depends on the application.  
(1) R = 37.5 Ω; SLT = 1.  
(2) R = 150 Ω; SLT = 0.  
Fig.7 Application diagram.  
1996 Aug 14  
11  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
video outputs  
from TDA8775  
3.3 µH  
video  
output  
75 Ω  
R1  
75 Ω  
R3  
27 pF  
2.7  
µH  
75  
Ω
180  
pF  
330 pF  
330 pF  
R2  
MGE968  
Fig.8 Example of reconstruction filter for 1 V output swing.  
MGE969  
att  
(dB)  
0
−10  
−20  
−30  
(1)  
(2)  
−40  
0
5
10  
15  
20  
25  
f (MHz)  
(1) R2 = 75 Ω.  
(2) R2 = 0 Ω.  
Fig.9 Frequency response for filter shown in Fig.8.  
12  
1996 Aug 14  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
PACKAGE OUTLINE  
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm  
SOT313-2  
c
y
X
36  
25  
A
E
37  
24  
Z
E
Q
e
H
E
A
2
A
(A )  
3
A
1
w M  
p
θ
pin 1 index  
b
L
p
L
13  
48  
detail X  
1
12  
Z
v M  
D
A
e
w M  
b
p
D
B
H
v
M
B
D
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
D
H
L
L
Q
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.  
7o  
0o  
0.20 1.45  
0.05 1.35  
0.27 0.18 7.1  
0.17 0.12 6.9  
7.1  
6.9  
9.15 9.15  
8.85 8.85  
0.75 0.69  
0.45 0.59  
0.95 0.95  
0.55 0.55  
1.60  
mm  
0.25  
0.5  
1.0  
0.2 0.12 0.1  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
93-06-15  
94-12-19  
SOT313-2  
1996 Aug 14  
13  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
If wave soldering cannot be avoided, the following  
conditions must be observed:  
SOLDERING  
Introduction  
• A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave)  
soldering technique should be used.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
• The footprint must be at an angle of 45° to the board  
direction and must incorporate solder thieves  
downstream and at the side corners.  
Even with these conditions, do not consider wave  
soldering LQFP packages LQFP48 (SOT313-2),  
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011). During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all LQFP  
packages.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
Wave soldering  
Wave soldering is not recommended for LQFP packages.  
This is because of the likelihood of solder bridging due to  
closely-spaced leads and the possibility of incomplete  
solder penetration in multi-lead devices.  
1996 Aug 14  
14  
Philips Semiconductors  
Preliminary specification  
Triple 10-bit video Digital-to-Analog  
Converter (DAC)  
TDA8775  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Aug 14  
15  
Philips Semiconductors – a worldwide company  
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Slovenia: see Italy  
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Tel. +46 8 632 2000, Fax. +46 8 632 2745  
Greece: No. 15, 25th March Street, GR 17778 TAVROS,  
Tel. +30 1 4894 339/911, Fax. +30 1 4814 240  
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Hungary: see Austria  
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.  
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Tel. +972 3 645 0444, Fax. +972 3 649 1007  
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Tel. +90 212 279 2770, Fax. +90 212 282 6707  
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,  
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557  
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Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,  
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077  
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,  
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421  
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,  
Tel. +82 2 709 1412, Fax. +82 2 709 1415  
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,  
Tel. +1 800 234 7381  
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
Tel. +60 3 750 5214, Fax. +60 3 757 4880  
Uruguay: see South America  
Vietnam: see Singapore  
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Tel. +381 11 825 344, Fax.+381 11 635 777  
Middle East: see Italy  
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,  
Internet: http://www.semiconductors.philips.com  
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1996  
SCA51  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
537021/50/01/pp16  
Date of release: 1996 Aug 14  
Document order number: 9397 750 01021  
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Standard Marking * Reel Pack,  
SMD, 13"  
TDA8775  
TDA8775  
TDA8775G/C1  
9352 274 50118  
9352 274 50151  
9352 274 50157  
9352 274 50518  
SOT313 Samples available  
SOT313 Samples available  
SOT313 Samples available  
SOT313 Samples available  
-
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Standard Marking * Tray Pack,  
Bakeable, Single  
Standard Marking * Tray Pack,  
Bakeable, Multiple  
Standard Marking * Reel Dry  
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TDA8775GB-T  
Standard Marking * Tray Dry  
Pack, Bakeable, Single  
TDA8775GB-S  
TDA8775GB  
9352 274 50551  
9352 274 50557  
SOT313 Samples available  
SOT313 Samples available  
Standard Marking * Tray Dry  
Pack, Bakeable, Multiple  
Please read information about some discontinued variants of this product.  
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