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935271869125 [NXP]

HCT SERIES, DUAL 2-INPUT AND GATE, PDSO8, 3 MM, PLASTIC, SOT-505-2, TSSOP-8;
935271869125
型号： 935271869125
厂家： NXP    NXP
描述：

HCT SERIES, DUAL 2-INPUT AND GATE, PDSO8, 3 MM, PLASTIC, SOT-505-2, TSSOP-8

输入元件 光电二极管 逻辑集成电路
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74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
Rev. 5 — 8 October 2013  
Product data sheet  
1. General description  
The 74HC2G08; 74HCT2G08 is a dual 2-input AND gate. Inputs include clamp diodes.  
This enables the use of current limiting resistors to interface inputs to voltages in excess  
of VCC  
.
2. Features and benefits  
Wide supply voltage range from 2.0 V to 6.0 V  
Input levels:  
For 74HC2G08: CMOS level  
For 74HCT2G08: TTL level  
Symmetrical output impedance  
High noise immunity  
Low power dissipation  
Balanced propagation delays  
Multiple package options  
ESD protection:  
HBM JESD22-A114E exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
Specified from 40 C to +85 C and 40 C to +125 C  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74HC2G08DP  
74HCT2G08DP  
74HC2G08DC  
74HCT2G08DC  
74HC2G08GD  
74HCT2G08GD  
40 C to +125 C  
40 C to +125 C  
40 C to +125 C  
TSSOP8  
VSSOP8  
XSON8  
plastic thin shrink small outline package; 8 leads;  
body width 3 mm; lead length 0.5 mm  
SOT505-2  
plastic very thin shrink small outline package; 8 leads; SOT765-1  
body width 2.3 mm  
plastic extremely thin small outline package; no leads; SOT996-2  
8 terminals; body 3 2 0.5 mm  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
4. Marking  
Table 2.  
Marking code  
Type number  
74HC2G08DP  
74HCT2G08DP  
74HC2G08DC  
74HCT2G08DC  
74HC2G08GD  
74HCT2G08GD  
Marking code[1]  
H08  
T08  
H08  
T08  
H08  
T08  
[1] The pin 1 indicator is located on the lower left corner of the device, below the marking code.  
5. Functional diagram  
&
1A  
1Y  
1B  
2A  
2Y  
2B  
&
001aah788  
001aah789  
Fig 1. Logic symbol  
Fig 2. IEC logic symbol  
A
B
Y
mna221  
Fig 3. Logic diagram (one gate)  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
2 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
6. Pinning information  
6.1 Pinning  
74HC2G08  
74HCT2G08  
1A  
1B  
1
2
3
4
8
7
6
5
V
CC  
74HC2G08  
74HCT2G08  
1Y  
2B  
2A  
2Y  
1
2
3
4
8
7
6
5
1A  
1B  
V
CC  
1Y  
2B  
2A  
GND  
2Y  
GND  
001aak019  
Transparent top view  
001aak018  
Fig 4. Pin configuration SOT505-2 (TSSOP8) and  
SOT765-1 (VSSOP8)  
Fig 5. Pin configuration SOT996-2 (XSON8)  
6.2 Pin description  
Table 3.  
Symbol  
1A, 2A  
1B, 2B  
GND  
Pin description  
Pin  
1, 5  
2, 6  
4
Description  
data input  
data input  
ground (0 V)  
data output  
supply voltage  
1Y, 2Y  
VCC  
7, 3  
8
7. Functional description  
Table 4.  
Function table[1]  
Input  
nA  
L
Output  
nB  
L
nY  
L
L
H
L
L
H
L
H
H
H
[1] H = HIGH voltage level; L = LOW voltage level.  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
3 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
8. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).  
Symbol  
VCC  
IIK  
Parameter  
Conditions  
Min  
Max  
+7.0  
20  
20  
25  
Unit  
V
supply voltage  
0.5  
[1]  
[1]  
[1]  
[1]  
[1]  
input clamping current  
output clamping current  
output current  
VI < 0.5 V or VI > VCC + 0.5 V  
VO < 0.5 V or VO > VCC + 0.5 V  
VO = 0.5 V to (VCC + 0.5 V)  
-
mA  
mA  
mA  
mA  
mA  
C  
IOK  
-
IO  
-
ICC  
supply current  
-
50  
IGND  
Tstg  
PD  
ground current  
50  
65  
-
-
storage temperature  
dynamic power dissipation  
+150  
300  
[2]  
Tamb = 40 C to +125 C  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
[2] For TSSOP8 package: above 55 C the value of Ptot derates linearly with 2.5 mW/K.  
For VSSOP8 package: above 110 C the value of Ptot derates linearly with 8 mW/K.  
For XSON8 package: above 118 C the value of Ptot derates linearly with 7.8 mW/K.  
9. Recommended operating conditions  
Table 6.  
Recommended operating conditions  
Voltages are referenced to GND (ground = 0 V).  
Symbol Parameter  
Conditions  
74HC2G08  
74HCT2G08  
Unit  
Min  
Typ  
Max  
6.0  
Min  
Typ  
Max  
5.5  
VCC  
VI  
supply voltage  
input voltage  
2.0  
5.0  
4.5  
5.0  
V
V
V
0
-
VCC  
VCC  
+125  
625  
139  
83  
0
-
VCC  
VCC  
VO  
output voltage  
ambient temperature  
0
-
+25  
-
0
-
+25  
-
Tamb  
t/V  
40  
40  
+125 C  
input transition rise  
and fall rate  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
-
-
-
-
139  
-
ns/V  
1.67  
-
1.67  
-
ns/V  
ns/V  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
4 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
10. Static characteristics  
Table 7.  
Static characteristics  
Voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min Typ[1] Max  
Min  
Max  
74HC2G08  
VIH  
HIGH-level input  
voltage  
VCC = 2.0 V  
1.5  
1.2  
2.4  
3.2  
0.8  
2.1  
2.8  
-
-
1.5  
-
-
V
V
V
V
V
V
VCC = 4.5 V  
3.15  
3.15  
VCC = 6.0 V  
4.2  
-
4.2  
-
VIL  
LOW-level input  
voltage  
VCC = 2.0 V  
-
-
-
0.5  
1.35  
1.8  
-
-
-
0.5  
1.35  
1.8  
VCC = 4.5 V  
VCC = 6.0 V  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 20 A; VCC = 2.0 V  
IO = 20 A; VCC = 4.5 V  
IO = 20 A; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
VI = VIH or VIL  
1.9  
4.4  
2.0  
4.5  
-
-
-
-
-
1.9  
4.4  
5.9  
3.7  
5.2  
-
-
-
-
-
V
V
V
V
V
5.9  
6.0  
4.13  
5.63  
4.32  
5.81  
VOL  
LOW-level output  
voltage  
IO = 20 A; VCC = 2.0 V  
IO = 20 A; VCC = 4.5 V  
IO = 20 A; VCC = 6.0 V  
IO = 4.0 mA; VCC = 4.5 V  
IO = 5.2 mA; VCC = 6.0 V  
-
-
-
-
-
-
-
0
0.1  
0.1  
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
0.4  
0.4  
1.0  
20  
V
0
V
0
0.15  
0.16  
-
0.1  
V
0.33  
0.33  
1.0  
10  
V
V
II  
input leakage current VI = VCC or GND; VCC = 6.0 V  
A  
A  
ICC  
supply current  
per input pin; VI = VCC or GND;  
IO = 0 A; VCC = 6.0 V  
-
CI  
input capacitance  
-
1.5  
-
-
-
pF  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
5 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
Table 7.  
Static characteristics …continued  
Voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min Typ[1] Max  
Min  
Max  
74HCT2G08  
VIH  
HIGH-level input  
voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
1.6  
1.2  
-
2.0  
-
-
V
V
VIL  
LOW-level input  
voltage  
0.8  
0.8  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 20 A; VCC = 4.5 V  
IO = 4.0 mA; VCC = 4.5 V  
VI = VIH or VIL  
4.4  
4.5  
-
-
4.4  
3.7  
-
-
V
V
4.13  
4.32  
VOL  
LOW-level output  
voltage  
IO = 20 A; VCC = 4.5 V  
IO = 4.0 mA; VCC = 4.5 V  
-
-
-
-
0
0.1  
0.33  
1.0  
10  
-
-
-
-
0.1  
0.4  
1.0  
20  
V
0.15  
V
II  
input leakage current VI = VCC or GND; VCC = 5.5 V  
-
-
A  
A  
ICC  
supply current  
VI = VCC or GND; IO = 0 A;  
VCC = 5.5 V  
ICC  
additional supply  
current  
per input; VCC = 4.5 V to 5.5 V;  
VI = VCC 2.1 V; IO = 0 A  
-
-
-
375  
-
-
-
410  
-
A  
CI  
input capacitance  
1.5  
pF  
[1] All typical values are measured at Tamb = 25 C.  
11. Dynamic characteristics  
Table 8.  
Dynamic characteristics  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7.  
Symbol Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
74HC2G08  
[2]  
tpd  
propagation delay nA and nB to nY; see Figure 6  
VCC = 2.0 V  
-
-
-
-
26  
9
95  
19  
-
-
-
-
-
110  
22  
-
ns  
ns  
ns  
ns  
VCC = 4.5 V  
VCC = 5.0 V; CL = 15 pF  
VCC = 6.0 V  
9
8
16  
20  
[3]  
[4]  
tt  
transition time  
see Figure 6  
VCC = 2.0 V  
VCC = 4.5 V  
VCC = 6.0 V  
-
-
-
-
20  
7
95  
19  
16  
-
-
-
-
-
125  
25  
20  
-
ns  
ns  
ns  
pF  
6
CPD  
power dissipation VI = GND to VCC  
capacitance  
10  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
6 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
Table 8.  
Dynamic characteristics …continued  
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 7.  
Symbol Parameter  
Conditions  
40 C to +85 C  
40 C to +125 C Unit  
Min  
Typ[1]  
Max  
Min  
Max  
74HCT2G08  
[2]  
tpd  
propagation delay nA and nB to nY; see Figure 6  
VCC = 4.5 V  
-
-
-
-
14  
14  
7
30  
-
-
-
-
-
36  
-
ns  
ns  
ns  
pF  
VCC = 5.0 V; CL = 15 pF  
[3]  
[4]  
tt  
transition time  
VCC = 4.5 V; see Figure 6  
19  
-
22  
-
CPD  
power dissipation VI = GND to VCC 1.5 V  
10  
capacitance  
[1] All typical values are measured at Tamb = 25 C.  
[2] pd is the same as tPLH and tPHL  
[3] tt is the same as tTLH and tTHL  
t
.
.
[4] CPD is used to determine the dynamic power dissipation (PD in W).  
PD = CPD VCC2 fi N + (CL VCC2 fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in V;  
N = number of inputs switching;  
(CL VCC2 fo) = sum of outputs.  
12. Waveforms  
V
I
nA, nB input  
GND  
V
M
t
t
PLH  
PHL  
V
OH  
V
Y
V
nY output  
M
V
X
V
OL  
t
t
TLH  
THL  
001aak020  
Measurement points are given in Table 9.  
OL and VOH are typical output voltage levels that occur with the output load.  
V
Fig 6. Propagation delay data input (nA, nB) to data output (nY) and transition time output (nY)  
Table 9.  
Type  
Measurement points  
Input  
VM  
Output  
VM  
VX  
VY  
74HC2G08  
0.5VCC  
0.5VCC  
1.3 V  
0.1VCC  
0.1VCC  
0.9VCC  
0.9VCC  
74HCT2G08  
1.3 V  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
7 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
t
W
V
I
90 %  
negative  
pulse  
V
V
V
M
M
10 %  
0 V  
t
t
r
f
t
t
f
r
V
I
90 %  
positive  
pulse  
V
M
M
10 %  
0 V  
t
W
V
CC  
V
CC  
V
V
O
I
R
L
S1  
G
open  
DUT  
R
T
C
L
001aad983  
Test data is given in Table 10.  
Definitions for test circuit:  
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.  
CL = Load capacitance including jig and probe capacitance.  
RL = Load resistance.  
S1 = Test selection switch.  
Fig 7. Test circuit for measuring switching times  
Table 10. Test data  
Type  
Input  
Load  
S1 position  
tPHL, tPLH  
open  
VI  
tr, tf  
CL  
RL  
74HC2G08  
GND to VCC  
GND to 3 V  
6 ns  
6 ns  
15 pF, 50 pF  
15 pF, 50 pF  
1 k  
1 k  
74HCT2G08  
open  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
8 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
13. Package outline  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm  
SOT505-2  
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
detail X  
1
4
e
w
M
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
max.  
0.15  
0.00  
0.95  
0.75  
0.38  
0.22  
0.18  
0.08  
3.1  
2.9  
3.1  
2.9  
4.1  
3.9  
0.47  
0.33  
0.70  
0.35  
8°  
0°  
mm  
1.1  
0.65  
0.25  
0.5  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-01-16  
SOT505-2  
- - -  
Fig 8. Package outline SOT505-2 (TSSOP8)  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
9 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm  
SOT765-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )  
3
pin 1 index  
θ
L
p
L
detail X  
1
4
e
w
M
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT  
v
w
y
Z
θ
1
2
3
p
E
max.  
0.15  
0.00  
0.85  
0.60  
0.27  
0.17  
0.23  
0.08  
2.1  
1.9  
2.4  
2.2  
3.2  
3.0  
0.40  
0.15  
0.21  
0.19  
0.4  
0.1  
8°  
0°  
mm  
1
0.5  
0.12  
0.4  
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-06-07  
SOT765-1  
MO-187  
Fig 9. Package outline SOT765-1 (VSSOP8)  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
10 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
XSON8: plastic extremely thin small outline package; no leads;  
8 terminals; body 3 x 2 x 0.5 mm  
SOT996-2  
D
B
A
E
A
A
1
detail X  
terminal 1  
index area  
e
1
C
v
C
C
A
B
b
e
L
1
y
1
y
w
C
1
4
L
2
L
8
5
X
0
1
2 mm  
scale  
Dimensions (mm are the original dimensions)  
(1)  
Unit  
A
A
1
b
D
E
e
e
1
L
L
1
L
2
v
w
y
y
1
max  
mm nom 0.5  
min  
0.05 0.35 2.1 3.1  
0.00 0.15 1.9 2.9  
0.5 0.15 0.6  
0.3 0.05 0.4  
0.5 1.5  
0.1 0.05 0.05 0.1  
sot996-2_po  
References  
Outline  
version  
European  
projection  
Issue date  
IEC  
JEDEC  
JEITA  
07-12-21  
12-11-20  
SOT996-2  
Fig 10. Package outline SOT996-2 (XSON8)  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
11 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
14. Abbreviations  
Table 11. Abbreviations  
Acronym  
CMOS  
DUT  
Description  
Complementary Metal Oxide Semiconductor  
Device Under Test  
ESD  
ElectroStatic Discharge  
Human Body Model  
HBM  
MM  
Machine Model  
TTL  
Transistor-Transistor Logic  
15. Revision history  
Table 12. Revision history  
Document ID  
Release date  
20131008  
Data sheet status  
Change notice  
Supersedes  
74HC_HCT2G08 v.5  
Modifications:  
Product data sheet  
-
74HC_HCT2G32 v.4  
• For type numbers 74HC2G08GD and 74HCT2G08GD XSON8U has changed to XSON8.  
74HC_HCT2G08 v.4  
74HC_HCT2G08 v.3  
74HC_HCT2G08 v.2  
74HC_HCT2G08 v.1  
20090507  
20031022  
20030203  
20020710  
Product data sheet  
Product specification  
Product specification  
Product specification  
-
-
-
-
74HC_HCT2G08 v.3  
74HC_HCT2G08 v.2  
74HC_HCT2G08 v.1  
-
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
12 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
16. Legal information  
16.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
Suitability for use — NXP Semiconductors products are not designed,  
16.2 Definitions  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors and its suppliers accept no liability for  
inclusion and/or use of NXP Semiconductors products in such equipment or  
applications and therefore such inclusion and/or use is at the customer’s own  
risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
16.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information. NXP Semiconductors takes no  
responsibility for the content in this document if provided by an information  
source outside of NXP Semiconductors.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
13 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
Translations — A non-English (translated) version of a document is for  
reference only. The English version shall prevail in case of any discrepancy  
between the translated and English versions.  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
16.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
17. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
74HC_HCT2G08  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2013. All rights reserved.  
Product data sheet  
Rev. 5 — 8 October 2013  
14 of 15  
NXP Semiconductors  
74HC2G08; 74HCT2G08  
Dual 2-input AND gate  
18. Contents  
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1  
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 1  
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2  
6
6.1  
6.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3  
7
Functional description . . . . . . . . . . . . . . . . . . . 3  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 4  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 6  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12  
8
9
10  
11  
12  
13  
14  
15  
16  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
16.1  
16.2  
16.3  
16.4  
17  
18  
Contact information. . . . . . . . . . . . . . . . . . . . . 14  
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2013.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 8 October 2013  
Document identifier: 74HC_HCT2G08  

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