935278954112 [NXP]
0.04W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8;
| 型号： | 935278954112 |
| 厂家： | 
NXP |
| 描述： | 0.04W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 放大器 光电二极管 |
| 文件： | 总17页 (文件大小：576K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TDA1308
Class-AB stereo headphone driver
Rev. 5 — 14 March 2011
Product data sheet
1. General description
The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or
a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal
Oxide Semiconductor (CMOS) process and has been primarily developed for portable
digital audio applications.
2. Features and benefits
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
High signal-to-noise ratio
High slew rate
Low distortion
Large output voltage swing
3. Quick reference data
Table 1.
Quick reference data
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
single supply
dual supply
dual supply
Min
3.0
1.5
Typ
5.0
2.5
Max Unit
VDD
supply voltage
7.0
3.5
V
V
V
VSS
negative supply
voltage
−1.5 −2.5 −3.5
IDD
supply current
no load
no load
-
-
3
5
mA
Ptot
total power
dissipation
15
25
mW
[1]
[1]
[1]
Po
output power
maximum; THD+N < 0.1 %
-
40
80
mW
%
THD+N
total harmonic
distortion-plus-noise
-
0.03 0.06
-
−70
−101
110
−65
dB
dB
dB
RL = 5 kΩ
-
-
-
S/N
signal-to-noise ratio
100
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
Table 1.
Quick reference data …continued
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
70
Max Unit
αcs
channel separation
-
-
-
-
-
-
dB
dB
dB
[1]
RL = 5 kΩ
105
90
PSRR
Tamb
power supply ripple fi = 100 Hz;
rejection
Vripple(p-p) = 100 mV
ambient temperature
−40
-
+85
°C
[1] VDD = 5 V; Vo(p-p) = 3.5 V (at 0 dB).
4. Ordering information
Table 2.
Ordering information
Type number Package
Name
Description
Version
TDA1308T
SO8
plastic small outline package; 8 leads; body width
3.9 mm
SOT96-1
TDA1308TT
TSSOP8
plastic thin shrink small outline package; 8 leads;
body width 3 mm
SOT505-1
5. Block diagram
TDA1308
1
8
OUTA
V
DD
2
3
INA-
7
INA+
OUTB
6
5
INB-
4
V
SS
INB+
mka779
Fig 1. Block diagram
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
2 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
6. Pinning information
6.1 Pinning
TDA1308
1
2
3
4
8
7
6
5
OUTA
INA-
V
DD
OUTB
INB-
INA+
V
INB+
SS
001aaf782
Fig 2. Pin configuration
6.2 Pin description
Table 3.
Symbol
OUTA
INA−
Pin description
Pin
1
Description
output A
inverting input A
2
INA+
3
non-inverting input A
negative supply
non-inverting input B
inverting input B
output B
VSS
4
INB+
5
INB−
6
OUTB
VDD
7
8
positive supply
7. Internal circuitry
V
DD
I
1
INA/B+
INA/B-
M1
M2
A1
M3
OUTA/B
C
m
M5
M4
D1
D2
D3
D4
A2
M6
V
SS
mka781
Fig 3. Equivalent schematic diagram
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
3 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
0
Max
8.0
-
Unit
V
VDD
tsc
supply voltage
short-circuit duration time
output;Tamb = 25 °C;
20
s
Ptot = 1 W
Tstg
storage temperature
ambient temperature
−65
−40
−2
+150
+85
+2
°C
°C
kV
V
Tamb
VESD
[1]
[2]
electrostatic discharge
voltage
HBM
MM
−200
+200
[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.
[2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.
9. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
SO8
Typ
210
220
Unit
K/W
K/W
Rth(j-a)
thermal resistance from junction
to ambient
TSSOP8
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
4 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
10. Characteristics
Table 6.
Characteristics
VDD = 5 V; VSS = 0 V; Tamb = 25 °C; fi = 1 kHz; RL = 32 Ω; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supplies
VDD
supply voltage
single supply
dual supply
dual supply
no load
3.0
1.5
−1.5
-
5.0
2.5
−2.5
3
7.0
3.5
−3.5
5
V
V
VSS
IDD
negative supply voltage
supply current
V
mA
mW
Ptot
total power dissipation
no load
-
15
25
Static characteristics
|VI(offset)
|
input offset voltage
input bias current
-
10
10
-
-
mV
pA
pA
dB
mA
Ω
IIB
-
-
Vcm
Gv(ol)
IO
common-mode voltage
open-loop voltage gain
output current
0
3.5
RL = 5 kΩ
-
70
60
0.25
-
-
maximum
-
-
Ro
output resistance
THD+N < 0.1 %
-
-
[1]
[1]
[1]
ΔVO
output voltage variation
0.75
4.25
3.5
4.9
-
V
RL = 16 Ω
RL = 5 kΩ
1.5
-
V
0.1
-
V
αcs
channel separation
-
-
-
-
70
105
90
-
dB
dB
dB
pF
[1]
RL = 5 kΩ
-
PSRR
CL
power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV
load capacitance
-
200
Dynamic characteristics
[2]
[2]
[2]
[2]
THD+N
total harmonic
distortion-plus-noise
-
0.03
−70
−101
0.0009
110
5.5
40
0.06
%
-
−65
dB
RL = 5 kΩ
RL = 5 kΩ
-
-
dB
-
-
%
S/N
f1
signal-to-noise ratio
unity gain frequency
output power
100
-
dB
open-loop; RL = 5 kΩ
-
-
-
-
-
-
MHz
mW
pF
Po
Ci
maximum; THD+N < 0.1 %
80
-
input capacitance
slew rate
3
SR
B
unity gain inverting
unity gain inverting
5
-
V/μs
kHz
bandwidth
20
-
[1] Values are proportional to VDD; THD+N < 0.1 %.
[2] VDD = 5 V; Vo(p-p) = 3.5 V (at 0 dB).
TDA1308
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Product data sheet
Rev. 5 — 14 March 2011
5 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
11. Application information
C4
R6
V
OUTA
3.9 kΩ
100 μF/6 V
R
L
1
8
C7
R5
2
3
5
6
V
INA
R1
10 kΩ
3.9 kΩ
1 μF
C2
100 μF
10 V
C5
0.1 μF
TDA1308
C1
22 μF
6 V
R2
10 kΩ
C6
R3
V
INB
3.9 kΩ
1 μF
7
4
C3
R4
V
OUTB
3.9 kΩ
100 μF/6 V
R
L
001aan758
Fig 4. Typical application
12. Test information
V
DD
100 μF
3.9 kΩ
V
OUTA
R
L
1
8
3.9 kΩ
3.9 kΩ
2
3
V
INA
C6
100 μF
V
ref
TDA1308
(typ. 2.5 V)
5
6
V
INB
7
4
100 μF
3.9 kΩ
V
OUTB
R
L
mka782
Fig 5. Measurement circuit for inverting application
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
6 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
mka784
mka785
-70
Xtalk
(dB)
80
G
(dB)
v
-90
R
L
= 32 Ω
40
R
= 16 Ω
32 Ω
L
no load
-110
-130
0
5 kΩ
-1
-2
-3
-4
-5
−2
−3
−4
−5
−6
−7
−8
10
10
10
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
i
i
Fig 6. Open-loop gain as a function of input frequency Fig 7. Crosstalk as a function of input frequency
mka786
mka787
100
-50
P
(mW)
o
R
L
= 16 Ω
THD+N
(dB)
R
R
= 16 Ω; P = 50 mW
o
L
L
60
32 Ω
8 Ω
-70
= 32 Ω; P = 50 mW
40
20
10
o
-90
R
= 5 kΩ; V
= 3.5 V
L
o(p-p)
-110
-1
-2
-3
-4
-5
3
4
5
DD
10
10
10
10
10
f (Hz)
i
V
(V)
Fig 8. Output power as a function of supply voltage
Fig 9. Total harmonic distortion plus noise ratio as a
function of input frequency
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
7 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
mka788
-40
THD+N
(dB)
R
= 8 Ω
16 Ω
L
-60
-80
32 Ω
5 kΩ
f = 1 kHz
i
-100
-2
-1
10
10
1
10
V
o(p-p)
(V)
Fig 10. Total harmonic distortion plus noise ratio as a function of output voltage level
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
8 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
13. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 11. Package outline SOT96-1 (SO8)
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
9 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm
SOT505-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
A
(A )
2
A
3
A
1
pin 1 index
θ
L
p
L
1
4
detail X
e
w M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT
v
w
y
Z
θ
1
2
3
p
max.
0.15
0.05
0.95
0.80
0.45
0.25
0.28
0.15
3.1
2.9
3.1
2.9
5.1
4.7
0.7
0.4
0.70
0.35
6°
0°
mm
1.1
0.65
0.25
0.94
0.1
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-04-09
03-02-18
SOT505-1
Fig 12. Package outline SOT505-1 (TSSOP8)
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
10 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
11 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 13) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
220
< 2.5
235
220
≥ 2.5
220
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 13.
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
12 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 13. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
13 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
15. Revision history
Table 9.
Revision history
Document ID
TDA1308 v.5
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20110314
Product data sheet
-
TDA1308_A_4
• Removed all references to type numbers TDA1308, TDA1308A, TDA1308AUK
• Changed pin names INA(neg), INA(pos), INB(pos), INB(neg) to INA−, INA+, INB+ and INB−
• Updated parameter symbols in Tables 4 and 6, and Figures 7, 9 and 10
• Replaced Figure 4
TDA1308_A_4
TDA1308_A_3
TDA1308_A_2
TDA1308_1
20070125
20020719
20020227
19940905
Product data sheet
Product specification
Product specification
Product specification
-
-
-
-
TDA1308_A_3
TDA1308_A_2
TDA1308_1
-
TDA1308
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© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
14 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
16.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
16.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
TDA1308
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
15 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TDA1308
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 5 — 14 March 2011
16 of 17
TDA1308
NXP Semiconductors
Class-AB stereo headphone driver
18. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 6
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
8
9
10
11
12
13
14
Soldering of SMD packages . . . . . . . . . . . . . . 11
Introduction to soldering . . . . . . . . . . . . . . . . . 11
Wave and reflow soldering . . . . . . . . . . . . . . . 11
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12
14.1
14.2
14.3
14.4
15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 14 March 2011
Document identifier: TDA1308
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