935287961518 [NXP]
DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8;
| 型号： | 935287961518 |
| 厂家： | 
NXP |
| 描述： | DATACOM, INTERFACE CIRCUIT, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 电信 光电二极管 电信集成电路 |
| 文件： | 总22页 (文件大小：222K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TJA1040
High speed CAN transceiver
Product specification
2003 Oct 14
Supersedes data of 2003 Feb 19
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
FEATURES
GENERAL DESCRIPTION
• Fully compatible with the ISO 11898 standard
• High speed (up to 1 MBaud)
The TJA1040 is the interface between the Controller Area
Network (CAN) protocol controller and the physical bus.
It is primarily intended for high speed applications, up to
1 MBaud, in passenger cars. The device provides
differential transmit capability to the bus and differential
receive capability to the CAN controller.
• Very low-current standby mode with remote wake-up
capability via the bus
• Very low ElectroMagnetic Emission (EME)
• Differential receiver with high common-mode range for
ElectroMagnetic Immunity (EMI)
The TJA1040 is the next step up from the TJA1050 high
speed CAN transceiver. Being pin compatible and offering
the same excellent EMC performance, the TJA1040 also
features:
• Transceiver in unpowered state disengages from the
bus (zero load)
• Input levels compatible with 3.3 V and 5 V devices
• An ideal passive behaviour when supply voltage is off
• Voltage source for stabilizing the recessive bus level if
• A very low-current standby mode with remote wake-up
split termination is used (further improvement of EME)
capability via the bus.
• At least 110 nodes can be connected
This makes the TJA1040 an excellent choice in nodes
which can be in power-down or standby mode in partially
powered networks.
• Transmit Data (TXD) dominant time-out function
• Bus pins protected against transients in automotive
environments
• Bus pins and pin SPLIT short-circuit proof to battery and
ground
• Thermally protected.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
operating range
MIN.
4.75
MAX.
5.25
15
UNIT
V
ICC
supply current
standby mode
5
µA
V
VCANH
VCANL
VSPLIT
Vesd
DC voltage on pin CANH
DC voltage on pin CANL
DC voltage on pin SPLIT
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
−27
−27
−27
+40
+40
+40
V
V
electrostatic discharge voltage Human Body Model (HBM)
pins CANH, CANL and SPLIT
−6
+6
kV
kV
ns
°C
all other pins
−4
+4
tPD(TXD-RXD) propagation delay TXD to RXD VSTB = 0 V
Tvj virtual junction temperature
40
255
+150
−40
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
SOT96-1
−
TJA1040T
TJA1040U
SO8
plastic small outline package; 8 leads; body width 3.9 mm
bare die; die dimensions 1840 × 1440 × 380 µm
−
2003 Oct 14
2
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
BLOCK DIAGRAM
V
CC
3
5
TIME-OUT &
SLOPE
1
TEMPERATURE
PROTECTION
V SPLIT
SPLIT
TXD
STB
V
CC
7
6
CANH
CANL
8
WAKE-UP
MODE CONTROL
DRIVER
4
2
WAKE-UP
FILTER
RXD
GND
MUX
TJA1040
MGU161
Fig.1 Block diagram.
PINNING
SYMBOL PIN
DESCRIPTION
TXD
GND
VCC
1
2
3
4
transmit data input
ground supply
handbook, halfpage
TXD
1
2
3
4
8
7
STB
GND
CANH
CANL
SPLIT
supply voltage
TJA1040T
RXD
receive data output; reads out data
from the bus lines
V
6
5
CC
RXD
SPLIT
CANL
CANH
STB
5
6
7
8
common-mode stabilization output
LOW-level CAN bus line
MGU160
HIGH-level CAN bus line
Fig.2 Pin configuration.
standby mode control input
2003 Oct 14
3
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
FUNCTIONAL DESCRIPTION
Operating modes
to the centre tap of the split termination (see Fig.4). In case
of a recessive bus voltage <0.5VCC due to the presence of
an unsupplied transceiver in the network with a significant
leakage current from the bus lines to ground, the split
circuit will stabilize this recessive voltage to 0.5VCC. So a
start of transmission does not cause a step in the
common-mode signal which would lead to poor
The TJA1040 provides two modes of operation which are
selectable via pin STB. See Table 1 for a description of the
modes of operation.
Table 1 Operating modes
ElectroMagnetic Emission (EME) behaviour.
PIN RXD
PIN
Wake-up
MODE
STB
LOW
HIGH
In the standby mode the bus lines are monitored via a
low-power differential comparator. Once the low-power
differential comparator has detected a dominant bus level
for more than tBUS, pin RXD will become LOW.
normal
LOW
bus dominant
bus recessive
standby
HIGH wake-up request no wake-up
detected request detected
Over-temperature detection
NORMAL MODE
The output drivers are protected against over-temperature
conditions. If the virtual junction temperature exceeds the
shutdown junction temperature Tj(sd), the output drivers will
be disabled until the virtual junction temperature becomes
lower than Tj(sd) and TXD becomes recessive again.
By including the TXD condition, the occurrence of output
driver oscillation due to temperature drifts is avoided.
In this mode the transceiver is able to transmit and receive
data via the bus lines CANH and CANL. See Fig.1 for the
block diagram. The differential receiver converts the
analog data on the bus lines into digital data which is
output to pin RXD via the multiplexer (MUX). The slope of
the output signals on the bus lines is fixed and optimized
in a way that lowest ElectroMagnetic Emission (EME) is
guaranteed.
TXD dominant time-out function
STANDBY MODE
A ‘TXD dominant time-out’ timer circuit prevents the bus
lines from being driven to a permanent dominant state
(blocking all network communication) if pin TXD is forced
permanently LOW by a hardware and/or software
application failure. The timer is triggered by a negative
edge on pin TXD.
In this mode the transmitter and receiver are switched off,
and the low-power differential receiver will monitor the bus
lines. A HIGH level on pin STB activates this low-power
receiver and the wake-up filter, and after tBUS the state of
the CAN bus is reflected on pin RXD.
If the duration of the LOW level on pin TXD exceeds the
internal timer value (tdom), the transmitter is disabled,
driving the bus lines into a recessive state. The timer is
reset by a positive edge on pin TXD. The TXD dominant
time-out time tdom defines the minimum possible bit rate of
40 kBaud.
The supply current on VCC is reduced to a minimum in
such a way that ElectroMagnetic Immunity (EMI) is
guaranteed and a wake-up event on the bus lines will be
recognized.
In this mode the bus lines are terminated to ground to
reduce the supply current (ICC) to a minimum. A diode is
added in series with the high-side driver of RXD to prevent
a reverse current from RXD to VCC in the unpowered state.
In normal mode this diode is bypassed. This diode is not
bypassed in standby mode to reduce current consumption.
Fail-safe features
Pin TXD provides a pull-up towards VCC in order to force a
recessive level in case pin TXD is unsupplied.
Pin STB provides a pull-up towards VCC in order to force
the transceiver into standby mode in case pin STB is
unsupplied.
Split circuit
Pin SPLIT provides a DC stabilized voltage of 0.5VCC. It is
turned on only in normal mode. In standby mode pin SPLIT
is floating. The VSPLIT circuit can be used to stabilize the
recessive common-mode voltage by connecting pin SPLIT
In the event that the VCC is lost, pins TXD, STB and RXD
will become floating to prevent reverse supplying
conditions via these pins.
2003 Oct 14
4
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
supply voltage
CONDITIONS
no time limit
MIN.
−0.3
MAX.
+6
5.25
UNIT
VCC
V
V
operating range
4.75
−0.3
−0.3
−0.3
−27
−27
−27
VTXD
VRXD
VSTB
VCANH
VCANL
VSPLIT
Vtrt
DC voltage on pin TXD
DC voltage on pin RXD
DC voltage on pins STB
DC voltage on pin CANH
DC voltage on pin CANL
DC voltage on pin SPLIT
VCC + 0.3 V
VCC + 0.3 V
VCC + 0.3 V
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
+40
+40
+40
+200
V
V
V
V
transient voltages on pins CANH, according to ISO 7637; see Fig.5 −200
CANL and SPLIT
Vesd
electrostatic discharge voltage
Human Body Model (HBM); note 1
pins CANH and CANL
and SPLIT
−6
+6
kV
all other pins
−4
+4
kV
V
Machine Model (MM); note 2
note 3
−200
−40
−55
+200
+150
+150
Tvj
virtual junction temperature
storage temperature
°C
°C
Tstg
Notes
1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.
2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.
3. Junction temperature in accordance with IEC 60747-1. An alternative definition of Tvj is: Tvj = Tamb + P × Rth(vj-amb)
where Rth(vj-amb) is a fixed value to be used for the calculating of Tvj. The rating for Tvj limits the allowable
combinations of power dissipation (P) and ambient temperature (Tamb).
,
THERMAL CHARACTERISTICS
In accordance with IEC 60747-1.
SYMBOL
Rth(vj-a)
PARAMETER
CONDITIONS
VALUE
UNIT
thermal resistance from virtual junction in free air
to ambient in SO8 package
145
K/W
Rth(vj-s)
thermal resistance from virtual junction in free air
to substrate of bare die
50
K/W
QUALITY SPECIFICATION
Quality specification in accordance with “AEC-Q100”.
2003 Oct 14
5
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
CHARACTERISTICS
VCC = 4.75 to 5.25 V, Tvj = −40 to +150 °C and RL = 60 Ω unless specified otherwise; all voltages are defined with
respect to ground; positive currents flow into the IC; note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin VCC
)
ICC
supply current
standby mode
5
10
15
µA
normal mode
recessive; VTXD = VCC
dominant; VTXD = 0 V
2.5
30
5
10
70
mA
mA
50
Transmit data input (pin TXD)
VIH
VIL
IIH
IIL
HIGH-level input voltage
2
−
−
0
VCC + 0.3 V
LOW-level input voltage
HIGH-level input current
LOW-level input current
input capacitance
−0.3
−5
+0.8
+5
V
VTXD = VCC
µA
µA
pF
normal mode; VTXD = 0 V −100
−200
−300
10
Ci
not tested
−
5
Standby mode control input (pin STB)
VIH
VIL
IIH
HIGH-level input voltage
LOW-level input voltage
HIGH-level input current
LOW-level input current
2
−
VCC + 0.3 V
−0.3
−
−
+0.8
−
V
VSTB = VCC
VSTB = 0 V
0
µA
µA
IIL
−1
−4
−10
Receive data output (pin RXD)
VOH
IOH
IOL
HIGH-level output voltage
standby mode;
IRXD = −100 µA
VCC − 1.1 VCC − 0.7 VCC − 0.4 V
HIGH-level output current
normal mode;
VRXD = VCC − 0.4 V
−0.1
−0.4
−1
mA
mA
LOW-level output current
VRXD = 0.4 V
2
6
12
Common-mode stabilization output (pin SPLIT)
VO
output voltage
normal mode;
−500 µA < IO < +500 µA
0.3VCC
0.5VCC
0
0.7VCC
5
V
IL
leakage current
standby mode;
−
µA
−22 V < VSPLIT < +35 V
Bus lines (pins CANH and CANL)
VO(dom)
dominant output voltage
VTXD = 0 V
pin CANH
pin CANL
3
3.6
1.4
0
4.25
1.75
+150
V
0.5
−100
V
VO(dom)(m)
VO(dif)(bus)
matching of dominant output
voltage (VCC - VCANH - VCANL
mV
)
differential bus output voltage VTXD = 0 V; dominant;
1.5
−
−
3.0
V
(VCANH − VCANL
)
45 Ω < RL < 65 Ω
VTXD = VCC; recessive;
no load
−50
+50
mV
2003 Oct 14
6
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VO(reces)
recessive output voltage
normal mode; VTXD = VCC
;
2
0.5VCC
3
V
no load
standby mode; no load
VTXD = 0 V
−0.1
0
+0.1
V
IO(sc)
short-circuit output current
pin CANH; VCANH = 0 V −40
−70
70
−
−95
100
+2.5
mA
mA
mA
pin CANL; VCANL = 40 V 40
IO(reces)
Vdif(th)
recessive output current
−27 V < VCAN < +32 V
−2.5
differential receiver threshold −12 V < VCANL < +12 V;
voltage −12 V < VCANH < +12 V
normal mode (see Fig.6) 0.5
0.7
0.7
70
0.9
V
standby mode
0.4
50
1.15
100
V
Vhys(dif)
differential receiver hysteresis normal mode;
mV
voltage
−12 V < VCANL < +12 V;
−12 V < VCANH < +12 V
ILI
input leakage current
VCC = 0 V;
VCANH = VCANL = 5 V
−5
15
−3
0
+5
35
+3
µA
kΩ
%
Ri(cm)
Ri(cm)(m)
common-mode input
resistance
standby or normal mode
VCANH = VCANL
25
0
common-mode input
resistance matching
Ri(dif)
Ci(cm)
differential input resistance
standby or normal mode
VTXD = VCC; not tested
25
50
75
20
kΩ
common-mode input
capacitance
−
−
pF
Ci(dif)
differential input capacitance
VTXD = VCC; not tested
normal mode
−
−
10
pF
Timing characteristics; see Fig.8
td(TXD-BUSon) delay TXD to bus active
td(TXD-BUSoff) delay TXD to bus inactive
td(BUSon-RXD) delay bus active to RXD
td(BUSoff-RXD) delay bus inactive to RXD
25
70
110
95
ns
ns
ns
ns
ns
µs
µs
10
50
15
65
115
160
255
1000
5
35
100
−
tPD(TXD-RXD) propagation delay TXD to RXD VSTB = 0 V
tdom(TXD) TXD dominant time-out VTXD = 0 V
tBUS
40
300
0.75
600
1.75
dominant time for wake-up via standby mode
bus
td(stb-norm)
delay standby mode to normal normal mode
mode
5
7.5
10
µs
Thermal shutdown
Tj(sd)
shutdown junction temperature
155
165
180
°C
Note
1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 °C
ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 °C ambient temperature for
cased products; unless specified otherwise. For bare dies, all parameters are only guaranteed with the backside of
the die connected to ground.
2003 Oct 14
7
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
APPLICATION AND TEST INFORMATION
5 V
BAT
V
CC
STB
V
3
CANH
SPLIT
CANL
CC
7
5
6
8
Port x
TJA1040
MICROCONTROLLER
RXD
TXD
RXD
TXD
4
1
2
MGU164
More application information is available in a separate application note.
Fig.3 Typical application for 5 V microcontroller.
V
CC
TJA1040
CANH
R
R
60 Ω
60 Ω
V
= 0.5V
CC
SPLIT
SPLIT
CANL
in normal mode;
otherwise floating
MGU162
GND
Fig.4 Stabilization circuitry and application.
8
2003 Oct 14
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
+
5 V
47 µF
100 nF
V
CC
3
1 nF
1 nF
TXD
CANH
1
4
7
TRANSIENT
GENERATOR
CANL
SPLIT
6
5
TJA1040
500 kHz
RXD
2
8
15 pF
GND STB
MGW336
The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7.
Fig.5 Test circuit for automotive transients.
MGS378
V
RXD
HIGH
LOW
(V)
hysteresis
0.5
0.9
V
i(dif)(bus)
Fig.6 Hysteresis of the receiver.
9
2003 Oct 14
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
+
5 V
47 µF
100 nF
V
CC
3
TXD
1
5
4
CANH
CANL
7
6
SPLIT
RXD
R
C
L
100 pF
L
TJA1040
60 Ω
2
8
15 pF
GND STB
MGW335
Fig.7 Test circuit for timing characteristics.
HIGH
LOW
TXD
CANH
CANL
dominant
(BUS on)
0.9 V
0.5 V
(1)
V
i(dif)(bus)
RXD
recessive
(BUS off)
HIGH
0.7V
CC
0.3V
CC
LOW
t
t
d(TXD-BUSon)
t
d(TXD-BUSoff)
t
d(BUSon-RXD)
d(BUSoff-RXD)
t
t
PD TXD-RXD
(
)
(
)
PD TXD-RXD
MGS377
(1) Vi(dif)(bus) = VCANH − VCANL
.
Fig.8 Timing diagram.
10
2003 Oct 14
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
BONDING PAD LOCATIONS
COORDINATES(1)
SYMBOL
TXD
PAD
8
7
6
5
handbook, halfpage
x
y
1
2
3
4
5
6
7
8
119.5
648.5
114.5
85
GND
VCC
test pad 1
test pad 2
1214.25
1635.25
1516.5
990.5
114.5
114.5
1275
TJA1040U
RXD
SPLIT
CANL
CANH
STB
1273.75
1273.75
1246
x
0
0
1
2
3
4
530.25
113.75
MBL584
y
Note
The backside of the bare die must be connected to ground.
1. All x/y coordinates represent the position of the centre
of each pad (in µm) with respect to the left hand
bottom corner of the top aluminium layer (see Fig.9).
Fig.9 Bonding pad locations.
2003 Oct 14
11
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
PACKAGE OUTLINE
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
2003 Oct 14
12
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
SOLDERING
To overcome these problems the double-wave soldering
method was specifically developed.
Introduction to soldering surface mount packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA and SSOP-T packages
Manual soldering
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
volume ≥ 350 mm3 so called thick/large packages.
• below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
2003 Oct 14
13
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP(8)
suitable
suitable
not recommended(5)(6) suitable
not recommended(7)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
REVISION HISTORY
REV
DATE
CPCN
DESCRIPTION
Product specification (9397 750 11837)
Modification:
6
5
20031014
200307014
• Change ‘Vth(dif) = 0.5 V’ in standby mode into ‘Vdif(th) = 0.4 V’
• Add Chapter REVISION HISTORY
Product specification (9397 750 10887)
20030219
−
2003 Oct 14
14
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Oct 14
15
Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1040
Bare die
All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
2003 Oct 14
16
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R16/06/pp17
Date of release: 2003 Oct 14
Document order number: 9397 750 11837
TJA1040 - High-speed CAN transceiver with standby mode from NXP Semiconductors
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TJA1040 - High-speed CAN transceiver with standby mode
TJA1040
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14-Oct-03, 17 Pages, 91kB
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General description
The TJA1040 is the interface between the Controller Area Network (CAN) protocol controller and the physical bus. It is primarily intended
for high speed applications, up to 1 MBaud, in passenger cars. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller.
The TJA1040 is the next step up from the TJA1050 high speed CAN transceiver. Being pin compatible and offering the same excellent EMC performance, the TJA1040 also features:
An ideal passive behaviour when supply voltage is off
A very low-current standby mode with remote wake-upcapability via the bus.
This makes the TJA1040 an excellent choice in nodes which can be in power-down or standby mode in partially powered networks.
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Features
Fully compatible with the ISO 11898 standard
High speed (up to 1 MBaud)
Very low-current standby mode with remote wake-up capability via the bus
Very low ElectroMagnetic Emission (EME)
Differential receiver with high common-mode range for ElectroMagnetic Immunity (EMI)
Transceiver in unpowered state disengages from the bus (zero load)
Input levels compatible with 3.3 V and 5 V devices
Voltage source for stabilizing the recessive bus level if split termination is used (further improvement of EME)
At least 110 nodes can be connected
Transmit Data (TXD) dominant time-out function
Bus pins protected against transients in automotive environments
Bus pins and pin SPLIT short-circuit proof to battery and ground
Thermally protected.
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21-Oct-2009
TJA1040 - High-speed CAN transceiver with standby mode from NXP Semiconductors
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Products/packages
Type number
TJA1040T/V
TJA1040T/V
TJA1040T/V
TJA1040T/VM
TJA1040T/VM
TJA1040T/VM
Orderable part number
TJA1040T/V,112
TJA1040T/V,118
Ordering code (12NC)
9352 853 53112
9352 853 53118
9352 853 53518
9352 879 61112
9352 879 61118
9352 879 61518
Product status
Package
SOT96
SOT96
SOT96
SOT96
SOT96
SOT96
Packing
Tube
Marking
ECCN
Volume production
Volume production
Volume production
Volume production
Volume production
Volume production
Standard Marking
Standard Marking
Standard Marking
Standard Marking
Standard Marking
Standard Marking
Reel Pack, SMD, 13"
Reel Dry Pack, SMD, 13"
Tube
Reel Pack, SMD, 13"
Reel Dry Pack, SMD, 13"
TJA1040T/V,518
TJA1040T/VM,112
TJA1040T/VM,118
TJA1040T/VM,518
The variants in the table below are discontinued. See the table Discontinued information for more information.
Type number
Orderable part number
Ordering code (12NC)
Product status
Package
Packing
Marking
ECCN
Discontinued
TJA1040T/N1
TJA1040T/N1,112
9352 687 35112
SOT96
Tube
Standard Marking
Replacement product
Discontinued
TJA1040T/N1
TJA1040T/N1
TJA1040T/N1,118
TJA1040T/N1,518
9352 687 35118
9352 687 35518
SOT96
SOT96
Reel Pack, SMD, 13"
Standard Marking
Standard Marking
Replacement product
Discontinued
Reel Dry Pack, SMD, 13"
Replacement product
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Quality/reliability/chemical content
Type number
Orderable part number
Chemical content
RoHS
Leadfree conversion date
RHF IFR (FIT)
MTBF (hours)
MSL
TJA1040T/V
TJA1040T/V,112
TJA1040T_V
Always Pb-free
TJA1040T/V
TJA1040T/V
TJA1040T/VM
TJA1040T/VM
TJA1040T/VM
TJA1040T/V,118
TJA1040T/V,518
TJA1040T/VM,112
TJA1040T/VM,118
TJA1040T/VM,518
TJA1040T_V
TJA1040T_V
TJA1040T_VM
TJA1040T_VM
TJA1040T_VM
Always Pb-free
Always Pb-free
Always Pb-free
Always Pb-free
Always Pb-free
The variants in the table below are discontinued. See the table Discontinued information for more information.
Type number
Orderable part number
Chemical content
RoHS
Leadfree conversion date
RHF IFR (FIT)
MTBF (hours)
MSL
TJA1040T/N1
TJA1040T/N1,112
TJA1040T_N1
week 3, 2005
TJA1040T/N1
TJA1040T/N1
TJA1040T/N1,118
TJA1040T/N1,518
TJA1040T_N1
TJA1040T_N1
week 3, 2005
Always Pb-free
Quality and reliability disclaimer
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TJA1040 - High-speed CAN transceiver with standby mode from NXP Semiconductors
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Samples
Pricing/ordering/availability
Type number Ordering code
(12NC)
Orderable part
number
Indicative price/unit
($)
Region Distributor In
stock
Order
Inventory
date
Buy
quantity
online
not
TJA1040T/V
TJA1040T/V
TJA1040T/V
9352 853 53112
9352 853 53118
9352 853 53518
TJA1040T/V,112
TJA1040T/V,118
TJA1040T/V,518
TJA1040T/VM,112
TJA1040T/VM,118
TJA1040T/VM,518
available
not
available
not
available
not
TJA1040T/VM 9352 879 61112
TJA1040T/VM 9352 879 61118
TJA1040T/VM 9352 879 61518
available
not
available
not
available
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Discontinued information
Type
Ordering code
(12NC)
Last-time Last-time
Replacement
DN
Status
Comments
number
buy date delivery date product
Notice
Sole source product
Limited Availability. FAB ICN5 Closure. Refer to
Limited availability (check
with your usual sales
contact)
TJA1040T/N1 935268735112
TJA1040T/N1 935268735118
TJA1040T/N1 935268735518
31-dec-09 30-jun-10
31-dec-09 30-jun-10
31-dec-09 30-jun-10
TJA1040T/VM
DN 64
DN 64
DN 64
PCN200901054F dated February 12, 2009. Replacement
type with new diffusion fab location only.
Sole source product
Limited availability (check
with your usual sales
contact)
Sole source product
Limited availability (check
with your usual sales
contact)
Limited Availability. FAB ICN5 Closure. Refer to
PCN200901054F dated February 12, 2009. Replacement
type with new diffusion fab location only.
TJA1040T/VM
TJA1040T/VM
Limited Availability. FAB ICN5 Closure. Refer to
PCN200901054F dated February 12, 2009. Replacement
type with new diffusion fab location only.
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Design support
Application Notes
AN10211_2;TJA1040 high speed CAN transceiver (2006-11-10)
AN00094_3;TJA1041/1041A high speed CAN transceiver (2006-11-08)
AN00020_2;TJA1050 high speed CAN transceiver (2006-11-10)
Support Documents
75015744; High-speed CAN transceivers TJA104x, JA1050 and PCA82C25x (2006-09-01)
75016161; NXP Automotive networking solutions (2007-09-01)
75015741; The vital link in the interconnected car (2006-09-01)
PCA82C250_251_TJA1040_TJA1050; Upgrading Note PCA82C250/251 -> TJA1040, TJA1050 (2001-11-20)
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Parametrics/similar products
Type
Package Supply
Application Configuration
CATEGORY FEATURES
FUNCTION
Operating No. of Package
Transceiver
number
voltage
(V)
temp.
(Cel)
Pins
Material
Type
ISO compliant, standby mode,
4.75 ~
Control
HS-CAN
CAN
-40 ~
+125
SO8, bare
die
TJA1040T/N1 SOT96
transceiver
transceiver
remote wake-up, invisible
when off
8
8
High Speed
5.25
Devices
transceiver
Transceivers
ISO compliant, standby mode,
remote wake-up, invisible
when off
4.75 ~
5.25
HS-CAN
-40 ~
+125
SO8, bare
die
TJA1040T/V SOT96
transceiver
Similar products
TJA1040 links to the similar products page containing an overview of products that are similar in function or related to the type number(s) as listed on this page. The similar products page
includes products from the same catalog tree(s), relevant selection guides and products from the same functional category.
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Disclaimers
General product disclaimer
Quality and reliability disclaimer
NXP
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©2006-2009 NXP Semiconductors. All rights reserved.
http://www.nxp.com/
21-Oct-2009
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