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TJA1049

High-speed CAN transceiver with Standby mode

Rev. 3 — 16 September 2013

Product data sheet

1. General description

The TJA1049 high-speed CAN transceiver provides an interface between a Controller

Area Network (CAN) protocol controller and the physical two-wire CAN bus. The

transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the automotive

industry, supplying the differential transmit and receive capability to (a microcontroller

with) a CAN protocol controller.

The TJA1049 belongs to the third generation of high-speed CAN transceivers from NXP

Semiconductors, offering significant improvements over first- and second-generation

devices such as the TJA1040. It offers improved ElectroMagnetic Compatibility (EMC)

and ElectroStatic Discharge (ESD) performance, and also features:

• Ideal passive behavior to the CAN bus when the supply voltage is off

• A very low-current Standby mode with bus wake-up capability

• TJA1049T/3 and TJA1049TK/3 can be interfaced directly to microcontrollers with

supply voltages from 3 V to 5 V

These features make the TJA1049 an excellent choice for all types of HS-CAN networks,

in nodes that require a low-power mode with wake-up capability via the CAN bus.

2. Features and benefits

2.1 General

 Fully ISO 11898-2 and ISO 11898-5 compliant

 Suitable for 12 V and 24 V systems

 Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)

 V_IOinput on TJA1049T/3 and TJA1049TK/3 allows for direct interfacing with 3 V to 5 V

microcontrollers

 SPLIT voltage output on TJA1049T and TJA1049TK for stabilizing recessive bus level

 Both variants available in SO8 and HVSON8 packages

 Leadless HVSON8 package (3.0 mm  3.0 mm) with improved Automated Optical

Inspection (AOI) capability

 Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)

compliant)

2.2 Low-power management

 Very low-current Standby mode with host and bus wake-up capability

 Functional behavior predictable under all supply conditions

 Transceiver disengages from the bus when not powered up (zero load)

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

2.3 Protection

 High ESD handling capability on the bus pins

 Bus pins protected against transients in automotive environments

 Transmit Data (TXD) dominant time-out function

 Bus-dominant time-out function in Standby mode

 Undervoltage detection on pins V_CCand V_IO

 Thermally protected

3. Quick reference data

Table 1.

Symbol

V_CC

Quick reference data

Parameter

Conditions

Min

4.75

-

Typ Max Unit

supply voltage

supply current

-

5.25

15

V

I_CC

Standby mode: TJA1049T, TJA1049TK

Standby mode: TJA1049T/3, TJA1049TK/3

Normal mode; bus recessive

10

-

A

mA

V

-

5

2.5

20

3.5

5

7.5

65

Normal mode; bus dominant

45

-

V_uvd(VCC)

undervoltage detection voltage

on pin V_CC

4.75

V_IO

I_IO

supply voltage on pin V_IO

supply current on pin V_IO

2.8

5

-

5.5

14

V

Standby mode

-

A

Normal mode; bus recessive

Normal mode; bus dominant

15

-

80

200

350 1000 A

V_uvd(VIO)

undervoltage detection voltage

on pin V_IO

1.3

2.0 2.7

V

V_ESD

V_CANH

V_CANL

V_SPLIT

T_vj

electrostatic discharge voltage

voltage on pin CANH

IEC 61000-4-2 at pins CANH and CANL

no time limit; DC limiting value

8

-

+8

kV

V

58

40

+58

voltage on pin CANL

V

voltage on pin SPLIT

V

virtual junction temperature

+150 C

4. Ordering information

Table 2.

Ordering information

Type number^[1]

Package

Name

Description

plastic small outline package; 8 leads; body width 3.9 mm

Version

TJA1049T

SO8

SOT96-1

SOT782-1

TJA1049TK

HVSON8

plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3  3  0.85 mm

TJA1049T/3

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

TJA1049TK/3

HVSON8

plastic thermal enhanced very thin small outline package; no leads;

SOT782-1

8 terminals; body 3  3  0.85 mm

[1] TJA1049T and TJA1049TK with SPLIT pin; TJA1049T/3 and TJA1049TK/3 with V_IOpin.

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

2 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

5. Block diagram

V

IO

5

CC

3

V

CC

TJA1049

TEMPERATURE

PROTECTION

(1)

V

IO

7

6

CANH

CANL

SLOPE

CONTROL

AND

1

TXD

TIME-OUT

DRIVER

(1)

V

IO

8

MODE

CONTROL

5

STB

SPLIT

MUX

AND

DRIVER

4

RXD

WAKE-UP

FILTER

2

015aaa164

GND

(1) In a transceiver with a SPLIT pin, the V_IOinput is internally connected to V_CC

.

Fig 1. Block diagram

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

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TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

6. Pinning information

6.1 Pinning

TJA1049

terminal 1

index area

TJA1049TK

1

2

3

4

8

7

6

5

TXD

STB

TXD

1

2

3

4

8

7

6

5

CANH

GND

CANH

CANL

SPLIT

V

CANL

SPLIT

CC

V

CC

RXD

015aaa420

Transparent top view

015aaa166

a. TJA1049T: SO8 package

b. TJA1049TK: HVSON8 package

TJA1049T/3

terminal 1

index area

TJA1049TK/3

1

2

3

4

8

7

6

5

TXD

STB

TXD

1

8

7

6

5

CANH

GND

2

3

4

GND

CANH

CANL

V

CC

CANL

V

CC

RXD

V

IO

RXD

V

IO

015aaa436

Transparent top view

015aaa435

c. TJA1049T/3: SO8 package

d. TJA1049TK/3: HVSON8 package

Fig 2. Pin configuration diagrams

6.2 Pin description

Table 3.

Pin description

Pin Description

Symbol

TXD

1

transmit data input

GND

V_CC

2^[1]ground supply

3

4

5

6

7

8

supply voltage

RXD

receive data output; reads out data from the bus lines

common-mode stabilization output; TJA1049T and TJA1049TK only

supply voltage for I/O level adapter; TJA1049T/3 and TJA1049TK/3 only

LOW-level CAN bus line

SPLIT

V_IO

CANL

CANH

STB

HIGH-level CAN bus line

Standby mode control input

[1] For enhanced thermal and electrical performance, the exposed center pad of the HVSON8 package should

be soldered to board ground (and not to any other voltage level).

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

4 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

7. Functional description

The TJA1049 is a HS-CAN stand-alone transceiver with Standby mode. It combines the

functionality of the PCA82C250, PCA82C251 and TJA1040 transceivers with improved

EMC and ESD handling capability and quiescent current performance. Improved slope

control and high DC handling capability on the bus pins provide additional application

flexibility.

The TJA1049 is available in two versions, distinguished only by the function of pin 5:

• The TJA1049T and TJA1049TK are 100 % backwards compatible with the TJA1040

when operating with a 5 V microcontroller, and also cover existing PCA82C250 and

PCA82C251 applications

• The TJA1049T/3 and TJA1049TK/3 allow for direct interfacing to microcontrollers with

supply voltages down to 3 V

7.1 Operating modes

The TJA1049 supports two operating modes, Normal and Standby, which are selectable

via pin STB. See Table 4 for a description of the operating modes under normal supply

conditions.

Table 4.

Mode

Operating modes

Pin STB

Pin RXD

LOW

HIGH

Normal

LOW

HIGH

bus dominant

bus recessive

Standby

wake-up request

detected

no wake-up request

detected

7.1.1 Normal mode

A LOW level on pin STB selects Normal mode. In this mode, the transceiver can transmit

and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram).

The differential receiver converts the analog data on the bus lines into digital data which is

output on pin RXD. The slope of the output signals on the bus lines is controlled and

optimized in a way that guarantees the lowest possible EME.

7.1.2 Standby mode

A HIGH level on pin STB selects Standby mode. In Standby mode, the transceiver is not

able to transmit or correctly receive data via the bus lines. The transmitter and

Normal-mode receiver blocks are switched off to reduce supply current, and only a

low-power differential receiver monitors the bus lines for activity. The wake-up filter on the

output of the low-power receiver does not latch bus dominant states, but ensures that only

bus dominant and bus recessive states that persist longer than t_{fltr(wake)bus}are reflected on

pin RXD.

In Standby mode, the bus lines are biased to ground to minimize the system supply

current. The low-power receiver is supplied by V_IO, and is capable of detecting CAN bus

activity even if V_IOis the only supply voltage available. When pin RXD goes LOW to signal

a wake-up request, a transition to Normal mode will not be triggered until STB is forced

LOW.

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

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TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

7.2 Fail-safe features

7.2.1 TXD dominant time-out function

A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on

pin TXD persists for longer than t_to(dom)TXD, the transmitter is disabled, releasing the bus

lines to recessive state. This function prevents a hardware and/or software application

failure from driving the bus lines to a permanent dominant state (blocking all network

communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.

The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.

7.2.2 Bus dominant time-out function

In Standby mode, a 'bus dominant time-out' timer is started when the CAN bus changes

from recessive to dominant state. If the dominant state on the bus persists for longer than

t_to(dom)bus, the RXD pin is forced HIGH. This prevents a clamped dominant bus (due to a

bus short-circuit or a failure in one of the other nodes on the network) generating a

permanent wake-up request. The bus dominant time-out timer is reset when the CAN bus

changes from dominant to recessive state.

7.2.3 Internal biasing of TXD and STB input pins

Pins TXD and STB have internal pull-ups to V_IOto ensure a safe, defined state in case

one (or both) of these pins is left floating. Pull-up currents flow in these pins in all states;

both pins should be held HIGH in Standby mode to minimize standby current.

7.2.4 Undervoltage detection on pins V_CCand V_IO

Should V_CCdrop below the V_CCundervoltage detection level, V_uvd(VCC), the transceiver

will switch to Standby mode. The logic state of pin STB will be ignored until V_CChas

recovered.

Should V_IOdrop below the V_IOundervoltage detection level, V_uvd(VIO), the transceiver will

switch off and disengage from the bus (zero load) until V_IOhas recovered.

7.2.5 Overtemperature protection

The output drivers are protected against overtemperature conditions. If the virtual junction

temperature exceeds the shutdown junction temperature, T_j(sd), the output drivers will be

disabled until the virtual junction temperature falls below T_j(sd)and TXD becomes

recessive again. Including the TXD condition ensures that output driver oscillation due to

temperature drift is avoided.

7.3 SPLIT output pin and V_IOsupply pin

Two versions of the TJA1049 are available, only differing in the function of a single pin.

Pin 5 is either a SPLIT output pin or a V_IOsupply pin.

7.3.1 SPLIT pin

Using the SPLIT pin on the TJA1049T or TJA1049TK in conjunction with a split

termination network (see Figure 3 and Figure 6) can help to stabilize the recessive voltage

level on the bus. This will reduce EME in networks with DC leakage to ground (e.g. from

deactivated nodes with poor bus leakage performance). In Normal mode, pin SPLIT

delivers a DC output voltage of 0.5V_CC. In Standby mode or when V_CCis off, pin SPLIT is

floating.

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

6 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

V

CC

TJA1049

CANH

SPLIT

CANL

R

60 Ω

V

= 0.5 V

CC

SPLIT

in normal mode;

otherwise floating

R

015aaa167

GND

Fig 3. Stabilization circuitry and application for version with SPLIT pin

7.3.2 V_IOsupply pin

Pin V_IOon the TJA1049T/3 and TJA1049TK/3 should be connected to the microcontroller

supply voltage (see Figure 7). This will adjust the signal levels of pins TXD, RXD and STB

to the I/O levels of the microcontroller. Pin V_IOalso provides the internal supply voltage for

the low-power differential receiver of the transceiver. For applications running in

low-power mode, this allows the bus lines to be monitored for activity even if there is no

supply voltage on pin V_CC

.

For versions of the TJA1049 without a V_IOpin, the V_IOinput is internally connected to V_CC

This sets the signal levels of pins TXD, RXD and STB to levels compatible with 5 V

microcontrollers.

.

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

7 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

8. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.

Symbol Parameter

Conditions

Min

Max

Unit

V_x

voltage on pin x

no time limit; DC value

on pins CANH, CANL and SPLIT

on any other pin

on pins CANH and CANL

IEC 61000-4-2

at pins CANH and CANL

HBM

58

+58

+7

V

0.3

[1]

[2]

[3]

[4]

V_trt

transient voltage

150 +100

V_ESD

electrostatic discharge voltage

8

+8

kV

at pins CANH and CANL

at any other pin

MM

8

4

+8

+4

kV

[5]

[6]

at any pin

300 +300

V

CDM

at corner pins

750 +750

500 +500

V

at any pin

V

[7]

T_vj

virtual junction temperature

storage temperature

40

55

+150

C

T_stg

[1] Verified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a,

3a and 3b.

[2] IEC 61000-4-2 (150 pF, 330 ); direct coupling.

[3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 ) has been be verified by an external test house.

The result is equal to or better than 8 kV (unaided).

[4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k).

[5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 H, 10 ).

[6] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF); grade C3B.

[7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: T_vj= T_amb+ P  R_th(vj-a), where R_th(vj-a)is a

fixed value to be used for the calculation of T_vj. The rating for T_vjlimits the allowable combinations of power dissipation (P) and ambient

temperature (T_amb).

9. Thermal characteristics

Table 6.

Thermal characteristics

According to IEC 60747-1.

Symbol

Parameter

Conditions

Typ

145

50

Unit

K/W

R_th(j-a)

thermal resistance from junction to ambient

SO8 package; in free air

HVSON8 package; in free air

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

8 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

10. Static characteristics

Table 7.

Static characteristics

T_vj= 40 C to +150 C; V_CC= 4.75 V to 5.25 V; V_IO= 2.8 V to 5.5 V^[1]; R_L= 60  unless specified otherwise; All voltages are

defined with respect to ground. Positive currents flow into the IC.^[2]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supply; pin V_CC

V_CC

I_CC

supply voltage

4.75

-

5.25

V

supply current

Standby mode

TJA1049T or TJA1049TK;

includes I_IO; V_TXD= V_IO

-

10

-

15

5

A

TJA1049T/3 or TJA1049TK/3

Normal mode

recessive; V_TXD= V_IO

dominant; V_TXD= 0 V

2.5

20

5

7.5

65

mA

V

45

-

V_uvd(VCC)

undervoltage detection

voltage on pin V_CC

[1]

3.5

4.75

I/O level adapter supply; pin V_IO

V_IO

I_IO

supply voltage on pin V_IO

2.8

5

-

5.5

14

V

supply current on pin V_IO

Standby mode; V_TXD= V_IO

Normal mode

A

recessive; V_TXD= V_IO

dominant; V_TXD= 0 V

15

-

80

200

1000

2.7

A

V

350

2.0

V_uvd(VIO)

undervoltage detection

voltage on pin V_IO

1.3

Standby mode control input; pin STB

[3]

V_IH

HIGH-level input voltage

0.7V_IO

-

V_IO

0.3

+

V

V_IL

I_IH

I_IL

LOW-level input voltage

HIGH-level input current

LOW-level input current

0.3

1

-

0.3V_IO

+1

V

V_STB= V_IO

V_STB= 0 V

A

15

1

CAN transmit data input; pin TXD

[3]

V_IH

HIGH-level input voltage

0.7V_IO

-

V_IO

0.3

+

V

V_IL

I_IH

I_IL

LOW-level input voltage

HIGH-level input current

LOW-level input current

input capacitance

0.3

5

-

0.3V_IO

+5

V

V_TXD= V_IO

V_TXD= 0 V

-

A

pF

260

-

150

30

10

[4]

C_i

5

CAN receive data output; pin RXD

I_OH

HIGH-level output current

TJA1049T or TJA1049TK;

V_RXD= V_CC 0.4 V

8

9

1

3

-

1

12

mA

TJA1049T/3 or TJA1049TK/3;

V_RXD= V_IO 0.4 V

I_OL

LOW-level output current

V_RXD= 0.4 V; bus dominant

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

9 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

Table 7.

Static characteristics …continued

T_vj= 40 C to +150 C; V_CC= 4.75 V to 5.25 V; V_IO= 2.8 V to 5.5 V^[1]; R_L= 60  unless specified otherwise; All voltages are

defined with respect to ground. Positive currents flow into the IC.^[2]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Bus lines; pins CANH and CANL

V_O(dom)

dominant output voltage

V_TXD= 0 V; t < t_to(dom)TXD

pin CANH

2.75

0.5

3.5

1.5

-

4.5

V

pin CANL

2.25

+400

V

V_dom(TX)sym

V_O(dif)bus

transmitter dominant voltage V_dom(TX)sym= V_CC V_CANH V_CANL

400

mV

symmetry

bus differential output

voltage

V_TXD= 0 V; t < t_to(dom)TXD

V_CC= 4.75 V to 5.25 V

R_L= 45  to 65 

1.5

-

3

V

_TXD= V_IOrecessive; no load

50

2

-

+50

3

mV

V

V_O(rec)

recessive output voltage

Normal mode; V_TXD= V_IO; no load

Standby mode; no load

V_cm(CAN)= 12 V to +12 V

Normal mode

0.5V_CC

-

0.1

+0.1

V

[5]

[6]

V_th(RX)dif

differential receiver

threshold voltage

0.5

0.4

100

-

0.9

V

Standby mode

1.15

300

V

V_hys(RX)dif

I_O(sc)dom

differential receiver

hysteresis voltage

V_cm(CAN)= 12 V to +12 V

mV

Normal mode

dominant short-circuit output V_TXD= 0 V; t < t_to(dom)TXD; V_CC= 5 V

current

pin CANH; V_CANH= 0 V

100

40

70

70

-

40

100

+5

mA

pin CANL; V_CANL= 5 V / 40 V

I_O(sc)rec

I_L

recessive short-circuit

output current

Normal mode; V_TXD= V_IO

V_CANH= V_CANL= 27 V to +32 V

5

leakage current

V_CC= V_IO= 0 V;

3

-

+3

A

V_CANH= V_CANL= 5 V

R_i

input resistance

9

15

-

28

+3

52

20

k

%

R_i

input resistance deviation

differential input resistance

between V_CANHand V_CANL

3

19

-

R_i(dif)

C_i(cm)

30

-

k

pF

[4]

common-mode input

capacitance

C_i(dif)

differential input capacitance

-

10

pF

V

Common mode stabilization output, pin SPLIT; only relevant for TJA1049T and TJA1049TK

V_O

output voltage

Normal mode

0.3V_CC0.5V_CC0.7V_CC

I_SPLIT= 500 A to +500 A

Normal mode; R_L= 1 M

0.45V_CC0.5V_CC0.55V_CC

V

I_L

leakage current

Standby mode

5

-

+5

-

A

V_SPLIT= 58 V to +58 V

Temperature detection

T_j(sd)shutdown junction

temperature

[4]

-

190

C

[1] Only TJA1049T/3 and TJA1049TK/3 have a V_IOpin; in TJA1049T and TJA1049TK, the V_IOinput is internally connected to V_CC

.

[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to

cover the specified temperature and power supply voltage range.

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

10 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

[3] Maximum value assumes V_CC< V_IO; if V_CC> V_IO, the maximum value will be V_CC+ 0.3 V.

[4] Not tested in production; guaranteed by design.

[5]

V_cm(CAN)is the common mode voltage of CANH and CANL.

[6] For TJA1049T/3 and TJA1049TK/3: values valid when V_IO= 4.5 V to 5.5 V; when V_IO= 2.8 V to 4.5 V, values valid when

V_cm(CAN)= 12 V to +12 V.

11. Dynamic characteristics

Table 8.

Dynamic characteristics

T_vj= 40 C to +150 C; V_CC= 4.75 V to 5.25 V; V_IO= 2.8 V to 5.5 V^[1]; R_L= 60  unless specified otherwise. All voltages are

defined with respect to ground. Positive currents flow into the IC.^[2]

Symbol

Parameter

Conditions

Min Typ

Max

Unit

Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 4 and Figure 5

t_{d(TXD-busdom)}delay time from TXD to bus dominant

t_{d(TXD-busrec)}delay time from TXD to bus recessive

t_{d(busdom-RXD)}delay time from bus dominant to RXD

t_{d(busrec-RXD)}delay time from bus recessive to RXD

Normal mode

-

65

90

60

65

-

ns

-

t_PD(TXD-RXD)

propagation delay from TXD to RXD

versions with SPLIT pin

Normal mode

60

220

versions with V_IOpin

Normal mode

60

-

250

ns

t_to(dom)TXD

t_to(dom)bus

t_{fltr(wake)bus}

TXD dominant time-out time

bus dominant time-out time

bus wake-up filter time

V_TXD= 0 V; Normal mode

Standby mode

0.3

0.5

2

1

5

3

ms

s

version with SPLIT pin

Standby mode

versions with V_IOpin

Standby mode

0.5

7

1.5

25

5

s

t_d(stb-norm)

standby to normal mode delay time

47

[1] Only TJA1049T/3 and TJA1049TK/3 have a V_IOpin; in the TJA1049T and TJA1049TK, the V_IOinput is internally connected to V_CC

.

[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to

cover the specified temperature and power supply voltage range.

TJA1049

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 16 September 2013

11 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

+5 V

47 μF

100 nF

V

CC

TXD

CANH

TJA1049

R

L

100 pF

SPLIT

CANL

RXD

GND

STB

15 pF

015aaa165

(1) For versions with a V_IOpin (TJA1049T/3 and TJA1049TK/3), the V_IOpin is connected to pin V_CC

.

Fig 4. Timing test circuit for CAN transceiver

HIGH

LOW

TXD

CANH

CANL

dominant

0.9 V

0.5 V

V

O(dif)(bus)

recessive

HIGH

0.7V

IO

RXD

0.3V

IO

LOW

t

d(TXD-busrec)

d(TXD-busdom)

t

d(busrec-RXD)

d(busdom-RXD)

t

PD(TXD-RXD)

015aaa025

Fig 5. CAN transceiver timing diagram

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

12 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

12. Application information

5 V

BAT

V

CC

V

DD

CANH

STB

Pxx

Pyy

CANH

MICRO-

CONTROLLER

SPLIT

CANL

TJA1049

TXD

RXD

TX0

RX0

CANL

GND

015aaa168

Fig 6. Typical application with TJA1049T or TJA1049TK and a 5 V microcontroller.

BAT

3 V

INH

5 V

V

IO

CC

V

STB

CANH

CANL

DD

Pxx

CANH

CANL

TJA1049T/3

MICRO-

CONTROLLER

TXD

RXD

TJA1049TK/3

TX0

RX0

GND

015aaa437

Switching off the 5 V supply in Standby mode (dotted line) is optional.

Fig 7. Typical application with TJA1049T/3 or TJA1049TK/3 and a 3 V microcontroller.

13. Test information

13.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for

integrated circuits, and is suitable for use in automotive applications.

TJA1049

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 16 September 2013

13 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

14. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 8. Package outline SOT96-1 (SO8)

TJA1049

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 16 September 2013

14 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

SOT782-1

X

D

B

A

E

A

1

c

detail X

terminal 1

index area

e

1

C

terminal 1

index area

v

C A

C

B

e

b

y

1

y

w

C

1

4

L

K

E

h

8

5

D

h

0

1

2 mm

L

scale

Dimensions

(1)

Unit

A

b

c

D

h

E

e

1

K

v

w

y

1

h

max 1.00 0.05 0.35

mm nom 0.85 0.03 0.30 0.2 3.00 2.40 3.00 1.60 0.65 1.95 0.30 0.40 0.1 0.05 0.05 0.1

min 0.80 0.00 0.25 2.90 2.35 2.90 1.55 0.25 0.35

3.10 2.45 3.10 1.65

0.35 0.45

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

sot782-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

JEITA

- - -

09-08-25

09-08-28

SOT782-1

MO-229

Fig 9. Package outline SOT782-1 (HVSON8)

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

15 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

15. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate precautions are taken as

described in JESD625-A or equivalent standards.

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

16.2 Wave and reflow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

• Board specifications, including the board finish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

16 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

• Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath specifications, including temperature and impurities

16.4 Reflow soldering

Key characteristics in reflow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to

higher minimum peak temperatures (see Figure 10) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 9 and 10

Table 9.

SnPb eutectic process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

 350

220

< 2.5

235

220

 2.5

220

Table 10. Lead-free process (from J-STD-020D)

Package thickness (mm) Package reflow temperature (C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 10.

TJA1049

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 16 September 2013

17 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 10. Temperature profiles for large and small components

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

17. Soldering of HVSON packages

Section 16 contains a brief introduction to the techniques most commonly used to solder

Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON

leadless package ICs can found in the following application notes:

• AN10365 “Surface mount reflow soldering description”

• AN10366 “HVQFN application information”

18. Revision history

Table 11. Revision history

Document ID

TJA1049 v3

Release date

20130916

Data sheet status

Change notice

Supersedes

Product data sheet

-

TJA1049 v.2

Modifications:

• added HVSON8 package

• added TJA1049T/3 and TJA1049TK/3 (with V_IOpin)

• revised text, drawings and characteristics tables throughout to accommodate above changes

TJA1049 v.2

TJA1049 v.1

20110323

Product data sheet

-

TJA1049 v.1

20100924

Product data sheet

-

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

18 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

19. Legal information

19.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use in automotive applications — This NXP

19.2 Definitions

Semiconductors product has been qualified for use in automotive

applications. Unless otherwise agreed in writing, the product is not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer's own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

19.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

TJA1049

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3 — 16 September 2013

19 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

19.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

20. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

TJA1049

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Product data sheet

Rev. 3 — 16 September 2013

20 of 21

TJA1049

NXP Semiconductors

High-speed CAN transceiver with Standby mode

21. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

19.4

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Contact information . . . . . . . . . . . . . . . . . . . . 20

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

2

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Low-power management . . . . . . . . . . . . . . . . . 1

Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

20

21

2.1

2.2

2.3

3

4

5

Quick reference data . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

7

7.1

Functional description . . . . . . . . . . . . . . . . . . . 5

Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5

Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6

TXD dominant time-out function. . . . . . . . . . . . 6

Bus dominant time-out function . . . . . . . . . . . . 6

Internal biasing of TXD and STB input pins . . . 6

Undervoltage detection on pins V_CCand V_IO. . 6

Overtemperature protection . . . . . . . . . . . . . . . 6

SPLIT output pin and V_IOsupply pin . . . . . . . . 6

SPLIT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

V_IOsupply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.1.1

7.1.2

7.2

7.2.1

7.2.2

7.2.3

7.2.4

7.2.5

7.3

7.3.1

7.3.2

8

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

Thermal characteristics . . . . . . . . . . . . . . . . . . 8

Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

Dynamic characteristics . . . . . . . . . . . . . . . . . 11

Application information. . . . . . . . . . . . . . . . . . 13

Test information. . . . . . . . . . . . . . . . . . . . . . . . 13

Quality information . . . . . . . . . . . . . . . . . . . . . 13

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14

Handling information. . . . . . . . . . . . . . . . . . . . 16

9

10

11

12

13

13.1

14

15

16

Soldering of SMD packages . . . . . . . . . . . . . . 16

Introduction to soldering . . . . . . . . . . . . . . . . . 16

Wave and reflow soldering . . . . . . . . . . . . . . . 16

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 17

16.1

16.2

16.3

16.4

17

18

Soldering of HVSON packages. . . . . . . . . . . . 18

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

19

Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

19.1

19.2

19.3

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 16 September 2013

Document identifier: TJA1049


型号：	935299509118
厂家：	NXP
描述：	DATACOM, INTERFACE CIRCUIT, PDSO8 电信光电二极管电信集成电路
文件：	总21页 (文件大小：419K)
中文：	中文翻译
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