935309647174 [NXP]
Peizoresistive Sensor;
| 型号： | 935309647174 |
| 厂家： | 
NXP |
| 描述： | Peizoresistive Sensor 传感器 换能器 |
| 文件： | 总10页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MPXV4115V
Rev 4, 10/2012
Freescale Semiconductor
Data Sheet: Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated, and
Calibrated
MPXV4115V
Series
INTEGRATED
PRESSURE SENSOR
-115 to 0 kPa (-16.7 to 0 psi)
0.2 to 4.6 V Output
The MPXV4115V series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
particularly those employing a microcontroller with A/D inputs. This transduc-
er combines advanced micromachining techniques, thin-film metallization
and bipolar processing to provide an accurate, high-level analog output signal
that is proportional to the applied pressure/vacuum. The small form factor and
high reliability of on-chip integration make the sensor a logical and economi-
cal choice for the automotive system designer. Figure 1 shows a block dia-
gram of the internal circuitry integrated on a pressure sensor chip.
Application Examples
• Vacuum Pump Monitoring
• Brake Booster Monitoring
Features
• 1.5% Maximum error over 0 to 85C
• Temperature Compensated from –40 + 125C
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
# of Ports
None Single
Pressure Type
Package
Options
Case
No.
Device
Marking
Device Name
Dual
Gauge
Differential Absolute
Small Outline Package (MPXV4115V Series)
MPXV4115V6U
MPXV4115V
MPXV4115V
Rails
482
• Vacuum/
Gauge
•
MPXV4115VC6U
Rails
482A
• Vacuum/
Differential
•
SMALL OUTLINE PACKAGES
MPXV4115VC6U
CASE 482A-01
MPXV4115V6U
CASE 482-01
© 2005, 2008, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range (Differential mode, Vacuum on metal cap side, Atmospheric
pressure on back side)
POP
–115
—
0
kPa
Supply Voltage(1)
Supply Current
VS
Io
4.75
—
5.0
6.0
4.6
5.25
10
Vdc
mAdc
Vdc
Full Scale Output(2)
(Pdiff = 0 kPa)2
(0 to 85C)
(0 to 85C)
(0 to 85C)
VFSO
4.535
4.665
Full Scale Span(3)
@ VS = 5.0 V
VFSS
—
—
4.4
—
—
Vdc
Accuracy(4)
Sensitivity
—
1.5%
%VFSS
V/P
tR
—
—
38.26
1.0
—
—
mV/kPa
ms
Response Time(5)
Output Source Current at Full Scale Output
Io
—
—
—
0.1
20
—
—
—
mAdc
ms
Warm-Up Time(6)
Offset Stability(7)
—
—
0.5
%VFSS
1. Device is ratiometric within this specified excitation range.
2. Full Scale Output is defined as the output voltage at the maximum or full-rated pressure.
3. Full Scale Span is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum-rated pressure.
4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of errors, including the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset:
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXV4115V
Sensors
2
Freescale Semiconductor, Inc.
Pressure
Maximum Ratings
Table 2. MAXIMUM RATINGS(1)
Rating
Symbol
Value
Unit
Maximum Pressure
Pmax
400
kPa
Storage Temperature
Operating Temperature
Tstg
TA
–40 to +125
–40 to +125
C
C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
2
VS
Thin Film
Gain Stage #2
and
Temperature
Sensing
Element
VOUT
Compensation
and
Gain Stage #1
Ground
4
Reference
Shift Circuitry
GND
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
3
Figure 1. Fully Integrated Pressure Sensor Schematic for Small Outline Package
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
3
Pressure
On-chip Temperature Compensation, Calibration, and Signal Conditioning
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic
chip carrier (Case 482). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MPXV4115V series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
differential pressure input. Typical, minimum and maximum
output curves are shown for operation over a temperature
range of 0C to 85C using the decoupling circuit shown in
Figure 3. The output will saturate outside of the specified
pressure range.
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
Fluorosilicone
Gel Die Coat
Stainless
Steel Cap
Die
P1
P2
Wire Bond
Thermoplastic
Case
Lead
Frame
Die Bond
Differential Sensing Element
Figure 2. Cross-Sectional Diagram (not to scale)
+5 V
Output
Vout
Vs
IPS
1.0 F
GND
470 pF
0.01 F
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For output filtering recommendations, refer to Application Note AN1646.)
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
4
Pressure
TRANSFER FUNCTION MPXV4115V
5
4.5
4
Transfer Function:
Vout = Vs*[(0.007652*P) + 0.92] ± Pressure error
*Temp Factor*0.007652*VS)
VS = 5.0 V ± 0.25 Vdc
3.5
3
TEMP = 0-85°C
2.5
2
MAX
MIN
1.5
1
0.5
0
–115
–95
–75
–55
Vout vs. Vacuum
–35
–15
Figure 4. Applied Vacuum in kPa
(below atmospheric pressure)
Transfer Function (MPXV4115V)
Nominal Transfer Value:
Vout = VS (P x 0.007652 + 0.92)
± (Pressure Error x Temp. Factor x 0.007652 x VS)
VS = 5 V ± 0.25 Vdc
Temperature Error Band
MPXV4115V Series
4.0
Temp
Multiplier
3.0
- 40
0 to 85
+125
3
1
3
Temperature
Error
Factor
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0C to-40C and from 85C to 125C.
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
5
Pressure
Pressure Error Band
1.950
1.725
1.500
0
Pressure in kPa
(below atmospheric)
–115 –100 –85 –60 –45 –30 –15
0
–1.500
–1.725
–1.950
Pressure
–115 to 0 kPa
Error (Max)
±1.725 kPa
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
6
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
Part Number
MPXV4115V6U
Case Type
Pressure (P1) Side Identifier
Side with Part Marking
482
MPXV4115VC6U
Side with Port Attached
482A
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
7
Pressure
PACKAGE DIMENSIONS
-A-
D
8 PL
4
1
M
S
S
A
0.25 (0.010)
T
B
5
-B-
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
INCHES
MIN MAX
MILLIMETERS
S
N
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
5.38
MAX
10.79
10.79
5.84
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.96
1.07
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
H
C
J
0˚
7˚
-T-
0.405 0.415
0.709 0.725
10.29
18.01
10.54
18.41
SEATING
PLANE
S
PIN 1 IDENTIFIER
K
M
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-A-
D
8 PL
4
1
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
0.25 (0.010)
T
B
5
-B-
8
N
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
8
Pressure
Table 3. Revision History
Revision Revision
Description of changes
• Deleted references to device number MPXV4115V6T1 throughout the document
number
date
4
10/2012
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
9
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© 2012 Freescale Semiconductor, Inc.
MPXV4115V
Rev. 4
10/2012
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