935381779118_技术文档

TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

Rev. 1 — 15 March 2019

Product data sheet

1 General description

The TEA19032CT is a highly configurable secondary side SMPS controller that is

available in many factory configured versions. Section 15 gives an overview of the off-

the-shelf available versions of the TEA19032CT. To inquire about the possibilities of

customer-specific versions, contact your local sales representative.

The TEA19032CT supports the following protocols:

• USB Type-C v.1.3

• USB power delivery (USB-PD) including programmable power supply (PPS)

®

™

• Qualcomm QuickCharge QC4

A complete smart-charging switched-mode power supply (SMPS) can be built in

combination with the TEA193x primary controller and the TEA199x secondary side

synchronous rectifier (SR) controller.

The TEA19032CT can be provided in several small packages with low pin count. Due

to its small number of external components, a small form factor SMPS can be built that

meets efficiency requirements like CoC Tier-2, EuP Iot6, and DOE v6 with an extremely

no-load power (< 30 mW).

The TEA19032CT has a high level of digital integration. It incorporates all required

circuits, including a charge pump to drive an external NMOS load switch directly, a USB-

PD physical interface (PHY), and an integrated driver for fast output discharge.

The output voltage and output current are continuously measured and are used to control

the SMPS. The GPIO pin measures the adapter temperature or the temperature in the

cable/connector. Optionally, the GPIO pin can be used for other features, like supply

(see Table 4). The die temperature of the TEA19032CT is monitored via an internal

temperature sensor.

Multiple protections ensure the best-in-class charging safety for the TEA19032CT.

To ensure correct operation under all conditions, all protections except UVP are

implemented in hardware. The response of these protections can be programmed as

latched or safe restart. Although not recommended, these protections can be disabled

individually via the settings in the non-volatile multi-time programmable (MTP) memory.

If an output short circuit occurs, the power dissipation in the adapter can be below

50 mW.

For output voltage regulation, current regulation, and protection, only a single

optocoupler is required in the application.

The TEA19032CT operates in CV mode with a better than 2 % voltage accuracy. In CC

mode, it operates with a better than 2 % full-load current accuracy.

NXP Semiconductors

TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

2 Features and benefits

2.1 General

• Best-in-class fail-safe application for high-power adapters; gives complete protection

against overload conditions in the load (e.g. phone)

• Wide output voltage operating range (2.9 V to 21 V)

• Ultra-high efficiency together with TEA193x QR/DCM controller and TEA199x SR

controller

• Very low no-load power (< 30 mW for the complete system solution)

• High power density

• Dedicated SW pin to drive external NMOS directly

• Constant voltage (CV) and constant current (CC) control (programmable level)

• Precise voltage and current control with low minimum step size (voltage 12-bit DAC,

current 10-bit DAC)

• Continuous measurement of output voltage and output current with a better than 2 %

accuracy

• Low-cost SO10 package (suitable for reflow soldering and wave soldering)

• Low-cost bill of materials (BOM; ≈15 external components)

• Embedded MCU (with ROM, RAM, and MTP memory)

• Discharge pin for fast output voltage ramp down

• Built-in series regulator and programmable cable compensation

• Non-volatile MTP memory for storage of system configuration parameters

2.2 Protocol support

• USB Type-C v.1.3

• USB power delivery (USB-PD) 2.0 and 3.0 including programmable power supply

(PPS)

®

™

• Qualcomm QuickCharge QC4 protocol

• Unstructured vendor defined messages (VDMs), which can be used for MTP

programming, e.g. to get Vendor IDs

TEA19032CT

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Product data sheet

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

2.3 Protections

• Overtemperature protection (OTP): one internal and one external

• Adaptive overvoltage protection (OVP)

• Adaptive undervoltage protection (UVP)

• Overcurrent protection (OCP)

• Undervoltage lockout (UVLO) protection

• Output short protection (OSP)

• Open-supply protection (OSUP)

• Overvoltage protection at the CC1 and CC2 pins

• Soft short protection at the CC1 and CC2 pins

• Soft short protection at the output

To ensure safe operation, the TEA19032CT switches off the load during fault conditions.

3 Applications

®

™

• USB chargers for smart phones and tablets supporting the Qualcomm QuickCharge

QC4 protocol

• USB-PD 3.0, type C 1.3 chargers with optional VDM support for smartphones and

tablets

4 Ordering information

Table 1.ꢀOrdering information

Type number

Package

Name

Description

Version

TEA19032CABT/1 SO10

plastic small outline package; 10 leads; body width: 3.9 mm

SOT1437-1

5 Marking

Table 2.ꢀMarking

Type number

TEA19032CABT

Marking code

A19032CAB

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

6 Block diagram

OPTO

VCC

BG_det

SW_OFF

30 µA

BG_OK

SUPPLY

BLOCK

UVLO

REF

20 mA

VCC_

below_xxx

4 bits

OVP

OCP

Vout_below_vcc

VSNS

ISNS

DISCH

CCmode

amp

0.8 V

VOUT_below_0p8

3 levels

+ off

CHARGE

PUMP

SW

GPIO

OTP

ana_ctrl

UVLO

PARAMETER

MTP

USB-PD

PROTO

USB-PD

PHY

OR

SW_OFF

3.3 V

TYPEC

CONDET

OVP

CC1

CC2

USB

BLOCK

RAM

ROM

I2C

(M/S)

µC

OSC

DIGITAL

GND

aaa-028424

Figure 1.ꢀTEA19032CT block diagram

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

7 Pinning information

7.1 Pinning

VCC

OPTO

GPIO

ISNS

1

2

3

4

5

10 SW

9

8

7

6

GND

DISCH

CC1

IC

VSNS

CC2

aaa-028425

Figure 2.ꢀTEA19032CT pinning diagram (SOT1437-1)

7.2 Pin description

Table 3.ꢀPin description

Symbol

VCC

1

Description

supply voltage

OPTO

GPIO

ISNS

VSNS

CC2

2

OPTO driver

3

general-purpose input/output

current sense input

4

5

voltage sense input

6

type C CC2 line detection and USB-PD communication

type C CC1 line detection and USB-PD communication

fast discharge sink

CC1

7

DISCH

GND

8

9

ground

SW

10

NMOS gate drive output

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

8 Functional description

The TEA19032CT can be considered as a versatile programmable replacement for the

well-known TL431 shunt regulator series, where:

• The VSNS pin takes the role of the REF input of the TL431

• The OPTO pin takes the role of the cathode

• The GND pin takes the role of the anode

In addition to the constant voltage (CV) mode, which is regulated via the VSNS pin, the

system supports constant current (CC) mode. The current control loop is regulated and

the cable compensation is added via the ISNS pin.

Alternatively, the ISNS input can be used for overcurrent protection (OCP; see Table 4).

Several other protections are available. Many of these protections are programmable

as latched or safe restart. For guaranteed safety, all protections are implemented in

hardware. So, even when the microcontroller stops, the protections are still functional.

The output voltage and the output current can be controlled via USB-PD using the CC

pins.

The output current and the output voltage are continuously measured via an integrated

AD-converter. The values can be made available continuously via the USB-PD protocol.

The applied time constant of the digital filter is initialized via the firmware. A dedicated

signal that indicates a stable output voltage/output current for a reliable measurement is

available. It can be used, for example, to determine and monitor the cable resistance in

the portable device.

The external temperature, measured via the GPIO pin, is continuously monitored. From

the GPIO voltage and applied currents, the controller calculates the corresponding

temperatures. The temperature can be communicated to the portable device. Optionally,

an OTP function is added to this external temperature measurement, which is

programmable via MTP (see Table 4).

The available protections are implemented in hardware. They are independent of

processor actions. These protections in combination with the NMOS load switch ensure a

fail-safe operation with only one optocoupler. When the optocoupler fails, the OVP of the

primary side controller (TEA1936x) limits the maximum output voltage.

The TEA19032CT supports the type-C connector standard.

When a Type C receptacle is used, the CC1/CC2 pair is used for plug attach/detach

detection. It is also meant to support the USB-PD communication standard.

The USB-PD specification requires the use of a load switch and certain discharge

behavior of the output voltage at the connector V_bus. So, to drive the gate of an external

NMOS switch, the TEA19032CT is equipped with an SW pin. To be able to discharge

V_bususing an external resistor in series with an internal switch, the TEA19032CT is

equipped with a DISCH pin.

User-defined parameters can be stored in the non-volatile multi-time programmable

(MTP) memory.

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

8.1 Start-up and supply

The TEA19032CT is supplied via the VCC pin connected to the secondary DC voltage of

an AC-to-DC SMPS converter (see Figure 7). To control the primary side controller, this

VCC voltage is regulated via an integrated voltage/current control loop with external loop

compensation and an external optocoupler. This optocoupler is part of the gain loop of

the primary side SMPS controller.

At each start-up and after power-on reset, the optocoupler current is initially zero. So,

the AC-to-DC converter starts up with full output power, resulting in a rapid increase of

the VCC voltage. Due to the low V_CC(start)level (≈3 V), the TEA19032CT ensures that it

is fully operating before the V_CCreaches the default initial regulation level. The default

values of the initial regulation level are 5 V and 3 A and they are programmed in the non-

volatile memory (MTP).

At power-on reset, the safe default values, which are read from MTP, are set.

When the V_CCvoltage is below the UVLO level, the external NMOS load switch is off.

When the output is shorted while the load switch is closed, the UVLO is also triggered.

The load switch is then immediately opened and the system restarts after the safe restart

timer.

When the V_CCexceeds the UVLO level, all circuits, the initial DAC value, and the

resistive divider ratio are initialized. The system regulates the output to 5 V with a limited

output current of 3 A. All these values can be set via the MTP.

To minimize the output voltage overshoot after start-up, an internal 20 mA current sink

is applied to VCC when the VCC voltage exceeds 1.05 × V_o(default). The sink current

remains active until the VCC voltage has dropped to below 1.05 × V_o(default)again.

After the output voltage has stabilized, the load switch becomes conducting and the

system waits for an attach. Before the attach, only the essential circuits are working

which reduces the no-load power to its minimum.

When the voltage on one of the CC pins drops to below the V_IH(Rd)level, an attach is

detected and all circuits are enabled.

If a protocol is detected, it is allowed to change the voltage and current.

1.05 x V

o(default)

UVLO

20 mA

discharge V

CC

5 V regulation

aaa-023848

initialization

Figure 3.ꢀStart-up sequence

The TEA19032CT operates on supply voltages up to 21 V. The voltage on the VCC pin is

used to detect an OVP and UVP. The OVP and UVP level are set as a percentage of the

requested output voltage level.

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

If the supply voltage drops to below the UVLO level, the system returns to the no-supply

state and opens the load switch. Analog circuits are reset below UVLO. The internal

digital circuit is reset below the band gap voltage reference level.

8.2 Voltage loop

The analog constant voltage (CV) loop regulates VCC such that the voltage on the

VSNS pin equals the internal reference voltage. An external resistor divider is connected

between VCC, the VSNS pin, and ground. The value of this divider must match the

value that is programmed in MTP exactly. It depends on the maximum voltage in the

application. The divider values are:

• 1/ 2.5; maximum PDO voltage ≤ 6 V

• 1/5.476; maximum PDO voltage ≤ 13 V

• 1/8.325; maximum PDO voltage ≤ 20 V

The CV loop is regulated by varying the current through an optocoupler diode similar

to a TL431 driven control loop commonly used in switch mode power supplies. The RC

combination between the OPTO and VSNS pin determines the dynamic behavior of

the integrating part of the control loop. The resistor in series with the optocoupler diode

determines the dynamic behavior of the proportional part of the control loop. To prevent

saturation of the control loop during switching, a diode is placed in parallel to this resistor.

See Section 13.3 for more information about the control loop.

When the voltage loop reference is set to a higher value using the USB-PD or the QC

protocol, the internal reference voltage is updated to the new setting within 20 μs. The

output voltage is regulated to the requested voltage with a speed determined by the

control loop. If there is a transition down, a predefined ramp down sequence is followed

to prevent a high undershoot. Depending on the step size, the ramp down either follows

a linear or a parabolic slope. For a transition up, no special measures are required to

prevent an overshoot. The reason is that the charging current of the loop capacitor lifts

the voltage on the VSNS pin when the V_CCvoltage in the application increases.

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

V

CC

OPTO

aaa-021703

a. Circuit

V

CC

V

opto

loop saturated

discharge

aaa-021704

b. Curve

Figure 4.ꢀLinear transition down (no load)

A linear ramp-down (see Figure 4) can yield a perfect linear ramp of the output voltage

without any undershoot. However, depending on the loop bandwidth, the voltage loop

can end up in saturation. Saturation hampers a fast response to a load step immediately

following the end of the ramp (most protocols do not allow any load to be drawn during

a transition). Making the ramp down slower can prevent saturation of the loop. However,

a slower ramp down can contradict with the maximum discharge time most protocols

specify.

A parabolic discharge curve (see Figure 5; patent pending) initially causes the voltage

loop to saturate, due to the initial rapid ramp down. However, it allows the loop to recover

and to resume regulation toward the end of the curve. The total parabolic sequence time

must be chosen such that no undershoot under the final end value occurs.

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

V

CC

OPTO

aaa-021703

a. Circuit

V

CC

loop reference

V

opto

parabola depth

loop saturated

f

(parabola factor)

discharge

aaa-021705

b. Curve

Figure 5.ꢀParabolic transition down (no-load)

8.3 Current loop

The voltage drop across a small external series resistor between the output return

terminal and the converter ground is supplied to the ISNS pin. An internal amplifier

multiplies the voltage on the ISNS pin by a factor of 50. The output voltage of the

amplifier must remain below 2.5 V. The external resistor value can be chosen from 2 mΩ

up to 22.5 mΩ in steps of 0.02 mΩ. The external resistor value must correspond to the

programmed value in MTP. Any deviation from this MTP value, e.g. due to PCB-layout

imperfections, causes a current error and must be corrected (see Section 13.2).

Current in the application, the sense resistor, and the gain of the internal amplifier must

be chosen such that the output voltage of the internal amplifier remains below 2.5 V.

When the application is used in CC-mode, an RC-combination must be connected

between the OPTO pin and the ISNS pin (see Section 13.4).

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

8.4 Cable compensation

With cable compensation enabled, the output voltage is increased when the output

current increases to compensate for the voltage drop over the cable. The value of the

cable compensation is the same for all PDOs. It is set in MTP between the minimum and

maximum values (see Table 4).

Setting the cable compensation above 200 mV/A is not recommendable. The cable

compensation can be enabled/disabled for each individual PDO.

8.5 Load switch

A low-cost NMOS transistor is used as load switch between V_CCand V_bus(see Figure 7).

A dedicated switch-drive output pin (SW pin) controls this NMOS transistor. The output

(high) level of the switch drive output is V_CC+ 6 V using an internal charge pump.

As long as V_CCis below the UVLO level or if the VCC connection is open, the SW pin is

held low, ensuring that the load switch is off. To ensure that the NMOS is also kept off

when the SW pin is disconnected, an external (high-ohmic) resistor is required between

the gate of the NMOS and V_bus

.

To avoid charging V_CCvia the back-gate diode of the load switch, it is possible to apply

two NMOS switches in series, with their sources connected together.

8.6 Discharge function

The DISCH pin, which has an internal low-ohmic switch, provides the means to discharge

the output V_busquickly. An external series resistor limits the maximum current and the IC

dissipation.

To check if the output voltage has dropped to below 0.8 V, a comparator is implemented.

This voltage drop is a requirement of the USB-PD specification (vSafe0V) if there is a

hard reset.

When the internal DISCH switch is activated, the voltage at the DISCH pin is always low,

because of the external current limiting resistor. A mechanism has been implemented

to check the real output voltage. During a hard reset discharge sequence, when V_CC

is below vSafe5V, the switch is opened every millisecond for 20 μs to check the output

voltage at the end of the 20 μs period. The check of the output voltage is done until the

voltage remains below 0.7 V and the hard reset discharge sequence is terminated. For

this check to work properly, the capacitance on the DISCH pin and the external current

limiting resistor must have a time constant that is short enough.

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

To ensure that the output remains low, a 1 mA sink current is present on the DISCH pin

when both the load switch and discharge switch are off. The period that the DISCH pin

is active in unattached state (t_d(act)) is typically 100 ms. The reason for this limitation is to

prevent that excessive power dissipation occurs if an external V_busvoltage is applied.

8.7 Detach detection

When the voltage on one of the CC pins is greater than 1.2 V, a detach is detected. If

the type C cable is disconnected, the output voltage is regulated to its default value (5 V)

after 200 µs.

8.8 Internal temperature measurement

The internal die temperature is monitored continuously. Its value can be requested with

the appropriate vendor defined message (VDM). When the internal OTP (see Table 5) is

enabled, the internal OTP is triggered when the die temperature exceeds the value that is

programmed in MTP.

8.9 GPIO pin

In the MTP, the following functions can be selected for the GPIO pin:

• Off

• NTC

• NTC + OTP

• Supply

In the sections below, the functions are further explained.

8.9.1 Off

The GPIO pin is disabled and can be connected to ground.

8.9.2 NTC

With the NTC function enabled, the GPIO pin can be used to measure the adapter

or cable connector temperature via an NTC resistor. The temperature value can be

requested with the appropriate VDM command. To ensure an accurate temperature

measurement over the complete temperature range, the external NTC is supplied via an

adaptive current source (see Figure 6).

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

I

1

= 15 µA

I

2

= 60 µA

I

= 240 µA

3

disable

DIGITAL

CONTROL

MTP

ADC

GPIO

OTP level

CC1

CC2

FIRMWARE

USB-PD

aaa-028134

a. Circuit

I

= 15 µA

I

= 60 µA

I = 240 µA

3

1

2

3

V

GPIO

2.5

2

1.5

1

0.5

0.4

0

-50

0

50

100

150

Temperature

aaa-028135

b. Curves

Figure 6.ꢀExternal NTC is supplied via adaptive current sources

The voltage on the GPIO pin is measured via an internal A-to-D converter. If the voltage

on the GPIO pin drops to below 400 mV, the source current is increased. If the voltage

on the GPIO pin exceeds 2.4 V, the source current is decreased. When a 47 kΩ NTC

resistor with a Beta of 4108 is used, the temperature is accurately measured with a better

than < 5 °C accuracy within a range of 0 °C to > 120 °C.

TEA19032CT

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

8.9.3 NTC + OTP

With this function enabled, an OTP function is added to the NTC function. The OTP

function is integrated in hardware. The OTP level is set in MTP.

When the NTC (+ OTP) function is enabled for the GPIO pin, but this pin is not used in

the application, it must be connected to ground via a fixed 47 kΩ resistor. Do not leave

the unused pin floating or connect it to ground.

8.9.4 Supply

When the supply functionality is chosen for the GPIO pin in MTP, the output of the GPIO

can be used to supply, e.g., an EEPROM. The following modes can be chosen via MTP:

• The supply signal is high continuously.

• Dynamic switching of the I²C slave supply on the GPIO pin.

When the master activates I²C communication, the supply is turned on first. After a

delay, the I²C communications start. When I²C communications stops for 1 s, the

supply is turned off.

• The signal on the GPIO can have inverted behavior.

8.10 Communication

If a type-C receptacle is used, attach/detach detection and USB-PD communication is

provided on the CC pins.

8.10.1 USB Type-C

The TEA19032CT complies with the USB Type-C 1.3 specification (see Ref. 1) in the

sense that the distinct pull-up current values support attach/detach and current capability

advertising. The attach/detach detection is done in the hardware. So, if there is a detach,

a return of V_busto vSafe5V is always ensured. The hardware implementation of the

return of V_busto vSafe5V eliminates the risk of software implementations where V_busmay

stay at an unsafe level if the program execution stalls.

To support currents higher than 3 A, use a captive cable. V_connis not supported.

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8.10.2 USB-PD

TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

The TEA19032CT supports the USB-PD, release 3.0 specification (see Ref. 3) as far as

it is required for a DFP.

The TEA19032CT supports the programmable power supply (PPS) part of the USB-PD

3.0 specification.

The TEA19032CT can be programmed such that it only complies with the USB-PD 2.0

specification. With these MTP settings, power-brick USB-PD-2.0 testing can be done and

USB-PD 2.0 qualification is possible.

Maximum seven different power data objects (PDO) can be defined in the non-

volatile memory (MTP). Released types have a predefined set of PDOs programmed

(see Table 4). For each PDO, current limit type (OCP/CC) and cable compensation on/

off can be set. However, any other voltage or current within the range can be defined in a

PDO.

Four of the seven PDOs can be set as programmable power supply (PPS) instead of a

fixed power supply (FPS) via MTP.

The TEA19032CT supports the QC4 VDMs.

8.10.3 Discover identification

The TEA19032CT supports the discover identification protocol in USB-PD. It is possible

to program VID, PID, and BCD values in MTP. These values can be requested via VDM

messages.

The maximum power, which is used to determine the power profile, can be set in MTP.

8.10.4 Quick charge

®

™

The Qualcomm QuickCharge QC4 protocol is fully supported (see Ref. 4). The

required fixed and PPS PDOs can be configured in MTP.

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TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

8.10.5 MTP configuration

The TEA19032CT is configurable via MTP. The different types are defined in Section 15.

Table 4 gives an overview of the programmability with their minimum/maximum values.

Table 4.ꢀMTP configuration options

Function

Options

minimum

level

maximum

level

step size

default output voltage

default maximum output current

GPIO

-

3 V

0.3 A

-

10 V

5 A

-

50 mV

20 mA

-

disable; NTC;

NTC with OTP^[1]; Supply

GPIO protection level

OTP internal

-

62 °C

111 °C

variable but

< 5 °C

-

27 °C

2 mΩ

-

135 °C

22 mΩ

-

4.3 °C

0.02 mΩ

-

external sense resistor(R_sns

)

-

external resistor divider VCC/

VSNS (=DIV)^[2]

8.325; 2.5; 5.476

cable compensation^[3]

-

0 mV/A

R_sns* DIV * 8

V/A

variable

CC mode or OCP mode

PDO1

OCP-mode/CC-mode

-

5 V

3 A

PDO2; PDO3; PDO4; PDO5;

PDO6; PDO7

-

3 V

20 V

10 A

0.05 V

0.01 A

0.3 A

OVP level (PDO)^[4]

UVP level (PDO)^[4]

UVP level (APDO)^[4]

PDO PPS enable^[5]

USB3.0 enable

120 %; 125 %; 130 %

off; 60 %; 70 %; 80 %

off; 70 %; 80 %; 90 %

TRUE/FALSE

-

TRUE/FALSE

-

power limit PPS

TRUE/FALSE

minimum voltage APDO

-

3.3 V

20 V

[1] The NTC readout and OTP levels are defined with an NTC of 47 kΩ and a B-constant of 4108.

[2] Maximum output voltage for 5.476 is 13 V. Maximum output voltage for 2.5 V is 6 V.

[3] Cable compensation above 200 mV/A is not recommended.

[4] Can be selected for each PDO individually.

[5] Maximum 4 PDOs can be an APDO.

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8.11 Protections

Table 5 gives an overview of the available protections. All protections operate in safe

restart mode. All protections except UVP are implemented in hardware. When a fault

condition occurs, the load switch is immediately opened. When the fault condition is

removed, the load switch is closed again. The VCC is set to default and the minimum

delay defined in MTP is passed.

8.11.1 Protections overview

Table 5.ꢀOverview of protections

Protection

Description

Implementation

hardware

software

Default filter

UVLO

undervoltage lockout

-

OVP

overvoltage protection

30 μs

OCP

overcurrent protection

20 ms

OTP (internal)

OTP (external)

UVP

overtemperature protection

undervoltage protection

open-supply (VCC) protection

overvoltage protection CC1 and CC2 pins

-

OSUP

hardware

-

OV_CC1_CC2

127 μs

8.11.2 Secondary side safe restart protection

When a safe restart protection is triggered, the load switch is immediately turned off.

The voltage loop is kept on and is regulated to the initial value (5 V typical). As the

load switch is immediately turned off before the regulation reduces the output power,

the VCC voltage may increase. To ensure that the VCC voltage has dropped to a safe

value, before the load switch is turned on again, V_CCis discharged via an internal current

source of 20 mA if it exceeds the level of 1.05 × V_default

.

When the protection is triggered, the safe restart timer is started. After 1 s (default

value), a restart sequence is performed, which reinitializes all circuits. Optionally, most

protections can be changed to latched protections in MTP.

8.11.3 Undervoltage lockout (UVLO)

The level at which the UVLO protection is triggered is fixed. When V_CCdrops to below

the UVLO level, the load switch is immediately turned off. All settings are reset to their

initial values. Internal circuitries are disabled.

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8.11.4 Overvoltage protection (OVP)

The OVP level is set as a percentage of the requested output voltage level. The OVP

level is set to default 125 % (V < 9 V) or 120 % (V ≥ 9 V) of the programmed output

voltage. When V_CCcontinuously exceeds this level for longer than the minimum OVP

time (default 30 μs), the OVP protection is triggered.

8.11.5 Overcurrent protection (OCP)

The default TEA19032CT setting is CC mode. In CC mode, the current loop defines the

maximum current. Instead, the OCP mode can be selected via MTP. The OCP level can

be programmed individually for each PDO. OCP is only triggered if the OCP mode is

set for the corresponding PDO and the output current is continuously higher than the

programmed current level for more than the programmed OCP blanking time.

8.11.6 Overtemperature protection (OTP)

8.11.6.1 Internal OTP

When the internally measured temperature exceeds the programmed OTP setting, OTP

is triggered, unless the protection is disabled in MTP. The temperature level can be

defined in MTP. The default value is 113 °C.

Furthermore, the internal temperature sensor can be used to measure the temperature.

The measured temperature can be sent via USB-PD.

8.11.6.2 External OTP

When the mode "NTC+OTP" is selected for GPIO in the MTP and the externally

measured temperature exceeds the programmed OTP setting, OTP is triggered. The

temperature level can be defined in MTP. The default value is 90 °C (see Section 15

and Table 4).

8.11.7 Open-supply protection (OSUP)

When the IC is not supplied via the VCC pin any more, the voltage on the OPTO pin

is used to open the external load switch. If the VCC pin is disconnected, opening the

external load switch prevents that the load is damaged.

8.11.8 Undervoltage protection (UVP)

The UVP level is set to 60 % PDO level. The reaction to a triggering of UVP is

programmed in the firmware. The protection is a safe restart protection by default. The

level can never be lower than the UVLO level. The level can be adjusted via MTP.

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8.11.9 Output short protection (OSP)

At a shorted output, the VCC voltage drops to below the UVLO level. The load switch

is turned off. After the programmed safe restart time, the output is enabled again. To

meet the average input power requirement at a shorted output, a proper safe restart time

must be chosen. When the VCC voltage exceeds the UVLO level, the primary controller

initially limits the maximum output power.

Because the safe restart time is set to 1 s, the dissipation is limited to < 50 mW. This

limitation prevents that the application heats up when the output is shorted.

8.11.10 OVP CC1 and CC2 pins (OV_CC1_CC2)

The overvoltage protection of the CC1 and CC2 pins can be enabled in MTP. However, it

is switched off by default.

OV_CC1_CC2 is a safe restart protection. When the CC1 or CC2 pin is shorted to V_bus

,

this protection is triggered. The trigger level of the OV_CC1_CC2 is at 4.5 V. To prevent

unwanted triggering, it has a 127 µs (default) blanking time.

8.11.11 Soft short protection CC pins (SHORT_CC1_CC2)

The CC pins are protected with a soft-short protection that measures the impedance

of the CC lines. When the measured impedance is not according to the USB-PD

specification, the load switch is opened.

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9 Limiting values

Table 6.ꢀLimiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Voltages

V_VCC

Parameter

Conditions

Min

Max

Unit

voltage on pin VCC

voltage on pin OPTO

voltage on pin CC1

voltage on pin CC2

voltage on pin SW

voltage on pin DISCH

voltage on pin VSNS

voltage on pin ISNS

voltage on pin GPIO

−0.5

+26

V

V_OPTO

V_CC1

+26

V_CC2

+26

V_SW

V_CC+ 9

+26

V_DISCH

V_VSNS

V_ISNS

V_GPIO

General

T_stg

+3.6

storage temperature

junction temperature

−65

−40

+150

°C

T_j

Electrostatic discharge (ESD)

V_ESD

electrostatic discharge

voltage

human body model

(HBM)

−2000

−500

−200

+2000

+500

+200

V

charged device model

(CDM)

machine model (MM)

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10 Recommended operating conditions

Table 7.ꢀRecommended operating conditions

Symbol

Voltages

V_VCC

Parameter

Conditions

Min

Max

Unit

voltage on pin VCC

voltage on pin OPTO

voltage on pin CC1

voltage on pin CC2

voltage on pin SW

voltage on pin DISCH

voltage on pin VSNS

voltage on pin ISNS

voltage on pin GPIO

0

21

V

V_OPTO

V_CC1

21

5

V_CC2

5

V_SW

V_CC+ 6

21

V_DISCH

V_VSNS

V_ISNS

V_GPIO

General

T_j

2.5

3.3

junction temperature

−20

+105

°C

11 Thermal characteristics

Table 8.ꢀThermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

R_th(j-a)

thermal resistance from

junction to ambient

JEDEC test board

115

K/W

R_th(j-c)

thermal resistance from

junction to case

JEDEC test board

44

K/W

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12 Characteristics

Table 9.ꢀCharacteristics

T_amb= 25 °C; V_CC= 5.0 V; all voltages are measured with respect to GND; currents are positive when flowing into the IC;

unless otherwise specified.

Symbol

Supply (VCC pin)

V_th(UVLO)undervoltage lockout

Parameter

Conditions

Min

Typ

Max

Unit

falling

-

2.85

2.9

V

threshold

I_CC

supply current

unattached; V_CC= 5 V

nominal; V_CC= 5 V

-

1.8

3

-

mA

I_CC(dch)

discharge supply

current

extra discharge current;

V_CC= 1.05 × V_o(default)

20

discharge current of

VCC during safe restart

protection; depends on

load conditions

-

20

-

mA

V_os

overshoot voltage

protection level voltage

-

1.05 × V_o(default)

-

V

CC1/CC2 section (CC1 and CC2 pins)

Type C

I_pu

pull-up current

current source for DFP pull-up indication

default current

1.5 A mode

3 A mode

−96

−80

−64

μA

−194

−356

−180

−330

−166

−304

V_IH

HIGH-level input

voltage

with standard 5.1 kΩ pull-down resistance

default current

1.5 A mode

3 A mode

1.5

1.6

1.7

V

1.5

1.6

1.7

2.45

2.60

2.75

V_IL

LOW-level input voltage with standard 5.1 kΩ pull-down resistance

default current

1.5 A mode

3 A mode

0.15

0.35

0.75

-

0.2

0.25

0.45

0.85

-

V

0.40

0.80

4.5

V_ovp

overvoltage protection CC1 and CC2 pins

voltage

USB-PD normative specification

f_bit

bit rate

BMC bit rate

270

300

330

Kbps

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Symbol

Parameter

Conditions

Min

Typ

Max

Unit

USB-PD transmitter normative specification

t_fall

fall time

rise time

10 % and 90

% amplitude

points; minimum is

underloaded condition

300

-

650

ns

t_rise

10 % and 90

300

-

650

ns

% amplitude

points; minimum is

underloaded condition

V_o

Z_o

output voltage

signal voltage swing

transmitter

1.05

-

1.125

45

1.2

-

V

output impedance

Ω

USB-PD receiver normative specification

C_in

input capacitance

receiver

-

250

-

pF

ns

|t_fltr(lim)

time constant limiting

filter

receiver bandwidth

100

z_i

input impedance

input voltage

receiver

10

-

MΩ

V_i

receiver comparator

low level

-

0.55

0.8

-

V

high level

V

hysteresis

250

mV

Voltage control (VSNS pin)

V_ref

reference voltage

input voltage range on

the VSNS pin to control

the voltage loop

0.3

-

2.4

V

V_acc

voltage accuracy

voltage loop accuracy;

V_CC= 5 V

−2

-

+2

%

measurement voltage

accuracy

g_m

transconductance

maximum gain

VCC in; OPTO out

cable compensation

4

-

mA/mV

mV/mV

G_max

8

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Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Current control (ISNS pin)

I_ref

reference current

parameter can be

programmed in MTP 10

bits

0

-

40

mV

I_out

output current

current loop accuracy; R_sense= 5 mΩ

0.5 A < I_out< 5 A

I_out> 5 A

−100

−2

-

+100

+2

mA

%

measurement current accuracy; R_sense= 5 mΩ

[1]

0.5 A < I_out< 5 A

I_out> 5 A

−100

−3

-

+100

+3

mA

%

g_m

transconductance

gain current;

200

mA/mV

amplifier = 50

gain current;

amplifier = 25

100

-

mA/mV

GPIO pin

I_O(GPIO)

output current on pin

GPIO

GPIO function = NTC (+OTP)

low temperatures

(see Figure 6)

−15.75 −15.00

−14.25 μA

medium

−63

−60

−57

μA

temperatures

(see Figure 6)

high temperatures

(see Figure 6)

−252

−5

−240

−228

+5

μA

°C

T_acc

T_res

V_I

temperature accuracy

47 kΩ NTC

(Beta = 4108)

-

temperature resolution temperature

measurement

−1

+1

input voltage

high level

1.5

-

V

low level

0.9

V_O

output voltage

GPIO function = supply

high level; no load

low level; no load

GPIO function = supply

source; V_O= 2.3 V

sink; V_O= 0.4 V

2.7

-

3.0

-

3.3

0.3

V

I_O

output current

-

−1

-

mA

1

Protections

V_ovp

overvoltage protection with control loop in

voltage voltage control mode

3

-

25

+3

V

V_ovp(acc)

overvoltage protection VCC pin; V_ovp= 6 V

voltage accuracy

−3

%

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Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_ocp

overcurrent protection

voltage

6

-

40

mV

V_ocp(acc)

V_uvp

V_uvp(acc)

I_CC(dch)

overcurrent protection

voltage accuracy

−3

3

-

+3

21

+3

-

%

undervoltage protection

voltage

-

V

undervoltage protection

voltage accuracy

−3

-

%

discharge supply

current

during safe restart

protection

20

mA

SW driver

R_O

output resistance

switch-on

switch-off

-

80

-

kΩ

Ω

600

DISCH part (DISCH pin)

R_dch

V_det(rst)

t_act

discharge resistance

reset detection voltage hard reset

-

3

-

Ω

0.65

-

0.70

100

0.75

-

V

active time

maximum on-time

ms

during attached state

OPTO pin

I_O(min)

minimum output current

-

30

5

-

μA

I_O(max)

maximum output

current

3.75

6.25

mA

Internal oscillator

f_oscinternal oscillator

frequency

Internal temperature protection

T_otp(acc)overtemperature

-

10

-

MHz

°C

temperature

−10

+10

protection trip accuracy regarding the trip level

programmed in MTP

[1] The current sense pin can be used up to 40 mV. The result is a current range that depends on the programmed R_senseresistor. (e.g. with 10 mΩ, the value

can be up to 4 A).

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13 Application information

V

CC

V

bus

XV

TEA199x

GND

R2

R3

DRAIN

GATE

S1

HV

n.c.

DRIVER

ISENSE

AUX

CAP

SOURCE

CTRL

TEA193x

GND

VCCH

VCCL

R1

PROTECT

R7

R5

VCC

SW

OPTO

GND

DISCH

R6

C2

R4

C1

GPIO

ISNS

CC1

CC2

TEA19032C

VSNS

NTC

(near connector)

aaa-031608

Figure 7.ꢀTypical application diagram, including TEA1938, TEA1999 (low-side SR), and TEA19032CT

13.1 Resistor divider

The resistor divider (R3 / (R2 + R3) connected from the VCC pin to the VSNS pin must

reduce the output voltage to < 2.5 V for the maximum output voltage. See Section 8.2 for

more information about the divider ratios. To minimize the voltage drop at the connector,

the resistor divider must be connected as close as possible to the load switch.

It is important that the external resistive divider exactly matches the internal value (MTP),

because internal measurements depend on it. In the resistive divider, use resistors with a

1 % or better accuracy.

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13.2 Sense resistor

The accuracy of the sense resistor R1 is very important. Any deviation from the value in

MTP gives an offset in the current measurement. Because the sense resistor is very low-

ohmic, the layout of the connections in the PCB can give major deviations from its initial

value.

To overcome these deviations, several options are available:

• Change the sense resistor value such that the complete value is matching the typical

MTP value (5 mΩ or 10 mΩ).

• Trim the value with a resistor divider so that the (R7 / (R5 + R7)) × (R1 + R_PCB

)

matches the MTP default value. R_PCBis the resistance of copper wires and the

resistance change of the sense resistor due to its soldering profile.

To maximize accuracy and temperature stability, keep R_pcbas low as possible. The

sense resistor must have a temperature coefficient that is as low as possible. To prevent

magnetic coupling, keep the length and the area of the connections between the sense

resistor and the GND and ISNS pins as small as possible.

13.3 Voltage loop

In the application diagram, an integrator network is connected between the VSNS pin

and the optocoupler. The recommended values of these components are:

• R2 = 160 kΩ to 180 kΩ

• R4 = 1 kΩ

• C1 = 10 nF; for the integral part

To prevent magnetic coupling to these parts, which results in pollution in output voltage,

the length and the area of the connection must be kept as small as possible.

13.4 Current loop

For applications using the CC loop in the application, an integrator network is connected

between the ISNS pin and the optocoupler. The recommended values for these

components are:

• R5 = 330 Ω when R1 = 10 mΩ; R5 = 160 Ω when R1 = 5 mΩ; connected between

sense resistor and the ISNS pin for the proportional part.

• R6 = 5 kΩ

• C2 = 100 nF; for the integral part

To prevent magnetic coupling to these parts, which results in pollution in output currents,

the length and the area of the connection must be kept as small as possible.

For applications that use OCP mode, these three components can be omitted.

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14 Package outline

SO10: plastic small outline package; 10 leads; body width 3.9 mm; body thickness 1.35 mm

SOT1437-1

D

E

A

c

y

X

H

E

v

A

Z

10

6

Q

A

2

A

1

A

3

θ

1

5

pin 1 index

L

p

L

e

w

b

p

detail X

(8x)

(10x)

0

5 mm

scale

Dimensions

Unit

max 1.75 0.25 1.45

(1)

A

b

c

D

E

e

H

L

Q

1.00 0.70

v

w

y

Z

θ

1

2

3

p

E

p

°

8

4

0

0.49 0.25 6.3 4.0

0.18 1.35 0.25 0.43 0.22 6.2 3.9 1.27 6.00 1.05 0.70 0.65 0.25 0.25 0.1 0.56

0.10 1.25 0.36 0.19 6.1 3.8 5.80 0.40 0.60 0.30

6.20

0.70

nom

min

mm

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

sot1437-1_po

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

15-02-09

15-03-06

SOT1437-1

Figure 8.ꢀPackage outline SOT1437-1 (SO10)

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15 Appendix: Internal parameter settings per type

In this section, the internal parameter settings per type are given.

15.1 TEA19032CABT

Table 10 gives an overview of the function settings in the TEA19032CABT.

Table 10.ꢀInternal parameter settings

Function

TEA19032CABT

power rating

45 W

USB-PD3; QC4

5 V

supported standards

default output voltage

default maximum output current

GPIO1 function

3 A

NTC with OTP

90 °C

GPIO1 protection level

chip OTP trigger level

113 °C

10 mΩ

external sense resistor (R_sense

)

external resistor divider VCC/VSNS (= DIV)

8.325

cable compensation

CC mode or OCP

OCP level/CC mode margin

PDO1

100 mV/A

OCP

5 %

PPS enable

voltage

FALSE

5 V

current

3 A

OVP level

125 %

off

UVP level

QC enable

TRUE

cable compensation enable

PDO2

PPS enable

voltage

FALSE

9 V

current

3 A

OVP level

120 %

60 %

TRUE

UVP level

QC enable

cable compensation enable

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Function

PDO3

PPS enable

TEA19032CABT

FALSE

12 V

voltage

current

3 A

OVP level

120 %

60 %

TRUE

UVP level

QC enable

cable compensation enable

PDO4

PPS enable

voltage

FALSE

15 V

current

3 A

OVP level

120 %

60 %

UVP level

QC enable

FALSE

TRUE

cable compensation enable

PDO5

PPS enable

voltage

FALSE

20 V

current

2.25 A

120 %

60 %

OVP level

UVP level

QC enable

FALSE

TRUE

cable compensation enable

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16 Abbreviations

Table 11.ꢀAbbreviations

Acronym

AC

Description

alternating current

augmented PDO

bi-phase mark coding

bill of materials

constant current

constant voltage

direct current

APDO

BMC

BOM

CC

CV

DC

DCM

DFP

discontinuous conduction mode

downstream facing port

electrically erasable programmable read-only memory

multi-time programmable

overcurrent protection

EEPROM

MTP

OCP

OSP

OSUP

OTP

output short protection

output supply protection

overtemperature protection

overvoltage protection

power data object

OVP

PDO

PPS

programmable power supply

Quasi-Resonant

QR

RAM

ROM

RPDO

SMPS

UFP

random-access memory

read-only memory

regular PDO

switched-mode power supply

upstream facing port

USB

universal serial bus

UVLO

UVP

undervoltage lockout

undervoltage protection

vendor defined messages

VDM

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17 References

[1] USB Type-C Cable and Connector Specification

— Revision 1.3 and ECNs; July 14, 2017

[2] USB Power Delivery Specification Rev. 2.0,

— Revision 2.0, version 1.3; January 12, 2017

Version 1.3

[3] USB Power Delivery Specification

— Revision 3.0, version 1.1; ECNs as of June 12, 2017;

June 12, 2017

[4] Qualcomm^®QuickCharge^™4 Interface Specification — Revision D; Qualcomm^®, August 1, 2017

- 80-NH008-3

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NXP Semiconductors

TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

18 Revision history

Table 12.ꢀRevision history

Document ID

Release date

20190315

Data sheet status

Change notice

Supersedes

TEA19032CT v.1

Product data sheet

-

TEA19032CT

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 15 March 2019

33 / 36

NXP Semiconductors

TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

19 Legal information

19.1 Data sheet status

Document status^[1][2]

Product status^[3]

Definition

Objective [short] data sheet

Development

This document contains data from the objective specification for product

development.

Preliminary [short] data sheet

Product [short] data sheet

Qualification

Production

This document contains data from the preliminary specification.

This document contains the product specification.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

19.2 Definitions

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

no representation or warranty that such applications will be suitable

for the specified use without further testing or modification. Customers

are responsible for the design and operation of their applications and

products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications

and products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with

their applications and products. NXP Semiconductors does not accept any

liability related to any default, damage, costs or problem which is based

on any weakness or default in the customer’s applications or products, or

the application or use by customer’s third party customer(s). Customer is

responsible for doing all necessary testing for the customer’s applications

and products using NXP Semiconductors products in order to avoid a

default of the applications and the products or of the application or use by

customer’s third party customer(s). NXP does not accept any liability in this

respect.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

19.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not

give any representations or warranties, expressed or implied, as to the

accuracy or completeness of such information and shall have no liability

for the consequences of use of such information. NXP Semiconductors

takes no responsibility for the content in this document if provided by an

information source outside of NXP Semiconductors. In no event shall NXP

Semiconductors be liable for any indirect, incidental, punitive, special or

consequential damages (including - without limitation - lost profits, lost

savings, business interruption, costs related to the removal or replacement

of any products or rework charges) whether or not such damages are based

on tort (including negligence), warranty, breach of contract or any other

legal theory. Notwithstanding any damages that customer might incur for

any reason whatsoever, NXP Semiconductors’ aggregate and cumulative

liability towards customer for the products described herein shall be limited

in accordance with the Terms and conditions of commercial sale of NXP

Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

TEA19032CT

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 15 March 2019

34 / 36

NXP Semiconductors

TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or

the grant, conveyance or implication of any license under any copyrights,

patents or other industrial or intellectual property rights.

of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Security — While NXP Semiconductors has implemented advanced

security features, all products may be subject to unidentified vulnerabilities.

Customers are responsible for the design and operation of their applications

and products to reduce the effect of these vulnerabilities on customer’s

applications and products, and NXP Semiconductors accepts no liability for

any vulnerability that is discovered. Customers should implement appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications. In

the event that customer uses the product for design-in and use in automotive

applications to automotive specifications and standards, customer (a) shall

use the product without NXP Semiconductors’ warranty of the product for

such automotive applications, use and specifications, and (b) whenever

customer uses the product for automotive applications beyond NXP

Semiconductors’ specifications such use shall be solely at customer’s own

risk, and (c) customer fully indemnifies NXP Semiconductors for any liability,

damages or failed product claims resulting from customer design and use

19.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

GreenChip — is a trademark of NXP B.V.

TEA19032CT

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 15 March 2019

35 / 36

NXP Semiconductors

TEA19032CT

USB-PD 2.0/USB-PD 3.0/QC 4 controller for SMPS

Contents

1

2

2.1

2.2

2.3

3

4

5

6

7

7.1

7.2

8

8.1

8.2

8.3

General description ............................................ 1

13.2

13.3

13.4

14

Sense resistor ..................................................27

Voltage loop .....................................................27

Current loop .....................................................27

Package outline .................................................28

Appendix: Internal parameter settings per

type .....................................................................29

TEA19032CABT .............................................. 29

Abbreviations .................................................... 31

References .........................................................32

Revision history ................................................ 33

Legal information ..............................................34

Features and benefits .........................................2

General .............................................................. 2

Protocol support ................................................ 2

Protections .........................................................3

Applications .........................................................3

Ordering information .......................................... 3

Marking .................................................................3

Block diagram ..................................................... 4

Pinning information ............................................ 5

Pinning ...............................................................5

Pin description ...................................................5

Functional description ........................................6

Start-up and supply ........................................... 7

Voltage loop .......................................................8

Current loop .....................................................10

Cable compensation ........................................11

Load switch ......................................................11

Discharge function ...........................................11

Detach detection ..............................................12

Internal temperature measurement ..................12

GPIO pin ..........................................................12

Off .................................................................... 12

NTC ..................................................................12

NTC + OTP ..................................................... 14

Supply ..............................................................14

Communication ................................................14

USB Type-C .................................................... 14

USB-PD ........................................................... 15

Discover identification ......................................15

Quick charge ................................................... 15

MTP configuration ............................................16

Protections .......................................................17

Protections overview ........................................17

Secondary side safe restart protection ............ 17

Undervoltage lockout (UVLO) ..........................17

Overvoltage protection (OVP) ..........................18

Overcurrent protection (OCP) ..........................18

Overtemperature protection (OTP) .................. 18

15

15.1

16

17

18

19

8.4

8.5

8.6

8.7

8.8

8.9

8.9.1

8.9.2

8.9.3

8.9.4

8.10

8.10.1

8.10.2

8.10.3

8.10.4

8.10.5

8.11

8.11.1

8.11.2

8.11.3

8.11.4

8.11.5

8.11.6

8.11.6.1 Internal OTP .................................................... 18

8.11.6.2 External OTP ...................................................18

8.11.7

8.11.8

8.11.9

Open-supply protection (OSUP) ...................... 18

Undervoltage protection (UVP) ........................18

Output short protection (OSP) .........................19

8.11.10 OVP CC1 and CC2 pins (OV_CC1_CC2) ....... 19

8.11.11 Soft short protection CC pins (SHORT_

CC1_CC2) ....................................................... 19

9

Limiting values ..................................................20

Recommended operating conditions .............. 21

Thermal characteristics ....................................21

Characteristics .................................................. 22

Application information ....................................26

Resistor divider ................................................26

10

11

12

13

13.1

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 March 2019

Document identifier: TEA19032CT


型号：	935381779118
厂家：	NXP
描述：	Power Supply Support Circuit
文件：	总36页 (文件大小：330K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

935381779118 [NXP]

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